JP7136831B2 - STAMPER HAVING STAMPER STRUCTURE AND MANUFACTURING METHOD THEREOF - Google Patents

Description

The invention relates to a method of manufacturing a stamper with a stamper structure according to claim 6 and to a structural stamper according to claim 1 .

In the semiconductor industry, structuring processes have to be carried out on materials in order to produce corresponding functional elements. One of the most important structuring processes of recent decades is still photolithography today.

In the last few years, indeed, besides photolithography, imprint technology has emerged as a new alternative structuring technology, which is still mainly, if not exclusively, highly symmetrical, especially It is used for the structuring of repetitive structural elements. Imprinting techniques can be used to create surface structures directly on the embossed material by means of a stamper process. The benefits resulting from this are clear. Developing and etching chemicals, which are still required for photolithographic processes, can be saved. Moreover, even today it is possible to stamp structure sizes in the nanometer range, the production of which, according to conventional photolithography, is only conceivable with extremely complex and particularly expensive equipment.

In the case of imprint technology, a distinction is made between two types of stampers: hard stampers and soft stampers. Each stamper process can theoretically be performed with a hard stamper or a soft stamper. However, for many technical and financial reasons, the hard stamper itself is used only as a so-called master stamper, from which a soft stamper is molded, if necessary, and which is then transferred to the original structure. Used as a stamper. This hard stamper is the negative of the soft stamper. Hard stampers are only needed for the production of soft stampers. Soft stampers can be distinguished from hard stampers by a variety of chemical, physical and industrial parameters. A distinction based on elastic behavior is conceivable. A soft stamper shows deformation behavior mainly based on entropy elasticity, and a hard stamper shows deformation behavior mainly based on energy elasticity. Furthermore, the two types of stampers can be distinguished, for example, by their hardness. Hardness is the resistance of a material against an object into which it is pushed. Since hard stampers are mainly made of metals or ceramics, the hard stampers exhibit correspondingly high hardness values. There are various methods of determining the hardness of solids. A very common method is the Vickers hardness description. Without going into details, it can be roughly said that a hard stamper has a Vickers hardness of over 500HV.

A hard stamper certainly has the advantage that it can be produced directly from a piece of material with high strength and high stiffness by suitable processes, for example electron beam lithography or laser beam lithography. A hard stamper of this kind has a very high hardness and is therefore more or less wear-resistant. This high strength and wear resistance is certainly opposed by the high costs incurred especially for the production of such hard stampers. Even if a hard stamper is available for 100 embossing steps, this stamper will show wear over time that can no longer be neglected. Furthermore, it is technically difficult to release this hard stamper from the embossing material. Hard stampers exhibit relatively high bending resistance. This rigid stamper is not particularly well deformable, ie it has to be removed normal to the embossing plane. When releasing the hard stamper after the embossing process, here regularly a destruction of the embossed nanostructures and/or microstructures can occur, since hard stampers exhibit a very high stiffness. , thus destroying the microstructure and/or nanostructure of the embossing material that has just been embossed. Furthermore, the substrate may have defects that in subsequent steps may damage or destroy the hard stamper. Indeed, if a hard stamper is used only as a master stamper, the molding process of the soft stamper from this master stamper is very well controllable and leads to very little wear of the master stamper.

A soft stamper can be produced very simply by a replication process from a master stamper (hard stamper). This master stamper is in this case the negative corresponding to the soft stamper. This soft stamper is thus embossed into a master stamper, then demoulded and then used as a structure stamper, usually for embossing stamper structures into the embossing material applied onto the substrate. A soft stamper is mechanically much simpler than a hard stamper and can be released from the embossing material more gently and without problems. Additionally, any number of flexible stampers can be cast from the master. After the soft stamper exhibits a predetermined amount of wear, the soft stamper is discarded and a new soft stamper is formed from the master stamper.

A problem of the prior art today is that soft stampers in particular, due to their chemical structure, exhibit a very high absorption for other molecular compounds. In other words, this soft stamper is generally transparent to other molecular compounds, unlike hard stampers which are mainly made of metal, ceramic or glass. In the case of metallic and ceramic microstructures, the absorption of molecular substances is mostly ruled out, but even in the case of special hard stampers, absorption of molecular substances can still occur. .

Soft stampers frequently absorb some of the embossing material during the embossing process with the embossing material. This absorption causes several undesirable effects.

First, the absorption of molecules of the embossing material causes swelling of the soft stamper. This swelling is particularly a problem within the microstructures and/or nanostructures on the surface of the soft stamper, since it takes an already small amount of the embossing material to distort the microstructures and/or nanostructures. This is because the numerator of is sufficient. Since the soft stamper is used multiple times, it absorbs more and more embossing material molecules over the course of its use. The absorption of the embossing material molecules decisively reduces the service life of the soft stamper. This swelling can be measured directly by a variety of measurement instruments, such as atomic force microscope (AFM), scanning electron microscope (SEM), etc., or indirectly through volume increase and/or mass increase. be. The measurement of volume increase and/or mass increase certainly requires measuring instruments with very high resolution. For example, measurement of mass gain by microgravimetry and/or nanogravimetry is conceivable.

Further, the molding material is cured by heat or electromagnetic waves. Particularly in the case of electromagnetic wave curing, the embossing material molecules that have already partially penetrated the stamper adversely affect the irradiation time of the entire embossing material. The reason for this is the hardening of the embossing material molecules that have penetrated into the soft stamper. The embossing material molecules in the soft stamper harden, making them less transparent and thereby reducing the intensity of the electromagnetic waves directed towards the original embossing material. This issue is equally important for soft stampers and hard stampers.

A third problem is sticking of the soft stamper. Soft stampers consist primarily of polymers that have similar physical and/or chemical properties to the embossing material. Adhesion of the surface of the soft stamper with the embossing material therefore occurs, which adversely affects the release properties of the soft stamper.

EP2286981B1 PCT/EP2013/062922

The object of the present invention is therefore to improve the production of structural stampers for imprint technology in such a way as to identify the optimum stamper material.

The above-mentioned problem is solved by the features of claims 1 and 6. Preferred embodiments of the invention are described in the dependent claims. Also included within the scope of the invention are all combinations of at least two of the features mentioned in the description, claims and/or drawings. The stated value ranges clearly fall within the stated limits of the limits, and any combination can also be used.

The present invention has the advantage of a soft stamper of stamper material, dealing with a stamper which can be released from the embossing material as simply as possible, exhibits as little swelling as possible and is not contaminated by the original embossing material. This stamper material is thus particularly impermeable to the embossing material in the case of the invention. Advantages according to the invention arise in particular if, in general, the embossing material and the stamper material of the structural stamper according to the invention vary in hydrophilicity and hydrophobicity. If the embossing material is hydrophobic, the stamper material of the structural stamper according to the invention is preferably hydrophilic and vice versa. However, in very special cases, special advantages may also arise if the structural stamper and the embossing material are both hydrophobic or both hydrophilic. The method of selecting the stamper material of the structural stamper according to the invention always makes it possible to select a material that exhibits low adhesion properties with respect to the embossing material. Therefore, further advantages according to the invention arise if the stamper material according to the invention is impermeable to the molecules of the embossing material. Another advantage according to the invention is the particularly well adjustable surface of the stamper material according to the invention. Especially in the case of soft stampers whose surfaces exhibit extremely high roughness, this can have a detrimental effect on the structure to be stamped. The use of the stamper material according to the present invention firstly minimizes the contact surface to the embossing material due to the smooth surface and secondly reduces the coupling due to form meshing. A likewise improved release results thereby. Improved and effective demolding can be attributed, inter alia, to a lower force required for demolding. Accordingly, the roughness of the stamper material according to the invention is less than 1 μm, preferably less than 100 nm, more preferably less than 10 nm, most preferably less than 1 nm. The disclosed roughness values refer to the arithmetic mean roughness (mittler Rauheit) and/or the root mean square height (quadratische Rauheit) and/or the ten-point mean roughness (gemittelte Rautiefe). This measurement is in this case over an area section of approximately 2 μm×2 μm.

In a very special embodiment, the stamper material according to the invention is electrically conductive. Thereby, preferably static charges are prevented or at least reduced. Further preferably, the electrically conductive stamper material according to the invention may be grounded, so that charges occurring on its surface are carried away. The electrically neutral surface prevents or completely eliminates particle attraction, especially electrostatic attraction, thereby enhancing the cleanliness of this stamper over time. A ground connects the stamper material according to the invention, and thus the stamper, preferably at the edge. The conductivity of the stamper material can be achieved by an appropriately used chemical structure that already allows electronic conductivity based on molecular properties, or at least one that renders the non-conductive stamper material conductive. can be achieved by adding other components of In particular, the use of microparticles and/or nanoparticles, nanowires, in particular carbon nanotubes, graphene, graphite, etc. is preferred in this case. The added microparticles and/or nanoparticles can also be used for the heating of the stamper, particularly preferably if the hardening of the embossing material is carried out thermally and not by UV light as is preferred. can. This kind of heating with microparticles and/or nanoparticles is disclosed in the patent document EP2286981B1. This cited patent document does point out that microparticles and/or nanoparticles are present in the embossing material. In the present case microparticles and/or nanoparticles are present in the stamper material according to the invention in order to achieve direct heating of the stamper and not the embossing material. Heating of the embossing material then takes place indirectly through the stamper. Patent document EP 2 286 981 B1 contemplates heating microparticles and/or nanoparticles by an alternating magnetic field if the microparticles and/or nanoparticles are sensitive to magnetic fields, ie exhibit magnetism.

Hydrophilicity is understood to mean the high interaction of the surface of a material with water. Hydrophilic surfaces are predominantly polar and interact correspondingly well with the permanent dipoles of the molecules of the fluid, preferably with water. Hydrophilicity of a surface is quantified by a contact angle measuring instrument. In this case the hydrophilic surface exhibits a very low contact angle. If the coating according to the invention must have a hydrophilic surface in order to be released from the embossing material as simply as possible, the following range of values according to the invention applies: the hydrophilic surface is 90° It exhibits a contact angle of less than 60°, more preferably less than 40°, more preferably less than 20° and most preferably less than 10°.

Hydrophobicity is correspondingly understood as a low interaction of the surface of the material with water. Hydrophobic surfaces are predominantly non-polar and interact poorly with the permanent dipoles of the fluid's molecules. In order to release from the embossing material as simply as possible, in one embodiment of the invention, if the coating according to the invention has a hydrophobic surface, the following range of values applies in the case of the invention: A hydrophobic surface exhibits a contact angle greater than 90°, preferably greater than 100°, more preferably greater than 120°, more preferably greater than 140°, most preferably greater than 160°. Although the behavior of surfaces is characterized with respect to water by hydrophilicity or hydrophobicity, adhesion properties between various materials must be measured directly to obtain an accurate description of their mutual behavior. It will be clear to those skilled in the art that this may also be the case. Characterization of the adhesion properties of surfaces with water certainly already provides a very rough insight into this adhesion behavior. When characterizing the adhesion properties between the stamper material and the embossing material, the contact angle measurement method is in the case of the present invention preferably liquid of the embossing material deposited directly on the stamper, not with water. It is carried out directly with drops. The stamper according to the invention is in particular an imprint stamper for use in imprint technology. This stamper is formed as a hard stamper for the production of soft stampers or preferably as a soft stamper for imprinting substrates. With the stamper material according to the invention, the release of the stamper from the embossing material is achieved without damaging and/or (partially) destroying the structure, since the stamper preferably exhibits low adhesion to the embossing material. possible without doing Adhesive capacity between two surfaces is best expressed in terms of energy per unit area, ie energy area density. This is understood to be the energy required to separate two bonded surfaces from each other along a unit area. The adhesion between the embossing material and the structural stamper is in this case less than 2.5 J/ ^m2 , preferably less than 1 J/ ^m2 , more preferably less than 0.1 J/ ^m2 , more preferably less than 0.01 J/m2. m ² , more preferably less than 0.001 J/m ² , more preferably less than 0.0001 J/m ² , most preferably less than 0.00001 J/m ² . This release is thereby made possible easier, faster, more effectively and at a lower cost than with a stamper that does not use the stamper material according to the invention. In particular, the increased demolding speed allows a higher number of stamping steps per unit of time, resulting in lower costs. In addition, stamper service life is significantly improved, thereby reducing manufacturing costs.

Preferably, a stamper material is used which is so hermetic that swelling of the structural stamper, in particular of the soft stamper, is prevented by the structural material according to the invention due to the inability of the embossing material to penetrate into the soft stamper. Correspondingly, distortion of the stamper structure is largely avoided.

The stamper material preferably exhibits a viscosity of 1-2500 mPas, preferably 10-2500 mPas, more preferably 100-2500 mPas, more preferably 150-2500 mPas.

Furthermore, the irradiation time of the embossing material through the stamper material of the stamper is shortened as long as the absorption of the embossing material is blocked or at least reduced by the stamper material according to the invention. This is particularly necessary when the embossing material is irradiated through the structural stamper. The embossing material according to the invention is therefore preferably mainly transparent to the electromagnetic waves used. Since most embossing materials are cured by UV light, the stamper material according to the invention is preferably transparent to UV light. The stamper material according to the invention is particularly transparent in the wavelength range from 5000 nm to 10 nm, preferably from 1000 nm to 100 nm, more preferably from 700 nm to 200 nm, more preferably from 500 nm to 300 nm.

The stamper material, the stamper structure and/or the structural stamper itself according to the invention in particular consist at least mainly, preferably completely, of at least one of the following materials:

○ Silicone,
● vinyl-functional polymers ● vinyl-terminated polydimethylsiloxanes, especially CAS: 68083-12-2
● Vinyl-terminated diphenylsiloxane-dimethylsiloxane copolymers, especially CAS: 68951-96-2
● Vinyl-terminated polyphenylmethylsiloxanes, especially CAS: 225927-21-9
● Vinylphenylmethyl-terminated vinylphenylsiloxane-phenylmethylsiloxane copolymers, especially CAS: 8027-82-1
● Vinyl-terminated trifluoropropylmethylsiloxane-dimethylsiloxane copolymers, especially CAS: 68951-98-4
● Vinylmethylsiloxane-dimethylsiloxane copolymer, trimethylsiloxy terminated, especially CAS: 67762-94-1
● Vinylmethylsiloxane-dimethylsiloxane copolymer, silanol terminated, especially CAS 67923-19-7
● Vinylmethylsiloxane-dimethylsiloxane copolymer, vinyl terminated, especially CAS 68083-18-1
● Vinyl rubber ● Vinyl Q resin dispersion, especially CAS: 68584-83-8
● Vinylmethylsiloxane homopolymer, especially CAS: 68037-87-6
● Vinyl T structure polymer, especially CAS: 126681-51-9
● monovinyl-functionalized polydimethylsiloxane (symmetrical or unsymmetrical), especially CAS: 689252-00-1
● Vinylmethylsiloxane terpolymer, especially CAS: 597543-32-3
● Vinyl methoxy siloxane homopolymer, especially CAS: 131298-48-1
● Vinylethoxysiloxane homopolymer, especially CAS: 29434-25-1
● Vinylethoxysiloxane-propylethoxysiloxane copolymer

● hydride-functional polymers ● hydride-terminated polydimethylsiloxanes, especially CAS: 70900-21-9
● Polyphenylmethylsiloxane, hydride terminated ● Methylhydrosiloxane-dimethylsiloxane copolymer, trimethylsiloxy terminated, especially CAS: 68037-59-2
● Methylhydrosiloxane-dimethylsiloxane copolymer, hydride terminated, especially CAS: 69013-23-6
● Polymethylhydrosiloxane, trimethylsiloxy terminated, especially CAS: 63148-57-2
● Polyethylhydrosiloxane, triethylsiloxy terminated, especially CAS: 24979-95-1
● Polyphenyl-dimethylhydroxysiloxane, hydride-terminated ● Methylhydrosiloxane-phenylmethylsiloxane copolymer, hydride-terminated, especially CAS: 115487-49-5
● Methylhydrosiloxane-octylmethylsiloxane copolymers and terpolymers, especially CAS: 68554-69-8
● Hydride Q resin, especially CAS: 68988-57-8

● Silanol-functional polymers ● Silanol-terminated polydimethylsiloxanes, especially CAS: 70131-67-8
● Silanol-terminated diphenylsiloxane-dimethylsiloxane copolymers, especially CAS 68951-93-9 and/or CAS: 68083-14-7
● Silanol-terminated polydiphenylsiloxanes, especially CAS: 63148-59-4
● Silanol-terminated polytrifluoropropylmethylsiloxane, especially CAS: 68607-77-2
● Silanol-trimethylsilyl modified Q resin, especially CAS: 56275-01-5

● Amino-functionalized silicones ● Aminopropyl-terminated polydimethylsiloxanes, especially CAS: 106214-84-0
● N-ethylaminoisobutyl-terminated polydimethylsiloxane, especially CAS: 254891-17-3
● aminopropylmethylsiloxane-dimethylsiloxane copolymer, especially CAS: 99363-37-8
● Aminoethylaminopropylmethylsiloxane-dimethylsiloxane copolymer, especially CAS 71750-79-3
● aminoethylaminoisobutylmethylsiloxane-dimethylsiloxane copolymer, especially CAS: 106842-44-8
● Aminoethylaminopropylmethoxysiloxane-dimethylsiloxane copolymer, especially CAS: 67923-07-3

● Hindered amine functional siloxanes
● Tetramethylpiperidinyloxypropylmethylsiloxane-dimethylsiloxane copolymer, especially CAS: 182635-99-0

● Epoxy-functionalized silicones ● Epoxypropoxypropyl-terminated polydimethylsiloxanes, especially CAS: 102782-97-8
● Epoxypropoxypropylmethylsiloxane-dimethylsiloxane copolymer, especially CAS: 68440-71-7
● Epoxypropoxypropyl-terminated polyphenylmethylsiloxane, especially CAS: 102782-98-9
● Epoxypropoxypropyldimethoxysilyl terminated polydimethylsiloxane, especially CAS: 188958-73-8
● Tris(glycidoxypropyldimethylsiloxy)phenylsilane, especially CAS: 90393-83-2
● Mono-(2,3-epoxy)-propyl ether terminated polydimethylsiloxane (preferred embodiment), especially CAS: 127947-26-6
● Epoxycyclohexylethylmethylsiloxane-dimethylsiloxane copolymer, especially CAS: 67762-95-2
● (2-3% epoxycyclohexylethylmethylsiloxane) (10-15% methoxypolyalkyleneoxymethylsiloxane)-dimethylsiloxane terpolymer, especially CAS: 69669-36-9

● Cycloaliphatic epoxysilanes and silicones ● Epoxycyclohexylethylmethylsiloxane)-dimethylsiloxane copolymers, especially CAS: 67762-95-2
● (2-3% epoxycyclohexylethylmethylsiloxane) (10-15% methoxypolyalkyleneoxymethylsiloxane)-dimethylsiloxane terpolymer, especially CAS: 69669-36-9
● Epoxycyclohexylethyl terminated polydimethylsiloxane, especially CAS: 102782-98-9

● Carbinol-functionalized silicones ● Carbinol-hydroxy-terminated polydimethylsiloxanes, especially CAS: 156327-07-0, CAS: 104780-66-7, CAS: 68937-54-2, CAS: 161755-53-9, CAS : 120359-07-1
● Bis(hydroxyethyl)amine)-terminated polydimethylsiloxanes ● Carbinol-functionalized methylsiloxane-dimethylsiloxane copolymers, especially CAS: 68937-54-2, CAS: 68957-00-6, CAS: 200443-93-2
● Monocarbinol-terminated polydimethylsiloxanes, especially CAS: 207308-30-3
● Monodicarbinol-terminated polydimethylsiloxanes, especially CAS: 218131-11-4

● methacrylate- and acrylate-functionalized siloxanes ● methacryloxypropyl-terminated polydimethylsiloxanes, especially CAS: 58130-03-3
● (3-acryloxy-2-hydroxypropoxypropyl)-terminated polydimethylsiloxanes, especially CAS: 128754-61-0
• acryloxy-terminated ethylene oxide-dimethylsiloxane-ethylene oxide ABA block copolymers, especially CAS: 117440-21-9;
● Methacryloxypropyl-terminated branched polydimethylsiloxanes, especially CAS: 80722-63-0
● Methacryloxypropylmethylsiloxane-dimethylsiloxane copolymer, especially CAS: 104780-61-2
● Acryloxypropylmethylsiloxane-dimethylsiloxane copolymer, especially CAS: 158061-40-6
● (3-acryloxy-2-hydroxypropoxypropyl)methylsiloxane-dimethylsiloxane copolymer ● methacryloxypropyl T-structured siloxane, especially CAS: 67923-18-6
● Acryloxypropyl T structured siloxane

● Polyhedral oligomeric silsesquioxane (POSS)
● Tetraethyl orthosilicate (TEOS)
● Poly(organo)siloxane

Preferably, this stamper material consists of epoxy silicone and/or acrylate silicone. The basic chemical structure of the stamper material according to the invention is thus polydimethylsiloxane in which the methyl groups are replaced by epoxy and/or acrylate groups at regular or irregular intervals. These chemical groups allow curing of the stamper material according to the invention, preferably by UV light. Corresponding radical and/or cationic initiators can be added to the stamper material according to the invention in order to initiate the UV curing process.

Furthermore, it is also conceivable to manufacture this stamper, in particular the stamper structure, from a combination of the materials mentioned above. Also conceivable is the use of a series of stampers and a backplane, where the stamper and backplane are generally of different materials. The use of multiple different materials leads to individual or combined stampers made from this material being referred to as hybrid stampers. The backplane can be used here as a stiffener for the stamper. Backplanes are certainly also conceivable which are extremely flexible and only serve as a support for the stamper. This backplane then particularly has a thickness of less than 2000 μm, preferably less than 1000 μm, more preferably less than 500 μm and most preferably less than 100 μm.

In a particularly preferred embodiment, the stamper is additionally coated with an anti-adhesion layer in order to reduce adhesion between the stamper material and the embossing material according to the invention. Preferably, this anti-adhesion layer is an organic molecule with correspondingly low adhesion properties towards the embossing material. Omitting the coating according to the invention as a diffusion barrier if the stamper is already impermeable to the molecules of the embossing material, as is most often the case, for example, in the case of stampers made of metal, ceramic or glass. This stamper can be directly coated with an anti-adhesion layer as a coating according to the invention. At least one favorable effect is thereby produced with respect to the release properties based on adhesion. A coating of this kind has already been mentioned in patent document PCT/EP2013/062922, to which this patent document is referred in this respect.

The stamper material according to the invention is preferably at least partially transparent to the wavelength range of the electromagnetic waves that crosslink the embossing material upon UV effect of the embossing material. The optical transparency is in this case greater than 0%, preferably greater than 20%, more preferably greater than 50%, even more preferably greater than 80% and most preferably greater than 95%. The wavelength range for this optical transparency is in particular 100 nm to 1000 nm, preferably 150 nm to 500 nm, more preferably 200 nm to 400 nm, most preferably 250 nm to 350 nm.

If the embossing material is thermally cured, the stamper, in particular the coating according to the invention, has the highest possible thermal conductivity. The thermal conductivity is in this case greater than 0.1 W/(m.K), preferably greater than 1 W/(m.K), preferably greater than 10 W/(m.K), more preferably greater than 100 W/(m.K). (m·K), most preferably greater than 1000 W/(m·K).

A construction stamper with a coating is designed to be particularly temperature-stable. This structural stamper is particularly preferably at temperatures above 25°C, preferably above 100°C, more preferably above 250°C, more preferably above 500°C, most preferably above 750°C. can be used in

Elastic modulus describes the elastic properties of a material. This structural stamper can have basically any arbitrary elastic modulus. However, a modulus of elasticity as small as possible is preferred in order to retain the structural stamper deformably and thereby easily separate it from the embossing material. This elasticity is primarily entropic elasticity. Therefore, the elastic modulus is less than 10000 MPa, preferably less than 1000 MPa, more preferably less than 100 MPa, more preferably 1-50 MPa, most preferably 1-20 MPa.

1 shows the chemical structure of a preferred silicone acrylate. 1 shows the chemical structure of a preferred epoxysilicone;

Claims (6)

An imprint stamper comprising a stamper structure, wherein said stamper structure is at least partially made of silicone as a stamper material, said imprint stamper is configured to be deformable, and said imprint stamper has a pressure of less than 10000 MPa. and the imprint stamper has a surface roughness of less than 1 μm, and the stamper material is impermeable to the embossing material, and the stamper material is electrically conductive. , wherein the electrical conductivity of said stamper material is achieved by adding at least one other component selected from carbon nanotubes, graphene and graphite, and the thermal conductivity is greater than 1 W/(mK) and is an epoxy-functionalized silicone and/or an acrylate-functionalized siloxane and/or an acrylate-silicone. An imprint stamper comprising a stamper structure, wherein said stamper structure is at least partially made of silicone as a stamper material, said imprint stamper is configured to be deformable, and said imprint stamper has a pressure of less than 10000 MPa. and the imprint stamper has a surface roughness of less than 1 μm, and the stamper material is impermeable to the embossing material, and the stamper material is electrically conductive. , wherein the electrical conductivity of said stamper material is achieved by adding at least one other component selected from carbon nanotubes, graphene and graphite, and the thermal conductivity is greater than 1 W/(mK) and is polydimethylsiloxane in which methyl groups are replaced by epoxy groups and/or acrylate groups at regular or irregular intervals. 3. Stamper according to claim 1 or 2, wherein the stamper material is or is curable by UV radiation or thermal radiation. 4. The stamper material according to any one of claims 1 to 3, wherein said stamper material is transparent in the wavelength range from 5000 nm to 10 nm, preferably from 1000 nm to 100 nm, more preferably from 700 nm to 200 nm, most preferably from 500 nm to 400 nm. stamper. In a method of forming a stamper structure of an imprint stamper, the stamper structure is formed at least partially from silicone as stamper material using a master stamper, and the stamper material of the stamper structure is exposed to UV radiation or thermal irradiation. hardened, the imprint stamper is configured to be deformable, the imprint stamper has a modulus of elasticity of less than 10000 MPa, a surface roughness of the imprint stamper of less than 1 μm, and the stamper material is impermeable to the embossing material, and said stamper material is electrically conductive , wherein said electrically conductive stamper material comprises at least one material selected from carbon nanotubes, graphene and graphite. The ink is achieved by adding other ingredients and has a thermal conductivity greater than 1 W/(mK) and is an epoxy-functionalized silicone and/or an acrylate-functionalized siloxane and/or an acrylate silicone. A method of forming a stamper structure for a print stamper. In a method of forming a stamper structure of an imprint stamper, the stamper structure is formed at least partially from silicone as stamper material using a master stamper, and the stamper material of the stamper structure is exposed to UV radiation or thermal irradiation. hardened, the imprint stamper is configured to be deformable, the imprint stamper has a modulus of elasticity of less than 10000 MPa, a surface roughness of the imprint stamper of less than 1 μm, and the stamper material is impermeable to the embossing material, and said stamper material is electrically conductive , wherein said electrically conductive stamper material comprises at least one material selected from carbon nanotubes, graphene and graphite. achieved by adding other components and having a thermal conductivity greater than 1 W/(mK) and having methyl groups replaced by epoxy groups and/or acrylate groups at regular or irregular intervals. A method of forming a stamper structure for an imprint stamper, which is polydimethylsiloxane.

Images