JP6942491B2 - Imprinting equipment and manufacturing method of goods - Google Patents

Description

The present invention relates to an imprinting apparatus and a method for manufacturing an article.

An imprinting apparatus that transfers the pattern to an imprinting material on a substrate by using a mold having a pattern region in which an uneven pattern is formed is attracting attention as one of mass production lithography apparatus such as a semiconductor device. The imprint apparatus can form a pattern on the imprint material on the substrate by performing an imprint process of curing the imprint material in a state where the mold and the imprint material on the substrate are in contact with each other. In such an imprinting apparatus, if air bubbles remain in the pattern of the mold when the mold and the imprint material are brought into contact with each other, the pattern formed on the imprint material may be defective. Patent Document 1 discloses a method of reducing the residual air bubbles in the mold pattern by deforming the pattern region of the mold into a convex shape protruding toward the substrate and bringing the mold and the imprint material into contact with each other. There is.

Special Table 2009-536591

In order to make the pattern region easily deformable, the mold may have a cavity (recess) formed on the surface opposite to the surface having the pattern region so that the thickness of the pattern region and its periphery becomes thin. However, the cavity may be formed with the center of gravity of the cavity deviated from the center of the pattern region due to, for example, a manufacturing error. In this case, the most displaced portion (maximum displacement portion) of the pattern region at the time of deformation is displaced with respect to the center of the pattern region. Therefore, if the contact between the mold and the substrate is started from the maximum displacement position, a force that distorts the pattern region can be applied to the mold while the contact region between the mold and the imprint material is expanded. As a result, it may be difficult to accurately form a pattern on the imprint material on the substrate.

Therefore, an object of the present invention is to provide an imprinting apparatus which is advantageous for forming a pattern on an imprinting material on a substrate with high accuracy.

In order to achieve the above object, the imprint device as one aspect of the present invention is an imprint device that transfers the pattern to the imprint material on the substrate by using a mold having a pattern region in which the pattern is formed. In a state where the pattern region is deformed into a convex shape protruding toward the substrate and the pattern region is deformed by the deformed portion and the relative inclination between the mold and the substrate is set as the target relative inclination. anda controller which initiates contact with the imprint material and the mold, controls the gradually expanding processing area of contact between the mold and the imprint material, wherein the control unit includes: the mold and the substrate for the relative tilt is obtained for each of the different plurality of states to each other, based on the relationship shown a change in the position of the center of gravity of the contact area with respect to changes in the size of the contact touch area, the change in size of the contact area The relative inclination when the ratio of changes in the position of the center of gravity of the contact region reaches a predetermined value is obtained, and the target relative inclination is determined based on the obtained relative inclination.

Further objects or other aspects of the invention will be manifested in the preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide an imprinting apparatus that is advantageous for accurately forming a pattern on an imprinting material on a substrate.

It is the schematic which shows the imprint apparatus of 1st Embodiment. It is a flowchart which shows the flow of imprint processing. It is a flowchart which shows the method of determining the target relative inclination of a mold and a substrate. It is a figure which shows the image obtained by the imaging unit. It is a figure which shows the relationship between the size of a contact area and the position of the center of gravity. It is a figure which shows the information of the rate of change. It is a figure which shows the curved state of the pattern region deformed by the deformed part. It is a figure when the mold deformed by the deformed part and a substrate are gradually brought into contact with each other. It is a figure which shows how the inclination of the boundary part of the contact area in a pattern area changes. It is a figure which shows the information of the contact start position. It is a flowchart which shows the method of determining the target relative inclination of a mold and a substrate. It is a figure which shows the relationship which shows the change of the XY position with respect to the change of the relative inclination of a mold and a substrate for each of a pattern region, a contact start position and a center. It is a figure which shows the information of the rate of change, and the information of the contact start position. It is a figure which shows the contact start position and the expansion of a contact area at the time of relative inclination TA and TB. It is a figure for demonstrating the control of the relative inclination of a mold and a substrate. It is a figure which shows the control profile of the relative inclination of a mold and a substrate. It is a figure which shows the relationship between the size of a contact area and the position of the center of gravity. It is a figure which shows the control profile of the relative inclination of a mold and a substrate. It is a figure which shows the relationship between the size of a contact area and the position of the center of gravity. It is a flowchart which shows the generation method of a control profile.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each figure, the same member or element is given the same reference number, and duplicate description is omitted. Further, in the following description, the direction parallel to the optical axis of the light irradiating the substrate is defined as the Z direction, and the two directions orthogonal to each other in the plane perpendicular to the Z direction are defined as the X direction and the Y direction.

<First Embodiment>
The imprinting apparatus 100 of the first embodiment according to the present invention will be described. The imprint device is a device that forms a pattern of a cured product to which the uneven pattern of the mold is transferred by bringing the imprint material supplied on the substrate into contact with the mold and applying energy for curing to the imprint material. be. The imprinting apparatus 100 uses a mold 1 having a pattern region 1a on which a pattern is formed, which is used in manufacturing a semiconductor device or the like, to transfer the pattern to an imprint material supplied on the shot region of the substrate 2. Perform imprint processing. For example, the imprint device 100 cures the imprint material in a state where the mold 1 on which the pattern is formed is in contact with the imprint material on the substrate. Then, the imprint device 100 can form a pattern on the imprint material by widening the distance between the mold 1 and the substrate 2 and peeling (releasing) the mold 1 from the cured imprint material.

There are two methods for curing the imprint material, a thermodynamic cycle method using heat and a photocuring method using light. In this embodiment, an example in which the photocuring method is adopted will be described. The photocuring method involves supplying an uncured ultraviolet curable resin as an imprint material onto a substrate and irradiating the imprint material with light (ultraviolet rays) in a state where the mold 1 and the imprint material are in contact with each other. This is a method of curing the imprint material.

As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, etc. are used as the energy for curing. The electromagnetic wave is, for example, light such as infrared rays, visible rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less.

The curable composition is a composition that is cured by irradiation with light or by heating. Of these, the photocurable composition that is cured by light may contain at least a polysynthetic compound and a photopolymerization initiator, and may contain a non-heavy synthetic compound or a solvent, if necessary. The non-heavy synthetic compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like.

The imprint material is applied in the form of a film on the substrate by a spin coater or a slit coater. Alternatively, the liquid injection head may be applied on the substrate in the form of droplets or in the form of islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

[Device configuration]
Next, the configuration of the imprinting apparatus 100 of the first embodiment will be described with reference to FIG. FIG. 1 is a schematic view showing the imprinting apparatus 100 of the first embodiment. The imprint device 100 includes a substrate stage 3, an imprint head 4, a deforming unit 5, an irradiation unit 6, a supply unit 7, an imaging unit 8, a first measurement unit 9, and a second measurement unit 10. , Control unit 11 and the like. The control unit 11 is composed of, for example, a computer having a CPU, a memory, or the like, and controls the imprint process (controls each unit of the imprint device 100). In the imprint process, for example, the pattern region 1a of the mold 1 is deformed by the deforming portion 5 to start contact between the mold 1 and the imprint material on the substrate, and the mold 1 and the imprint material (board 2) are brought into contact with each other. It may include a process of gradually expanding the contact area (contact process).

The substrate stage 3 includes, for example, a substrate holding portion 3a and a substrate driving portion 3b, and is configured to hold and move the substrate 2. The substrate holding portion 3a holds the substrate 2 by, for example, a vacuum suction force or an electrostatic force. The substrate driving unit 3b mechanically holds the substrate holding unit 3a and drives the substrate holding unit 3a (board 2) in the XY directions. Further, the substrate driving unit 3b may be configured so that the position of the substrate 2 in the Z direction, the inclination of the substrate 2 with respect to the XY plane, and the rotation of the XY plane can be changed. Here, as the substrate 2, for example, a single crystal silicon substrate, an SOI (Silicon on Insulator) substrate, a glass substrate, or the like is used. An imprint material is supplied to the upper surface of the substrate 2 by a supply unit 7 described later. Glass, ceramics, metal, semiconductors, resins and the like are used for the substrate 2, and if necessary, a member made of a material different from the substrate may be formed on the surface thereof. Specific examples of the substrate include silicon wafers, compound semiconductor wafers, and quartz glass. Further, before applying the imprint material, an adhesion layer for improving the adhesion between the imprint material and the substrate may be provided, if necessary.

The imprint head 4 has a mold holding portion 4a that holds the mold by, for example, a vacuum suction force or an electrostatic force, and a mold driving portion that can change the position and inclination of the mold holding portion 4a (mold 1) in the Z direction. 4b and can be included. Further, the mold driving unit 4b may be configured so that the position of the mold 1 in the XY direction can be adjusted. Here, in the present embodiment, the operation of changing the relative inclination of the mold 1 and the substrate 2 and the operation of moving the mold 1 and the substrate 2 closer to or further from each other are performed by the imprint head 4, but are limited thereto. is not it. For example, these operations may be performed by the substrate stage 3 or by both the imprint head 4 and the substrate stage 3.

The mold 1 is usually made of a material capable of transmitting ultraviolet rays such as quartz, and an uneven pattern to be transferred to the substrate 2 is formed on the surface (pattern surface) on the substrate side as a device pattern. It has a pattern region 1a. The pattern region 1a has a mesa shape composed of steps of, for example, several tens of μm, and the size of the pattern region 1a varies depending on the device pattern to be transferred on the substrate, but is generally 33 mm × 26 mm. be. Further, in the mold 1, in order to make the pattern region easily deformable, a cavity 1b (recess) is formed on the surface opposite to the pattern surface so that the thickness of the pattern region 1a and its periphery becomes thin. The cavity 1b becomes a substantially sealed space when the mold 1 is held by the imprint head 4 (mold holding portion 4a). The cavity 1b is connected to the deformed portion 5 via a pipe 5a.

By changing the pressure inside the cavity 1b of the mold 1 held by the imprint head 4, the deforming portion 5 deforms the pattern region 1a of the mold 1 into a convex shape protruding toward the substrate 2. For example, when the mold 1 and the substrate 2 are brought close to each other and the imprint material on the substrate is brought into contact with each other, the deformed portion 5 supplies compressed air to the inside of the cavity 1b via, for example, a pipe 5a. Therefore, the pressure inside the cavity 1b is made higher than the pressure outside the cavity 1b. As a result, the deformed portion 5 can deform the pattern region 1a of the mold 1 into a convex shape protruding toward the substrate 2, and the contact region between the mold 1 and the imprint material can be gradually expanded in the contact process. can. As a result, it is possible to reduce the remaining air bubbles in the pattern of the mold 1 in contact with the imprint material, and it is possible to suppress the occurrence of defects in the pattern formed on the imprint material by the imprint process.

In the process of curing the imprint material on the substrate, the irradiation unit 6 irradiates the substrate 2 with light (ultraviolet rays) for curing the imprint material via the mold 1. In the present embodiment, the light emitted from the irradiation unit 6 is reflected by the beam splitter 12 (band filter) and is applied to the substrate 2 via the relay optical system 13 and the mold 1. Further, the supply unit 7 supplies (coats) the imprint material on the substrate. As described above, in the imprinting apparatus 100 of the present embodiment, an ultraviolet curable resin having a property of being cured by irradiation with ultraviolet rays can be used as the imprint material.

The imaging unit 8 images the pattern region 1a of the mold 1 via the beam splitter 12 and the relay optical system 13. For example, in the contact process in which the mold 1 and the substrate 2 are brought into contact with each other via the imprint material, the imaging unit 8 has a plurality of timings while expanding the contact region between the pattern region 1a of the mold 1 and the substrate 2. The pattern region 1a is imaged with. Since interference fringes generated by the contact between the mold 1 and the substrate 2 are formed in each image obtained by the imaging unit 8 in this way, the contact region between the pattern region 1a and the imprint material is formed based on each image. You can observe how it spreads. Further, an alignment scope (detection system) may be provided in order to detect the alignment marks formed on the mold 1 and the substrate 2.

The first measuring unit 9 measures the heights of a plurality of points on the pattern region (on the mold). The first measuring unit 9 is, for example, a laser interferometer that irradiates the mold 1 with light and measures the height of the pattern region 1a (distance between the first measuring unit 9 and the pattern region 1a) by the reflected light from the mold 1. Can be mounted on the substrate stage 3. The first measuring unit 9 measures the heights of a plurality of points on the pattern region while moving in the XY directions together with the substrate stage 3. The first measurement unit 9 may be provided separately from the substrate stage 3. Thereby, the shape and posture of the pattern region 1a can be obtained. Further, the second measuring unit 10 measures the heights of a plurality of points on the substrate. The second measuring unit 10 includes, for example, a laser interferometer that irradiates the substrate 2 with light and measures the height of the substrate 2 (distance between the second measuring unit 10 and the substrate 2) by the reflected light from the substrate 2. sell. The second measuring unit 10 can obtain the shape and orientation of the substrate 2 by measuring the heights of a plurality of points on the substrate while the substrate 2 is moving in the XY direction by the substrate stage 3.

[Imprint processing]
Next, the imprint process in the imprint device 100 of the first embodiment will be described with reference to FIG. FIG. 2 is a flowchart showing the flow of imprint processing. Each step of the imprint process shown below can be performed by the control unit 11.

In S10, the control unit 11 controls the substrate stage 3 so that the substrate 2 is arranged below the supply unit 7. Then, the supply unit 7 is controlled so as to supply the imprint material to the target shot region (target shot region) to be imprinted among the plurality of shot regions formed on the substrate. After the imprint material is supplied to the target shot region, the control unit 11 controls the substrate stage 3 so that the target shot region is arranged under the mold 1 (pattern region 1a).

In S11, the control unit 11 controls the deformation unit 5 so that the pattern region 1a of the mold 1 is deformed into a convex shape protruding toward the substrate 2. In S12, the control unit 11 controls the relative inclination of the mold 1 and the substrate 2 so as to have a target relative inclination of the mold 1 and the substrate 2 determined as described later.

In S13, the control unit 11 controls the imprint head 4 so that the mold 1 and the substrate 2 come close to each other in a state where the pattern region 1a of the mold 1 is deformed by the deforming portion 5, and the mold 1 and the substrate 2 are pressed. Contact (contact processing, for example, via an imprint material). For example, the control unit 11 starts contact between the mold 1 and the imprint material in a state where the pattern region 1a of the mold 1 is deformed by the deforming unit 5, and gradually reduces the contact region between the mold 1 and the imprint material. spread. At this time, the control unit 11 is deformed so that the pressure inside the cavity 1b gradually decreases as the contact area between the mold 1 and the imprint material expands after the contact between the mold 1 and the imprint material starts. 5 is controlled. As a result, the shape of the pattern region 1a when the entire pattern region 1a comes into contact with the imprint material can be made into a planar shape.

In S14, the control unit 11 controls the irradiation unit 6 so as to irradiate the imprint material with light in a state where the mold 1 and the imprint material are in contact with each other, and cures the imprint material. In S15, the control unit 11 controls the imprint head 4 so that the mold 1 and the substrate 2 are separated from each other, and peels (releases) the mold 1 from the cured imprint material. As a result, a three-dimensional pattern that follows the pattern of the mold 1 can be formed on the imprint material on the target shot region.

In S16, the control unit 11 determines whether or not there is a shot region (next shot region) on which the pattern of the mold 1 is continuously transferred on the substrate. If there is a next shot area, the process returns to S10, and if there is no next shot area, the process ends.

[Method of determining the target relative inclination between the mold and the substrate]
The cavity 1b of the mold 1 may be formed so that the position of the center of gravity of the cavity in the XY direction deviates from the center of the pattern region 1a due to, for example, a manufacturing error. In this case, the portion of the pattern region 1a that is most displaced at the time of deformation (hereinafter referred to as the maximum displacement portion) is displaced with respect to the center of the pattern region 1a. Therefore, if the contact between the mold 1 and the imprint material on the substrate is started from the maximum displacement portion of the pattern region 1a, a force that distorts the pattern region 1a in the contact process can be applied to the mold 1. As a result, it may be difficult to accurately form a pattern on the imprint material on the substrate.

Therefore, the control unit 11 of the present embodiment starts the contact so that the contact start position of the pattern region 1a when starting the contact between the mold 1 and the imprint material approaches the center of the pattern region 1a. The target relative inclination between the mold 1 and the substrate 2 is determined. That is, the control unit 11 reduces the deviation between the contact start position of the pattern region 1a and the center of the pattern region 1a caused by the deviation between the maximum displacement portion of the pattern region 1a and the center of the pattern region 1a. , Determine the target relative slope. In other words, in the control unit 11, the difference between the contact start position of the pattern region 1a with the substrate 2 and the center of the pattern region 1a is based on the difference between the maximum displacement location of the pattern region 1a and the center of the pattern region 1a. Determine the target relative slope so that it becomes smaller.

For example, the control unit 11 performs contact processing for each of a plurality of states in which the relative inclinations of the mold 1 and the substrate are different from each other. Then, from this result, the control unit 11 generates a relationship indicating a change in the position of the center of gravity of the contact region with respect to a change in the size of the contact region between the mold 1 and the substrate for each of the plurality of states. As a result, the control unit 11 can determine the target relative inclination between the mold 1 and the substrate 2 when starting the contact between the mold 1 and the substrate 2 based on the relationship generated for each of the plurality of states. can.

Further, the control unit 11 controls the relative inclination of the mold 1 and the substrate 2 so as to have the target relative inclination determined in S12 of FIG. As a result, the contact start position of the pattern region 1a when starting the contact processing can be brought closer to the center of the pattern region 1a, so that the force applied to the mold 1 so as to distort the pattern region 1a in the contact processing can be reduced. Can be done. Here, in the present embodiment, when the mold 1 and the substrate 2 are relatively tilted when the contact between the mold 1 and the imprint material is started, the mold 1 and the substrate 2 are not parallel to each other. However, when the entire pattern region 1a comes into contact with the imprint material, it is preferable that the mold 1 (pattern region 1a) and the substrate 2 are parallel to each other. Therefore, in S13 of FIG. 2, the control unit 11 gradually makes the pattern region 1a of the mold 1 and the substrate 2 parallel to each other as the contact region between the mold 1 and the imprint material expands after the contact processing is started. In addition, it is preferable to control the relative inclination between the mold 1 and the substrate 2.

Hereinafter, a specific method for determining the target relative inclination between the mold 1 and the substrate 2 will be described with reference to FIG. FIG. 3 is a flowchart showing a method of determining a target relative inclination between the mold 1 and the substrate 2. Each step shown below can be performed, for example, by using a second substrate (dummy substrate) different from the substrate 2 instead of the substrate 2. In the present embodiment, it is assumed that the imprint material is already supplied (coated) to the second substrate, but the present invention is not limited to this, and the imprint material is supplied (coated) to the second substrate. It does not have to be. In this case, in order to avoid damage to the mold 1 due to contact with the second substrate, it is preferable to apply a cushioning material such as an adhesion layer for adhering the imprint material on the second substrate. Here, in the present embodiment, the target relative inclination is determined using the second substrate, but the present invention is not limited to this, and for example, the imprint processing is performed first among a plurality of shot areas on the substrate. The target relative slope may be determined using several shot regions.

In S20, the control unit 11 causes the first measurement unit 9 to measure the heights of a plurality of points on the pattern region of the mold 1 while moving the substrate stage 3 in the XY directions. Here, the pattern region 1a is not deformed by the deformed portion 5. In S21, the control unit 11 causes the second measurement unit 10 to measure the heights of a plurality of points on the second substrate while moving the substrate stage 3 in the XY directions.

In S22, the control unit 11 molds the mold 1 that has not been deformed by the deformation unit 5 and the second substrate in parallel based on the measurement results of the first measurement unit 9 and the second measurement unit 10. The relative inclination between the 1st and the 2nd substrate is controlled. The step S22 can be performed, for example, by changing the inclination of the mold 1 by the imprint head 4. Here, in the present embodiment, in the step of S22, the relative inclinations of the mold 1 and the second substrate are controlled so as to be parallel to each other, but the present invention is not limited to this. For example, the control unit 11 calculates the relative inclination between the mold 1 and the second substrate based on the measurement results of the first measurement unit 9 and the second measurement unit 10, and determines the calculated relative inclination in a later step. It may be added as an offset value to the target relative inclination of the mold 1 and the substrate 2.

In S23 to S27, for each of a plurality of states in which the relative inclinations of the mold 1 and the second substrate are different from each other, the position of the center of gravity (center position) of the contact region with respect to the change in the size of the contact region between the mold 1 and the second substrate. ) Is a step of generating a relationship indicating a change. Here, in S25, it is preferable that the mold 1 and the second substrate are brought into contact with each other at the same portion on the second substrate in the plurality of states from the viewpoint of reproducibility. Here, the position of the center of gravity of the contact region is the position of the center of gravity in the XY direction when the contact region is viewed from the Z direction. In other words, the position of the center of gravity of the contact region is the position of the center of gravity of the projected image (two-dimensional) in which the contact region is projected onto a surface parallel to the surface of the substrate 2 (second substrate).

In S23, the control unit 11 controls the deformation unit 5 so that the pattern region 1a of the mold 1 is deformed into a convex shape protruding toward the second substrate. In S24, the control unit 11 controls the imprint head 4 so that the mold 1 and the second substrate come close to each other in a state where the pattern region 1a of the mold 1 is deformed by the deforming portion 5, and the mold 1 and the second substrate are brought close to each other. A contact process is performed to bring the upper imprint material into contact with the material. At this time, the control unit 11 captures the pattern region 1a of the mold 1 at each of a plurality of timings in which the sizes of the contact regions are different from each other while expanding the contact region between the mold 1 and the imprint material on the second substrate. The imaging unit 8 is controlled so as to perform the above. As a result, an image is obtained for each of the plurality of timings. Each image obtained by the imaging unit 8 is formed by, for example, as shown in FIG. 4, the contact region 15 between the mold 1 and the second substrate, and the contact between the mold 1 and the imprint material on the second substrate. Interference fringes 16 (Newton's rings) may appear. Here, when the imprint material is not supplied on the second substrate, the mold 1 and the second substrate are brought into contact with each other in the contact process of S24.

In S25, the control unit 11 obtains the position of the center of gravity of the contact region from the boundary of the contact region 15 or the interference fringes 16 for each image obtained in S24. As a result, as shown in FIG. 5, the control unit 11 has a relationship indicating a change in the position of the center of gravity of the contact area with respect to a change in the size of the contact area (hereinafter, "relationship between the size of the contact area and the position of the center of gravity"). ) Can be obtained. The "center of gravity position of the contact region" in the present embodiment is defined as, for example, a position relative to the center of the pattern region 1a. That is, the "position of the center of gravity of the contact region" is defined as the difference (distance) between the position of the center of gravity of the contact region and the center of the pattern region 1a. However, the present invention is not limited to this, and the "position of the center of gravity of the contact region" may be defined with reference to a position different from the center of the pattern region 1a. Further, the "size of the contact area" may be the area of the contact area or the diameter of the contact area.

In S26, the control unit 11 determines whether or not the relationship between the size of the contact region and the position of the center of gravity has been obtained for each of the plurality of states in which the relative inclinations of the mold 1 and the second substrate are different from each other. If the relationship is not obtained for each of the plurality of states, the process proceeds to S27, and the control unit 11 changes the relative inclination between the mold 1 and the second substrate in S27, and then returns to S23. On the other hand, when the relationship is obtained for each of the plurality of states, the process proceeds to S28. Here, the number of a plurality of states (that is, the number of times S23 to S26 are repeated) can be arbitrarily set. In the example shown in FIG. 5, the relationship is obtained for each of the three states.

In S28, the control unit 11 determines the ratio of the change in the position of the center of gravity of the contact area to the change in the size of the contact area from the relationship between the size of the contact area generated for each of the plurality of states and the position of the center of gravity (hereinafter, ". The rate of change) is calculated for each state. For example, the control unit 11 can obtain the slope of the linear function as the rate of change by linearly approximating the relationship between the size of the contact region and the position of the center of gravity with a linear function for each state. As a result, as shown in FIG. 6, information indicating the change in the rate of change with respect to the change in the relative inclination between the mold 1 and the second substrate (hereinafter, referred to as information on the rate of change) can be obtained.

In S29, the control unit 11 determines the target relative inclination between the mold 1 and the substrate 2 when the contact process is started, based on the information on the rate of change obtained in S28. For example, the control unit 11 obtains the relative inclination Topt between the mold 1 and the second substrate when the rate of change reaches the target value (for example, zero) based on the information obtained in S28, and obtains the obtained relative inclination Topt. It is determined as the target relative inclination between the mold 1 and the substrate 2.

Here, since a plurality of molds are used in the imprint device 100, it is preferable to perform a process of determining the target relative inclination for each mold. This is because the deviation of the center of gravity of the cavity 1b with respect to the center of the pattern region 1a may differ from mold to mold. Further, the process of determining the target relative inclination may be performed for each of the relative inclination around the X-axis and the relative inclination around the Y-axis.

[About target relative inclination]
Next, by determining the relative inclination between the mold 1 and the second substrate when the rate of change becomes zero as the target relative inclination, the contact start of the pattern region 1a when the contact between the mold 1 and the substrate 2 is started is started. The reason why the position can be brought closer to the center of the pattern region 1a will be described.

FIG. 7 is a diagram showing the curved state of the pattern region 1a of the mold 1 deformed by the deformed portion 5 by the inclination (inclination) at each position in the X direction in the pattern region 1a. This figure was obtained by simulation. With reference to FIG. 7, it can be seen that the slope increases linearly near the center of gravity of the cavity 1b (near the horizontal axis is zero), but the slope gradually decreases and becomes non-linear as the distance from the center of gravity increases. The solid line shown in FIG. 7 is a line obtained by approximating the plot with a cubic polynomial, and the broken line is a line approximated by a linear function. From this, it can be inferred that the way the imprint material spreads when the mold 1 and the imprint material on the substrate are brought into contact with each other differs as the distance from the center of gravity of the cavity 1b increases.

Next, the contact state between the mold 1 and the substrate 2 will be considered. FIG. 8 is a view when the mold 1 deformed by the deformed portion 5 and the substrate 2 are gradually brought into contact with each other. 8 (a) shows a state in which the contact between the mold 1 and the substrate 2 has not started, and FIGS. 8 (b) and 8 (c) show a state in which the contact region between the mold 1 and the substrate 2 is gradually expanded. Each is shown. FIG. 8C shows a state in which the contact area between the mold 1 and the substrate 2 is larger than that in FIG. 8B. In the left view of FIGS. 8A to 8C, the solid line (50a to 50c), the broken line (51a to 51c), and the alternate long and short dash line (52a to 52c) indicate the cross section of the mold 1 (pattern region 1a), respectively. There is. The molds indicated by the broken lines (51a to 51b) are in a state of being tilted counterclockwise with respect to the molds indicated by the solid lines (50a to 50c), and the molds indicated by the alternate long and short dash lines (52a to 52c) are indicated by the solid lines. It is tilted clockwise with respect to the mold. Further, the right view of FIGS. 8A to 8C is an image diagram showing a contact region 15 and an interference fringe 16 appearing in an image in which the pattern region 1a is captured by the imaging unit 8.

In the state shown in FIG. 8 (b), since the interval between the interference fringes 16 is narrower than in the state shown in FIG. 8 (c), it can be seen that the inclination of the boundary portion of the contact region 15 in the pattern region 1a is large. That is, it can be inferred that the inclination of the boundary portion of the contact region in the pattern region 1a changes according to the size of the contact region between the mold 1 and the substrate 2. This situation is shown in FIG. In FIG. 9, the horizontal axis represents the distance in the X direction with respect to the center of gravity of the cavity 1b, and the vertical axis represents the inclination of the boundary portion of the contact region in the pattern region 1a. Further, each curve (60a to 60c, 61a to 61c, 62a to 62c) shown in FIG. 9 corresponds to each curve (50a to 50c, 51a to 51c, 52a to 52c) showing a mold in the left figure of FIG. ..

With reference to FIG. 9, it can be seen that the inclination of the boundary portion of the contact region in the pattern region 1a changes according to the size of the contact region. Looking at the point (X-intercept) where the slope (vertical axis) becomes zero for each curve in FIG. 9, the change in the position in the X direction with respect to the change in the relative slope between the mold 1 and the substrate 2 in the three states You can see that they are different. That is, the difference between the curve 61b and the curve 62b is wider than the difference between the curve 61a and the curve 62c, and the difference between the curve 61c and the curve 62c is even wider. That is, this result shows that the ratio (rate of change) of the change in the position of the center of gravity of the contact region to the change in the size of the contact region increases as the relative inclination between the mold 1 and the second substrate increases as seen in FIG. It represents the phenomenon of increasing. That is, when the inclination of the boundary portion of the contact region in the pattern region 1a changes, the rate of change can change according to the relative inclination between the mold 1 and the second substrate. Conversely, when the rate of change does not change (that is, when it becomes zero), the relative inclination between the mold 1 and the substrate 2 (second substrate) is such that the contact start position in the contact process is centered on the pattern region 1a. It is suggested that stable contact processing can be performed by bringing them closer together.

<Second Embodiment>
In the second embodiment, another method of determining the target relative inclination between the mold 1 and the substrate 2 will be described. In the second embodiment, the target relative inclination is determined according to the flowchart shown in FIG. 3, but the steps S28 to S29 are different from those in the first embodiment. Hereinafter, the steps S28 to S29 according to the second embodiment will be described.

In S28, the control unit 11 determines the position of the center of gravity of the contact region when the size of the contact region becomes zero from the relationship between the size of the contact region generated for each of the plurality of states and the position of the center of gravity (FIG. 5). Each state is obtained as the contact start position of the pattern region 1a. For example, the control unit 11 linearly approximates the relationship between the size of the contact region and the position of the center of gravity by a linear function for each state, and sets the Y-intercept of the linear function as the contact start position of the pattern region 1a. You can ask about the condition. As a result, as shown in FIG. 10, the information indicating the change in the contact start position of the pattern region 1a with respect to the change in the relative inclination between the mold 1 and the second substrate (hereinafter, referred to as the contact start position information) is the rate of change. Can be obtained instead of the information in.

In S29, the control unit 11 determines the target relative inclination between the mold 1 and the substrate 2 when the contact process is started, based on the information of the contact start position obtained in S28. For example, when the target relative inclination is determined so that the contact start position of the pattern region 1a is the center of the pattern region 1a, the control unit 11 uses the mold 1 and the second substrate when the vertical axis of FIG. 10 becomes zero. The relative slope Topt of is determined to be the target relative slope. Further, the target relative inclination may be determined so that the contact start position of the pattern region 1a is between the maximum displacement point of the pattern region 1a and the center of the pattern region 1a. For example, the target relative inclination may be determined so that the contact start position of the pattern region 1a is the midpoint between the maximum displacement portion of the pattern region 1a and the center of the pattern region 1a.

<Third Embodiment>
In the present embodiment, a method of obtaining the optimum relative inclination between the mold 1 and the substrate 2 will be described from the results obtained by each of the method described in the first embodiment and the method described in the second embodiment.

FIG. 13A is a diagram showing information on the rate of change obtained by an experiment using the method described in the first embodiment (information indicating a change in the rate of change with respect to a change in the relative inclination between the mold 1 and the substrate). Is. As described in the first embodiment, the information on the rate of change is obtained by linearly approximating the relationship between the size of the contact region generated for each of the plurality of states and the position of the center of gravity by a linear function. It can be obtained by finding the slope of the quadratic function as the rate of change for each state. In FIG. 13A, the relative inclination between the mold 1 and the substrate when the vertical axis (rate of change) becomes zero is “TA”.

Further, FIG. 13B shows information on the contact start position obtained by the experiment using the method described in the second embodiment (change in the contact start position in the pattern region with respect to the change in the relative inclination between the mold 1 and the substrate). It is a figure which shows information). As described in the second embodiment, the information on the contact start position linearly approximates the relationship between the size of the contact region generated for each of the plurality of states and the position of the center of gravity by a linear function. Then, it can be obtained by obtaining the Y-intercept of the linear function as the contact start position of the pattern region for each state. In FIG. 13B, the relative inclination between the mold 1 and the substrate when the vertical axis (contact start position) becomes zero is “TB”.

FIG. 14 is a diagram showing the contact start position 17 and the expansion of the contact region when the relative inclinations are TA and TB. In FIG. 14, the top view shows the mold 1 and the substrate, where A represents the center position of the pattern region 1a and B represents the position of the center of gravity of the cavity 1b. The figure in the middle shows the contact start position 17 of the pattern region 1a and the spread of the contact region, and the spread of the contact region is conceptually represented by the size of the circle. The bottom figure conceptually shows the relative inclination (eccentricity) between the mold 1 and the substrate. Further, FIG. 14 also shows an example when the relative inclination between the mold 1 and the substrate is set to “T +”.

When the relative inclination is "TB", the contact start position 17 can be set near the center of the pattern region 1a, but the spread of the contact region is biased to the right with respect to the contact start position 17. That is, in the relative inclination TB, the contact region cannot be expanded evenly with respect to the pattern region 1a. On the other hand, when the relative inclination is "TA", the contact region can be expanded substantially evenly with respect to the contact start position 17, but the contact start position 17 is not near the center of the pattern region 1a. That is, even with the relative inclination TA, the contact region cannot be evenly expanded with respect to the pattern region 1a. That is, it can be seen that the optimum relative inclination that can evenly expand the contact region with respect to the pattern region 1a is between "TA" and "TB". Therefore, by obtaining the relative slope TA and the relative slope TB, respectively, the optimum relative slope can be obtained as the target relative slope from the relative slope TA and the relative slope TB.

Here, when the mold 1 and the imprint material on the substrate are brought into contact with each other in S13, the relative inclination of the mold 1 and the substrate 2 may be changed. For example, as shown in FIG. 15, after the mold and the imprint material are brought into contact with each other by the relative inclination TB in which the contact start position 17 is near the center of the shot area, the relative inclination becomes TA as the contact area expands. , The relative inclination between the mold 1 and the substrate 2 may be controlled. FIG. 16 is a diagram showing an example of a control profile of the relative inclination between the mold 1 and the substrate 2. In the control profile shown in FIG. 16, after the contact between the mold 1 and the imprint material is started by the relative inclination TB, the relative inclination between the mold 1 and the substrate 2 becomes TA as the contact area expands. To change. At this time, it is preferable to control the relative inclination of the mold 1 and the substrate 2 so as to once exceed the relative inclination TA and then return to the relative inclination TA. As a result, it is possible to further reduce the application of a force that distorts the pattern region to the mold 1 while expanding the contact region between the mold 1 and the imprint material.

<Fourth Embodiment>
As described above, the process of determining the target relative inclination between the mold 1 and the substrate 2 is preferably performed for each of the plurality of shot regions on the substrate. However, it is complicated to perform a plurality of contact processes by changing the relative inclination between the mold 1 and the second substrate in order to obtain information on the rate of change or information on the contact start position for each of the plurality of shot regions. .. Therefore, in the present embodiment, a method of obtaining the target relative inclination in the other shot regions will be described based on the information on the rate of change and the information on the contact start position obtained in one shot region among the plurality of shot regions. do.

In the following description, in the first shot region of the plurality of shot regions, each step of the flowchart shown in FIG. 3 is performed, the change rate information shown in FIG. 6 and the contact start position information shown in FIG. It is assumed that has already been obtained. Then, an example of determining the target relative inclination for the second shot region different from the first shot among the plurality of shot regions from the information on the rate of change for the first shot region and the information on the contact start position will be described.

Here, in the information on the rate of change obtained for the first shot region, assuming that the slope of the linear function indicating the relationship between the relative slope and the rate of change is the sensitivity ma, the relative slope when the rate of change is A0 ( The first relative slope) is represented by A0 / ma. Further, in the information on the contact start position obtained for the first shot region, assuming that the slope of the linear function indicating the relationship between the relative slope and the contact start position is the sensitivity mb, the relative when the contact start position is B0. The slope (second relative slope) is represented by B0 / mb. A0 and B0 can be set to, for example, zero, respectively. The contact start position becomes zero, that is, the contact start position of the pattern region 1a becomes the center of the pattern region 1a.

The control unit 11 uses the second substrate (dummy substrate) to perform contact processing only once on the region on the second substrate corresponding to the second shot region. The contact process at this time can be performed with the target relative inclination determined for the first shot region. As a result, the relationship between the size of the contact region and the position of the center of gravity can be obtained for the second shot region. Then, by linearly approximating the relationship with a linear function, the slope of the linear function can be obtained as the rate of change A, and the Y intercept of the linear function can be obtained as the contact start position B.

Next, the control unit 11 obtains the relative inclination A'/ ma by the following equation (1), and determines the relative inclination A'/ ma as the target relative inclination for the second shot region. Further, the control unit may obtain the relative inclination B'/ mb by the equation (2) and determine the relative inclination B'/ ma as the target relative inclination for the second shot region.

Here, the difference value | A0 / ma-B0 / mb | between the relative inclination A0 / ma and the relative inclination B0 / mb | is an error component (mold error) caused by the mold 1, and is zero in the ideal state. Should be. Therefore, by removing this mold error from | A / ma-B / mb |, only the error component due to the position of the shot region (that is, the device error (for example, the error of the substrate stage 3)) can be corrected. A correction value can be obtained. The correction value can be represented by {(A / ma-B / mb)-(A0 / ma-B0 / mb)} / 2 in the equations (1) and (2).

Since such mold error is different for each mold, it can be managed for each mold. For example, as a mold error, a difference value (A0 / ma-B0 / mb) between the relative inclination A0 / ma and the relative inclination B0 / mb can be managed for each mold. Further, since the device error differs for each imprint device, it can be managed for each device. For example, as a device error, a correction value represented by {(A / ma-B / mb)-(A0 / ma-B0 / mb)} / 2 can be managed for each device.

<Fifth Embodiment>
Assuming that the relative tilt error (tilt error) between the mold 1 and the substrate 2 caused by the device error while the mold 1 and the imprint material are in contact with each other (during imprinting) is E, E = {( It can be expressed as A / ma-B / mb)-(A0 / ma-B0 / mb)} / 2. The behavior of this E will be described with reference to FIG. FIG. 17 is a diagram showing the relationship between the size of the contact region and the position of the center of gravity (amount of eccentricity) of the contact region. In FIG. 17, the curve p represents an ideal state, and the curve q shows a state in which the inclination and the intercept are changed due to a molding error or the like from this state. Further, the curve r shows a state in which a change in relative inclination occurs during stamping due to an error E. In such a state of the curve r, the size of the contact region and the position of the center of gravity of the contact region are determined by controlling the relative inclination of the mold 1 and the substrate 2 during imprinting in the same manner as in the control described above with reference to FIG. The relationship can be brought closer to the ideal state (curve p).

FIG. 18 is a diagram showing an example of a control profile of the relative inclination between the mold 1 and the substrate 2. “TA0” in FIG. 18 represents the relative inclination (first relative inclination) when the rate of change is A0 in the information on the rate of change, and “TB0” is when the contact start position is B0 in the information on the contact position. The relative inclination (second relative inclination) of is shown. In the control profile shown in FIG. 18, after the contact between the mold 1 and the imprint material is started at the relative inclination TB0, the relative inclination between the mold 1 and the substrate 2 becomes TA0 as the contact area expands. To change. Then, once the relative inclination between the mold 1 and the substrate 2 becomes TA0, the relative inclination is returned by an error E. When the relative inclination of the mold 1 and the substrate 2 is controlled in this way, as shown in FIG. 19, the curve r in which the relative inclination changes during imprinting due to the error E becomes a curve s close to the curve p in the ideal state. can do.

FIG. 20 is a flowchart showing a method of generating a control profile. In S40, the control unit 11 performs the steps S20 to S29 shown in FIG. 3 to obtain information on the rate of change and information on the contact start position. In S41, the control unit 11 obtains an error E using the above equation, and determines the obtained error E as an amount (correction amount) for returning the relative slope from TA0 in order to bring the curve r closer to the ideal state. In S42, the control unit 11 determines whether or not the correction amount is smaller than the determination value (threshold value). If the correction amount is smaller than the determination value, the process ends, and if the correction amount is greater than or equal to the determination value, the process proceeds to S43. In S43, the control unit 11 generates a control profile as shown in FIG. 19 based on the correction amount determined in S42. Then, the control unit 11 performs the steps of S40 (S20 to S29) using the generated control profile, and obtains the correction amount again.

<Sixth Embodiment>
In the sixth embodiment, another method for determining the target relative inclination between the mold 1 and the substrate 2 will be described with reference to FIG. FIG. 11 is a flowchart showing a method of determining a target relative inclination between the mold 1 and the substrate 2. In the present embodiment, the heights of a plurality of points on the pattern region of the mold 1 deformed by the deforming portion 5 are measured by the first measuring unit 9, and the contact of the pattern region 1a is based on the measurement result of the first measuring unit 9. I'm looking for a starting position.

In S30, the control unit 11 causes the first measurement unit 9 to measure the heights of a plurality of points on the pattern region of the mold 1 while moving the substrate stage 3 in the XY directions. Here, the pattern region 1a is not deformed by the deformed portion 5. In S31, the control unit 11 causes the second measurement unit 10 to measure the heights of a plurality of points on the substrate while moving the substrate stage 3 in the XY directions.

In S32, the control unit 11 bases the mold 1 on the basis of the measurement results of the first measurement unit 9 and the second measurement unit 10 so that the mold 1 not deformed by the deformation unit 5 and the substrate 2 are parallel to each other. Controls the relative inclination between the substrate 2 and the substrate 2. The step S32 can be performed, for example, by changing the inclination of the mold 1 by the imprint head 4. Here, in the present embodiment, in the step of S32, the relative inclinations of the mold 1 and the substrate 2 are controlled so as to be parallel to each other, but the present invention is not limited to this. For example, the control unit 11 calculates the relative inclination between the mold 1 and the substrate 2 based on the measurement results of the first measurement unit 9 and the second measurement unit 10, and the calculated relative inclination is determined in a later process. It may be added as an offset value to the target relative inclination between 1 and the substrate 2.

S33 to S37 are steps of obtaining the contact start position of the pattern region 1a and the position (coordinates) of the center of the pattern region 1a in the XY directions for each of the plurality of states in which the relative inclinations of the mold 1 and the substrate 2 are different from each other. Is.

In S33, the control unit 11 controls the deformation unit 5 so that the pattern region 1a of the mold 1 is deformed into a convex shape protruding toward the substrate 2. In S34, the control unit 11 measures the heights of a plurality of points on the pattern region as the first measuring unit while moving the substrate stage 3 in the XY direction in a state where the pattern region 1a of the mold 1 is deformed by the deforming unit 5. Let 9 measure. As a result, as the measurement result (data) of the first measurement unit, it is possible to obtain a height map of a plurality of points on the pattern region with reference to the moving surface (XY surface) on which the first measurement unit 9 moves.

In S35, the control unit 11 obtains the contact start position of the pattern region 1a and the center position of the pattern region 1a as XY coordinates from the measurement results of the first measurement unit 9. As described above, the pattern region 1a has a mesa shape composed of steps of about several tens of μm. Therefore, the control unit 11 detects the mesa edge from the measurement results of the first measurement unit 9, and the mesa edge is detected. The center can be obtained as the center position of the pattern region 1a. Further, the control unit 11 can obtain the point having the lowest height (the point closest to the substrate 2) in the pattern region 1a as the contact start position. Here, in order to improve the accuracy of determining the contact start position and the center position of the pattern region 1a, the first measurement unit 9 may set the distance between a plurality of points of the pattern region 1a for measuring the height to 0.1 mm or less. preferable.

In S36, the control unit 11 determines whether or not the contact start position and the center position of the pattern region 1a have been obtained for each of the plurality of states in which the relative inclinations of the mold 1 and the substrate 2 are different from each other. If the contact start position and the center position have not been obtained for each of the plurality of states, the process proceeds to S37, and the control unit 11 returns to S34 after changing the relative inclination of the mold 1 and the substrate 2 in S37. On the other hand, when the contact start position and the center position are obtained for each of the plurality of states, the process proceeds to S38.

In S38, as shown in FIG. 12, the control unit 11 indicates information indicating a change in the contact start position of the pattern region 1a with respect to a change in the relative inclination, and information indicating a change in the center position of the pattern region 1 with respect to the change in the relative inclination. To be calculated respectively. Then, the control unit 11 determines the relative slope Topt when the two approximate straight lines obtained by approximating each of them with a linear function as the target relative slope. Here, in the present embodiment, the contact start position and the center position of the pattern region 1a are obtained as XY coordinates, respectively, but the present invention is not limited thereto. For example, the contact start position of the pattern region 1a can be defined as a position with reference to the center position of the pattern region 1a. That is, the "contact start position" may be defined as the difference between the contact start position and the center position of the pattern region 1a. In this case, in the figure shown in FIG. 12, only the information indicating the change in the contact start position of the pattern region 1a with respect to the change in the relative inclination can be obtained.

The control unit 11 controls the relative inclination of the mold 1 and the substrate 2 so as to have the target relative inclination determined in this way, and brings the mold 1 and the substrate 2 into contact with each other via the imprint material. As a result, the contact start position of the pattern region 1a when starting the contact processing can be brought closer to the center of the pattern region 1a, so that the force applied to the mold 1 so as to distort the pattern region 1a in the contact processing can be reduced. Can be done.

<Embodiment of manufacturing method of article>
The method for manufacturing an article according to the embodiment of the present invention is suitable for producing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily in manufacturing various articles.

The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting. The cured product pattern is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching, ion implantation, or the like in the substrate processing process.

In the method for manufacturing an article of the present embodiment, a pattern is formed on a resin coated on a substrate by using the above-mentioned imprint device (a step of imprinting the substrate), and a pattern is formed by such a step. Includes the process of processing the substrate. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, flattening, etching, resist peeling, dicing, bonding, packaging, etc.). The method for producing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

1: Mold 2: Substrate 3: Substrate stage 4: Imprint head, 5: Deformation part, 6: Irradiation part, 7: Supply part, 8: Imaging part, 9: 1st measurement part, 10: 2nd Measuring unit, 100: Imprint device

Claims (13)

An imprinting apparatus that transfers the pattern to an imprinting material on a substrate using a mold having a pattern region on which the pattern is formed.
A deformed portion that deforms the pattern region into a convex shape protruding toward the substrate, and a deformed portion.
The pattern region is deformed by the deformed portion, and the contact between the mold and the imprint material is started in a state where the relative inclination between the mold and the substrate is set as the target relative inclination, and the mold and the imprint material are brought into contact with each other. A control unit that controls the process of gradually expanding the contact area of
Including
Wherein the control unit, the relative inclination between the mold and the substrate are obtained for each of the different plurality of states to each other, based on the relationship shown a change in the position of the center of gravity of the contact area with respect to changes in the size of the contact touch region The relative inclination when the ratio of the change in the position of the center of gravity of the contact area to the change in the size of the contact area becomes a predetermined value is obtained, and the target relative inclination is determined based on the obtained relative inclination. An imprinting device characterized by. The imprinting apparatus according to claim 1, wherein the predetermined value is zero. The first or second claim is characterized in that the control unit acquires the relationship for each of the plurality of states by performing the processing in advance for each of the plurality of states having different relative inclinations. The imprinting device described. The imprint device according to any one of claims 1 to 3 , wherein the control unit determines the target relative inclination for each mold. The control unit controls the relative inclination of the mold and the substrate so as to have the target relative inclination, starts contact between the mold and the imprint material, and then contacts the mold and the imprint material. The invention according to any one of claims 1 to 4 , wherein the relative inclination of the mold and the substrate is controlled so that the mold and the substrate gradually become parallel as the region gradually expands. The imprinting device described. It further includes an imaging unit that images the pattern region.
Claim 1 is characterized in that the control unit obtains the size of the contact region between the mold and the imprint material and the position of the center of gravity of the contact region based on the image obtained by the imaging unit. The imprinting apparatus according to any one of 5 to 5. Claims 1 to 6 are characterized in that the control unit determines the relative slope when the ratio reaches a predetermined value as the target relative slope based on the relationship for each of the plurality of states. The imprinting apparatus according to any one of the above. The control unit
Based on the relationship for each of said plurality of states, generate the first information indicating a change in the ratio of change in the phase to slope, said time of said ratio from said first information is the predetermined value seek relative inclination as the first relative inclination,
Based on the relationship for each of said plurality of states, generate the second information indicating a change in the contact start position of the pattern region with respect to a change in the phase to slope, the contact start of the pattern area from the second information position is calculated the phase to slope when a predetermined position of the pattern area as a second relative inclination,
The imprint device according to any one of claims 1 to 6, wherein the target relative inclination is determined based on the first relative inclination and the second relative inclination. The imprint device according to claim 8, wherein the control unit determines the target relative inclination between the first relative inclination and the second relative inclination. The imprinting apparatus according to claim 8 or 9, wherein the predetermined position is the center of the pattern region. The substrate has a plurality of shot regions including a first shot region and a second shot region.
Prior Symbol controller, claims wherein the target relative inclination of the second shot region, determined based on the first information and the second information generated for the first shot area, it is characterized by The imprinting apparatus according to any one of 8 to 10. Wherein, prior SL on the basis of said first relative inclination second relative inclination, after contacting the substrate and the mold in the second relative tilt, said relative tilt as the contact area is enlarged The imprint device according to any one of claims 8 to 10, wherein a control profile of the target relative inclination in the process is determined so as to have the first relative inclination. A forming step of forming a pattern on a substrate by using the imprinting apparatus according to any one of claims 1 to 12.
A processing process for processing the substrate on which a pattern is formed in the forming process, and a processing process for processing the substrate.
Including
A method for producing an article, which comprises producing an article from the substrate processed in the processing step.

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