CN101384129A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN101384129A
CN101384129A CNA2007102016038A CN200710201603A CN101384129A CN 101384129 A CN101384129 A CN 101384129A CN A2007102016038 A CNA2007102016038 A CN A2007102016038A CN 200710201603 A CN200710201603 A CN 200710201603A CN 101384129 A CN101384129 A CN 101384129A
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Prior art keywords
differential signal
signal transmission
circuit board
printed circuit
pcb
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CNA2007102016038A
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CN101384129B (zh
Inventor
刘建宏
许寿国
白育彰
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2007102016038A priority Critical patent/CN101384129B/zh
Priority to US11/957,419 priority patent/US7542303B2/en
Publication of CN101384129A publication Critical patent/CN101384129A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印刷电路板，包括一差分信号对，所述差分信号对包括分别位于所述印刷电路板相邻两信号层的两差分信号传输线，每一差分信号传输线所在的信号层上于该差分信号传输线的至少一侧设有与该差分信号传输线间隔相邻的接地层。所述印刷电路板可通过调整差分信号传输线和相邻接地层之间的距离调整传输线的单端阻抗值，达到印刷电路板设计规范中传输线单端阻抗的设计要求。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板，特别涉及一种具有上下耦合式差分信号对的印刷电路板。
背景技术
在印刷电路板的布线中，通常采用差分信号对的布线方式以降低信号在传输信道上传输时所产生的串扰。差分信号对的排列方式通常有上下耦合式(Broadside-Coupling)和左右耦合式(Edge-Coupling)。图1为传统的具有上下耦合式差分信号对的印刷电路板，其中印刷电路板1中间两层分别布置差分信号对10的两差分信号传输线D+、D-，外侧两层分别布置差分信号传输线D+和D的参考接地层20。根据印刷电路板设计规范，差分信号传输线差分阻抗的理想值为100欧姆，单端阻抗的理想值范围为50~60欧姆。采用传统的印刷电路板虽然能达到传输线差分阻抗的设计要求，却存在较高的传输线单端阻抗值，无法达到传输线单端阻抗的设计要求。
发明内容
鉴于以上内容，有必要提供一种印刷电路板，能降低传输线的单端阻抗值，达到印刷电路板设计规范中传输线单端阻抗的设计要求。
一种印刷电路板，包括一差分信号对，所述差分信号对包括分别位于所述印刷电路板相邻两信号层的两差分信号传输线，每一差分信号传输线所在的信号层上于该差分信号传输线的至少一侧设有与该差分信号传输线间隔相邻的接地层。
所述印刷电路板可通过调整差分信号传输线和相邻接地层之间的距离调整传输线的单端阻抗值，达到印刷电路板设计规范中传输线单端阻抗的设计要求。
附图说明
下面结合附图及较佳实施方式对本发明作进一步详细描述：
图1是传统的印刷电路板的示意图。
图2是本发明印刷电路板较佳实施方式的示意图。
具体实施方式
本发明印刷电路板较佳实施方式如图2所示，一印刷电路板3包括一差分信号对30和若干接地层40。所述差分信号对30包括两恒定间距、长度一致且信号流向相反的差分信号传输线D+、D-，所述差分信号传输线D+、D布置于印刷电路板3的相邻两信号层上，差分信号传输线D+所在的信号层上在差分信号传输线D+的两侧对称的间隔设置两接地层40，差分信号传输线D所在的信号层上在差分信号传输线D的两侧也对称的间隔设置两接地层40。接地层40的厚度等于差分信号传输线D+、D的厚度T，接地层40的长度等于差分信号传输线D+、D的长度。差分信号传输线D+、D的宽度为W，每一接地层40到其同一层相邻的差分信号传输线的距离为S，差分信号传输线D+、D之间的间距为H。传输线单端阻抗的计算方法可参照相应的经验公式，如：
Z 0 ≈ 87 ϵ r + 1.41 ln 5.98 S 0.8 W + T
其中，Z0为传输线的单端阻抗，εγ为介质的介电常数，W为传输线的宽度，T为传输线的厚度，S为每一接地层40到其同一层相邻的差分信号传输线的距离。所述差分信号对30的单端阻抗值由T、W、S共同决定，而T、W通常在设计印刷电路板时是固定的，因此只需调整接地层40到其同一层相邻的差分信号传输线的距离S即可调整差分信号对30的单端阻抗值，达到印刷电路板设计规范中传输线单端阻抗的设计要求。
本发明也可以分别只在差分信号传输线D+、D的一侧间隔设置接地层40，同样可以通过调整接地层40到其同一层相邻的差分信号传输线的距离S达到调整差分信号对30单端阻抗值的目的。但与两侧各间隔设置一个接地层相比，在两侧各间隔设置一个接地层具有能够排除其他传输线对差分信号传输线D+、D干扰的优点。
在本发明较佳实施例中，差分信号传输线D+、D的宽度W为4mil，差分信号传输线D+、D-之间的间距H为8mil，而差分信号传输线D+、D的厚度T一般在2.1mil左右，若是利用传统的印刷电路板，传输线的差分阻抗值约为100.33ohm虽然能达到设计要求，但其单端阻抗也高达70.06ohm，远超出设计规范所规定的50~60欧姆的单端阻抗要求。而利用本发明印刷电路板，只需将每一接地层40到其同一层相邻的差分信号传输线的距离S调整为4.8mil，就可达到一个比较理想的单端阻抗值60.83ohm，其差分阻抗值也达到100.39ohm，均在印刷电路板设计规范的理想值范围内。其中每一差分信号传输线两侧的接地层40的对称排列可抑制信号传输过程中共模杂讯的干扰。同时，由于差分信号传输线D+、D分别与对应的参考接地层位于同一层，因此节省了两层的布线空间，降低了印刷电路板的制造成本。

Claims (3)

  1. 【权利要求1】一种印刷电路板，包括一差分信号对，所述差分信号对包括分别位于所述印刷电路板相邻两信号层的两差分信号传输线，其特征在于：每一差分信号传输线所在的信号层上于该差分信号传输线的至少一侧设有与该差分信号传输线间隔相邻的接地层。
  2. 【权利要求2】如权利要求1所述的印刷电路板，其特征在于：每一差分信号传输线的两侧各设有一接地层。
  3. 【权利要求3】如权利要求2所述的印刷电路板，其特征在于：每一差分信号传输线两侧的接地层为对称排列。
CN2007102016038A 2007-09-06 2007-09-06 印刷电路板 Expired - Fee Related CN101384129B (zh)

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CN2007102016038A CN101384129B (zh) 2007-09-06 2007-09-06 印刷电路板
US11/957,419 US7542303B2 (en) 2007-09-06 2007-12-15 Printed circuit board

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101983003A (zh) * 2010-08-31 2011-03-02 华为终端有限公司 电路板
CN102339332A (zh) * 2010-07-19 2012-02-01 鸿富锦精密工业（深圳）有限公司 差分信号走线布线系统及方法
CN103635016A (zh) * 2012-08-21 2014-03-12 晨星半导体股份有限公司 电路布图方法以及印刷电路板
CN103906342A (zh) * 2012-12-28 2014-07-02 鸿富锦精密工业（深圳）有限公司 电路板
CN105050312A (zh) * 2014-04-30 2015-11-11 三星电机株式会社 布线基板
CN111315117A (zh) * 2020-02-27 2020-06-19 歌尔股份有限公司 印制电路板

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US8847696B2 (en) * 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
JPWO2022003905A1 (zh) * 2020-07-02 2022-01-06
CN112601345A (zh) * 2020-12-08 2021-04-02 深圳市卡卓无线信息技术有限公司 一种印刷电路板及电子设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102339332A (zh) * 2010-07-19 2012-02-01 鸿富锦精密工业（深圳）有限公司 差分信号走线布线系统及方法
CN101983003A (zh) * 2010-08-31 2011-03-02 华为终端有限公司 电路板
CN101983003B (zh) * 2010-08-31 2014-04-02 华为终端有限公司 电路板
CN103635016A (zh) * 2012-08-21 2014-03-12 晨星半导体股份有限公司 电路布图方法以及印刷电路板
CN103906342A (zh) * 2012-12-28 2014-07-02 鸿富锦精密工业（深圳）有限公司 电路板
CN105050312A (zh) * 2014-04-30 2015-11-11 三星电机株式会社 布线基板
CN111315117A (zh) * 2020-02-27 2020-06-19 歌尔股份有限公司 印制电路板

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US7542303B2 (en) 2009-06-02
CN101384129B (zh) 2010-06-09
US20090065241A1 (en) 2009-03-12

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