CN101416131A - 处理数据管理系统、处理系统、以及处理装置的数据管理方法 - Google Patents
处理数据管理系统、处理系统、以及处理装置的数据管理方法 Download PDFInfo
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- CN101416131A CN101416131A CNA2007800116307A CN200780011630A CN101416131A CN 101416131 A CN101416131 A CN 101416131A CN A2007800116307 A CNA2007800116307 A CN A2007800116307A CN 200780011630 A CN200780011630 A CN 200780011630A CN 101416131 A CN101416131 A CN 101416131A
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- 238000012545 processing Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 69
- 238000013523 data management Methods 0.000 title claims description 24
- 230000008569 process Effects 0.000 claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 claims abstract description 28
- 238000005070 sampling Methods 0.000 claims abstract description 26
- 230000008859 change Effects 0.000 claims description 16
- 238000013480 data collection Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 238000004458 analytical method Methods 0.000 claims description 7
- 230000033228 biological regulation Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000004364 calculation method Methods 0.000 abstract description 6
- 238000013500 data storage Methods 0.000 abstract description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 20
- 238000010891 electric arc Methods 0.000 description 13
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Images
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/85—Coating a support with a magnetic layer by vapour deposition
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Physical Vapour Deposition (AREA)
- Testing And Monitoring For Control Systems (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP101212/2006 | 2006-03-31 | ||
JP2006101212A JP5177958B2 (ja) | 2006-03-31 | 2006-03-31 | 処理データ管理システム、磁気ディスク製造装置用の処理システム、および、磁気ディスク製造装置のデータ管理方法 |
PCT/JP2007/057087 WO2007114332A1 (ja) | 2006-03-31 | 2007-03-30 | 処理データ管理システム、処理システム、および、処理装置のデータ管理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101416131A true CN101416131A (zh) | 2009-04-22 |
CN101416131B CN101416131B (zh) | 2011-09-28 |
Family
ID=38563599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800116307A Active CN101416131B (zh) | 2006-03-31 | 2007-03-30 | 处理数据管理系统、处理系统、以及处理装置的数据管理方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8862259B2 (zh) |
JP (1) | JP5177958B2 (zh) |
CN (1) | CN101416131B (zh) |
MY (1) | MY151420A (zh) |
WO (1) | WO2007114332A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009251874A (ja) * | 2008-04-04 | 2009-10-29 | Nec Corp | 時系列データ保存装置および時系列データ保存方法 |
CN102479285B (zh) * | 2010-11-23 | 2014-06-18 | 上海市电力公司 | 一种用于电能质量的暂降特征量的计算方法 |
DE102011006989A1 (de) * | 2011-04-07 | 2012-10-11 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung und System zur Bestimmung, Optimierung oder Überwachung zumindest einer Prozessgröße |
CN102932277B (zh) * | 2012-10-12 | 2015-05-13 | 深信服网络科技(深圳)有限公司 | 数据缓存方法及系统 |
US9958863B2 (en) * | 2012-10-31 | 2018-05-01 | General Electric Company | Method, system, and device for monitoring operations of a system asset |
JP2015023202A (ja) * | 2013-07-22 | 2015-02-02 | パナソニック株式会社 | ガスレーザ発振装置 |
US10316823B2 (en) * | 2017-03-15 | 2019-06-11 | Inventus Holdings, Llc | Wind turbine group control for volant animal swarms |
EP4068023A4 (en) * | 2019-11-27 | 2023-08-09 | Kabushiki Kaisha Yaskawa Denki | PRODUCTION SYSTEM INFORMATION COLLECTION DEVICE, INFORMATION COLLECTION METHOD AND PROGRAM |
Family Cites Families (33)
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JPH11162851A (ja) * | 1997-11-25 | 1999-06-18 | Hitachi Ltd | 半導体装置の製造方法および半導体製造装置 |
US6338777B1 (en) * | 1998-10-23 | 2002-01-15 | International Business Machines Corporation | Method and apparatus for sputtering thin films |
JP3178449B2 (ja) * | 1999-01-22 | 2001-06-18 | 株式会社日立製作所 | 磁気ディスクの製造方法 |
US6636818B1 (en) * | 1999-09-15 | 2003-10-21 | Becton, Dickinson And Company | Systems, methods and computer program products for constructing sampling plans for items that are manufactured |
US20010050220A1 (en) * | 1999-11-16 | 2001-12-13 | Applied Materials, Inc. | Method and apparatus for physical vapor deposition using modulated power |
US6871112B1 (en) * | 2000-01-07 | 2005-03-22 | Advanced Micro Devices, Inc. | Method for requesting trace data reports from FDC semiconductor fabrication processes |
EP1220529A3 (en) | 2000-12-28 | 2003-06-25 | Seiko Epson Corporation | System and method for generating logo data, and data storage medium |
JP4805469B2 (ja) * | 2001-03-30 | 2011-11-02 | 芝浦メカトロニクス株式会社 | 成膜装置および成膜装置用プログラム |
US6772034B1 (en) * | 2001-07-12 | 2004-08-03 | Advanced Micro Devices, Inc. | System and software for data distribution in semiconductor manufacturing and method thereof |
KR100571116B1 (ko) * | 2001-09-28 | 2006-04-13 | 시바우라 메카트로닉스 가부시키가이샤 | 스퍼터링용 전원 장치 |
FR325790A (fr) * | 2002-03-28 | 1903-05-08 | Kempshall Eleazer | Balle perfectionnée pour le jeu de golf |
US7981257B2 (en) * | 2002-04-12 | 2011-07-19 | Schneider Electric USA, Inc. | Current-based method and apparatus for detecting and classifying arcs |
US6736944B2 (en) * | 2002-04-12 | 2004-05-18 | Schneider Automation Inc. | Apparatus and method for arc detection |
US7247221B2 (en) * | 2002-05-17 | 2007-07-24 | Applied Films Corporation | System and apparatus for control of sputter deposition process |
JP3866615B2 (ja) * | 2002-05-29 | 2007-01-10 | 株式会社神戸製鋼所 | 反応性スパッタリング方法及び装置 |
US20050236266A1 (en) * | 2002-06-19 | 2005-10-27 | Poole John E | Sputter target monitoring system |
AU2003251542A1 (en) * | 2002-07-03 | 2004-01-23 | Tokyo Electron Limited | Method for dynamic sensor configuration and runtime execution |
CH707868B1 (de) * | 2002-08-02 | 2014-10-31 | Oblamatik Ag | Kapazitive Sensorvorrichtung und Installationen mit einer solchen Sensorvorrichtung. |
KR20050058374A (ko) * | 2002-08-20 | 2005-06-16 | 도쿄 일렉트론 가부시키가이샤 | 데이터 콘텍스트 기반 데이터 처리방법 |
US6741941B2 (en) * | 2002-09-04 | 2004-05-25 | Hitachi, Ltd. | Method and apparatus for analyzing defect information |
EP1546827A1 (en) * | 2002-09-30 | 2005-06-29 | Tokyo Electron Limited | Method and apparatus for the monitoring and control of a semiconductor manufacturing process |
JP2004186445A (ja) * | 2002-12-03 | 2004-07-02 | Omron Corp | モデル化装置及びモデル解析方法並びにプロセス異常検出・分類システム及びプロセス異常検出・分類方法並びにモデル化システム及びモデル化方法並びに故障予知システム及びモデル化装置の更新方法 |
WO2004101844A1 (en) * | 2002-12-18 | 2004-11-25 | Cardinal Cg Company | Plasma-enhanced film deposition |
CN1570885A (zh) * | 2003-07-21 | 2005-01-26 | 万国电脑股份有限公司 | 具备最佳化压缩管理机制的储存装置 |
JP4174399B2 (ja) * | 2003-09-24 | 2008-10-29 | 株式会社東芝 | 検査システム,検査方法,及び電子装置の製造方法 |
JP4495960B2 (ja) * | 2003-12-26 | 2010-07-07 | キヤノンItソリューションズ株式会社 | プロセスと品質との関係についてのモデル作成装置 |
WO2005077024A2 (en) * | 2004-02-06 | 2005-08-25 | Test Advantage, Inc. | Methods and apparatus for data analysis |
TWI336823B (en) * | 2004-07-10 | 2011-02-01 | Onwafer Technologies Inc | Methods of and apparatuses for maintenance, diagnosis, and optimization of processes |
US7477960B2 (en) * | 2005-02-16 | 2009-01-13 | Tokyo Electron Limited | Fault detection and classification (FDC) using a run-to-run controller |
US20070038889A1 (en) * | 2005-08-11 | 2007-02-15 | Wiggins Robert D | Methods and systems to access process control log information associated with process control systems |
US7580768B2 (en) * | 2006-09-22 | 2009-08-25 | Texas Instruments Deutschland Gmbh | Method of adjusting process variables in a processing flow |
US7778797B2 (en) * | 2006-09-28 | 2010-08-17 | Fisher-Rosemount Systems, Inc. | Method and system for detecting abnormal operation in a stirred vessel |
US7765020B2 (en) * | 2007-05-04 | 2010-07-27 | Applied Materials, Inc. | Graphical user interface for presenting multivariate fault contributions |
-
2006
- 2006-03-31 JP JP2006101212A patent/JP5177958B2/ja active Active
-
2007
- 2007-03-30 CN CN2007800116307A patent/CN101416131B/zh active Active
- 2007-03-30 MY MYPI20083908 patent/MY151420A/en unknown
- 2007-03-30 WO PCT/JP2007/057087 patent/WO2007114332A1/ja active Application Filing
- 2007-03-30 US US12/295,617 patent/US8862259B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8862259B2 (en) | 2014-10-14 |
MY151420A (en) | 2014-05-30 |
JP2007270337A (ja) | 2007-10-18 |
JP5177958B2 (ja) | 2013-04-10 |
CN101416131B (zh) | 2011-09-28 |
WO2007114332A1 (ja) | 2007-10-11 |
US20090287335A1 (en) | 2009-11-19 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Wd Meida Singapore Pte Ltd. Assignor: HOYA Corporation|HOYA magnetics Ltd Contract record no.: 2010990000897 Denomination of invention: Processing data management system, processing system and data management method for processing device License type: Exclusive License Open date: 20090422 Record date: 20101111 |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HOYA MAGNETICS CO., LTD. |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111010 Address after: Tokyo, Japan, Japan Patentee after: HOYA Corporation Address before: Tokyo, Japan, Japan Co-patentee before: Hoya Magnetics Singapore Pte. Ltd. Patentee before: HOYA Corporation |