CN101465307A - Standard mechanical interface equipment with microparticle adsorption pad - Google Patents
Standard mechanical interface equipment with microparticle adsorption pad Download PDFInfo
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- CN101465307A CN101465307A CNA2007101724208A CN200710172420A CN101465307A CN 101465307 A CN101465307 A CN 101465307A CN A2007101724208 A CNA2007101724208 A CN A2007101724208A CN 200710172420 A CN200710172420 A CN 200710172420A CN 101465307 A CN101465307 A CN 101465307A
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- mechanical interface
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- adsorption pad
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Abstract
The invention discloses a standard mechanical interface (SMIF) equipment with a particulate absorption pad. The equipment is provided with a particulate absorption pad which is attached to a particulate accumulation area to adsorb the particles left on the area so as to avoid the flying particles falling on the wafer surface and impacting the semiconductor manufacturing process environment and the product yield; at the same time, the pad can avoid the mutual pollution among the equipments which are polluted by particles to reduce the machine station cleaning time and frequency; the pad can be timely replaced based on the particulate adsorption condition of the particulate absorption pad, so as to shorten the machine cleaning time, greatly enhance the running time of the machine station and increase the effective production capacity.
Description
Technical field
The present invention relates to a kind of standard mechanical interface (SMIF) equipment, particularly relate to a kind of standard mechanical interface (SMIF) equipment that reduces particle contamination.
Background technology
In manufacture of semiconductor, arround particulate or processing procedure in the particle contamination that produced will directly influence the yield of wafer.So in order to reduce particle contamination, improve the yield of wafer, the development fast that standard mechanical interface (SMIF) system obtains, it has not only promoted the manufacturing automation of semiconductor wafer, also reduced simultaneously when manufacture of semiconductor stores and transmit wafer, particulate is fallen the chance of wafer.The SMIF system mainly comprises three parts: standard mechanical interface wafer case (SMIF-Pod) is used for transmitting or storing the brilliant boat (WaferCassette) of wafer; Small environment, it is to utilize the wafer fabrication region of hyperpure gas around brilliant boat loading place and process apparatus, so that become the clean room of scaled-down version between wafer case internal environment and microenvironment; And automatic transfer assembly, load, the brilliant boat of unloading or wafer, it is sent to process work bench from wafer case, and does not make wafer in the brilliant boat be subjected to the pollution of external environment.For example, SMIF wafer load machine (SMIF-Indexer) can be with brilliant boat by shifting out in the wafer case, and grasp single-wafer by the Robot of semi-conductor processing equipment and move in the semi-conductor processing equipment, to carry out semi-conductive various production process.
Yet; owing to can producing particulate, the friction between SMIF wafer load machine and the SMIF wafer case parts is deposited in the inside of SMIF wafer load machine and the bottom of SMIF wafer case; the long-time back of piling up is under the influence of board decline and SMIF wafer load machine filter, and the particulate of accumulation can be kicked up.And the particulate of kicking up can drop on wafer surface, and particularly the nethermost contaminated degree of SMIF wafer case is the highest, and influences the yield manufacture of semiconductor environment and product; Polluted mutually between the two by the SMIF wafer load machine of particle contamination and SMIF wafer case simultaneously, increased the time and the frequency of cleaning board, the running time of having reduced board.For this reason, how to reduce the pollution that produces therefrom, improve the wafer yield, become industry one big problem.
Summary of the invention
The object of the present invention is to provide a kind of standard mechanical interface (SMIF) equipment, the particle contamination that is produced to be reduced in the manufacture of semiconductor, thereby the yield of raising wafer.
Another object of the present invention is to provide a kind of method that reduces particle contamination in the manufacture of semiconductor, thereby improve the yield of wafer.
For reaching above-mentioned purpose, the invention provides a kind of standard mechanical interface (SMIF) equipment that reduces particle contamination, it comprises a particulate accumulation area and a microparticle adsorption pad, invests above-mentioned particulate accumulation area.
Further, above-mentioned microparticle adsorption pad is one to meet the adhesive tape of semiconductor manufacturing (Fab) environment.
Further, the size of above-mentioned microparticle adsorption pad and particulate accumulation area is measure-alike.
Further, the above-mentioned particulate accumulation area base-plates surface that is SMIF wafer load machine.
The present invention provides a kind of method of the pollution of avoiding particulate to kick up being caused in addition in standard mechanical interface (SMIF) system, be included in the attached microparticle adsorption pad of particulate accumulation area.
Further, above-mentioned microparticle adsorption pad is one to meet the adhesive tape of semiconductor manufacturing (Fab) environment.
Further, the size of above-mentioned microparticle adsorption pad and particulate accumulation area is measure-alike.
Further, above-mentioned particulate accumulation area is the base-plates surface of a SMIF wafer load machine.
The present invention invests the particulate accumulation area with microparticle adsorption pad, with fall thereon particulate of absorption, influences the yield of manufacture of semiconductor environment and product thereby the particulate of avoiding kicking up drops on wafer surface; Avoided simultaneously by the mutual pollution between the equipment of particle contamination, reduced the time and the frequency of cleaning board, only needed in time to change, both can shorten the clear time according to the situation of microparticle adsorption pad adsorbent particles, also improve the running time of board greatly, increased the effective capacity of board.
Description of drawings
Fig. 1 is the structural representation of SMIF wafer load machine;
Fig. 2 is a particulate accumulation area schematic diagram;
Fig. 3 is the microparticle adsorption pad schematic diagram;
Fig. 4 is the schematic diagram that has the particulate accumulation area of microparticle adsorption pad.
Embodiment
Below with reference to accompanying drawing, be example with standard mechanical interface wafer load machine (SMIF-Indexer), it is next that the present invention is further illustrated.
Please refer to Fig. 1, it is the structural representation of SMIF wafer load machine.SMIF wafer load machine 200 comprises pedestal 202, is equipped with filter 204 on the pedestal 202, and arrow indicates in its effect mobility status of downstream such as figure.SMIF wafer case 100 places on the board of SMIF wafer load machine 200, and realizes shifting out of brilliant boat or wafer by wafer case opener 206.When SMIF wafer case 100 rose or descends, the particulate that produces owing to the friction between parts can be piled up in pedestal 202 surfaces of SMIF wafer load machine 200.As can be seen from Figure, under the influence of filter, particulate can be kicked up, and it is the highest to drop on the surface, the particularly contaminated degree of SMIF wafer case 100 nethermost parts of wafer, and causes the decline of wafer yield.
For this reason, one embodiment of the invention provides a kind of method of avoiding particulate to kick up and polluted in standard mechanical interface (SMIF) system, and it sets up a microparticle adsorption pad in the particulate accumulation area, to adsorb to fall particulate thereon, reduces kicking up of particulate.Please refer to Fig. 2 and Fig. 3, it is respectively the schematic diagram of particulate accumulation area and microparticle adsorption pad.And Fig. 4 is the schematic diagram that has the particulate accumulation area of microparticle adsorption pad.Then be the particulate accumulation area for the a-quadrant among Fig. 2 wherein, make microparticle adsorption pad S according to its size, it is invested particulate accumulation area A, thereby the particulate that is produced just can be adsorbed on the microparticle adsorption pad S pollution of having avoided particulate to kick up and caused when SMIF wafer load machine operates.Wherein microparticle adsorption pad S is for meeting the various adhesive tapes of semiconductor manufacturing (Fab) environment.
Simultaneously, one embodiment of the invention also provides a kind of standard mechanical interface (SMIF) equipment that reduces particle contamination, as: SMIF wafer load machine.It comprises a microparticle adsorption pad S, invests a particulate accumulation area A of this standard mechanical interface (SMIF) equipment, to adsorb to fall particulate thereon, reduces particulate and kicks up.The size of this microparticle adsorption pad S is suitable with the particulate accumulation area, can be made by the various adhesive tapes that meet semiconductor manufacturing (Fab) environment.
In sum, the present invention invests the particulate accumulation area with microparticle adsorption pad, with fall thereon particulate of absorption, influences the yield of manufacture of semiconductor environment and product thereby the particulate of avoiding kicking up drops on wafer surface; Avoided simultaneously by the SMIF wafer load machine of particle contamination and the mutual pollution between the two of SMIF wafer case, the time and the frequency of cleaning board have been reduced, only need in time to change according to the situation of microparticle adsorption pad adsorbent particles, both can shorten the clear time, also improve the running time of board greatly, increased the effective capacity of board.
Claims (8)
1. the standard mechanical interface equipment that can reduce particle contamination is characterized in that, comprising:
One particulate accumulation area; And
One microparticle adsorption pad invests above-mentioned particulate accumulation area.
2. the standard mechanical interface equipment that reduces particle contamination according to claim 1 is characterized in that, wherein above-mentioned microparticle adsorption pad is an adhesive tape that meets semiconductor fabrication environment.
3. the standard mechanical interface equipment that reduces particle contamination according to claim 1 is characterized in that, wherein the size of above-mentioned microparticle adsorption pad and particulate accumulation area is measure-alike.
4. the standard mechanical interface equipment that reduces particle contamination according to claim 1 is characterized in that, wherein above-mentioned particulate accumulation area is the base-plates surface of a standard mechanical interface wafer load machine.
5. a method of avoiding particulate to kick up and polluted in the standard mechanical interface system is characterized in that, comprising:
In the attached microparticle adsorption pad of a particulate accumulation area.
6. the method for avoiding particulate to kick up and polluted in the standard mechanical interface system according to claim 5 is characterized in that, wherein above-mentioned microparticle adsorption pad is the adhesive tape that meets semiconductor fabrication environment.
7. the method for avoiding particulate to kick up and polluted in the standard mechanical interface system according to claim 5 is characterized in that, wherein the size of above-mentioned microparticle adsorption pad and particulate accumulation area is measure-alike.
8. the method for avoiding particulate to kick up and polluted in the standard mechanical interface system according to claim 5 is characterized in that, wherein above-mentioned particulate accumulation area is the base-plates surface of a standard mechanical interface wafer load machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101724208A CN101465307B (en) | 2007-12-17 | 2007-12-17 | Standard mechanical interface equipment with microparticle adsorption pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101724208A CN101465307B (en) | 2007-12-17 | 2007-12-17 | Standard mechanical interface equipment with microparticle adsorption pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101465307A true CN101465307A (en) | 2009-06-24 |
| CN101465307B CN101465307B (en) | 2011-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101724208A Expired - Fee Related CN101465307B (en) | 2007-12-17 | 2007-12-17 | Standard mechanical interface equipment with microparticle adsorption pad |
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| CN (1) | CN101465307B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105891055A (en) * | 2016-05-12 | 2016-08-24 | 绍兴文理学院 | Particle sensitive detecting equipment using full-band variable structure working condition self-adaptive filtering |
| CN105891057A (en) * | 2016-05-12 | 2016-08-24 | 绍兴文理学院 | Double-excitation solenoid type particle sensitive detection device adopting full-band filtering |
| CN105910964A (en) * | 2016-05-12 | 2016-08-31 | 绍兴文理学院 | Double-excitation solenoid type particle sensing device adopting wave inhibiting |
| CN105973778A (en) * | 2016-05-12 | 2016-09-28 | 绍兴文理学院 | Variable structure working condition-adaptive filtration-based double-exciting solenoid particle sensing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6189238B1 (en) * | 1998-11-30 | 2001-02-20 | Lucent Technologies Inc. | Portable purge system for transporting materials |
| US6827218B1 (en) * | 2000-08-28 | 2004-12-07 | Sud-Chemie Inc. | Packaging container for electronic components |
| CN1649133A (en) * | 2004-01-30 | 2005-08-03 | 义隆电子股份有限公司 | Packaging structure and method for reducing photosensitive module to be polluted by microparticles |
| CN100437899C (en) * | 2006-01-27 | 2008-11-26 | 台湾积体电路制造股份有限公司 | Device for reducing the impurity in the processing environment and its method |
-
2007
- 2007-12-17 CN CN2007101724208A patent/CN101465307B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105891055A (en) * | 2016-05-12 | 2016-08-24 | 绍兴文理学院 | Particle sensitive detecting equipment using full-band variable structure working condition self-adaptive filtering |
| CN105891057A (en) * | 2016-05-12 | 2016-08-24 | 绍兴文理学院 | Double-excitation solenoid type particle sensitive detection device adopting full-band filtering |
| CN105910964A (en) * | 2016-05-12 | 2016-08-31 | 绍兴文理学院 | Double-excitation solenoid type particle sensing device adopting wave inhibiting |
| CN105973778A (en) * | 2016-05-12 | 2016-09-28 | 绍兴文理学院 | Variable structure working condition-adaptive filtration-based double-exciting solenoid particle sensing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101465307B (en) | 2011-06-15 |
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Granted publication date: 20110615 Termination date: 20181217 |