CN101463494A - 电镀方法 - Google Patents
电镀方法 Download PDFInfo
- Publication number
- CN101463494A CN101463494A CNA2007102032115A CN200710203211A CN101463494A CN 101463494 A CN101463494 A CN 101463494A CN A2007102032115 A CNA2007102032115 A CN A2007102032115A CN 200710203211 A CN200710203211 A CN 200710203211A CN 101463494 A CN101463494 A CN 101463494A
- Authority
- CN
- China
- Prior art keywords
- electro
- plating
- plating method
- matrix
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000009713 electroplating Methods 0.000 title claims description 39
- 238000007747 plating Methods 0.000 claims abstract description 64
- 239000011159 matrix material Substances 0.000 claims abstract description 55
- 239000011248 coating agent Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000002086 nanomaterial Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 34
- 229920000049 Carbon (fiber) Polymers 0.000 description 19
- 239000004917 carbon fiber Substances 0.000 description 19
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 18
- 230000005684 electric field Effects 0.000 description 10
- 239000002131 composite material Substances 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000006479 redox reaction Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000006255 coating slurry Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005501 phase interface Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
- 【权利要求1】一种电镀方法,其包括以下步骤:提供待进行电镀的基体,所述基体包括待进行电镀的第一部分及与第一部分相接的第二部分;于第二部分的表面形成导电层,所述导电层宽度等于或大于基体第一部分的宽度,并与第一部分相接;将第一部分的表面置于镀液中进行电镀,以于第一部分的表面形成电镀层,电镀进行过程中逐渐提升第一部分,使第一部分逐渐移出镀液。
- 【权利要求2】如权利要求1所述的电镀方法,其特征在于,所述基体为包含碳纤维材料或碳纳米材料的片状、丝状、膜状、棒状或具有一定长度结构。
- 【权利要求3】如权利要求1所述的电镀方法,其特征在于,所述基体采用塑料制成的具有一定长度的结构。
- 【权利要求4】如权利要求1所述的电镀方法,其特征在于,所述导电层通过于第二部分的表面涂覆导电材料形成。
- 【权利要求5】如权利要求4所述的电镀方法,其特征在于,所述导电材料为银、金、铜、镍、铝及其合金的导电浆料。
- 【权利要求6】如权利要求1所述的电镀方法,其特征在于,所述导电层通过于第二部分压合导电金属粉末而形成。
- 【权利要求7】如权利要求1所述的电镀方法,其特征在于,所述导电层通过于第二部分固定片状金属而形成。
- 【权利要求8】如权利要求1所述的电镀方法,其特征在于,所述第一部分被匀速提升。
- 【权利要求9】如权利要求1所述的电镀方法,其特征在于,电镀过程中采用的阴极的输出电流随第一部分浸入镀液中长度变化的减小量ΔI=vIo/L,其中v为第一部分提升速度,Io为阴极的初始输出电流,L为第一部分浸入镀液中的长度。
- 【权利要求10】如权利要求1所述的电镀方法,其特征在于,所述电镀方法进一步包括去除第二部分及导电层的步骤。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102032115A CN101463494B (zh) | 2007-12-19 | 2007-12-19 | 电镀方法 |
US12/164,429 US7998332B2 (en) | 2007-12-19 | 2008-06-30 | Electroplating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102032115A CN101463494B (zh) | 2007-12-19 | 2007-12-19 | 电镀方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101463494A true CN101463494A (zh) | 2009-06-24 |
CN101463494B CN101463494B (zh) | 2011-05-11 |
Family
ID=40787312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007102032115A Expired - Fee Related CN101463494B (zh) | 2007-12-19 | 2007-12-19 | 电镀方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7998332B2 (zh) |
CN (1) | CN101463494B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104357885A (zh) * | 2014-10-15 | 2015-02-18 | 中航飞机股份有限公司西安飞机分公司 | 一种轴类零件局部电镀铬的保护方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3142091C2 (de) * | 1981-10-23 | 1984-05-30 | Deutsche Automobilgesellschaft Mbh, 7000 Stuttgart | Verfahren zur Herstellung einer stabilen Verbindung zwischen einem Elektrodengerüst aus einem metallisierten Faserkörper und einer Stromableiterfahne |
CN1006306B (zh) * | 1987-06-24 | 1990-01-03 | 福建师范大学 | Abs塑料基二氧化铅电极的制造方法 |
CN1023414C (zh) * | 1989-10-27 | 1994-01-05 | 合肥工业大学 | 碳纤维连续镀铜的方法 |
CN1844481A (zh) * | 2006-03-09 | 2006-10-11 | 上海交通大学 | 短碳纤维的金属化处理方法 |
-
2007
- 2007-12-19 CN CN2007102032115A patent/CN101463494B/zh not_active Expired - Fee Related
-
2008
- 2008-06-30 US US12/164,429 patent/US7998332B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104357885A (zh) * | 2014-10-15 | 2015-02-18 | 中航飞机股份有限公司西安飞机分公司 | 一种轴类零件局部电镀铬的保护方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101463494B (zh) | 2011-05-11 |
US7998332B2 (en) | 2011-08-16 |
US20090159452A1 (en) | 2009-06-25 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20191219 |