CN101470344A - 用于对全芯片图案实施图案分解的方法 - Google Patents
用于对全芯片图案实施图案分解的方法 Download PDFInfo
- Publication number
- CN101470344A CN101470344A CNA200810173349XA CN200810173349A CN101470344A CN 101470344 A CN101470344 A CN 101470344A CN A200810173349X A CNA200810173349X A CN A200810173349XA CN 200810173349 A CN200810173349 A CN 200810173349A CN 101470344 A CN101470344 A CN 101470344A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US99634807P | 2007-11-13 | 2007-11-13 | |
US60/996,348 | 2007-11-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101470344A true CN101470344A (zh) | 2009-07-01 |
CN101470344B CN101470344B (zh) | 2011-06-22 |
Family
ID=40624942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810173349XA Expired - Fee Related CN101470344B (zh) | 2007-11-13 | 2008-11-13 | 用于对全芯片图案实施图案分解的方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8572521B2 (zh) |
JP (1) | JP4779003B2 (zh) |
CN (1) | CN101470344B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105051737A (zh) * | 2013-02-22 | 2015-11-11 | 新思科技有限公司 | 用于三重曝光的混合演进算法 |
TWI684110B (zh) * | 2015-03-13 | 2020-02-01 | 南韓商三星電子股份有限公司 | 提供積體電路佈局資料之方法、系統與電腦程式產品 |
CN113227899A (zh) * | 2018-12-28 | 2021-08-06 | Asml荷兰有限公司 | 用于在片段边界处产生图案形成装置图案的方法 |
TWI825961B (zh) * | 2022-03-16 | 2023-12-11 | 大陸商東方晶源微電子科技(北京)有限公司 | 一種解決掩模版著色邊界衝突的方法、裝置和電腦設備 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7793238B1 (en) * | 2008-03-24 | 2010-09-07 | Xilinx, Inc. | Method and apparatus for improving a circuit layout using a hierarchical layout description |
TW201102848A (en) * | 2009-07-02 | 2011-01-16 | Univ Nat Taiwan | Method for concurrent migration and decomposition of integrated circuit layout |
US8245174B2 (en) * | 2009-07-23 | 2012-08-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Double patterning friendly lithography method and system |
US8347240B2 (en) | 2010-10-29 | 2013-01-01 | International Business Machines Corporation | Split-layer design for double patterning lithography |
US8429574B2 (en) * | 2011-04-14 | 2013-04-23 | Cadence Design Systems, Inc. | Dual-pattern coloring technique for mask design |
US20130145340A1 (en) * | 2011-06-28 | 2013-06-06 | Qiao Li | Determination Of Uniform Colorability Of Layout Data For A Double Patterning Manufacturing Process |
US8359556B1 (en) | 2011-06-29 | 2013-01-22 | International Business Machines Corporation | Resolving double patterning conflicts |
US8516403B2 (en) * | 2011-09-01 | 2013-08-20 | International Business Machines Corporation | Multiple patterning layout decomposition for ease of conflict removal |
US8434033B2 (en) | 2011-09-01 | 2013-04-30 | International Business Machines Corporation | Mask assignment for multiple patterning lithography |
US8473873B2 (en) | 2011-09-02 | 2013-06-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-patterning method |
US8468470B2 (en) | 2011-09-21 | 2013-06-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-patterning method |
US8601408B2 (en) * | 2011-10-10 | 2013-12-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for replacing a pattern in a layout |
US8448100B1 (en) * | 2012-04-11 | 2013-05-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Tool and method for eliminating multi-patterning conflicts |
US8601409B1 (en) | 2012-07-12 | 2013-12-03 | Taiwan Semiconductor Manufacturing Co, Ltd. | Compression method and system for use with multi-patterning |
KR20140029050A (ko) | 2012-08-31 | 2014-03-10 | 삼성전자주식회사 | 패턴 형성 방법 |
US8689151B1 (en) | 2012-09-12 | 2014-04-01 | International Business Machines Corporation | Pitch-aware multi-patterning lithography |
JP6141044B2 (ja) * | 2013-02-22 | 2017-06-07 | キヤノン株式会社 | 生成方法、プログラム及び情報処理装置 |
JP6598421B2 (ja) * | 2013-02-22 | 2019-10-30 | キヤノン株式会社 | マスクパターンの決定方法、プログラム、情報処理装置 |
WO2015023856A1 (en) * | 2013-08-15 | 2015-02-19 | Synopsys, Inc. | Detecting and displaying multi-patterning fix guidance |
US10013520B2 (en) * | 2013-10-03 | 2018-07-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of determining if layout design is N-colorable |
KR102219460B1 (ko) | 2014-09-04 | 2021-02-24 | 삼성전자주식회사 | 반도체 장치의 레이아웃 분리 방법 및 이를 사용한 반도체 장치 제조 방법 |
US9934347B2 (en) | 2014-10-01 | 2018-04-03 | Samsung Electronics Co., Ltd. | Integrated circuit and method of designing layout of integrated circuit |
KR102230503B1 (ko) | 2015-04-14 | 2021-03-22 | 삼성전자주식회사 | 레이아웃 디자인 시스템, 이를 이용한 마스크 패턴 제조 시스템 및 방법 |
KR102338365B1 (ko) | 2015-04-24 | 2021-12-09 | 삼성전자주식회사 | 레이아웃 분리 방법 및 레이아웃 분리 시스템 |
US10175571B2 (en) * | 2015-06-19 | 2019-01-08 | Qualcomm Incorporated | Hybrid coloring methodology for multi-pattern technology |
US9679100B2 (en) * | 2015-08-21 | 2017-06-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Environmental-surrounding-aware OPC |
US9842185B2 (en) * | 2015-08-21 | 2017-12-12 | Qualcomm Incorporated | Systems and methods for group constraints in an integrated circuit layout |
US10192021B1 (en) * | 2017-02-21 | 2019-01-29 | Cadence Design Systems, Inc. | Generating and inserting metal and metal etch shapes in a layout to correct design rule errors |
US11720015B2 (en) * | 2020-06-29 | 2023-08-08 | Synopsys, Inc. | Mask synthesis using design guided offsets |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05341498A (ja) * | 1992-04-10 | 1993-12-24 | Toshiba Corp | フォトマスク設計装置および設計方法 |
JP3378302B2 (ja) * | 1993-06-29 | 2003-02-17 | 株式会社東芝 | フォトマスク設計方法及び設計装置 |
KR0172558B1 (ko) * | 1995-03-22 | 1999-03-20 | 김주용 | 노광 마스크의 제조방법 |
JP3537953B2 (ja) * | 1995-03-27 | 2004-06-14 | 株式会社東芝 | 半導体製造用フォトマスク設計方法及びシステム |
JP3344242B2 (ja) * | 1996-01-11 | 2002-11-11 | 富士通株式会社 | ホトマスクに対する位相シフタ配置方法及び記憶媒体 |
WO1997033205A1 (en) | 1996-03-06 | 1997-09-12 | Philips Electronics N.V. | Differential interferometer system and lithographic step-and-scan apparatus provided with such a system |
DE69717975T2 (de) | 1996-12-24 | 2003-05-28 | Asml Netherlands Bv | In zwei richtungen ausgewogenes positioniergerät, sowie lithographisches gerät mit einem solchen positioniergerät |
US5883813A (en) * | 1997-03-04 | 1999-03-16 | International Business Machines Corporation | Automatic generation of phase shift masks using net coloring |
JPH11327120A (ja) * | 1998-05-19 | 1999-11-26 | Toppan Printing Co Ltd | 光強度シミュレーション装置および光強度シミュレーション方法並びに光強度シミュレーションプログラムを記録した記録媒体 |
JP2000066365A (ja) * | 1998-08-18 | 2000-03-03 | Toppan Printing Co Ltd | フォトマスクパターン設計支援装置、フォトマスクパターン設計支援方法、および、フォトマスクパターン設計支援プログラムを記録した記録媒体 |
US6978436B2 (en) * | 2000-07-05 | 2005-12-20 | Synopsys, Inc. | Design data format and hierarchy management for phase processing |
JP2002353102A (ja) * | 2001-05-23 | 2002-12-06 | Hitachi Ltd | 半導体装置の製造方法 |
CN1195316C (zh) * | 2002-03-26 | 2005-03-30 | 华邦电子股份有限公司 | 改进临界尺寸一致性的方法 |
US6993741B2 (en) * | 2003-07-15 | 2006-01-31 | International Business Machines Corporation | Generating mask patterns for alternating phase-shift mask lithography |
US7378195B2 (en) * | 2004-06-28 | 2008-05-27 | International Business Machines Corporation | System for coloring a partially colored design in an alternating phase shift mask |
US7493589B2 (en) * | 2005-12-29 | 2009-02-17 | Asml Masktools B.V. | Method, program product and apparatus for model based geometry decomposition for use in a multiple exposure process |
JP4945367B2 (ja) * | 2006-08-14 | 2012-06-06 | エーエスエムエル マスクツールズ ビー.ブイ. | 回路パターンを複数の回路パターンに分離する装置および方法 |
JP4922112B2 (ja) * | 2006-09-13 | 2012-04-25 | エーエスエムエル マスクツールズ ビー.ブイ. | パターン分解フィーチャのためのモデルベースopcを行うための方法および装置 |
JP4700664B2 (ja) * | 2006-09-13 | 2011-06-15 | エーエスエムエル マスクツールズ ビー.ブイ. | アンカーリングフィーチャを利用したパターンピッチ分割分解を行うための方法 |
CN101271483B (zh) * | 2006-09-13 | 2012-02-22 | Asml蒙片工具有限公司 | 分解图案的方法、器件制造方法及产生掩模的方法 |
JP5032948B2 (ja) * | 2006-11-14 | 2012-09-26 | エーエスエムエル マスクツールズ ビー.ブイ. | Dptプロセスで用いられるパターン分解を行うための方法、プログラムおよび装置 |
US7802226B2 (en) * | 2007-01-08 | 2010-09-21 | Mentor Graphics Corporation | Data preparation for multiple mask printing |
US8713483B2 (en) * | 2007-06-05 | 2014-04-29 | Mentor Graphics Corporation | IC layout parsing for multiple masks |
-
2008
- 2008-11-06 JP JP2008285523A patent/JP4779003B2/ja not_active Expired - Fee Related
- 2008-11-13 US US12/270,498 patent/US8572521B2/en not_active Expired - Fee Related
- 2008-11-13 CN CN200810173349XA patent/CN101470344B/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105051737A (zh) * | 2013-02-22 | 2015-11-11 | 新思科技有限公司 | 用于三重曝光的混合演进算法 |
CN105051737B (zh) * | 2013-02-22 | 2019-06-14 | 新思科技有限公司 | 用于验证设计的计算机实现方法及系统 |
TWI684110B (zh) * | 2015-03-13 | 2020-02-01 | 南韓商三星電子股份有限公司 | 提供積體電路佈局資料之方法、系統與電腦程式產品 |
CN113227899A (zh) * | 2018-12-28 | 2021-08-06 | Asml荷兰有限公司 | 用于在片段边界处产生图案形成装置图案的方法 |
TWI825961B (zh) * | 2022-03-16 | 2023-12-11 | 大陸商東方晶源微電子科技(北京)有限公司 | 一種解決掩模版著色邊界衝突的方法、裝置和電腦設備 |
Also Published As
Publication number | Publication date |
---|---|
US20090125866A1 (en) | 2009-05-14 |
US8572521B2 (en) | 2013-10-29 |
CN101470344B (zh) | 2011-06-22 |
JP2009139938A (ja) | 2009-06-25 |
JP4779003B2 (ja) | 2011-09-21 |
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ASS | Succession or assignment of patent right |
Owner name: ASML NETHERLANDS CO., LTD. Free format text: FORMER OWNER: RUICHU TECHNOLOGY COMPANY Effective date: 20100519 Free format text: FORMER OWNER: ASML NETHERLANDS CO., LTD. |
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Free format text: CORRECT: ADDRESS; FROM: CALIFORNIA, U.S.A. TO: WEIDEHUOWEN, HOLLAND |
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Effective date of registration: 20100519 Address after: Holland Weide Eindhoven Applicant after: ASML Holland Co., Ltd. Address before: American California Applicant before: Brion Technologies Inc. Co-applicant before: ASML Holland Co., Ltd. |
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Granted publication date: 20110622 Termination date: 20191113 |