CN101409227A - Plasma treatment system as well as cooling device and method thereof - Google Patents
Plasma treatment system as well as cooling device and method thereof Download PDFInfo
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- CN101409227A CN101409227A CNA2008102251776A CN200810225177A CN101409227A CN 101409227 A CN101409227 A CN 101409227A CN A2008102251776 A CNA2008102251776 A CN A2008102251776A CN 200810225177 A CN200810225177 A CN 200810225177A CN 101409227 A CN101409227 A CN 101409227A
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Abstract
The invention discloses a cooling device which is used for cooling a workpiece in a plasma processing system. The cooling device comprises a cooling chamber containing the workpiece. Cooling gas enters into the cooling chamber or is discharged out of the cooling chamber by a gas inlet valve and a drain tap respectively. The cooling device also comprises a heat exchanger used for reducing the temperature of the cooling gas in the cooling chamber. The invention also discloses a plasma processing system which comprises the cooling device and a method for cooling the workpiece in the plasma processing system. The temperature of the cooling gas can be reduced by the heat exchanger, so that the heat of the workpiece is absorbed, but the cooling gas still can keep the original low temperature state and can keep large temperature difference with the workpiece, and the workpiece can be cooled fast. At the same time, a reaction chamber can be filled with proper amount of the cooling gas, therefore, the cooling gas consumption is reduced obviously, and the use cost of the plasma processing system can be reduced.
Description
Technical field
The present invention relates to microelectronics technology, particularly relate to a kind of cooling device that is used for plasma process system.The invention still further relates to a kind of plasma process system that comprises above-mentioned cooling device, and a kind of cooling means that is used for plasma handling system.
Background technology
Plasma process system has been widely used in microelectronics technology.
Please refer to Fig. 1, Fig. 1 is a kind of structural representation of plasma process system.
Plasma process system 1 has adjacent successively loading chamber 11, preheating chamber 12, reaction chamber 13 and cooling chamber 14, and the substrate carrier plate 16 that has loaded workpiece 17 passes through above-mentioned each chamber successively under the drive of support plate conveyer (for example transfer roller group of being made up of some transfer rollers 15).Certainly, plasma process system 1 also can have other specific constructive form.
Can in the reaction chamber under being in vacuum state 13, import gas, and import suitable radio frequency to activate described gas, like this, can produce and keep plasma environment on the surface of workpiece 17 to reaction chamber 13.Owing to have strong etching and deposit ability, physical-chemical reactions such as etching or deposit can take place with workpiece 17 in described plasma, to obtain needed etching figure or illuvium.The accessory substance of above-mentioned physical-chemical reaction is extracted out from reaction chamber 13.
Because above-mentioned technical process is to finish under higher temperature (for example 300 ℃ to 500 ℃), so technical process is finished back workpiece 17 should be cooled to the suitable temperature (usually less than 100 ℃) that unloads in cooling chamber 14.Workpiece 17 completion of discharge meron support plates 16 can reclaim also by automatic Handling device and come into operation again; The dotted line of band arrow has schematically shown the moving line of substrate carrier plate 16 in the whole technical process among the figure.
Usually can accelerate workpiece 17 coolings by refrigerating gas.Can be connected cooling air pipe respectively with the bottom at the top of cooling chamber 14, as shown in Figure 1, node a can be communicated with the cooling source of the gas, and is connected in series intake valve 141 in admission line.Node b can be connected with exhaust gas processing device, is used for discharging refrigerating gas from cooling off chamber 14; The discharge duct air valve 142 that can run in.
In order to shorten the spent time of cooling link to improve the operating efficiency of plasma process system 1 integral body, can in the temperature-fall period of workpiece 17, continue in cooling chamber 14, to import refrigerating gas, and discharge described refrigerating gas constantly, like this, can keep the bigger temperature difference between refrigerating gas and the workpiece 17, heat exchange efficiency is therefore higher.For the cleanliness factor that keeps cooling chamber 14 and the oxidation of associated components in the cooling chamber 14, adopt higher high-purity nitrogen of price or argon gas usually as refrigerating gas; Therefore, though it is very fast to continue to import the refrigerating gas cooling rate in cooling chamber 14, because refrigerating gas does not make full use of, its spent cost is higher.
In addition, the temperature of the refrigerating gas that heat exchange finishes is higher, go forward side by side the end of line gas disposal in discharging process with extracting out in its autoreaction chamber 13, associated conduit and equipment (for example pump) all need to carry out thermal protection to be handled, so also cause whole system comparatively complicated, the cost of plasma process system 1 also further raises.
Therefore, how workpiece being cooled off with fast speeds by lower cost, is the present technical issues that need to address of those skilled in the art.
Summary of the invention
The purpose of this invention is to provide a kind of cooling device that is used for plasma process system, expend the cooling that more a spot of refrigerating gas can be realized workpiece apace.Another object of the present invention provides a kind of plasma process system that comprises above-mentioned cooling device, and a kind of method of cooling off workpiece in the plasma process system.
For solving the problems of the technologies described above, the invention provides a kind of cooling device, be used for the cooling of plasma process system workpiece, comprise the cooling chamber that holds described workpiece, refrigerating gas enters or discharges described cooling chamber by air intake valve, drain tap respectively; Described cooling device further comprises the heat exchanger that is used for reducing described cooling chamber refrigerating gas temperature.
Further, described cooling device also comprises the circulation air path that is communicated with described cooling chamber, and is located at the power set in the described circulation air path; Described refrigerating gas is circulating in described circulation air path and described cooling chamber under the effect of described power set.
Further, the air inlet of described circulation air path is positioned at the bottom of described cooling chamber, and the air outlet of described circulation air path is positioned at the top of described cooling chamber.
Further, described heat exchanger is arranged in the described circulation air path.
Further, the temperature of heat transferring medium or flow can be adjusted in the described heat exchanger.
The present invention also provides a kind of plasma process system, comprises above-mentioned each described cooling device.
Cooling device provided by the present invention has increased the heat exchanger that is used to reduce the refrigerating gas temperature, like this, on the one hand, cause has trend of rising with the temperature that workpiece carries out the described refrigerating gas of heat exchange, and described but then heat exchanger can maintain original low-temperature condition with described refrigerating gas.Therefore, after described air intake valve and drain tap are closed, still can keep the bigger temperature difference between refrigerating gas in the cooling device provided by the present invention and the workpiece, thereby form bigger cooling gradient, heat exchanger effectiveness between described refrigerating gas and the described workpiece can maintain higher level, described workpiece thereby can be cooled off fast.Simultaneously, can close described air intake valve charge into an amount of refrigerating gas in described reaction chamber after, and needn't continue to import refrigerating gas, therefore the amount of expending of refrigerating gas significantly reduces; This obviously will reduce the use cost of plasma process system.
In another embodiment, described cooling device also comprises the circulation air path that is communicated with described cooling chamber, and described refrigerating gas can circulate in described circulation air path and described cooling chamber under the effect of power set.As everyone knows, the heat convection efficient of fluid and heat exchange object is subjected to the influence of rate of flow of fluid bigger; Rate of flow of fluid is big more, and heat convection efficient is high more.Therefore, described refrigerating gas circulates the heat radiation that can significantly accelerate described workpiece; Also help described refrigerating gas simultaneously and shift heat to described heat exchanger, and the temperature contrast of eliminating the refrigerating gas each several part.Described workpiece thereby can realize lowering the temperature more rapidly.
The present invention also provides a kind of method of cooling off workpiece in the plasma process system, reduces the temperature of described workpiece by the refrigerating gas in the cooling chamber; In the temperature-fall period of described workpiece, described refrigerating gas is closed in the fixing space, and reduces the temperature of described refrigerating gas by heat exchanger.
Further, in the temperature-fall period of described workpiece, described refrigerating gas flows in described cooling chamber.
Further, described cooling chamber further is connected with circulation air path; In the temperature-fall period of described workpiece, described refrigerating gas circulates in described cooling chamber and circulation air path.
Further, described refrigerating gas is by the cools down that is arranged in the described circulation air path.
Cooling means provided by the present invention carries out by heat exchanger described refrigerating gas being cooled off in the heat exchange between refrigerating gas and workpiece.Like this, can keep the higher temperature difference between described refrigerating gas and the described workpiece, thereby form bigger cooling gradient, so that the heat exchanger effectiveness between described refrigerating gas and the described workpiece can maintain higher level, described workpiece thereby can be cooled off fast.Simultaneously, owing to described refrigerating gas is closed in the described reaction chamber, so the amount of expending of refrigerating gas significantly reduces in the cooling procedure, helps reducing the use cost of plasma process system.
In another embodiment, refrigerating gas described in the cooling procedure constantly flows in described cooling chamber.The heat radiation of described workpiece can be significantly accelerated in constantly flowing of described refrigerating gas; Also help described refrigerating gas simultaneously and shift heat to described heat exchanger, and the temperature contrast of eliminating the refrigerating gas each several part.The temperature-fall period of described workpiece thereby can further be shortened.
Description of drawings
Fig. 1 is a kind of structural representation of plasma process system;
Fig. 2 is the structural representation of the present invention's cooling device that a kind of embodiment provides.
Embodiment
Core of the present invention provides a kind of cooling device that is used for plasma process system, expends the cooling that more a spot of refrigerating gas can be realized workpiece apace.Another core of the present invention provides a kind of plasma process system that comprises above-mentioned cooling device, and a kind of method of cooling off workpiece in the plasma process system.
In order to make those skilled in the art person understand the present invention program better, the present invention is described in further detail below in conjunction with the drawings and specific embodiments.
Please refer to Fig. 2, the structural representation of the present invention's cooling device that a kind of embodiment provides.
In a kind of embodiment, the main part of cooling device provided by the present invention is a cooling chamber 21, and cooling chamber 21 is adjacent with the reaction chamber of plasma process system usually; Finish corresponding technical process in described reaction chamber after, support plate 4 and the workpiece 3 that is carried thereof can enter in the cooling chamber 21 from described reaction chamber under the drive of transmitting device 5.
Node d is communicated with the refrigerating gas source of the gas, therefore can carry refrigerating gas in cooling chamber 21 by corresponding passage.Be connected in series air intake valve 22 in the passage between node d and the cooling chamber 21, obviously, can control the break-make of refrigerating gas by air intake valve 22.The import of refrigerating gas is arranged at the top of cooling chamber 21 usually.
Node c can be communicated with air-extractor, so that refrigerating gas is discharged from cooling off in the chamber 21; Be connected in series drain tap 23 in the passage between node c and the cooling chamber 21.Cooperation control by air intake valve 22 and drain tap 23 can make cooling device provided by the present invention switch in different operating states.
Can open air intake valve 22 and close drain tap 23,, then air intake valve 22 be closed with an amount of refrigerating gas of input in cooling chamber 21; This moment, refrigerating gas was closed among the cooling chamber 21.
Because have the bigger temperature difference between the workpiece 3 in refrigerating gas and the cooling chamber 21, the heat of workpiece 3 can constantly pass to refrigerating gas, thereby the temperature that may cause refrigerating gas self constantly rises.If let alone this situation, along with the rising of refrigerating gas temperature and the continuous reduction of workpiece 3 temperature, both temperature difference reduce gradually, and heat exchange efficiency will significantly reduce, temperature-fall period also will expend the more time, be unfavorable for that plasma treatment is the raising of efficient.
For fear of the appearance of above-mentioned rough sledding, cooling device provided by the present invention further comprises heat exchanger 24.
In any case, protection scope of the present invention should not be subjected to heat exchanger 24 particular type, the restriction of position and set-up mode is set.
Because cooling device provided by the present invention has increased heat exchanger 24, though its temperature has trend of rising behind the heat of refrigerating gas absorption workpiece 3, heat exchanger 24 can absorb the heat of refrigerating gas, thereby it is maintained original low-temperature condition.Therefore, even without new refrigerating gas mend into, still can keep the bigger temperature difference between refrigerating gas in the cooling device provided by the present invention and the workpiece 3, thereby form bigger cooling gradient, heat exchanger effectiveness between refrigerating gas and the workpiece 3 can maintain higher level, workpiece 3 thereby can be cooled off fast.
Simultaneously, in cooling chamber 21, charge into and to close air intake valve 22 behind an amount of refrigerating gas and stop to import refrigerating gas, so the amount of expending of refrigerating gas significantly reduces; This obviously will reduce the use cost of plasma process system.
Can improve cooling device mentioned above.
As shown in Figure 2, circulation air path 29 can be set further, the two ends of circulation air path 29 all are communicated with cooling chamber 21; Obviously, its both ends open should keep suitable distance, to avoid the refrigerating gas short circuit.
The effect of circulation air path 29 is to make refrigerating gas constantly circulation in the process of cooling workpiece 3, does the heat exchange efficiency that can significantly improve refrigerating gas and workpiece 3 like this.Rate of flow of fluid is big more, and the heat convection efficient of itself and heat exchange object is high more.Therefore, refrigerating gas circulate the heat radiation that can significantly accelerate workpiece 3, further shorten cooling time, improve the whole efficiency of plasma processing.In addition, circulating of refrigerating gas also helps its heat exchanger 24 transfer heats, and helps suppressing the temperature generation difference of each several part in the refrigerating gas, finally helps workpiece 3 to realize cooling more rapidly.
The circulation of refrigerating gas is to realize that by the power set that are arranged in the circulation air path 29 described power set specifically can be pump or blower fan, can select roots blower for use usually.
The air inlet of circulation air path 29 can be opened in the middle position of cooling chamber 21 bottoms, the air intake of circulation air path 29 also can with the exhaust duct partial common of cooling chamber 21; Can in the circulation intake stack, be connected in series circulation air intake valve 27.The air outlet of circulation air path 29 can be opened in the middle position at cooling chamber 21 tops, and the outlet air end of circulation air path 29 can be connected in series circulation air intake valve 28.Air inlet, air outlet are provided with in the manner described above and are beneficial to refrigerating gas and form comparatively desirable air-flow distribute in cooling chamber 21, and the air-flow that makes progress in the footpath of workpiece 3 is comparatively even.
Certainly, the air inlet of circulation air path 29, the air outlet sidewall or other positions that are opened in cooling chamber 21 also is fine.
Can further heat exchanger 24 be arranged in the circulation air path 29, can make the heat transfer process of refrigerating gas and heat exchanger 24 more abundant like this, help keeping the temperature difference of refrigerating gas and workpiece 3.
The dotted line of band arrow has schematically shown the flow path of refrigerating gas in cooling chamber 21 and circulation air path 29 among Fig. 2.
Heat transferring medium in the heat exchanger 24 can adopt water, liquid nitrogen, but is not limited thereto.The flow of heat transferring medium or temperature preferably can be adjusted in the heat exchanger 24, all can satisfy the requirement of refrigeration load like this at different temperature-fall periods.For example, the flow of heat transferring medium can be adjusted by the change of valve port opening.
Plasma process system provided by the present invention comprises above-mentioned each described cooling device.The structure of other each several parts of plasma process system please refer to Fig. 1 and describes with its corresponding character, and prior art; This paper repeats no more.
The present invention also provides a kind of method of cooling off workpiece in the plasma process system.In this method, workpiece 3 is in the cooling chamber 21, and imports an amount of refrigerating gas in cooling chamber 21; Then cooling chamber 21 is sealed, and reduce the temperature of workpiece 3 by the lower refrigerating gas of temperature.In the temperature-fall period of workpiece 3, method provided by the present invention also reduces the temperature of refrigerating gas by heat exchanger 24.That is, the temperature of workpiece 3 is reduced by refrigerating gas on the one hand, and the temperature of refrigerating gas is reduced by heat exchanger 24 on the other hand; These two processes are carried out substantially simultaneously.
Like this, can keep the higher temperature difference between refrigerating gas and the workpiece 3, thereby form bigger cooling gradient, so that the heat exchanger effectiveness between refrigerating gas and the workpiece 3 can maintain higher level, workpiece 3 thereby can be cooled off fast.Simultaneously, owing to refrigerating gas is closed in the cooling chamber 21, so the amount of expending of refrigerating gas significantly reduces in the cooling procedure, helps reducing the use cost of plasma process system.
Can further improve said method, promptly in the temperature-fall period of workpiece 3, refrigerating gas be flowed in cooling chamber 21.
Perhaps, can be with cooling chamber 21 further communication loop air channels 29; In the temperature-fall period of workpiece 3, refrigerating gas can circulate in cooling chamber 21 and circulation air path 29.
In aforementioned two sections improvement that literal provided any one all can make refrigerating gas constantly flow in cooling chamber 21, and this can significantly accelerate the heat radiation of workpiece 3, and helps cold gas to shifting heat with heat exchanger 24; The temperature-fall period of workpiece 3 thereby can further be shortened.
Should guarantee the temperature of the refrigerating gas that in time efficiently temperature raise and reduce again; Therefore, can further heat exchanger 24 be arranged in the circulation air path 29, can make the heat transfer process of refrigerating gas and heat exchanger 24 more abundant and rapid like this, help stably keeping the temperature difference of refrigerating gas and workpiece 3.
Can be with reference to above about description and Fig. 2 of cooling device provided by the present invention, so that understand the method for workpiece in the cooling plasma process system provided by the present invention more accurately.
More than to plasma process system provided by the present invention, its cooling device, and the method for workpiece is described in detail in the cooling plasma process system.Used specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof.Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention, can also carry out some improvement and modification to the present invention, these improvement and modification also fall in the protection range of claim of the present invention.
Claims (10)
1, a kind of cooling device, be used for the cooling of plasma process system workpiece, comprise the cooling chamber that holds described workpiece, refrigerating gas enters or discharges described cooling chamber by air intake valve, drain tap respectively, it is characterized in that, further comprise the heat exchanger that is used for reducing described cooling chamber refrigerating gas temperature.
2, cooling device as claimed in claim 1 is characterized in that, further comprises the circulation air path that is communicated with described cooling chamber, and is located at the power set in the described circulation air path; Described refrigerating gas is circulating in described circulation air path and described cooling chamber under the effect of described power set.
3, cooling device as claimed in claim 2 is characterized in that, the air inlet of described circulation air path is positioned at the bottom of described cooling chamber, and the air outlet of described circulation air path is positioned at the top of described cooling chamber.
4, cooling device as claimed in claim 2 is characterized in that, described heat exchanger is arranged in the described circulation air path.
5, cooling device as claimed in claim 1 is characterized in that, the temperature of heat transferring medium or flow can be adjusted in the described heat exchanger.
6, a kind of plasma process system is characterized in that, comprises as each described cooling device of claim 1 to 5.
7, a kind of method of cooling off workpiece in the plasma process system, reduce the temperature of described workpiece by the refrigerating gas in the cooling chamber, it is characterized in that, in the temperature-fall period of described workpiece, described refrigerating gas is closed in the fixing space, and reduces the temperature of described refrigerating gas by heat exchanger.
8, the method for workpiece in the cooling plasma process system as claimed in claim 7 is characterized in that, in the temperature-fall period of described workpiece, described refrigerating gas flows in described cooling chamber.
9, the method for workpiece in the cooling plasma process system as claimed in claim 7 is characterized in that described cooling chamber further is connected with circulation air path; In the temperature-fall period of described workpiece, described refrigerating gas circulates in described cooling chamber and circulation air path.
10, the method for workpiece in the cooling plasma process system as claimed in claim 9 is characterized in that described refrigerating gas is by the cools down that is arranged in the described circulation air path.
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| CNA2008102251776A CN101409227A (en) | 2008-10-30 | 2008-10-30 | Plasma treatment system as well as cooling device and method thereof |
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| CNA2008102251776A CN101409227A (en) | 2008-10-30 | 2008-10-30 | Plasma treatment system as well as cooling device and method thereof |
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| CN101988191A (en) * | 2010-12-01 | 2011-03-23 | 东莞宏威数码机械有限公司 | Substrate unloading device and unloading method thereof |
| WO2011079699A1 (en) * | 2009-12-29 | 2011-07-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and plasma enhanced chemical vapor deposition system for removing film contamination produced during working process |
| CN102154630A (en) * | 2010-09-30 | 2011-08-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for manufacturing plasma reaction chamber, method for manufacturing and equipment and parts of same and method for treating substrate |
| CN101901739B (en) * | 2009-05-25 | 2012-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate cooling method, substrate cooling system and substrate processing device |
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| CN101901739B (en) * | 2009-05-25 | 2012-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate cooling method, substrate cooling system and substrate processing device |
| WO2011079699A1 (en) * | 2009-12-29 | 2011-07-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and plasma enhanced chemical vapor deposition system for removing film contamination produced during working process |
| CN102154630A (en) * | 2010-09-30 | 2011-08-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for manufacturing plasma reaction chamber, method for manufacturing and equipment and parts of same and method for treating substrate |
| CN101988191A (en) * | 2010-12-01 | 2011-03-23 | 东莞宏威数码机械有限公司 | Substrate unloading device and unloading method thereof |
| CN101988191B (en) * | 2010-12-01 | 2012-05-16 | 东莞宏威数码机械有限公司 | Substrate unloading device and unloading method thereof |
| US9530656B2 (en) | 2011-10-07 | 2016-12-27 | Lam Research Corporation | Temperature control in RF chamber with heater and air amplifier |
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| US10825661B2 (en) | 2011-10-07 | 2020-11-03 | Lam Research Corporation | Systems for cooling RF heated chamber components |
| US11495441B2 (en) | 2011-10-07 | 2022-11-08 | Lam Research Corporation | Systems for cooling RF heated chamber components |
| US11887819B2 (en) | 2011-10-07 | 2024-01-30 | Lam Research Corporation | Systems for cooling RF heated chamber components |
| CN104078301B (en) * | 2013-03-27 | 2016-08-24 | 朗姆研究公司 | There is the temperature in the rf tank of heater and air amplifier control |
| CN104078301A (en) * | 2013-03-27 | 2014-10-01 | 朗姆研究公司 | Temperature control in rf chamber with heater and air amplifier |
| TWI623960B (en) * | 2013-03-27 | 2018-05-11 | 蘭姆研究公司 | Semiconductor manufacturing apparatus and method for processing the same |
| CN106191818A (en) * | 2016-09-08 | 2016-12-07 | 北京精诚铂阳光电设备有限公司 | A kind of LPCVD coating process later stage substrate cooling system |
| CN108718476A (en) * | 2018-08-15 | 2018-10-30 | 烟台海灵健康科技有限公司 | A kind of arc plasma generator of installation plasma heat sink |
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Open date: 20090415 |