CN101394989A - Imprinting mold and method of imprinting - Google Patents

Imprinting mold and method of imprinting Download PDF

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Publication number
CN101394989A
CN101394989A CNA2007800073621A CN200780007362A CN101394989A CN 101394989 A CN101394989 A CN 101394989A CN A2007800073621 A CNA2007800073621 A CN A2007800073621A CN 200780007362 A CN200780007362 A CN 200780007362A CN 101394989 A CN101394989 A CN 101394989A
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Prior art keywords
pattern
mould
face
transferred
mentioned
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Chinese (zh)
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桥本和信
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Pioneer Corp
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Pioneer Corp
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855Coating only part of a support with a magnetic layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/40Plastics, e.g. foam or rubber
    • B29C33/405Elastomers, e.g. rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds

Abstract

An imprinting mold for, through pressing of a pattern formed on a flexible mold surface against transfer printing layer (5) superimposed on transfer printing substrate (4), effecting pattern transfer onto the transfer printing layer (5), which imprinting mold comprises weight member (3) enclosed at a center portion within flexible mold (1). Thus, when a pattern forming plane is directed downward in the vertical direction, elastic deformation of the pattern forming plane into a protrudent curved surface occurs, so that at transfer printing, the mold (1) from its extreme apex is brought into contact with the transfer printing substrate (4) to thereby enable avoiding of air bubble mixing into the transfer printing surface.

Description

Imprint mold and method for stamping
Technical field
The present invention relates to imprint mold and method for stamping.
Background technology
Stamping technique can form meticulous pattern with low cost, therefore is desirably in disk, semiconductor, device (laser instrument, optical waveguide etc.), the retrofit parts of MEMS (microelectromechanical systems), NEMS (nanoelectronic mechanical system) etc., the indicator of new generation etc. and is used.
Stamping technique is to be transferred coating resin material on the substrate, pushes the mould that is formed with relief pattern on this resin bed, handles or heat cooling processing that resin bed is solidified by UV, and mould is peeled off from resin bed, forms pattern on resin bed.In the soft lithography of one of stamping technique, use PDMS elastomers such as (dimethyl silicone polymers) to replace die hards such as quartz, silicon as soft mold.
In the above-mentioned stamping technique, be smooth owing to formed the face of pattern, therefore, contact area increases when pushing mould on the resin bed on substrate, might sneak into bubble between substrate and the mould, and it is extremely important for normally impressing to get rid of this influence.
In the compression molding device in the past, be by solving transfer printing bad (with reference to patent documentation 1) with vacuumizing, reduce pressure, form the froth breaking environment around the shaping mould, the equipment of vacuum plant must being arranged.
In order to form pattern with high precision, in patent documentation 2, the plastic medium that will be formed with protuberance is fixed on the other curved surface shape surface of elastomer, makes medium follow elastomeric distortion and flexural deformation by applying mechanical external force, and control is transferred the opportunity that contacts of substrate and medium.But this must make the medium that is formed with protuberance and it further is fixed on curved surface shape surface of elastomer, needs numerous and diverse step.
Open in the patent documentation 3: for high accuracy and easily carry out peeling off the step of mould from being transferred substrate, use crooked mould, like this, the substrate that is shaped as warpage with respect to mould during applying restores to the original state when peeling off, and peels off easily.But, in such formation,, must make separately smooth mould and crooked baseplate-laminating, and the relief pattern of institute's transfer printing not the pattern of smooth mould, and become the pattern of bending mould in order to make the mould bending, be difficult to carry out meticulous and high-precision transfer printing.
Patent documentation 1: TOHKEMY 2003-48728 communique
Patent documentation 2: TOHKEMY 2004-17409 communique
Patent documentation 3: TOHKEMY 2004-288845 communique (paragraph 0031-0033)
Summary of the invention
In the problem that the present invention will solve, the problems referred to above are examples.
The object of the present invention is to provide and prevent that bubble from sneaking into the imprint mold and the method for stamping of transfer surface.
Imprint mold of the present invention according to claim 1, be that the pattern that will form on the surface of rubber-like mould presses on the imprint mold that carries out transfer printing on the layer that is transferred that is forming on the substrate, it is characterized in that: the different zone of proportion is set in the inside of above-mentioned mould, make pattern form the surface elastic distortion, thereby pressing on above-mentionedly when being transferred on the layer, above-mentioned pattern forms face and plays contact successively by the regulation position in its face.
Method for stamping of the present invention is as described in the claim 5, be to form figuratum mold compresses in the method for stamping that carries out transfer printing on the layer that is transferred that is forming on the substrate on the rubber-like surface, it is characterized in that: the different zone of proportion is set in the inside of above-mentioned mould, make pattern form the surface elastic distortion, make pattern form face and push contiguously successively from the regulation position in its face.
The accompanying drawing summary
Fig. 1 is the schematic diagram of the soft mold of embodiment of the present invention 1, (a) is sectional view, (b) is front elevation.
Fig. 2 (a)-(c) is the figure that the imprint step of soft mold shown in Figure 1 is used in explanation.
Fig. 3 (a)-(e) is the figure of the preparation method of explanation soft mold shown in Figure 1.
Fig. 4 is the figure that is used to illustrate the distortion of soft mold shown in Figure 1.
Fig. 5 is the substrate and the figure that is transferred the relief intensity of substrate that is used to illustrate soft mold shown in Figure 1.
Fig. 6 is the schematic diagram of the soft mold of embodiment of the present invention 2, (a) is sectional view, (b) is front elevation.
Fig. 7 is the schematic diagram of the soft mold of embodiment of the present invention 3, (a) is sectional view, (b) is front elevation.
Fig. 8 is the figure of expression disk with an example of pattern.
Fig. 9 (a)-(e) is the figure that is used to illustrate the step for preparing disk.
Figure 10 (f)-(l) is the figure that is used to illustrate the step for preparing disk.
Figure 11 is the flow process of the step of preparation disk.
Symbol description
1 mould
2 substrates
3 Weight type parts
4 are transferred substrate
5 resin beds
6 master toolings
7 is framed
11 servo pattern parts
12 form the data track part of pattern
100 substrates keep body
102 moulds keep body
105 are transferred layer (resin bed)
106 hard mask layers
107 record retes
108 recording medium substrates
109 nonmagnetic substances
110 lubricating layers
111 protective layers
The best mode that carries out an invention
Below, with reference to accompanying drawing embodiment of the present invention are described.Below exemplifying in the explanation do not limit the present invention.
(embodiment 1)
Below, adopt Fig. 1-Fig. 5 that embodiment of the present invention 1 are described.
Fig. 1 is the schematic diagram of the mould of the present embodiment, (a) is sectional view, (b) is front elevation.
Mould 1 shown in Figure 1 is the rubber-like soft mold, for example by PDMS formations such as (dimethyl silicone polymers), is formed with relief pattern 1a on its rubber-like surface.Mould 1 keeps its back side by the substrate (mould holding member) 2 that is made of quartz or Si (silicon) etc.The proportion Weight type parts 3 bigger than die ontology (elastomer) are contained in the inside of mould 1.That is,, form the different zone of proportion at mould inside by interior bag Weight type parts 3.Weight type parts 3 are rectangular shape, are configured in the middle body of 1 of square dies.
Details as described later, the pattern formation face of mould 1 is a tabular surface, this face is adjusted to the surface irregularity that can correctly reproduce pattern under this smooth state.That is, by being pressed in smooth substrate surface, then its binding face is smooth with rubber-like mould 1, and therefore, under the state at this moment, pattern is adjusted to predetermined live width/arrangement.In the mould 1 of above-mentioned formation, as shown in Figure 1, make pattern formation face be vertically downward state, then rubber-like mould 1 bears the effect of gravity, by wrapping in middle body in the Weight type parts 3, middle body is deformed into the convex curved surface shape of slow bending to vertical direction below protuberance to the radial direction outer elastic by the part of this protuberance.The proportion that is considered to Weight type parts 3 to the reason of vertical direction below protuberance than surround these Weight type parts 3, form mould 1 elastomeric than great, the effect of for example bearing gravity, Weight type parts 3 are absorbed in the male mold part of mould 1.Under this state, if with mould 1 by being pressed in being transferred on the layer on the substrate, then Long Qi middle body at first contacts, then to peripheral direction expansion, contact successively.Finally, convex curved surface reproduces along the even shape of the surface configuration that is transferred layer.Here, in the present embodiment, for the middle body that is formed face by pattern begins contact, bag Weight type parts 3 in the middle body of mould 1, but,, then should wrap Weight type parts 3 in the position at position mutually if wish that pattern forms face and begins contact by other position.That is, wrap in the Weight type parts 3 and wish and be transferred the corresponding position, regulation position that layer at first contacts.
Like this, by interior bag Weight type parts 3, make the pattern of mould 1 form surface elastic to be deformed into convex curved surface, be transferred on the layer by being pressed in this state, be not whole but partly begin contact, so can prevent to carry bubble secretly at contact-making surface with the smooth layer that is transferred by the small size at top.
Fig. 2 is the figure that the imprint step of above-mentioned soft mold is used in explanation.Among Fig. 2, the pattern form of soft mold omits.
Be transferred layer a 5-resin bed as being transferred coating resin material on the substrate 4 of substrate, forming.Substrate 4 can use silicon wafer, quartz base plate, aluminium base or the substrate etc. of laminated semiconductor layer, magnetosphere or strong dielectric layer etc. on these substrates.The resin that formation is transferred layer 5 can use PMMA thermoplastic resins such as (polymethyl methacrylates) or PAK-01 UV curable resins such as (ProductName, Toyo Synthetic Industry Co., Ltd.'s preparations) etc.Form under the face state vertically downward at the pattern that makes mould 1, mould 1 is relative close with substrate 4.At this moment, mould 1 is owing to the Weight type parts 3 of interior bag form by the convex curved surface (Fig. 2 (a)) of middle body to the radial direction outside curve.
Therefore, the top of the flexure plane of mould 1 at first contacts with being transferred layer 5, contacts (Fig. 2 (b)) successively to peripheral direction then.Thus, can prevent to sneak into bubble in the transfer surface, push mould 1 (Fig. 2 (c)).Step afterwards is not shown, when being transferred layer 5 for thermoplastic resin, heats cooling processing, makes resin solidification.Perhaps, when being transferred layer 5, make resin solidification by the UV processing for the UV curable resin.After making resin solidification like this, mould 1 is peeled off from being transferred substrate 4.At this moment, be surrounded by Weight type parts 3 in the middle body, therefore peel off successively to middle body, can peel off easily and swimmingly by peripheral part.
Then, adopt Fig. 3 that the preparation method of soft mold is described.Fig. 3 is that the figure of PDMS as the preparation method of the soft mold of mold materials used in explanation.
Clean forming the figuratum master tooling 6 that for example contains the silicon raw sheet, implement the demoulding and handle, framed 7 (Fig. 3 (a)) of encirclement pattern are set in the periphery of master tooling 6.The framed 7 interior PDMS1 (Fig. 3 (b)) that are mixed with curing agent that flow into of this master tooling 6.Weight type parts 3 (Fig. 3 (c)) are set in PDMS1.Under this state, on PDMS1, place substrate 2, at room temperature place, make PDMS1 solidify (Fig. 3 (d)).Then, peel off the mould 1 (Fig. 3 (e)) that forms with PDMS from master tooling 4.
Among Fig. 3 (b), Weight type parts 3 are arranged at the middle body that pattern forms face, are arranged at the middle body of the thickness direction of PDMS1, make the PDMS normal temperature cure in this position, keep Weight type parts 3.Then as shown in Figure 1, the pattern of mould 1 is formed face vertically downward, be surrounded by the middle body protuberance of Weight type parts 3 in then, strain is the convex curvature face to the outside curve of radial direction.
Like this, by forming soft mold, can be at the pattern formation face of mould smooth state, promptly with the state that is transferred baseplate-laminating under, verily reproduce the shape of caster.Therefore, push with the state of bending, also can under this state, correctly reproduce the pattern of wanting transfer printing by being pressed in the upward smooth state of formation of layer that be transferred even the pattern of mould forms face.
Here, the preparation method of soft mold has exemplified an example that flows into the mould making method of PDMS, normal temperature cure in framed, also can use elastomer precursor, adopts curings such as heat cure, photocuring, normal temperature cure to prepare them.In addition, forming method of patterning at die surface also can be by processing method processing graphic patterns such as cuttings after mold cured.
Then, the pattern to soft mold forms face because the strain that the Weight type parts cause is described in detail.
Soft mold must have the elasticity of the appropriateness of the pattern form that fully remains on its surface formation, and, owing to use with writing board shape usually, can not think and contain the Weight type parts, when overall proportion is even, only can is not extending terrifically at thickness direction/be out of shape with the elasticity of soft mold itself.Therefore, the poor λ of the elongation in the zone (Y of Fig. 4) of the zone of interior bag Weight type parts (X of Fig. 4) and not interior bag Weight type parts can represent (with reference to Fig. 4) approx with the fundamental formular (1) of coefficient of elasticity.
λ=P×L/(E×A) (1)
P: the load that the Weight type parts bring
L: the thickness of soft mold
E: the coefficient of elasticity of soft mold
A: the sectional area of Weight type parts
Soft mold be transferred substrate (strictly say be transferred layer) when contacting, consider the process of sneaking into bubble between mould-substrate, if the poor λ of the elastomeric elongation that the Weight type parts bring than the back side of the relief intensity hw on substrate 4 surfaces and soft mold, promptly fixedly the relief intensity hc sum (hw+hc) (with reference to Fig. 5) on substrate 2 surfaces of soft mold is big, then is expected to prevent sneaking into of air in the contact process.Here, relief intensity hw and hc be the zone directly related with transfer printing, be mould with the surface area that is transferred substrate contacts in relief intensity.
It is formulated, and then in order to make soft mold bring into play function effectively, condition is the relation establishment that draws following formula (2) from (1) formula.
P×L/(E×A)>hw+hc (2)
For example, use the PDMS soft mold that forms on quartz base plate, the condition when impressing on the Si wafer is as follows.
The relief intensity of Si wafer: 5[μ m]
The relief intensity of quartz base plate: 5[μ m]
The shape of soft mold: wide 10[cm], thick 5[mm]
The coefficient of elasticity of PDMS: 2.5[MPa]
At this moment, according to formula (2), can derive 1cm by following formula 2Load (P/A).
P/A>(hw+hc)×E/L
P[Kgf]/A[cm 2]>(0.0005+0.0005)[cm]×0.255[Kgf/cm 2]/0.5[cm]
=0.0005[Kgf/cm 2]=0.5[gf/cm 2]
In the above-mentioned condition, as an example, adopting the length of side is square iron (the proportion 7.85[g/cm of 1cm 3]) during as the Weight type parts,
0.5/7.85[cm]=0.064[cm]=640[μm],
Therefore at 1cm 2Nei Neibao thickness gets final product greater than the iron plate of 640 μ m.
It is square gold (the proportion 19.3[g/cm of 1cm that the Weight type parts adopt the length of side 3]) time,
0.5/19.3[cm]=0.026[cm]=260[μm],
Therefore at 1cm 2Bag thickness gets final product greater than the gold foil of 260 μ m in the inherent soft mold.
Equally, adopting the length of side is quartzy (the proportion 2.5[g/cm of square of 1cm 3]) during as the Weight type parts,
0.5/2.5[cm]=0.20[cm]=2[mm],
Therefore at 1cm 2Nei Neibao thickness gets final product greater than the quartz of 2mm.
As mentioned above, according to the present embodiment, the pattern formation face of mould forms the convex curved surface of middle body protuberance, with mould with to be transferred laminating fashionable, pattern forms face and is contacted gradually to the radial direction outside by middle body, therefore can prevent to sneak in the transfer surface bubble.In addition, during the mould transfer printing, it is smooth that pattern forms face, with the surface irregularity formation same with master tooling, the pattern precision of mould in the time of therefore can well keeping transfer printing.In addition, therefore the curve form on soft mold surface can not need to apply the mechanism of external force owing to interior bag Weight type parts form.
Mould of the present invention is not limited to above-mentioned embodiment, so long as by the different zone of proportion is set in the rubber-like mould, the mould that makes pattern form the surface elastic distortion gets final product.
Mould makes pattern form face generation strain by the different zone of proportion is set in elastomer, can reduce contact area with being transferred when layer beginning to contact at mould, can prevent to sneak in the transfer surface bubble.In addition, on being transferred layer the time, the mould strain is out of shape along the surface configuration that is transferred layer, therefore the surface irregularity that can correctly regulate pattern with mold compresses.
The pattern of the surface irregularity that the pattern of mould forms face by mould forms face and regulates with the shape that to be transferred laminating fashionable, even form facial disfigurement owing to difference in specific gravity causes the pattern of mould, mould be transferred the pattern that also can correctly reproduce mould under the state that laminating closes, therefore correct pattern transfer can be transferred on the layer.
As mould in the past, when pattern formation face was smooth, the area that begins to contact was big, has bubble to sneak into the problem of transfer surface easily.Therefore, by the different zone of proportion is set, the pattern of mould forms the crooked shapes such as inclined plane that facial disfigurement is convex curved surface or end protuberance, when beginning to contact, mould be transferred the layer contact with small size, enlarge contact area afterwards gradually, close simultaneously, carry out mould and the applying that is transferred layer on one side bubble is got rid of at the top that can be on one side forms the curved shape of face by pattern towards periphery with being transferred laminating.
The deformed shape that the pattern that the different zone of proportion is set and forms forms face is the convex shape with contact angle to a certain degree with respect to being transferred real estate preferably, can also be bigger protuberance to be arranged forming on the vertical direction of face than the relief volume at the mould back side and the summation that is transferred the relief volume of substrate surface, can get rid of the influence that mould and the fluctuating that is transferred substrate produce thus with pattern.
The elastomeric material that constitutes above-mentioned mould is not limited to above-mentioned formation, can use so-called elastomer, for example have: organic siliconresin, carbamate resins, natural rubber, SBR (butadiene/styrene copolymers), NBR (butadiene/acrylonitrile copolymer), CR (polychloroprene), BR (polybutadiene), IR (polyisoprene) or fluororesin etc., wherein preferred organic siliconresin and carbamate resins, preferred especially organic siliconresin.And, consider that from the easiness of Mold Making preferably by the organic siliconresin of curing agent curing, above-mentioned resin for example has PDMS.
The peripheral shape of mould of the present invention is not limited to above-mentioned square, the mould that can adopt shape and object product to be fit to.In the making of for example semiconductor, device, MEMS, NEMS etc., can adopt square mould, in the making of for example disk, CD etc., can adopt circular mould.
Weight type parts of the present invention are not limited to above-mentioned formation, as long as can form the zone of different specific weight in mould.When this regional proportion is bigger than the elastomer that constitutes mould, if pattern forms face vertically downward, mould formation face protuberance that then should the zone; Pattern forms face vertically upward, and mould formation face depression that then should the zone makes pattern form facial disfigurement.On the contrary, this regional proportion is than the elastomer that constitutes mould hour, and the load in the zone that this regional load ratio only is made of mould is little, therefore, if pattern forms face vertically downward, then should the zone forms the concavity shape than mould formation face depression; Pattern forms face vertically upward, then should swell in the zone, makes pattern form facial disfigurement.Mould has elasticity, so pattern forms the part slow distortion of face from this region deformation, the formation curved shape.
The Weight type configuration of components is not limited to the middle body of die face, can adopt suitable position according to the shape that is transferred layer or substrate, transfer printing process.In addition, be not limited to circle/square mould,, also can control the contact position that is transferred layer and mould by change Weight type configuration of components position for the more complicated mould of shape.
The shape of Weight type parts is not particularly limited, and except that above-mentioned rectangular shape, sphere, circle, ellipse, thin sheet form etc. is arranged.
Above-mentioned Weight type parts are as long as formed by the heavy material of proportion than mould itself (elastomer).The Weight type parts do not have to mold materials preferably that burn into decomposes, harmful effect such as rotten, and can not be subjected to the dysgenic materials such as burn into oxidation, dissolving from mold materials.For example have: quartz, iron, gold etc., but be not limited to this.If use UV permeability materials such as quartz in the Weight type parts, then UV permeability PDMS mould and quartz base plate can be made up equally, the formation that the UV permeability of taking mold integral can variation improves reliability in UV cured type nano impression method.
Except that the Weight type parts,, for example can disperse the great powder of quartzy geometric ratio to form above-mentioned zone by the specific region in mould as heavy zone in the mould.By above-mentioned zone, can more critically regulate the curved shape on the pattern formation face of mould.
(embodiment 2)
Below, with Fig. 6 embodiment of the present invention 2 are described.For adopting same-sign, omit its explanation with the same formation of above-mentioned embodiment 1.
Soft mold shown in Figure 6 is in above-mentioned embodiment 1, an example of change Weight type configuration of components and shape, and at the edge, one side of square soft mold, the Weight type parts 3 of band shape in the outside of pattern 1a.
During impression, form under the face state vertically downward at the pattern of soft mold 1, by Weight type parts 3 are set, with respect to soft mold 1 side shifting downwards relatively itself, one end of soft mold 1 is swelled towards the below, form the shape that slowly tilts to the other end by an end.Under this state, soft mold 1 is contacted with being transferred layer by vertical direction top, soft mold 1 is begun to contact gradually by an end and is transferred layer, so can impress under the situation that bubble is sneaked into preventing.Afterwards, soft mold 1 is raised, peeled off soft mold 1.
(embodiment 3)
Below, with Fig. 7 embodiment of the present invention 3 are described.For adopting same-sign, omit its explanation with the same formation of above-mentioned embodiment 1.
Soft mold shown in Figure 7 is under pattern formation face maintenance state vertically upward, is pushed by the top and is transferred constituting of substrate, in the neighboring of square soft mold 1, is surrounded by Weight type parts 3 in the outside of pattern 1a all around.Thus, the neighboring of mould tilts downwards, and the middle body of soft mold 1 swells relatively, forms slowly crooked convex curved surface shape towards its radial direction outside.
Make to be transferred substrate and soft mold is relatively close under this state, then soft mold contact with being transferred layer by the top of central authorities, then towards the contact gradually of the radial direction outside, so can prevent to be transferred sneaking into of bubble in the face.
Above-mentioned formation can be in technology fixing soft mold one side, therefore, can be undertaken that UV handles or the heating cooling processing by soft mold one side by simple formation.
As described above, imprint mold of the present invention is that the pattern that the surface at the rubber-like mould forms is pressed on the imprint mold that carries out transfer printing on the layer that is transferred that is forming on the substrate, by inside the different zone of proportion is set at above-mentioned mould, make pattern form face generation strain, thereby press on above-mentioned when being transferred on the layer, above-mentioned pattern forms face and is contacted successively by regulation position in the face, therefore mould is begun to contact with being transferred parts by small size when transfer printing, can prevent that bubble from sneaking in the transfer surface.
Method for stamping of the present invention is to form figuratum mold compresses in the method for stamping that carries out transfer printing on the layer that is transferred that is forming on the substrate on the rubber-like surface, at above-mentioned mould inside the different zone of proportion is set, make pattern form the surface elastic distortion, pattern formation face is risen successively by the position of stipulating in its face to be pushed contiguously, therefore mould is begun to contact with being transferred parts by small size when transfer printing, can prevent that bubble from sneaking in the transfer surface.
At last, with reference to Fig. 8-Figure 11, the gimmick of using mould shown in Figure 11 preparation disk is described.
At first, Fig. 8 represents an example of the pattern form that forms in the disk die for preparation tool.As shown in Figure 8, the pattern formation face of mould 1 is formed with concavo-convex corresponding to the data track part 11 that forms pattern, servo pattern part 12.Particularly the pattern corresponding to the data track part 11 that forms pattern is with the fine pattern of certain interval about the about 25nm that forms on whole.In recent years, day by day the disk of high capacity to be equivalent to density for formation be 500Gbpsi (gigabit/inch 2) above, particularly the superfine pattern of the high area recording density about 1-10Tbpsi is effective.Therefore, formed the mould of the pattern of about 25nm bit interval, can make the high density patterns recording medium that packing density is approximately 1Tbpsi by use.Above-mentioned fine pattern is preferably drawn formation by the electron beam that can form high fine pattern.
Then, use mould 1, the step for preparing disk is described with the pattern that exemplifies among Fig. 8.Fig. 9 and Figure 10 are the figure that schematically shows each step, and Figure 11 is its flow chart.
At first, in step S101, shown in Fig. 9 (a), prepare recording medium that chemically reinforced glass, Si wafer, aluminium sheet, other material by special processing constitute with substrate 108 (preparation of substrate 108).Then, on substrate 108, write down the film forming (formation of record rete 107) of rete 107 by sputter etc.During for perpendicular magnetic recording medium, form the laminated structure of soft magnetic underlayer, intermediate layer, ferromagnetism recording layer etc.Then, on record rete 107, form the hard mask layers 106 (formation of hard mask layers 106) of Ta or Ti etc. by sputter etc.Again by the method for being coated with etc. on hard mask layers 106 the coating UV curable resin as transfer materials (being transferred the formation of layer 105).
In step S102, shown in Fig. 9 (b), soft mold 1 is installed in (installation of mould on mould maintenance body) on the mould holding member 102.Afterwards, be installed in again in the imprinting apparatus, make the pattern of mould 1 form face with remain on substrate on the substrate holder 100 be transferred layer 105 (installation on imprinting apparatus) toward each other.At this moment, carrying out mould keeps body 102 and substrate to keep the position adjustments (position adjustments) of the horizontal direction of body 100.
Among the step S103, substrate near mould 1, is formed face with the pattern of mould 1 and is transferred on the layer 105 (Fig. 9 (c)) by being pressed in.The back side one side irradiation UV light (wavelength 300-400nm) from mould 1 solidifies UV curable resin (being transferred layer 105), then substrate is peeled off from mould 1, and thus, pattern is transferred and is being transferred on the layer 105 (Fig. 9 (d)).
Among the step S104, the substrate for taking out from imprinting apparatus uses O 2The residual film (removing of residual film) that is transferred layer 105 is removed in the soft ashing of gas etc. etc.Thus, the remaining pattern that is transferred layer 105 becomes the etching mask (Fig. 9 (e)) that is used for etching hard mask layers 106.
In step S105, shown in Figure 10 (f), use CHF 3Gas etc. carry out the etching of hard mask layers 106, form pattern on hard mask layers 106.Shown in Figure 10 (g), carry out wet method processing or ashing etc. then, remove remaining etching mask (being transferred layer 105) (on hard mask layers 106, forming pattern).
In step S106, shown in Figure 10 (h), as etching mask, use Ar gas etc. to carry out dry ecthing the hard mask layers 106 that formed pattern, forming pattern (on record rete 107, forming pattern) on the record rete 107.Shown in Figure 10 (i), carry out wet method processing or dry ecthing then, remove residual hard mask layers 106.
In step S107, shown in Figure 10 (j), by sputter or coating, imbedding nonmagnetic substance 109 at the recess on the surface of writing down rete 107 (when being magnetic recording media, is SiO 2Deng nonmagnetic substance (imbedding of nonmagnetic substance 109).
In step S108, shown in Figure 10 (k), by etching or chemical polishing etc., lapped face makes its smooth (planarization).Thus, recording materials form the structure of being separated by non-record material.
In step S109, shown in Figure 10 (1), carry out CVD or sputter, the sealer 111 of formation carbon etc. is again by further lubricating layers 110 (surface treatment) that forms such as infusion processes.
Prepare disk as mentioned above with fine pattern structure, at last, it is installed in the hard disk drive of have the magnetic disk media drive system (Spindle Motor, rotation Drive and Control Circuit etc.) and magnetic information read write device (magnetic head, suspension arrangement, error correction circuit etc.), finishes magnetic recording system.
Even soft mold of the present invention also can prevent sneaking into of bubble when the fine pattern of transfer printing about 25nm as shown in Figure 8, simultaneously, with the state of baseplate-laminating under can reproduce predetermined pattern, therefore can the high accuracy pattern transferring.In addition, pattern formation face contacts gradually when pushing mould, and also is to break away from gradually when breaking away from, and therefore can prevent the generation of pattern inversion, disengaging etc.
More than specific embodiments of the present invention is illustrated, only otherwise depart from the scope of the present invention then and can carry out various distortion, this is conspicuous for commonsense in the art personnel.Therefore, technical scope of the present invention is not only limited to above-mentioned embodiment institute restricted portion, should be determined by claim scope and the scope that is equal to it.

Claims (5)

1. imprint mold, this imprint mold is that the pattern that the surface at the rubber-like mould forms is pressed on the imprint mold that carries out transfer printing on the layer that is transferred that is forming on the substrate, it is characterized in that: the different zone of proportion is set in the inside of above-mentioned mould, make pattern form face generation strain, thereby pressing on above-mentionedly when being transferred on the layer, above-mentioned pattern forms face and is contacted successively by the regulation position in its face.
2. the described imprint mold of claim 1 is characterized in that: the pattern of the surface irregularity that the pattern of above-mentioned mould forms face by above-mentioned mould forms face and the above-mentioned shape that is transferred baseplate-laminating is regulated.
3. claim 1 or 2 described imprint molds is characterized in that: it is smooth that the pattern of above-mentioned mould forms face, and by above-mentioned zone is set, this pattern formation face bends.
4. each described imprint mold among the claim 1-3, it is characterized in that: the load (P/A) of the above-mentioned mould unit are that above-mentioned zone causes is in the represented scope of following formula:
P/A>(hw+hc)×E/L
P: the load that bring in the zone
A: the sectional area in zone
Hw: the relief intensity that is transferred substrate surface
Hc: the relief intensity at the mould back side
E: the coefficient of elasticity of mould
L: the thickness of mould.
5. method for stamping, this method is to have formed the mold compresses of pattern on the rubber-like surface in the method for stamping that carries out transfer printing on the layer that is transferred that is forming on the substrate, it is characterized in that: the different zone of proportion is set in the inside of above-mentioned mould, make pattern form the surface elastic distortion, above-mentioned pattern formation face is risen successively by the position of stipulating in its face push contiguously.
CNA2007800073621A 2006-03-03 2007-02-26 Imprinting mold and method of imprinting Pending CN101394989A (en)

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