CN101427427A - 一种由具有不同输出性能特征的激光器提供质量一致的靶材料去除的方法 - Google Patents
一种由具有不同输出性能特征的激光器提供质量一致的靶材料去除的方法 Download PDFInfo
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Abstract
激光脉冲能量调整是受对这样的影响的理解驱动的,即对不同激光器中激光脉冲宽度变化对满足与激光加工靶关联的质量衡量的影响。在优选实施例中,调整标准化靶样品中不同激光钻孔中脉冲宽度变化的影响。基于应用到孔位置的脉冲能量,传输到靶样品从而形成每个孔的激光脉冲的数量可改变,从而控制不同孔质量衡量。
Description
技术领域
[0001]本发明涉及使用激光器在电子材料产品的材料中钻孔或处理某些部分,特别涉及这样的技术,即,由具有不同操作输出参数的基于激光器的系统进行材料加工后形成一致的高质量钻孔或区域。
背景技术
[0002]激光器被用来在电子材料产品的材料,如具有或没有金属覆层的匀质薄膜、微粒填充的树脂、聚酰亚胺,和纤维增强聚合物中钻孔和烧蚀。固体UV激光器钻孔的现有技术是,例如,通过为所需工艺设定和控制激光脉冲功率和重复频率而设定和控制或监视激光脉冲能量。以这种方式使用高斯光束光学和成像光束光学配置。不同激光器中其他激光器输出性能特征改变,但仍保持在激光器规格内。在多激光器、多光束定位头、和多激光器系统中,激光器输出性能特征在规定限制内的变化可导致钻孔质量的差别,即使所有系统中采用同样工艺和相同的材料。特别地,激光器规格内参数的变化可引起底部铜覆层的残渣形成或不均匀熔化,特别对于钻盲孔的应用,这导致钻孔的质量差别。在这些应用中,在钻孔工艺中所采用的脉冲能量也可能影响孔锥度(孔底部直径对顶部直径的比率),以及底部铜覆层的质量。高质量盲孔是具有所需底部直径的孔,且从底部去除所有薄膜树脂材料从而露出闪亮的铜覆层斑点。
[0003]一般地,激光器加工的材料的质量参考由激光器加工设备客户所制定的鉴定标准。质量衡量对于不同的激光器加工操作是不同的。除了上面讨论的钻孔质量衡量,激光器输出对于电导连接割断、电阻性材料修整、厚或薄钝化元件的热退火、和衬底材料划割也有质量衡量。
[0004]对于连接割断的质量衡量决定了在割断连接过程中,激光输出与材料相互作用对包围连接和在连接下面的材料的操作损伤的程度。激光修整的质量衡量决定了由激光交互作用在电阻性材料去除过程中贡献的电光响应的最小化,以便对为了确定在电阻性材料修整过程何时达到规定的电阻值而执行的电气测量没有实质性影响。激光退火的质量衡量决定了应用到元件上的热分布的不一致性的程度,从而改变其一个特征参数。激光划割的质量衡量决定了划线槽边缘中微裂缝形成的最小化,该微裂缝是在切割过程中产生的碎屑导致的。这是测量激光器脉冲能量和被划割材料的烧蚀能量阈值之间的差异。
[0005]而且,脉冲能量的控制是不完美的,并受没有被该光学系统中能量控制装置标准化的短期瞬态的影响。脉冲能量中这样的偏差可引起孔控制衡量的不希望出现的变化。
[0006]因此,需要用于实现多激光器、多光束定位头、和多个基于激光的系统的激光器以一致的高质量钻孔和去除材料的技术。而且需要实现通过激光器一致地去除材料,在时间上,其输出性能特征在规定地限度内变化。
发明内容
[0007]本发明实现调整激光脉冲能量,从而解决不同激光器中激光脉冲宽度的变化引起的影响。激光脉冲能量调整是受对这样的影响的理解驱动的,即对不同激光器中激光脉冲宽度变化对满足与激光加工靶关联的质量衡量的影响。在优选实施例中,调整标准化靶样品中不同激光钻孔中脉冲宽度变化的影响。此外,基于应用到孔位置的脉冲能量,传输到靶样品从而形成每个孔的激光脉冲的数量可改变,从而控制不同孔质量衡量。
[0008]传统控制钻孔工艺的方法必须为给定工艺控制脉冲能量。用来执行给定工艺的脉冲能量EP是由该工艺所需的能量密度(fluence)F决定的。以J/cm2为单位,该能量密度可如下计算
其中是EP以J为单位的脉冲能量,D是以厘米为单位的孔直径。本申请人已经发现以相同的能量密度水平,具有不同脉冲宽度的激光器钻相同的材料导致不同的质量的靶样品的底部铜覆层。本申请人已经确定了更合适的参数来预测盲孔的底部铜覆层的质量,该参数为
[0009]本发明其他方面和优点将从优选实施例的下面详细说明中看出,该描述参考附图给出。
附图说明
[0010]图1是一组四个光显微图像,其示出在同样铜覆层的靶材上以不同激光器发射脉冲激光束,在相同的能量密度但不同脉冲宽度钻出的58微米直径盲孔的质量差异。
[0013]图5是曲线图,其示出孔锥度,该孔锥度作为在Model ABF介电靶材中以60kHz的重复频率和0.73J/cm2能量密度钻直径58微米盲孔的激光脉冲的数目的函数。
具体实施方式
[0014]本发明优选实施例需要使用固态UV激光器执行电路材料,如有或没有金属覆层的均匀膜,微粒填充的树脂,聚酰亚胺,和纤维增强的聚合物的钻孔和烧蚀。由日本kawasaki的Ajinomoto Fine-Techno Co.,Inc.制造的Model ABF电路板介电材料是靶材,下面的描述就是基于这种靶材。下面的描述是针对钻孔的,但本发明也可以应用至其他去除材料的方法,如连接割断、材料修整、退火、和划割。
[0015]图1是一组四个显微图像照片,其示出本发明解决的问题。图1示出两个58微米直径钻孔的光显微图片,该孔是以近似相同的能量密度级利用不同脉冲宽度的355纳米UV激光器钻至35微米到40微米深。顶部两个图片表示聚焦于靶材的上表面的盲孔图像,底部两个图片表示聚焦于孔底部的下部铜覆层的盲孔图像。(参数Pws表示工作表面上的激光器功率。)图1中左手侧和右手侧照片对的比较揭示出,以相同的能量密度水平,较短的脉冲宽度激光器A稍微熔化底部铜层,而较长的脉冲宽度激光器B仅从底部铜层上清除介电材料。激光器A和激光B器每个都发射355纳米光束。对于同样的能量密度水平的两个不同激光脉冲宽度,底部铜层的亮度显著不同。
[0017]图2和图3每个都是一组四个显微图像的图片,其示出本发明对激光钻孔质量的影响。图2和3中顶部两个图片和底部两个图片表示相应于图1中图片所用的相同聚焦深度。图2和图3示出盲孔的光显微图像,该盲孔是在相同的材料中以具有不同脉冲宽度的激光钻的,但比率而非F保持近似相等。底部图片示出对于激光器发射的不同脉冲宽度的脉冲,只要比率保持恒定,则底部铜层的表面质量是相似的。
[0018]认识到参数影响底部铜层质量,系统操作员可采取措施保持一组激光器中不同激光器的该参数恒定,从而提供更一致的激光加工。对于具有标准值,最小值,和最大值的脉冲宽度规格的激光器,一组激光器中不同的激光器可通过标准化该组激光器中每个激光器的比率而彼此标准化。一种实现标准化的方法需要相对额定脉冲宽度规格标准化所有激光器,这样所有激光器就如同它们中的每一个对于任意给定组的工艺参数都是标准脉冲宽度激光器那样钻孔。对于该脉冲宽度的影响,标准化激光器的等式是
其中FDrill是要在钻孔过程中使用的能量密度,Fnom是为给定工艺设定在激光器系统中的额定能量密度,τLaser是所使用的激光器的实际脉冲宽度,τnom是激光器的额定脉冲宽度规格。
[0019]在一个典型的过程中,操作员在系统输入装置中设定为给定加工操作规定的能量密度值。系统具有存储器存储先前输入的激光器参数数据。激光器系统软件自动地采用为给定工艺输入的参数并再次计算不同脉冲能量,从而满足参数与钻孔过程中需要使用的质量衡量一致,即,基于实际被使用的激光器的脉冲宽度的脉冲能量。同样方法也可用于校正脉冲宽度随着激光脉冲重复频率改变时的变化,从而导致以同样设定的能量密度和不同重复频率钻的孔有一致的孔质量。对于使用的单个激光器的脉冲宽度信息可以基于先前的测量输入到校准文件中或使用脉冲探测器实时地测量。
[0020]脉冲能量影响的标准化的基础通过图4和图5示出,其示出对于给定脉冲能量,孔锥度对脉冲数目的关系。特别地,图4示出入射到靶位置的最小数目的脉冲,从而实现75%的孔锥度。如图4所示,对于特定孔的平均脉冲能量的下降(导致的相应下降)可导致需要使用较大数目的脉冲从而产生所需的锥度比率。图5示出使用比所需数目小的锥度脉冲导致孔锥度低于所需锥度。为了补偿该脉冲能量减小,机器控制系统可实时检测给定孔的脉冲能量,并实时调整应用到该孔的脉冲数目,从而保持所需的锥度。如图5所示,对于给定例子,使用58个脉冲实现75%的孔锥度。额外的脉冲用来获得更好的孔底表面质量。脉冲的数目可以增加也可以减小,从而对于给定孔产生所需锥度,这取决于用于该孔的平均脉冲能量是否高于或低于设定的脉冲能量。
[0021]对于本领域技术人员来说,显然可以对上述实施例的细节做出许多改变而不偏离本发明的基本原理。本发明的范围应仅由下面的权利要求限定。
Claims (10)
1.一种一致地满足质量衡量的方法,该质量衡量是为由从一组激光器中不同激光器发出的激光输出脉冲加工的靶样品材料的区域规定的,在加工靶样品材料之前,激光输出脉冲特征为有由脉冲宽度和峰值功率值确定的额定脉冲能量值,该方法包括:
为靶样品材料被激光加工的区域规定质量衡量;和
调整激光输出脉冲的额定脉冲能量值,从而为该组中每个激光器建立调整的能量值,该能量值使由激光输出脉冲加工的靶样品材料的区域一致地满足所规定的质量衡量。
2.如权利要求1所述的方法,其中该组中每个激光器发射一系列激光输出脉冲,并进一步包括改变一个或多个激光器的系列中激光输出脉冲的数目,从而响应对于调整的能量值的偏离进行的检测,加工靶样品材料的相关区域。
3.如权利要求1所述的方法,其中激光加工靶样品材料从而在靶样品材料区域的一个区域中形成孔。
4.如权利要求3所述的方法,其中靶样品材料包括可烧蚀靶材料,其具有被金属覆层覆盖的主表面,且其中质量衡量中的一个衡量包括关于去除可烧蚀的靶材料从而形成孔的金属覆层的条件。
5.如权利要求1所述的方法,其中每个激光输出脉冲覆盖靶面积,且其中脉冲能量值的调整包括为该组中激光器确定表示规定的质量衡量的比率,其被表示为
其中F和τ分别是激光脉冲的能量密度和脉冲宽度。
6.一种一致地满足质量衡量的方法,该质量衡量是为由从一个激光器发出的激光输出脉冲加工的靶样品材料的区域规定的,该激光器在输出性能规格范围内运行,该激光器发射一系列输出脉冲,每个脉冲的特征是额定功率值和实际脉冲宽度,该方法包括:
规定质量衡量,该质量衡量是关于完成激光加工的靶样品材料的区域所满足的;和
乘以一个参数来比例激光输出脉冲的额定功率值,从而提供一系列具有比例能量值的输出脉冲来加工靶样品材料的区域,该参数得自激光脉冲的实际脉冲宽度。
7.如权利要求6的方法,其中具有比例能量值的激光脉冲每个覆盖靶面积,所述参数被表示为
其中F和τ分别是激光脉冲的能量密度和脉冲宽度。
8.如权利要求6的方法,其中激光加工靶样品材料从而在区域中形成孔。
9.如权利要求8的方法,其中靶样品材料包括可烧蚀靶材料,其具有被金属覆层覆盖的主表面,且其中质量衡量中的一个衡量包括关于去除可烧蚀的靶材料从而形成孔的金属覆层的条件。
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US11/131,432 US7985942B2 (en) | 2004-05-28 | 2005-05-17 | Method of providing consistent quality of target material removal by lasers having different output performance characteristics |
US11/131,432 | 2005-05-17 | ||
PCT/US2005/018676 WO2005119860A2 (en) | 2004-05-28 | 2005-05-26 | Method of providing consistent quality of target material removal by lasers having different output performance characteristics |
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CN101427427A true CN101427427A (zh) | 2009-05-06 |
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CN (1) | CN101427427B (zh) |
DE (1) | DE112005001225T5 (zh) |
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TW (1) | TWI357842B (zh) |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7605343B2 (en) * | 2006-05-24 | 2009-10-20 | Electro Scientific Industries, Inc. | Micromachining with short-pulsed, solid-state UV laser |
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Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2002A (en) * | 1841-03-12 | Tor and planter for plowing | ||
US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
GB2290411A (en) | 1994-06-15 | 1995-12-20 | Zeiss Stiftung | Laser and adapter for mounting it on a surgical microscope |
JPH1099980A (ja) | 1996-09-30 | 1998-04-21 | Toshiba Corp | 積層部材の加工方法 |
DE19734732A1 (de) | 1996-12-10 | 1998-06-18 | Wavelight Laser Technologie Gm | Vorrichtung für die Behandlung von Körpersubstanzen |
US6333485B1 (en) * | 1998-12-11 | 2001-12-25 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam |
WO2000060668A1 (de) | 1999-04-07 | 2000-10-12 | Siemens Solar Gmbh | Vorrichtung und verfahren zum abtragen von dünnen schichten auf einem trägermaterial |
US6229114B1 (en) * | 1999-09-30 | 2001-05-08 | Xerox Corporation | Precision laser cutting of adhesive members |
JP2002335063A (ja) * | 2001-05-09 | 2002-11-22 | Hitachi Via Mechanics Ltd | プリント基板の穴あけ加工方法および装置 |
TW503143B (en) * | 2000-10-06 | 2002-09-21 | Hitachi Via Mechanics Ltd | Method and apparatus for drilling printed wiring boards |
JP4634692B2 (ja) | 2001-01-31 | 2011-02-16 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザ処理方法 |
US6639177B2 (en) * | 2001-03-29 | 2003-10-28 | Gsi Lumonics Corporation | Method and system for processing one or more microstructures of a multi-material device |
US6864457B1 (en) | 2002-02-25 | 2005-03-08 | The Board Of Regents Of The University Of Nebraska | Laser machining of materials |
DE10209617C1 (de) | 2002-03-05 | 2003-08-07 | Siemens Ag | Laserbeschriftungsverfahren |
US6809291B1 (en) | 2002-08-30 | 2004-10-26 | Southeastern Universities Research Assn., Inc. | Process for laser machining and surface treatment |
JP2004114094A (ja) | 2002-09-26 | 2004-04-15 | Kyocera Corp | プリプレグシートのレーザによる穿孔方法 |
US6979798B2 (en) | 2003-03-07 | 2005-12-27 | Gsi Lumonics Corporation | Laser system and method for material processing with ultra fast lasers |
JP2006224174A (ja) | 2005-02-21 | 2006-08-31 | Sumitomo Heavy Ind Ltd | レーザ加工装置及びパルスエネルギのしきい値設定方法 |
-
2005
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WO2005119860A3 (en) | 2009-04-09 |
GB0623282D0 (en) | 2007-01-03 |
KR101147799B1 (ko) | 2012-05-18 |
TW200603930A (en) | 2006-02-01 |
WO2005119860A2 (en) | 2005-12-15 |
US7985942B2 (en) | 2011-07-26 |
GB2429422B (en) | 2008-06-11 |
TWI357842B (en) | 2012-02-11 |
JP2013099792A (ja) | 2013-05-23 |
US20050265408A1 (en) | 2005-12-01 |
JP2008515634A (ja) | 2008-05-15 |
KR20070019741A (ko) | 2007-02-15 |
DE112005001225T5 (de) | 2007-06-28 |
JP5635139B2 (ja) | 2014-12-03 |
GB2429422A (en) | 2007-02-28 |
CN101427427B (zh) | 2012-03-21 |
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