CN101466229A

CN101466229A - Radiating device

Info

Publication number: CN101466229A
Application number: CNA200710125289XA
Authority: CN
Inventors: 赖其渊; 周志勇; 赖振田
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2007-12-21
Filing date: 2007-12-21
Publication date: 2009-06-24
Anticipated expiration: 2027-12-21
Also published as: CN101466229B

Abstract

Disclosed is a heat-dissipating device, which is used for electronic components to dissipate heat; the heat-dissipating device comprise a base plate, a lower fin group connected on the base plate, and a plurality of heat pipes arranged on the base plate; wherein, the heat-dissipating device includes a top plate connected on the base plate and used for holding the heat pipes with the base plate together, and an upper fin group connected on the top plate. Compared with prior art, the heat pipes of the heat-dissipating device are held between the base plate and the top plate without arranging the grooves on the base plate. Therefore, the thickness of the base plate can be controlled within a smaller range, so as to ensure that the heat generated by the electronic components can be transmitted to the fins through the shortest heat conductive path, and lead the heat-dissipating ratio of the heat-dissipating device to be correspondingly improved.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor especially electronic element radiating.

Background technology

In recent years along with the development of electronic industry, the performance of electronic component constantly promotes, and arithmetic speed is more and more faster, and the arithmetic speed of its inside chip group constantly promotes, number of chips constantly increases, the also corresponding increase of the heat that is distributed during chip operation if these heats are not in time distributed, will greatly influence the performance of electronic component, the arithmetic speed of electronic component is reduced, along with the continuous accumulation of heat, also may burn electronic component, therefore must dispel the heat to electronic component.

Traditional radiator comprises a base plate and some from the upwardly extending fin of base plate.This base plate contacts with electronic component to absorb the heat of its generation, and fin then is distributed to the heat that base plate absorbed in the middle of the air, realizes the heat radiation to electronic component thus.

For improving the radiating efficiency of radiator, some heat pipes are installed on base plate also usually.These heat pipes can promptly be disseminated to the heat that is distributed in the base plate part on the whole base plate, and heat is conducted on the fin more fully.

For heat pipe is mounted on the base plate, the common method that adopts of industry is for to offer some grooves at base plate at present.These heat pipes are embedded in the groove, thereby are consolidated into one with base plate.But,, cause the thickness of base plate must be greater than the internal diameter of groove because the groove of this kind method is opened on the base plate.Therefore, the base plate that this method adopted needs thicker, causes electronic component longer to the thermally conductive pathways between fin, influences the radiating efficiency of heat abstractor.

Summary of the invention

In view of this, but in fact be necessary to provide a kind of heat abstractor of quick heat radiating.

A kind of heat abstractor is used for electronic element radiating, and it comprises that a base plate, is bonded to top board on the base plate, somely is folded in the heat pipe between base plate and top board and is bonded on one on base plate and the top board fins group respectively and fins group once.

Compared with prior art, the heat pipe of heat abstractor of the present invention is folded between base plate and the top board, does not need to offer on base plate groove.Thus, the controllable thickness of base plate is guaranteed that the heat that electronic component produces can transfer on the fin via the shortest thermally conductive pathways, thereby the radiating efficiency of heat abstractor is got a promotion in a small range.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

Description of drawings

Fig. 1 is the three-dimensional assembly diagram of heat abstractor of the present invention.

Fig. 2 is the three-dimensional exploded view of Fig. 1.

Fig. 3 is the inversion figure of the heat pipe of heat abstractor among Fig. 2.

Fig. 4 is the inversion figure of Fig. 1.

Fig. 5 is the front view of Fig. 1.

Embodiment

As illustrated in fig. 1 and 2, heat abstractor 10 of the present invention is used for being installed on electronic component (figure does not show) heat radiation on the circuit board (figure do not show), and it comprises that a base plate 20, is bonded to the top board 30 of base plate 20, is bonded to fins group 40 on the fins group 50 and of base plate 20 and top board 30 and some heat pipes 60 that is folded in the flat of 30 on base plate 20 and top board respectively.

See also Fig. 4, described base plate 20 is integrally formed by a metallic plate, and its longitudinal section roughly is " U " shape.This base plate 20 comprises the side 26 that a smooth rectangle plate body 22, two sidewalls 24 and two that extend vertically upward from plate body 22 relative both sides oppositely form from two sidewalls, 24 top levels respectively.The downward impact extrusion in the subregion of this plate body 22 goes out the recess 222 that a square boss 220 (as Fig. 4) and is positioned at this boss 220, and wherein this boss 220 protrudes out the bottom surface of plate body 22, and this recess 222 dents into the end face of plate body 22 and towards upper shed.This boss 220 is used for contacting with electronic component and absorbs the heat of its generation, 222 corresponding constructions that are used for ccontaining heat pipe 60 of this recess.Two sidewalls 24 and dual side-edge 26 are in outwards bend out two fins (figure is mark not) near its medium position place level.The fixed part 70 of two rectangles places on this two fin respectively and plugs in sidewall 24 and the side 26.All greater than the height of sidewall 24, its top extends beyond dual side-edge 26 to connect with top board 30 to the height of each fixed part 70.Two perforation 700 run through two fixed parts 70 and two fins respectively, pass and base plate 20 is fixed on the circuit board for fastener (figure does not show).

To the side 26 of base plate 20, it is also integrally formed by a metallic plate by solder bond for described top board 30.This top board 30 is a smooth rectangular configuration, and its periphery is consistent with the periphery of base plate 20.This top board 30 is parallel to the plate body 22 of base plate 20, its each side offer all that area equates and with corresponding two rectangular indentation 32 of the fin of base plate 20.The part of top board 30 between two breach 32 of its each side forms the shell fragment 34 of a rectangle, and it is used for elasticity and compresses the fixed part 70 that is installed on the base plate 20.Two breach 32 that are positioned at top board 30 each side equate with the top area of each fixed part 70 with the area sum of a shell fragment 34.One circular hole 340 is opened in shell fragment 34 middle parts, and it aligns with the respective perforations 700 of base plate 20, and base plate 20 and top board 30 after will welding for fastener passes are fixed on the circuit board.

See also Fig. 5, fins group 50 was respectively welded to the bottom surface of the end face and the base plate 20 of top board 30 under described upward fins group 40 reached, and it includes the

fin

42,52 of plurality of stacked serial connection.The middle part of each

fin

42,52 is all perpendicular to top board 30, and it then bends and be bonded to separately on base plate 20 or the top board 30 from the middle part level in two ends up and down.The periphery that should go up fins group 40 is consistent with the periphery of top board 30, and it occupies the whole top of top board 30; This time fins group 50 is near the boss 220 of base plates 20, and it roughly occupies 1/3rd bottom surface (as Fig. 4) of plate body 22.

See also Fig. 3, described heat pipe 60 is folded between base plate 20 and the top board 30, and it comprises two straight first heat pipe 62 and two second heat pipes 64 that bend.This 2 first heat pipe 62 closes up and directly contact mutually.Each second heat pipe 64 comprises that two bending segments 642 and of a flat segments 640, two bendings outside flat segments 640 two ends are tilted to are formed at the tip 644 of a bending segment 642 ends.The flat segments 640 of second heat pipe 64 is closed up with first heat pipe 62 and is directly contacted, and bending segment 642 separates with first heat pipe 62 obliquely, and 644 on tip separates with first heat pipe 62 abreast.The equal in length of the spacing of the opposite end of each second heat pipe 64 and first heat pipe 62.The spacing of the tip 644 of 2 second heat pipes 64 equates with the spacing of the end of its two bending segment 642 and less than the spacing of two sidewalls 24 of base plate 20, thus, when heat pipe 60 places on the base plate 20, its bending segment 642 and tip 644 all will separate (as Fig. 5) with the sidewall 24 of base plate 20, thereby form some gas channels at

heat pipe

60 and 20 of base plates, to promote the radiating efficiency of heat abstractor 10.2 first heat pipes 62 protrude out the protuberance 626 of two rectangles downwards in the position near its middle part, 2 second heat pipes 64 also protrude out the protuberance 646 of two rectangles downwards in the bottom of its flat segments 640, the area of this four protuberance 626,646 equates and less than the area of the recess 222 of base plate 20, it is used to be placed in the recess 222 of base plate 20 and with the top of boss 220 and contacts, with heat delivered that boss 220 is absorbed to heat pipe 60.

Compared with prior art, the heat pipe 60 of heat abstractor of the present invention is folded between base plate 20 and the top board 30, and does not need to offer on base plate 20 groove for its embedding.Thus, the controllable thickness of base plate 20 is guaranteed that the heat that electronic component produces can transfer to via the shortest thermally conductive pathways on the

fin

42,52, thereby the radiating efficiency of heat abstractor 10 is correspondingly got a promotion in a small range.

Claims

1. heat abstractor, be used for electronic element radiating, it comprises that a base plate, is bonded to following fins group and the some heat pipes that places on the base plate on the base plate, is characterized in that: described heat abstractor comprises that also one is bonded on the base plate and is bonded to last fins group on the top board with top board and that base plate inserts and puts heat pipe jointly.

2. heat abstractor as claimed in claim 1 is characterized in that: described fins group down is bonded to the bottom of base plate, and last fins group is bonded to the top of top board.

3. heat abstractor as claimed in claim 2 is characterized in that: described base plate comprises sidewall that a plate body, two that carries heat pipe upwards forms from the relative both sides of plate body respectively and the dual side-edge that oppositely bends from this two top side wall, and this top board is fixed on the dual side-edge.

4. heat abstractor as claimed in claim 3 is characterized in that: described heat pipe comprises some first straight heat pipes and some second heat pipes that inserts and puts the bending of first heat pipe jointly, and these second heat pipes all separate with sidewall.

5. heat abstractor as claimed in claim 4 is characterized in that: described first heat pipe closes up and directly contact mutually mutually.

6. heat abstractor as claimed in claim 4 is characterized in that: each second heat pipe comprise a flat segments, two from the flat segments two ends outwards the bending segment and of bending to be formed at a bending segment terminal and be parallel to the tip of flat segments.

7. heat abstractor as claimed in claim 6 is characterized in that: the flat segments of described second heat pipe is closed up with first heat pipe and is directly contacted, and bending segment separates with first heat pipe obliquely, and tip is parallel to first heat pipe and is spaced from.

8. as each described heat abstractor of claim 3 to 7, it is characterized in that: the subregion of the plate body of described base plate goes out that a boss and is positioned at boss and towards the recess of upper shed to lower recess.

9. heat abstractor as claimed in claim 8 is characterized in that: the bottom of described heat pipe protrudes out some protuberances downwards, and these protuberances are placed in the recess of base plate and with boss and contact.

10. heat abstractor as claimed in claim 8 is characterized in that: describedly go up the whole top that fins group occupies top board, following fins group is near boss and occupy the part zone of the bottom surface of plate body.

11. heat abstractor as claimed in claim 3 is characterized in that: described heat abstractor comprises that also two are inserted in the fixed part in base plate side walls and the side, and this two fixed part is higher than sidewall and elasticity presses on top board.