SG11201604407WA - Asymmetric template shape modulation for partial field imprinting - Google Patents
Asymmetric template shape modulation for partial field imprintingInfo
- Publication number
- SG11201604407WA SG11201604407WA SG11201604407WA SG11201604407WA SG11201604407WA SG 11201604407W A SG11201604407W A SG 11201604407WA SG 11201604407W A SG11201604407W A SG 11201604407WA SG 11201604407W A SG11201604407W A SG 11201604407WA SG 11201604407W A SG11201604407W A SG 11201604407WA
- Authority
- SG
- Singapore
- Prior art keywords
- partial field
- template shape
- shape modulation
- asymmetric template
- field imprinting
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361922431P | 2013-12-31 | 2013-12-31 | |
| PCT/US2014/072955 WO2015103370A1 (en) | 2013-12-31 | 2014-12-31 | Asymmetric template shape modulation for partial field imprinting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201604407WA true SG11201604407WA (en) | 2016-07-28 |
Family
ID=53480768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201604407WA SG11201604407WA (en) | 2013-12-31 | 2014-12-31 | Asymmetric template shape modulation for partial field imprinting |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10578964B2 (en) |
| JP (1) | JP6538695B2 (en) |
| KR (1) | KR102305247B1 (en) |
| CN (1) | CN106030756B (en) |
| SG (1) | SG11201604407WA (en) |
| TW (1) | TWI690482B (en) |
| WO (1) | WO2015103370A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3134771B1 (en) | 2014-04-22 | 2019-08-28 | Ev Group E. Thallner GmbH | Method and device for embossing a nanostructure |
| JP2016157784A (en) * | 2015-02-24 | 2016-09-01 | 株式会社東芝 | Pattern forming method and pattern forming apparatus |
| JP2017059717A (en) * | 2015-09-17 | 2017-03-23 | 株式会社東芝 | Template, imprint device and control method |
| US11104057B2 (en) | 2015-12-11 | 2021-08-31 | Canon Kabushiki Kaisha | Imprint apparatus and method of imprinting a partial field |
| JP6942491B2 (en) * | 2016-03-15 | 2021-09-29 | キヤノン株式会社 | Imprinting equipment and manufacturing method of goods |
| US10627715B2 (en) | 2016-10-31 | 2020-04-21 | Canon Kabushiki Kaisha | Method for separating a nanoimprint template from a substrate |
| US10549313B2 (en) * | 2016-10-31 | 2020-02-04 | Canon Kabushiki Kaisha | Edge field imprint lithography |
| US11454883B2 (en) | 2016-11-14 | 2022-09-27 | Canon Kabushiki Kaisha | Template replication |
| JP7086711B2 (en) * | 2018-05-18 | 2022-06-20 | キヤノン株式会社 | Imprint device and article manufacturing method |
| US11204549B2 (en) * | 2018-10-26 | 2021-12-21 | Canon Kabushiki Kaisha | Superstrate with an offset mesa and methods of using the same |
| JP7171394B2 (en) * | 2018-11-29 | 2022-11-15 | キヤノン株式会社 | Molding Apparatus, Molding Method, and Article Manufacturing Method |
| US11614693B2 (en) | 2021-06-30 | 2023-03-28 | Canon Kabushiki Kaisha | Method of determining the initial contact point for partial fields and method of shaping a surface |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5151277A (en) * | 1991-03-27 | 1992-09-29 | The Charles Stark Draper Lab., Inc. | Reconfigurable fiber-forming resin transfer system |
| US5464337A (en) * | 1991-03-27 | 1995-11-07 | The Charles Stark Draper Laboratories | Resin transfer molding system |
| US5464711A (en) * | 1994-08-01 | 1995-11-07 | Motorola Inc. | Process for fabricating an X-ray absorbing mask |
| US6873087B1 (en) | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
| US20060005657A1 (en) * | 2004-06-01 | 2006-01-12 | Molecular Imprints, Inc. | Method and system to control movement of a body for nano-scale manufacturing |
| US20080160129A1 (en) | 2006-05-11 | 2008-07-03 | Molecular Imprints, Inc. | Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template |
| US7077992B2 (en) | 2002-07-11 | 2006-07-18 | Molecular Imprints, Inc. | Step and repeat imprint lithography processes |
| US6932934B2 (en) | 2002-07-11 | 2005-08-23 | Molecular Imprints, Inc. | Formation of discontinuous films during an imprint lithography process |
| US6936194B2 (en) | 2002-09-05 | 2005-08-30 | Molecular Imprints, Inc. | Functional patterning material for imprint lithography processes |
| US8349241B2 (en) | 2002-10-04 | 2013-01-08 | Molecular Imprints, Inc. | Method to arrange features on a substrate to replicate features having minimal dimensional variability |
| US20040065252A1 (en) | 2002-10-04 | 2004-04-08 | Sreenivasan Sidlgata V. | Method of forming a layer on a substrate to facilitate fabrication of metrology standards |
| US7179396B2 (en) | 2003-03-25 | 2007-02-20 | Molecular Imprints, Inc. | Positive tone bi-layer imprint lithography method |
| US7396475B2 (en) | 2003-04-25 | 2008-07-08 | Molecular Imprints, Inc. | Method of forming stepped structures employing imprint lithography |
| US7157036B2 (en) | 2003-06-17 | 2007-01-02 | Molecular Imprints, Inc | Method to reduce adhesion between a conformable region and a pattern of a mold |
| US7037458B2 (en) * | 2003-10-23 | 2006-05-02 | Intel Corporation | Progressive stamping apparatus and method |
| US8076386B2 (en) | 2004-02-23 | 2011-12-13 | Molecular Imprints, Inc. | Materials for imprint lithography |
| WO2005118914A2 (en) * | 2004-05-28 | 2005-12-15 | Board Of Regents, The University Of Texas System | Substrate support system and method |
| US7635263B2 (en) | 2005-01-31 | 2009-12-22 | Molecular Imprints, Inc. | Chucking system comprising an array of fluid chambers |
| US7802978B2 (en) * | 2006-04-03 | 2010-09-28 | Molecular Imprints, Inc. | Imprinting of partial fields at the edge of the wafer |
| US20070231422A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | System to vary dimensions of a thin template |
| US8048473B2 (en) | 2006-07-04 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
| US7997891B2 (en) * | 2007-04-12 | 2011-08-16 | Purdue Research Foundation | Molding processes and tool therefor |
| US7999912B2 (en) * | 2007-05-08 | 2011-08-16 | Asml Netherlands B.V. | Lithographic apparatus and sensor calibration method |
| JP5112022B2 (en) | 2007-11-26 | 2013-01-09 | 株式会社東芝 | Electric vacuum cleaner |
| US8913230B2 (en) * | 2009-07-02 | 2014-12-16 | Canon Nanotechnologies, Inc. | Chucking system with recessed support feature |
| JP2012099789A (en) * | 2010-10-08 | 2012-05-24 | Canon Inc | Imprint device and manufacturing method of article |
| JP2012134214A (en) | 2010-12-20 | 2012-07-12 | Canon Inc | Imprint apparatus and manufacturing method of goods |
| JP5759303B2 (en) | 2011-08-11 | 2015-08-05 | キヤノン株式会社 | Imprint apparatus and article manufacturing method using the same |
| JP6061524B2 (en) * | 2011-08-11 | 2017-01-18 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
| JP6004738B2 (en) | 2011-09-07 | 2016-10-12 | キヤノン株式会社 | Imprint apparatus and article manufacturing method using the same |
| JP2013098497A (en) * | 2011-11-04 | 2013-05-20 | Canon Inc | Imprint apparatus and manufacturing method of article |
| JP5930699B2 (en) * | 2011-12-20 | 2016-06-08 | キヤノン株式会社 | Imprint apparatus, imprint method, and device manufacturing method |
| JP2013142158A (en) * | 2012-01-06 | 2013-07-22 | Nippon Shokubai Co Ltd | Metallic nanostructure and method for producing the same |
| JP5824380B2 (en) * | 2012-02-07 | 2015-11-25 | キヤノン株式会社 | Imprint apparatus, imprint method, and article manufacturing method |
| JP6304934B2 (en) | 2012-05-08 | 2018-04-04 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
-
2014
- 2014-12-31 US US14/587,370 patent/US10578964B2/en active Active
- 2014-12-31 TW TW103146559A patent/TWI690482B/en active
- 2014-12-31 SG SG11201604407WA patent/SG11201604407WA/en unknown
- 2014-12-31 CN CN201480071488.5A patent/CN106030756B/en active Active
- 2014-12-31 WO PCT/US2014/072955 patent/WO2015103370A1/en active Application Filing
- 2014-12-31 JP JP2016540024A patent/JP6538695B2/en active Active
- 2014-12-31 KR KR1020167018482A patent/KR102305247B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US20150183151A1 (en) | 2015-07-02 |
| CN106030756B (en) | 2021-01-22 |
| US10578964B2 (en) | 2020-03-03 |
| TWI690482B (en) | 2020-04-11 |
| CN106030756A (en) | 2016-10-12 |
| TW201536663A (en) | 2015-10-01 |
| JP6538695B2 (en) | 2019-07-03 |
| JP2017502510A (en) | 2017-01-19 |
| WO2015103370A1 (en) | 2015-07-09 |
| KR102305247B1 (en) | 2021-09-27 |
| KR20160103020A (en) | 2016-08-31 |
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