CN101398619B - 压印装置 - Google Patents
压印装置 Download PDFInfo
- Publication number
- CN101398619B CN101398619B CN2008102114410A CN200810211441A CN101398619B CN 101398619 B CN101398619 B CN 101398619B CN 2008102114410 A CN2008102114410 A CN 2008102114410A CN 200810211441 A CN200810211441 A CN 200810211441A CN 101398619 B CN101398619 B CN 101398619B
- Authority
- CN
- China
- Prior art keywords
- chamber
- substrate
- soft mode
- chamber shell
- imprinting apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070098097A KR100898146B1 (ko) | 2007-09-28 | 2007-09-28 | 기판에 식각 영역을 만들기 위한 장치 |
KR10-2007-0098097 | 2007-09-28 | ||
KR1020070098097 | 2007-09-28 | ||
KR1020070117545 | 2007-11-16 | ||
KR10-2007-0117545 | 2007-11-16 | ||
KR1020070117545A KR100916298B1 (ko) | 2007-11-16 | 2007-11-16 | 기판에 식각 영역을 만들기 위한 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101398619A CN101398619A (zh) | 2009-04-01 |
CN101398619B true CN101398619B (zh) | 2012-04-04 |
Family
ID=40517253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008102114410A Expired - Fee Related CN101398619B (zh) | 2007-09-28 | 2008-09-22 | 压印装置 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100898146B1 (ko) |
CN (1) | CN101398619B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103257473B (zh) * | 2013-06-03 | 2016-06-15 | 郴州市晶讯光电有限公司 | 一种有减振器的液晶显示屏撒粉装置 |
CN105034344B (zh) * | 2015-06-01 | 2017-09-29 | 青岛博纳光电装备有限公司 | 一种大面积纳米压印软模具复制装置及方法 |
CN107238957A (zh) * | 2017-08-02 | 2017-10-10 | 业成科技(成都)有限公司 | 贴合设备及其贴合方法 |
JP7066559B2 (ja) * | 2018-07-13 | 2022-05-13 | 東京エレクトロン株式会社 | 接合装置および接合方法 |
CN114505817B (zh) * | 2022-03-11 | 2024-04-19 | 深圳市凯威达电子有限公司 | 一种智能照明驱动芯片生产用可精准定位的插接装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100685922B1 (ko) * | 2002-03-25 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | 액정표시소자용 합착 장치 |
KR100550803B1 (ko) * | 2004-06-17 | 2006-02-09 | 주식회사 에이디피엔지니어링 | 플라즈마 식각장비 |
KR101147098B1 (ko) * | 2005-06-30 | 2012-05-17 | 엘지디스플레이 주식회사 | 미세 패턴 형성 장치 및 이를 이용한 미세 패턴 형성방법 |
JP4470923B2 (ja) * | 2006-08-02 | 2010-06-02 | 株式会社日立プラントテクノロジー | 基板組立て装置 |
-
2007
- 2007-09-28 KR KR1020070098097A patent/KR100898146B1/ko not_active IP Right Cessation
-
2008
- 2008-09-22 CN CN2008102114410A patent/CN101398619B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20090032666A (ko) | 2009-04-01 |
CN101398619A (zh) | 2009-04-01 |
KR100898146B1 (ko) | 2009-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: WEIHAI DIANMEISHI OPTO-MECHATRONICS CO., LTD. Free format text: FORMER OWNER: DISPLAY PRODUCTION SERVICE CO., LTD. Effective date: 20140226 |
|
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: 264205 WEIHAI, SHANDONG PROVINCE |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140226 Address after: 264205 Shandong city in Weihai Province, its economic and Technological Development Zone Road No. 88-1 Patentee after: Weihai dianmei Shiguang electromechanical Co Ltd Address before: Gyeonggi Do, South Korea Patentee before: Display Production Service Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120404 Termination date: 20180922 |