CN101466227B

CN101466227B - Radiating device

Info

Publication number: CN101466227B
Application number: CN2007101252739A
Authority: CN
Inventors: 赖其渊; 周志勇; 赖振田
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2007-12-19
Filing date: 2007-12-19
Publication date: 2011-12-21
Anticipated expiration: 2027-12-19
Also published as: CN101466227A

Abstract

Disclosed is a heat-dissipating device, which is used for electronic components to dissipate heat; the heat-dissipating device comprises a base plate and a plurality of heat pipes arranged on the base plate; a plurality of raised points are formed on the base plate; the arrangement of the raised points is the same as the outline of the heat pipes and can hold the heat pipe in the middle part thereof. Compared with prior art, the raised points hold the heat pipes in the middle part thereof so as to realize the positioning the heat pipes. Therefore, the base plate is unnecessary to arrange the grooves; the thickness of the base plate can be controlled within a smaller range, so as to save material. In addition, the raised points only occupy few areas of the base plate, and can basically not be affected by the size of the base plate. Therefore, though the size of the base plate is smaller, the heat pipes positioning can also be realized.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor especially electronic element radiating.

Background technology

In recent years along with the development of electronic industry, the performance of electronic component constantly promotes, and arithmetic speed is more and more faster, and the arithmetic speed of its inside chip group constantly promotes, number of chips constantly increases, the also corresponding increase of the heat that is distributed during chip operation if these heats are not in time distributed, will greatly influence the performance of electronic component, the arithmetic speed of electronic component is reduced, along with the continuous accumulation of heat, also may burn electronic component, therefore must dispel the heat to electronic component.

Traditional radiator comprises a base plate and some from the upwardly extending fin of base plate.This base plate contacts with electronic component to absorb the heat of its generation, and fin then is distributed to the heat that base plate absorbed in the middle of the air, realizes the heat radiation to electronic component thus.

For improving the radiating efficiency of radiator, some heat pipes are installed on base plate also usually.These heat pipes can promptly be disseminated to the heat that is distributed in the base plate part on the whole base plate, and heat is conducted on the fin more fully.

For heat pipe is mounted on the base plate, industry adopts two kinds of methods usually at present: first method is for offering some grooves that are embedded heat pipe on base plate.But,, cause the thickness of base plate must be greater than the internal diameter of groove because the groove of this kind method is opened on the base plate.Therefore, the base plate that this method adopted needs thicker, makes the spent material of base plate and also correspondingly becomes many, has increased the cost of radiator.Second method is for directly being soldered to heat pipe on the base plate.But this kind method need use positioning fixture heat pipe to be positioned on the precalculated position of base plate, just can weld then.If the area of base plate is less, anchor clamps can't successfully be placed on the base plate, bring inconvenience for the location of heat pipe.

Summary of the invention

In view of this, be necessary to provide a kind of heat abstractor that can conveniently realize the heat pipe location and save material in fact.

A kind of heat abstractor is used for electronic element radiating, and it comprises a base plate and some heat pipes that places on the base plate, forms on this base plate somely to arrange consistent with the profile phase of heat pipe and heat pipe is folded in therebetween salient point.

Compared with prior art, the base plate of heat abstractor of the present invention is formed with some salient points, and these salient points are folded in heat pipe therebetween and the location of realizing opposite heat tube.Thus, need not offer groove on the base plate, its controllable thickness is in a small range, thus the saving material.In addition, these salient points only occupy a little area of base plate, and it is not influenced by the size of base plate substantially.Therefore, even the size of base plate is less, still can realize the location of opposite heat tube easily.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

Description of drawings

Fig. 1 is the three-dimensional assembly diagram of heat abstractor of the present invention.

Fig. 2 is the three-dimensional exploded view of Fig. 1.

Fig. 3 is and the similar view of Fig. 2 that this moment, the heat pipe of heat abstractor was mounted on the base plate.

Fig. 4 is the inversion figure of Fig. 1.

Embodiment

As illustrated in fig. 1 and 2, heat abstractor 10 of the present invention is used for being installed on electronic component (figure does not show) heat radiation on the circuit board (figure do not show), and it comprises that a base plate 20, is bonded to the top board 30 of base plate 20, is bonded to fins group 40 on the fins group 50 and of base plate 20 and top board 30 and some heat pipes 60 that is folded in 30 on base plate 20 and top board respectively.

See also Fig. 4, described base plate 20 is integrally formed by a metallic plate, and its longitudinal section roughly is " U " shape.This base plate 20 comprises the side 26 that a smooth rectangle plate body 22, two sidewalls 24 and two that extend vertically upward from plate body 22 relative both sides oppositely form from sidewall 24 top levels respectively.The downward impact extrusion in the subregion of this plate body 22 goes out a square boss 220 (as Fig. 4) and is positioned at the top recess 222 of this boss 220, and wherein this boss 220 protrudes out the bottom surface of plate body 22, and this recess 222 dents into the end face of plate body 22 and towards upper shed.Recess 222 is formed in the boss 220.This boss 220 is used for contacting with electronic component and absorbs the heat of its generation, 222 corresponding constructions that are used for ccontaining heat pipe 60 of this recess.Some salient points 200 that are used to locate heat pipe 60 are upwards gone out in the corresponding position of this plate body 22, and these salient points 200 are all arranged according to the profile of heat pipe 60, and wherein two salient points 200 are formed in the recess 222, and other salient points 200 are formed at outside the recess 222.Two sidewalls 24 and dual side-edge 26 are in bend out two fins (figure is mark not) near its outside level in medium position place.The fixed part 70 of two rectangles places on this two fin respectively and plugs in sidewall 24 and the side 26.All greater than the height of sidewall 24, its top extends beyond dual side-edge 26 to connect with top board 30 to the height of each fixed part 70.Two perforation 700 run through two fixed parts 70 and two fins respectively, pass and base plate 20 is fixed on the circuit board for fastener (figure does not show).

To the side 26 of base plate 20, it is also integrally formed by a metallic plate by solder bond for described top board 30.This top board 30 is a smooth rectangular configuration, and its periphery is consistent with the periphery of base plate 20.This top board 30 is parallel to the plate body 22 of base plate 20, its each side offer all that area equates and with corresponding two rectangular indentation 32 of the fin of base plate 20.The part of top board 30 between two breach 32 of its each side forms the shell fragment 34 of a rectangle, it is used for elasticity and compresses the fixed part 70 that is installed on the base plate 20, and two breach 32 that wherein are positioned at each side equate with the top area of each fixed part 70 with the area sum of a shell fragment 34.One circular hole 340 is opened in shell fragment 34 middle parts, and it aligns with the respective perforations 700 of base plate 20, and base plate 20 and top board 30 after will welding for fastener passes are fixed on the circuit board.

Fins group 50 was respectively welded to the bottom surface of the end face and the base plate 20 of top board 30 under described upward fins group 40 reached, and it includes the

fin

42,52 of plurality of stacked serial connection.The middle part of each

fin

42,52 is all perpendicular to top board 30, its then level bending and being bonded to separately on base plate 20 or the top board 30 of two ends up and down.Should go up the whole top that fins group 40 occupies top board 30, this time fins group 50 also roughly occupies 1/3rd bottom surface (as Fig. 4) of plate body 22 near the boss 220 of base plates 20.

See also Fig. 3, described heat pipe 60 is positioned on the base plate 20 by salient point 200, and it comprises two straight first heat pipe 62 and two second heat pipes 64 that bend.This 2 first heat pipe 62 closes up and directly contact mutually, and the adjacent two ends of this 2 first heat pipe 62 are jointly by two salient points, 200 folded establishing.Each second heat pipe 64 comprises that two bending segments 642 and of a flat segments 640, two bendings outside flat segments 640 two ends are tilted to are formed at the tip 644 of a bending segment 642 ends.The flat segments 640 of second heat pipe 64 is closed up with first heat pipe 62 and is directly contacted, and bending segment 642 separates with first heat pipe 62 obliquely, and 644 on tip separates with first heat pipe 62 abreast.The flat segments 640 of each second heat pipe 64 and the junction of bending segment 642 are by two salient points, 200 folded establishing, bending segment 642 is is also inserted and put by two salient points 200 with the junction of tip 644, that is to say, each second heat pipe 64 in its bending place all by two salient points, 200 folded establishing; The end of a corresponding bending segment 642 of second heat pipe 64 is by two salient points, 200 folded establishing, 644 on its tip is resisted against a salient point 200 and separates with the sidewall 24 of base plate 20, thereby form some gas channels at

heat pipe

60 and 20 of base plates, promote the radiating efficiency of heat abstractor 10 with this.2 first heat pipes 62 protrude out two protuberances (figure does not show) downwards in the position near its middle part, 2 second heat pipes 64 also protrude out two protuberances 646 downwards in the bottom of its flat segments 640.The protuberance of first heat pipe 62 and the protuberance 646 of second heat pipe 64 are used to be placed in the recess 222 of base plate 20 and with the top of boss 220 and contact, with heat delivered that boss 220 is absorbed to heat pipe 60.

When assembling this heat abstractor, only need heat pipe 60 is placed the location that can realize 20 of itself and base plates on the plate body 22 along salient point 200 from top to bottom.Compared with prior art, need not offer groove on the base plate 20 of heat abstractor 10 of the present invention, its controllable thickness is in a small range, thus the saving material.In addition, these salient points 200 only occupy a little area of base plate 20, and it is not influenced by the size of base plate 20 substantially.Therefore, even the size of base plate 20 is less, still can realize the location of opposite heat tube 60 easily.

Claims

1. a heat abstractor is used for electronic element radiating, and it comprises a base plate and some heat pipes that places on the base plate, it is characterized in that: form some salient points on the described base plate, the arranging consistent with the profile of heat pipe of these salient points and heat pipe is folded in therebetween.

2. heat abstractor as claimed in claim 1 is characterized in that: described heat pipe comprises second heat pipe of at least one bending, and each bending place of this at least one second heat pipe is inserted and put by two salient points.

3. heat abstractor as claimed in claim 2 is characterized in that: described heat pipe also comprises at least one first straight heat pipe, and the two ends of this at least one first heat pipe are respectively against two salient points.

4. heat abstractor as claimed in claim 3, it is characterized in that: described at least one second heat pipe comprises that a flat segments, two bending segments and from flat segments two ends diagonally extending are formed at the tip of a bending segment end, and this flat segments is parallel at least one first heat pipe.

5. heat abstractor as claimed in claim 4 is characterized in that: the flat segments of described at least one second heat pipe and at least one first heat pipe close up, and bending segment separates with at least one first heat pipe obliquely, and tip separates with at least one first heat pipe abreast.

6. as each described heat abstractor of claim 1 to 5, it is characterized in that: described base plate comprises a smooth plate body, two from upwardly extending sidewall in the relative both sides of plate body and two sides from the reverse level bending of top side wall, and heat pipe places on the plate body and with sidewall and separates.

7. heat abstractor as claimed in claim 6, it is characterized in that: the subregion of the plate body of described base plate goes out downwards that a boss and is formed in the boss and towards the recess of upper shed, the subregion of heat pipe protrudes out downwards and is placed in the recess and with boss and contacts.

8. heat abstractor as claimed in claim 6 is characterized in that: described heat abstractor comprises that also one is bonded to the top board of base plate dual side-edge, and this top board and base plate are folded in heat pipe therebetween jointly.

9. heat abstractor as claimed in claim 8 is characterized in that: described heat abstractor comprises that also a last fins group and that is bonded to top board is bonded to the following fins group of base plate.

10. heat abstractor as claimed in claim 9 is characterized in that: describedly go up the whole top that fins group occupies top board, following fins group occupies 1/3rd bottom surface of the plate body of base plate.