CN113620571B - Thermal forming die, shell and electronic equipment - Google Patents
Thermal forming die, shell and electronic equipment Download PDFInfo
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- CN113620571B CN113620571B CN202010385661.6A CN202010385661A CN113620571B CN 113620571 B CN113620571 B CN 113620571B CN 202010385661 A CN202010385661 A CN 202010385661A CN 113620571 B CN113620571 B CN 113620571B
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- boss
- mold
- thermoforming
- die
- face
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/03—Re-forming glass sheets by bending by press-bending between shaping moulds
- C03B23/0302—Re-forming glass sheets by bending by press-bending between shaping moulds between opposing full-face shaping moulds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The application discloses a thermal forming die, a shell and electronic equipment, wherein the thermal forming die comprises a lower die and an upper die, and the lower die is provided with a cavity which is open upwards; the upper die comprises an upper die body and a boss, the upper die body is provided with a convex part matched with the cavity, the surface of the upper die body, away from the convex part, is a first compression surface, the boss is arranged on the first compression surface, the surface of the boss, away from the first compression surface, is a second compression surface, and the second compression surface extends downwards in the direction from the center of the first compression surface to the outer edge of the first compression surface. According to the thermoforming mould of this application, through set up the boss on first pressurized face, and in the direction of the outward flange by the center of first pressurized face to first pressurized face, the second pressurized face extends towards the downward sloping, when utilizing this thermoforming mould to treat the machined part and carry out thermoforming, can reduce or eliminate the bubble of treating to wrap up under hand in the machined part, improve the shaping quality of treating the machined part, reduce the defective percentage.
Description
Technical Field
The application relates to the field of mold processing, in particular to a thermal forming mold, a shell and electronic equipment.
Background
In the related art, a workpiece to be processed is generally shaped in a mold, and particularly at a high temperature, the workpiece to be processed is formed by softening and flowing, and in the process, gas is easily entrapped and bubbles are formed in the interior of the workpiece to be processed. However, in the related art thermoforming mold, bubbles formed inside the workpiece to be processed are not smoothly discharged during use, so that a large amount of bubbles exist in the part after thermoforming, the molding quality is reduced, and the defective rate is high.
Disclosure of Invention
The application provides a thermoforming mould, and when this thermoforming mould was treated the machined part and is carried out the thermoforming, can realize reducing or eliminate and treat the bubble of holding in hand in the machined part, improve the shaping quality of treating the machined part, reduce the defective percentage.
The application also provides a shell formed by utilizing the thermal forming die.
The application also provides the electronic equipment with the shell.
According to this application of first aspect embodiment's thermoforming mould, includes: a lower die having a cavity opened upward; go up the mould, go up the mould and include mould body and boss, go up the mould body have with cavity complex convex part, the convex part with inject the die cavity between the inner wall of cavity, go up the keeping away from of mould body the surface of convex part is first to be compressed the face, the boss is established first to be compressed the face, keeping away from of boss the surface of first compressed the face is the second compressed the face, by the center of first compressed the face extremely on the direction of the outward flange of first compressed the face, the second compressed the face extends towards the downward sloping.
According to the application, through set up the boss on first pressurized face (namely thermoforming mould's non-shaping face), and in the direction of the outward flange by the center of first pressurized face to first pressurized face, the second pressurized face extends towards the downward sloping, when utilizing this thermoforming mould to treat the machined part and carry out thermoforming, at thermoforming mould compound die in-process, can produce from inside to outside pressure on treating the machined part, helping hand extrusion exhaust, can reduce or eliminate and treat the bubble of holding under the arms in the machined part, improve the shaping quality of treating the machined part, the low order rate.
According to embodiments of the second aspect of the present application, the housing is formed using the thermoforming mould according to embodiments of the first aspect of the present application described above.
According to the shell, the thermoforming mold is used for molding, so that air bubbles wrapped in the shell are reduced or eliminated, the molding quality of the shell is improved, and the defective rate is reduced.
An electronic device according to an embodiment of the third aspect of the present application includes: a housing according to an embodiment of the second aspect of the present application described above.
According to the electronic equipment of this application, through setting up above-mentioned casing, because the bubble that wraps up in the casing is less, the shaping quality of casing is higher to electronic equipment's quality has been improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a perspective view of a thermoforming mold according to some embodiments of the present application;
FIG. 2 is a side view of a thermoforming mold according to some embodiments of the present application;
FIG. 3 is another angled side view of a thermoforming mold according to some embodiments of the present application;
FIG. 4 is a schematic view of an electronic device according to some embodiments of the present application.
Reference numerals are as follows:
a thermoforming mold 100;
a lower die 1;
an upper die 2; an upper die body 21; the first pressure receiving surface 211; a boss 22; the second pressure receiving surface 221; a convex portion 23;
an electronic device 200;
a front cover plate 3; a rear shell 4.
Detailed Description
Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
A thermoforming mold 100 according to an embodiment of the present application is described below with reference to the drawings.
Referring to fig. 1 to 3, a thermoforming mold 100 according to an embodiment of the first aspect of the present application includes a lower mold 1 and an upper mold 2. The lower die 1 has a cavity opened upward, the upper die 2 includes an upper die body 21 and a boss 22, the upper die body 21 has a boss 23 fitted to the cavity, and a cavity is defined between the boss 23 and an inner wall of the cavity. When the thermal forming die 100 is used for thermal forming of a workpiece to be processed, the workpiece to be processed can be placed into the cavity, the workpiece to be processed is heated and softened, the lower die 1 and the upper die 2 are closed, for example, the lower die 1 and the upper die 2 can be closed through a die-casting forming machine, the cavity and the convex part 23 are matched to limit the cavity, one surface of the workpiece to be processed, which is adjacent to the lower die 1, can be extruded into a shape matched with the inner wall of the cavity, one surface of the workpiece to be processed, which is adjacent to the upper die 2, can be extruded into a shape matched with the convex part 23, and therefore thermal forming of the workpiece to be processed is achieved. For example, when the housing for the electronic device 200 is die-cast from the sheet glass by the thermoforming mold 100, the sheet glass is first placed in the cavity, then the mold temperature is raised to a temperature higher than the softening point of the glass, so that the sheet glass is softened, the lower mold 1 and the upper mold 2 are closed, and the sheet glass is deformed under pressure, thereby thermoforming the housing of the electronic device 200.
The housing of the electronic device 200 may be a rear case 4 of the electronic device 200; when the electronic device 200 includes a display screen, the housing of the electronic device 200 may cover the front cover 3 disposed on the front side of the display screen. The front cover plate 3 may be a glass cover plate, and the glass cover plate may be of an equal thickness, and at this time, the thermal forming mold 100 may be a hot bending mold, and the flat glass may be hot-bent into a glass cover plate of an equal thickness by a hot bending process using the hot bending mold. The glass cover plate may also be of unequal thickness, and at this time, the thermal forming mold 100 may be a die-casting mold, and the plate glass is die-cast into the glass cover plate of unequal thickness by a die-casting process, and when the glass cover plate of unequal thickness is applied to the front cover plate of the electronic device 200, the display range of the electronic device 200 may be increased, and the stereoscopic display effect may be enhanced.
For example, when the thermal forming mold 100 is a die-casting mold, the to-be-processed member is softened by the die-casting process, so that the to-be-processed member has certain fluidity, the to-be-processed member can be bent, the to-be-processed member with the original consistent thickness can be conveniently die-cast into a part with the inconsistent thickness, and more production requirements can be met. For example, the temperature of the plate glass may be raised to a temperature higher than the softening point of the glass so that the plate glass has a certain fluidity, and then the plate glass may be easily die-cast into a glass cover plate having a non-uniform thickness. In the process of die-casting the to-be-processed member by the hot forming die 100, the flowing to-be-processed member may be wrapped with air bubbles, and if the air bubbles cannot be discharged, the air bubbles exist in the die-cast part, so that quality problems occur.
The surface of the upper die body 21 away from the convex portion 23 is a first pressure receiving surface 211, and the first pressure receiving surface 211 is a non-molding surface of the upper die body 21, and the upper die 2 and the lower die 1 can be clamped by applying pressure to the first pressure receiving surface 211 by, for example, a die casting machine. The boss 22 is arranged on the first pressure receiving surface 211, the surface, far away from the first pressure receiving surface 211, of the boss 22 is the second pressure receiving surface 221, the boss 22 arranged on the first pressure receiving surface 211 is higher than the first pressure receiving surface 211, so that when the die-casting forming machine is used for die-casting the upper die 2, the die-casting forming machine can contact the second pressure receiving surface 221 of the boss 22 firstly and then contact the first pressure receiving surface 211, the exhaust capacity of the thermal forming die 100 for a workpiece to be machined can be improved, the local pressure of the workpiece to be machined is improved, bubbles wrapped in the workpiece to be machined can be reduced or eliminated, and the machining quality of the workpiece to be machined is improved.
The second pressure receiving surface 221 extends obliquely downwards in the direction from the center of the first pressure receiving surface 211 to the outer edge of the first pressure receiving surface 211, so that the die-casting forming machine can firstly contact the part of the second pressure receiving surface 221 adjacent to the center of the first pressure receiving surface 211, then the die-casting forming machine gradually contacts the part of the second pressure receiving surface 221 adjacent to the outer edge of the first pressure receiving surface 211, the lateral pressing force along the center towards the edge of the workpiece to be processed is applied to the workpiece to be processed by the hot forming die 100 through the decomposition of the pressure by the boss 22, and the air bubbles wrapped in the workpiece to be processed are moved to the edge of the hot forming die 100 and discharged under the action of the pressing force, so that the air bubbles wrapped in the workpiece to be processed can be further reduced or eliminated, and the processing quality of the workpiece to be processed is improved.
According to the thermoforming mold 100 of the application, the boss 22 is arranged on the first pressure receiving surface 211 (namely, the non-forming surface of the thermoforming mold 100), and the second pressure receiving surface 221 extends downwards in an inclined manner in the direction from the center of the first pressure receiving surface 211 to the outer edge of the first pressure receiving surface 211, when a workpiece to be processed is thermoformed by using the thermoforming mold 100, in the mold closing process of the thermoforming mold 100, pressure from inside to outside can be generated on the workpiece to be processed, and the air is exhausted by aid of extrusion, so that air bubbles wrapped in the workpiece to be processed can be reduced or eliminated, the forming quality of the workpiece to be processed is improved, and the defective rate is reduced.
Referring to fig. 1-3, according to some embodiments of the present application, the boss 22 is disposed adjacent an outer edge of the first pressure receiving face 211. When the last mould 2 of thermoforming mould 100 applys pressure, treat that the bubble of wrapping up in under hand in the machined part moves to the edge discharge along the direction from inside to outside, in this process, the bubble that receives the extrusion force moves and mostly concentrates on the bight or the edge of treating the machined part, the outward flange setting of neighbouring first pressurized face 211 through boss 22, when making thermoforming mould 100 die-casting go up mould 2, the pressure of treating the marginal part of machined part has been improved, can improve thermoforming mould 100 and treat the marginal exhaust ability of machined part, thereby can further reduce or eliminate and treat to wrap up in the machined part and hold the bubble under hand, improve the shaping quality of treating the machined part.
Referring to fig. 1 to 3, according to some embodiments of the present application, the first pressure receiving surface 211 and the second pressure receiving surface 221 are both planar, so that the first pressure receiving surface 211 is in smooth contact with a die casting forming machine, the second pressure receiving surface 221 is in smooth contact with the die casting forming machine, the forming quality of a workpiece to be machined is improved, and the first pressure receiving surface 211 and the second pressure receiving surface 221 are simple in structure and convenient to machine.
Referring to fig. 1-3, optionally, an included angle α (refer to fig. 3) between the second pressure receiving surface 221 and the first pressure receiving surface 211 ranges from 3 to 20 °, and if the included angle between the second pressure receiving surface 221 and the first pressure receiving surface 211 is too large, the structural strength of the boss 22 is reduced, and the boss is easily deformed by compression; if the included angle between the second pressure receiving surface 221 and the first pressure receiving surface 211 is too small, the lateral extrusion force applied by the thermoforming mold 100 to the workpiece to be processed along the center of the workpiece to be processed toward the edge is small, and the exhaust effect is reduced. Through inject the contained angle between second pressure surface 221 and the first pressure surface 211 in suitable scope, can be more evenly transmitted pressure through thermoforming mould 100 guaranteeing die-casting machine under the prerequisite of treating the machined part, thermoforming mould 100 treats that the machined part fully applys along the center of treating the machined part towards the lateral extrusion force at edge to make the exhaust of treating the machined part smooth and easy, improve the processingquality who treats the machined part.
Referring to fig. 1-3, according to some embodiments of the present application, a height h (refer to fig. 2) of the boss 22 ranges from 5 to 25mm, and the height of the boss 22 may be such that the highest point of the boss 22 is higher than the height of the first pressure receiving surface 211. By limiting the height of the boss 22 within a suitable range, the thermal forming die 100 can exhaust the workpiece sufficiently to improve the forming quality of the workpiece while ensuring that the die-casting machine can transmit the pressure sufficiently to the workpiece through the thermal forming die 100. Moreover, the overall structure of the thermoforming mold 100 can be made compact and the occupied space is small.
Referring to fig. 1 to 3, according to some embodiments of the present disclosure, the upper die body 21 and the boss 22 are integrally formed, such that the upper die body 21 and the boss 22 have high connection strength, the structural strength of the thermoforming mold 100 can be improved, the pressure bearing capability of the thermoforming mold 100 can be improved, and the processing procedure of the thermoforming mold 100 can be simplified.
Referring to fig. 1 to 3, according to some embodiments of the present application, the number of the bosses 22 is multiple, and the multiple bosses 22 are arranged at intervals along the circumferential direction of the upper die body 21, such that the hot forming die 100 can sufficiently exhaust the workpiece to be processed, so that the workpiece to be processed is exhausted more thoroughly, and the processing quality of the workpiece to be processed is further improved.
In the present application, "plurality" means two or more.
Referring to fig. 1-3, optionally, the upper die body 21 is rectangular and each corner of the boss 22 of the upper die 2 is provided with a boss 22. When the upper die 2 of the hot forming die 100 applies pressure, the bubbles to be wrapped in the workpiece move to the edge along the direction from inside to outside to be discharged, in the process, the bubbles subjected to extrusion force are easily gathered to the corner of the workpiece to be processed, the boss 22 is arranged at each corner of the upper die body 21, when the upper die 2 of the hot forming die 100 applies pressure, the bubbles to be wrapped in each corner of the workpiece to be processed can be subjected to larger extrusion force, the exhaust of the corner of the workpiece to be processed, particularly the workpiece to be processed, is more sufficient, and the forming quality of the workpiece to be processed is further improved.
Referring to fig. 1 to 3, optionally, the length a (refer to fig. 1) of the boss 22 in the width direction of the upper die body 21 ranges from 20 to 50mm, the width b (refer to fig. 1) of the boss 22 in the length direction of the upper die body 21 ranges from 10 to 30mm, and the second pressure receiving surface 221 has a suitable area by limiting the length of the boss 22 in the width direction of the upper die body 21 and the width of the boss 22 in the length direction of the upper die body 21 in a suitable range, so that the hot forming die 100 can achieve sufficient air discharge of the workpiece to be processed on the premise that the pressure of the die-casting machine can be sufficiently transmitted to the workpiece to be processed through the hot forming die 100, thereby improving the forming quality of the workpiece to be processed.
Referring to fig. 4, a housing according to an embodiment of the second aspect of the present application is formed using a thermoforming mold 100 according to an embodiment of the first aspect of the present application described above.
The housing of the electronic device 200 may be a rear case 4 of the electronic device 200; when the electronic device 200 includes a display screen, the housing of the electronic device 200 may cover the front cover 3 disposed on the front side of the display screen. The front cover plate 3 may be a glass cover plate, the glass cover plate may be of an equal thickness, and the thermal forming mold 100 may be a hot bending mold, and the flat glass may be hot bent into the equal thickness glass cover plate through a hot bending process using the hot bending mold. The glass cover plate may also be of unequal thickness, and at this time, the thermal forming mold 100 may be a die-casting mold, and the plate glass is die-cast into the glass cover plate of unequal thickness by a die-casting process, and when the glass cover plate of unequal thickness is applied to the front cover plate of the electronic device 200, the display range of the electronic device 200 may be increased, and the stereoscopic display effect may be enhanced.
According to the shell, the thermal forming die 100 is used for forming, so that air bubbles trapped in the shell are reduced or eliminated, the shell forming quality is improved, and the defective rate is reduced.
Referring to fig. 4, according to some embodiments of the present application, the housing is a glass piece, such that the housing has good structural strength and light transmission, and the housing is easily formed at high temperature.
A process of molding a housing, which is a glass member, using the thermoforming mold 100 of the present application is described below.
The thermoforming mold 100 includes a lower mold 1 and an upper mold 2, the lower mold 1 having a cavity opened upward, the upper mold 2 including an upper mold body 21 and a boss 22, the upper mold body 21 having a convex portion 23 fitted with the cavity. The surface of the upper die body 21 away from the convex portion 23 is a first pressure receiving surface 211, the boss 22 is disposed on the first pressure receiving surface 211, the boss 22 is adjacent to the outer edge of the first pressure receiving surface 211, and the surface of the boss 22 away from the first pressure receiving surface 211 is a second pressure receiving surface 221. The length of the boss 22 in the width direction of the upper die body 21 is 20-50mm, the width of the boss 22 in the length direction of the upper die body 21 is 10-30mm, the included angle between the second pressure-receiving surface 221 and the first pressure-receiving surface 211 is 3-20 degrees, and the height of the boss 22 is 5-25mm.
The forming process of the shell comprises the following steps:
placing the sheet glass into a thermoforming mold 100;
placing the thermoforming mold 100 into a die-casting molding machine;
heating the thermal forming die 100 to 800-1200 ℃;
keeping the temperature at 900-1100 ℃ constant, and closing the upper die 2 and the lower die 1 at the pressure of 3-9 Kpa;
keeping the pressure and the temperature unchanged under the closing state of the upper die 2 and the lower die 1, and keeping the time for 150-300s;
keeping the pressure unchanged and slowly cooling in the closing state of the upper die 2 and the lower die 1, and quickly cooling after the temperature is reduced to 500-600 ℃ of the glass annealing temperature;
after the temperature is lowered to room temperature, the thermoforming mold 100 is opened and the molded housing is taken out.
One specific example of a process for forming a housing, which is a glass piece, using the thermoforming mold 100 of the present application is described below.
The thermoforming mold 100 includes a lower mold 1 and an upper mold 2, the lower mold 1 having a cavity opened upward, the upper mold 2 including an upper mold body 21 and a boss 22, the upper mold body 21 having a convex portion 23 fitted with the cavity. The surface of the upper die body 21 away from the convex portion 23 is a first pressure receiving surface 211, the boss 22 is disposed on the first pressure receiving surface 211, the boss 22 is adjacent to the outer edge of the first pressure receiving surface 211, and the surface of the boss 22 away from the first pressure receiving surface 211 is a second pressure receiving surface 221. The length of the boss 22 in the width direction of the upper die body 21 is 25mm, the width of the boss 22 in the length direction of the upper die body 21 is 20mm, the included angle between the second pressure receiving surface 221 and the first pressure receiving surface 211 is 8 °, and the height of the boss 22 is 10mm.
The forming process of the shell comprises the following steps:
placing a sheet glass into a thermoforming mold 100;
placing the thermoforming mold 100 into a die-casting molding machine;
heating the thermal forming die 100 to 910 ℃;
keeping the temperature at 880 ℃ constant, and enabling the upper die 2 and the lower die 1 to be matched at the pressure of 5 Kpa;
keeping the pressure and the temperature unchanged and keeping the time for 150s when the upper die 2 and the lower die 1 are in a die-closing state;
keeping the pressure unchanged and slowly cooling in the closing state of the upper die 2 and the lower die 1, and quickly cooling after the temperature is reduced to 550 ℃ of the glass annealing temperature;
after the temperature is lowered to room temperature, the thermoforming mold 100 is opened and the molded shell is removed.
The shell processed by the thermal forming die 100 in the application realizes the reduction or elimination of bubbles wrapped in the shell, and the shell has higher forming quality.
Referring to fig. 4, an electronic device 200 according to an embodiment of the third aspect of the present application includes a housing according to the above-described second aspect of the present application.
The electronic device 200 of the present application may be, for example, any of various types of computer system devices that are mobile or portable and that perform wireless communications. Specifically, the electronic device 200 may be a mobile phone or smart phone (e.g., iPhone (TM) based, android (TM) based phone), a Portable game device (e.g., nintendo DS (TM), playStation Portable (TM), game Key Advance (TM), iPhone (TM)), a laptop, a PDA, a Portable Internet device, a music player, and a data storage device, among other handheld devices.
According to the electronic device 200 of the present application, by providing the above housing, since the number of bubbles trapped in the housing is small, the molding quality of the housing is high, thereby improving the quality of the electronic device 200.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (12)
1. A thermoforming mold, comprising:
a lower die having a cavity opened upward;
go up the mould, go up the mould and include mould body and boss, go up the mould body have with cavity complex convex part, the convex part with inject the die cavity between the inner wall of cavity, go up the keeping away from of mould body the surface of convex part is first to be compressed the face, the boss is established first to be compressed the face, keeping away from of boss the surface of first compressed the face is the second compressed the face, by the center of first compressed the face extremely on the direction of the outward flange of first compressed the face, the second compressed the face extends towards the downward sloping, the second compressed the face with contained angle scope between the first compressed the face is 3 ~ 20.
2. The thermoforming mold of claim 1, wherein the boss is disposed adjacent an outer edge of the first pressure receiving surface.
3. The thermoforming mold of claim 1, wherein the first pressure receiving surface and the second pressure receiving surface are both planar.
4. A thermoforming mould as claimed in claim 1, characterised in that the height of the boss is in the range 5 to 25mm.
5. The thermoforming mold of claim 1, wherein the upper mold body and the boss are integrally formed.
6. The thermoforming mold of claim 1, wherein the thermoforming mold is a die casting mold.
7. The thermoforming mold of claim 1, wherein the boss is a plurality of bosses, and the plurality of bosses are spaced apart along a circumference of the upper mold body.
8. The thermoforming mold of claim 7, wherein the upper mold body is rectangular, each corner of the upper mold boss being provided with the boss.
9. The thermoforming mold according to claim 7, wherein the length of the boss in the width direction of the upper mold body is in a range of 20 to 50mm, and the width of the boss in the length direction of the upper mold body is in a range of 10 to 30mm.
10. A housing, characterized in that the housing is shaped using a thermoforming mould according to any of claims 1-9.
11. The housing of claim 10, wherein the housing is a glass piece.
12. An electronic device, comprising: the housing of claim 10 or 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010385661.6A CN113620571B (en) | 2020-05-09 | 2020-05-09 | Thermal forming die, shell and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010385661.6A CN113620571B (en) | 2020-05-09 | 2020-05-09 | Thermal forming die, shell and electronic equipment |
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| Publication Number | Publication Date |
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| CN113620571A CN113620571A (en) | 2021-11-09 |
| CN113620571B true CN113620571B (en) | 2023-03-14 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101394989A (en) * | 2006-03-03 | 2009-03-25 | 日本先锋公司 | Imprinting mold and method of imprinting |
| CN104088875A (en) * | 2014-07-20 | 2014-10-08 | 格林精密部件（惠州）有限公司 | Pneumatic type bubble-prevention assembling clamp |
| JP2015013317A (en) * | 2014-10-22 | 2015-01-22 | 株式会社キーレックス | Hot press device and hot press molding method |
| CN206255981U (en) * | 2016-09-30 | 2017-06-16 | 蓝思科技（长沙）有限公司 | A kind of many edge forming dies of 3D hot bendings |
| CN209552272U (en) * | 2018-12-28 | 2019-10-29 | 永豪光电（中国）有限公司 | Exhaust hot pressing aspherical lens module |
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2020
- 2020-05-09 CN CN202010385661.6A patent/CN113620571B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101394989A (en) * | 2006-03-03 | 2009-03-25 | 日本先锋公司 | Imprinting mold and method of imprinting |
| CN104088875A (en) * | 2014-07-20 | 2014-10-08 | 格林精密部件（惠州）有限公司 | Pneumatic type bubble-prevention assembling clamp |
| JP2015013317A (en) * | 2014-10-22 | 2015-01-22 | 株式会社キーレックス | Hot press device and hot press molding method |
| CN206255981U (en) * | 2016-09-30 | 2017-06-16 | 蓝思科技（长沙）有限公司 | A kind of many edge forming dies of 3D hot bendings |
| CN209552272U (en) * | 2018-12-28 | 2019-10-29 | 永豪光电（中国）有限公司 | Exhaust hot pressing aspherical lens module |
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| CN113620571A (en) | 2021-11-09 |
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