CN101489356A - 电路板及其制作方法 - Google Patents
电路板及其制作方法 Download PDFInfo
- Publication number
- CN101489356A CN101489356A CN200810300121.2A CN200810300121A CN101489356A CN 101489356 A CN101489356 A CN 101489356A CN 200810300121 A CN200810300121 A CN 200810300121A CN 101489356 A CN101489356 A CN 101489356A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- dielectric base
- conductive metal
- conducting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 238000000151 deposition Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 229920002120 photoresistant polymer Polymers 0.000 claims description 27
- 230000008021 deposition Effects 0.000 claims description 18
- 238000004062 sedimentation Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- WBHAUHHMPXBZCQ-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound COC1=CC=CC(C)=C1O WBHAUHHMPXBZCQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 2
- 150000005690 diesters Chemical class 0.000 claims description 2
- OZGODEHZQADZQC-UHFFFAOYSA-N ethenyl acetate terephthalic acid Chemical compound C(C1=CC=C(C(=O)O)C=C1)(=O)O.C(C)(=O)OC=C OZGODEHZQADZQC-UHFFFAOYSA-N 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 2
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 239000002585 base Substances 0.000 description 44
- 238000005530 etching Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000002894 chemical waste Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000009514 concussion Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (13)
- 【权利要求1】一种电路板的制作方法,包括步骤:提供一绝缘基底;于该绝缘基底至少一表面形成图案化的光阻层,使得绝缘基底部分表面被图案化的光阻层所覆盖;于绝缘基底的未被图案化的光阻层所覆盖的表面沉积导电金属层;去除图案化的光阻层,从而得到待制作的电路板。
- 【权利要求2】如权利要求1所述的电路板的制作方法,其特征在于,所述采用物理气相沉积法或化学气相沉积法形成导电金属层。
- 【权利要求3】如权利要求1所述的电路板的制作方法,其特征在于,沉积导电金属层之前,先于绝缘基底的未被图案化的光阻层所覆盖的表面沉积一生长层。
- 【权利要求4】如权利要求3所述的电路板的制作方法,其特征在于,所述采用物理气相沉积法或化学气相沉积法形成生长层。
- 【权利要求5】如权利要求4所述的电路板的制作方法,其特征在于,所述生长层的材料为镍、银或钯。
- 【权利要求6】如权利要求1所述的电路板的制作方法,其特征在于,所述导电金属层的材料为铜、银、铝或所述金属的合金。
- 【权利要求7】一种电路板,其包括基底及形成于基底表面的导电线路,其特征在于,所述导电线路采用沉积法形成。
- 【权利要求8】如权利要求7所述的电路板,其特征在于,所述导电线路与基底之间具有通过沉积法形成的生长层。
- 【权利要求9】如权利要求8所述的电路板,其特征在于,所述生长层的材料为镍、银或钯。
- 【权利要求10】如权利要求7所述的电路板,其特征在于,所述导电线路的厚度小于8微米。
- 【权利要求11】如权利要求7所述的电路板,其特征在于,所述基底为软性绝缘基底或硬性绝缘基底。
- 【权利要求12】如权利要求11所述的电路板,其特征在于,所述软性绝缘基底的材料为聚酰亚胺、聚对苯二甲酸乙烯酯或聚二甲酸乙二酯。
- 【权利要求13】如权利要求11所述的电路板,其特征在于,所述硬性绝缘基底的材料为玻纤布基环氧树脂、玻纤布基酚醛树脂、纸基环氧树脂或纸基酚醛树脂。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810300121.2A CN101489356B (zh) | 2008-01-16 | 2008-01-16 | 电路板及其制作方法 |
US12/184,942 US20090178276A1 (en) | 2008-01-16 | 2008-08-01 | Method for forming circuit in making printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810300121.2A CN101489356B (zh) | 2008-01-16 | 2008-01-16 | 电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101489356A true CN101489356A (zh) | 2009-07-22 |
CN101489356B CN101489356B (zh) | 2011-03-30 |
Family
ID=40849411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810300121.2A Expired - Fee Related CN101489356B (zh) | 2008-01-16 | 2008-01-16 | 电路板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090178276A1 (zh) |
CN (1) | CN101489356B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102998641A (zh) * | 2011-09-15 | 2013-03-27 | 西门子公司 | 带有重叠线圈元件的磁共振线圈、磁共振装置和方法 |
CN105407648A (zh) * | 2014-09-16 | 2016-03-16 | 欣永立企业有限公司 | 极细的金属线路的制造方法及其结构 |
CN107623007A (zh) * | 2016-07-15 | 2018-01-23 | 东捷科技股份有限公司 | 芯片固定结构的制造方法 |
CN111370854A (zh) * | 2020-03-03 | 2020-07-03 | 安徽精卓光显技术有限责任公司 | 天线及其制作方法、电子设备 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103635027B (zh) * | 2012-08-29 | 2017-05-31 | 深南电路有限公司 | 一种线路板的制造方法及线路板 |
WO2018147678A1 (ko) * | 2017-02-09 | 2018-08-16 | (주)잉크테크 | 시드층을 이용한 회로형성방법 및 시드층의 선택적 에칭을 위한 에칭액 조성물 |
US20230247758A1 (en) * | 2022-01-31 | 2023-08-03 | Baker Hughes Oilfield Operations Llc | Printed circuit board, method, and system |
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US3896473A (en) * | 1973-12-04 | 1975-07-22 | Bell Telephone Labor Inc | Gallium arsenide schottky barrier avalance diode array |
US4647711A (en) * | 1985-01-29 | 1987-03-03 | The Standard Oil Company | Stable front contact current collector for photovoltaic devices and method of making same |
CH665428A5 (de) * | 1985-07-26 | 1988-05-13 | Balzers Hochvakuum | Verfahren zur beschichtung von mikrovertiefungen. |
US4920639A (en) * | 1989-08-04 | 1990-05-01 | Microelectronics And Computer Technology Corporation | Method of making a multilevel electrical airbridge interconnect |
US5707466A (en) * | 1995-03-31 | 1998-01-13 | California Institute Of Technology | Method and apparatus for selectively annealing heterostructures using microwave |
US5976970A (en) * | 1996-03-29 | 1999-11-02 | International Business Machines Corporation | Method of making and laterally filling key hole structure for ultra fine pitch conductor lines |
DE19841900A1 (de) * | 1998-09-11 | 2000-03-30 | Schott Glas | Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte für großflächige Flachbildschirme |
US6265301B1 (en) * | 1999-05-12 | 2001-07-24 | Taiwan Semiconductor Manufacturing Company | Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures |
DE10000090A1 (de) * | 2000-01-04 | 2001-08-30 | Elfo Ag Sachseln Sachseln | Verfahren zum Herstellen einer mehrlagigen Planarspule |
US6403893B2 (en) * | 2000-05-26 | 2002-06-11 | Visteon Global Technologies, Inc. | Circuit board and a method for making the same |
US6729023B2 (en) * | 2000-05-26 | 2004-05-04 | Visteon Global Technologies, Inc. | Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material |
US6696910B2 (en) * | 2001-07-12 | 2004-02-24 | Custom One Design, Inc. | Planar inductors and method of manufacturing thereof |
US20040197541A1 (en) * | 2001-08-02 | 2004-10-07 | Joseph Zahka | Selective electroless deposition and interconnects made therefrom |
US7640651B2 (en) * | 2003-12-31 | 2010-01-05 | Microfabrica Inc. | Fabrication process for co-fabricating multilayer probe array and a space transformer |
US7341628B2 (en) * | 2003-12-19 | 2008-03-11 | Melas Andreas A | Method to reduce crystal defects particularly in group III-nitride layers and substrates |
US7596842B2 (en) * | 2005-02-22 | 2009-10-06 | Oak-Mitsui Inc. | Method of making multilayered construction for use in resistors and capacitors |
DE102005030466B4 (de) * | 2005-06-28 | 2012-10-25 | Infineon Technologies Ag | Halbleiterwafer mit Verdrahtungsstrukturen und Halbleiterbauelement sowie Verfahren zur Herstellung desselben |
IL175011A (en) * | 2006-04-20 | 2011-09-27 | Amitech Ltd | Coreless cavity substrates for chip packaging and their fabrication |
US7444253B2 (en) * | 2006-05-09 | 2008-10-28 | Formfactor, Inc. | Air bridge structures and methods of making and using air bridge structures |
KR100782412B1 (ko) * | 2006-10-25 | 2007-12-05 | 삼성전기주식회사 | 전사회로 형성방법 및 회로기판 제조방법 |
US7841080B2 (en) * | 2007-05-30 | 2010-11-30 | Intel Corporation | Multi-chip packaging using an interposer with through-vias |
-
2008
- 2008-01-16 CN CN200810300121.2A patent/CN101489356B/zh not_active Expired - Fee Related
- 2008-08-01 US US12/184,942 patent/US20090178276A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102998641A (zh) * | 2011-09-15 | 2013-03-27 | 西门子公司 | 带有重叠线圈元件的磁共振线圈、磁共振装置和方法 |
US9513351B2 (en) | 2011-09-15 | 2016-12-06 | Siemens Aktiengesellschaft | Magnetic resonance coil with overlapping coil elements |
CN105407648A (zh) * | 2014-09-16 | 2016-03-16 | 欣永立企业有限公司 | 极细的金属线路的制造方法及其结构 |
CN105407648B (zh) * | 2014-09-16 | 2018-08-03 | 常州欣盛微结构电子有限公司 | 极细的金属线路的制造方法及其结构 |
CN107623007A (zh) * | 2016-07-15 | 2018-01-23 | 东捷科技股份有限公司 | 芯片固定结构的制造方法 |
CN111370854A (zh) * | 2020-03-03 | 2020-07-03 | 安徽精卓光显技术有限责任公司 | 天线及其制作方法、电子设备 |
CN111370854B (zh) * | 2020-03-03 | 2023-10-20 | 安徽精卓光显技术有限责任公司 | 天线及其制作方法、电子设备 |
Also Published As
Publication number | Publication date |
---|---|
CN101489356B (zh) | 2011-03-30 |
US20090178276A1 (en) | 2009-07-16 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhen Ding Technology Co.,Ltd. Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Hongsheng Technology Co.,Ltd. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
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Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee after: Peng Ding Polytron Technologies Inc. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
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Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: AVARY HOLDING (SHENZHEN) Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
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Granted publication date: 20110330 Termination date: 20220116 |
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CF01 | Termination of patent right due to non-payment of annual fee |