CN101370351A - 软性电路板 - Google Patents

软性电路板 Download PDF

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Publication number
CN101370351A
CN101370351A CN200710201390.9A CN200710201390A CN101370351A CN 101370351 A CN101370351 A CN 101370351A CN 200710201390 A CN200710201390 A CN 200710201390A CN 101370351 A CN101370351 A CN 101370351A
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circuit board
flexible circuit
differential pair
layer
spacing
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CN101370351B (zh
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白育彰
许寿国
刘建宏
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200710201390.9A priority Critical patent/CN101370351B/zh
Priority to US11/946,859 priority patent/US8022309B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种软性电路板，包括一信号层、一接地层，所述信号层与接地层之间填充一层绝缘介质，所述信号层上布设一差分对，所述差分对包括两条差分传输线，所述接地层上与所述差分传输线垂直相对的部分为一挖空区域，所述信号层上，在所述差分对两侧分别平行设置有一条接地导电材料，每一条接地导电材料与其相邻的传输线具有一间距。所述软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。所述软性电路板无需增加额外成本，只需调整现有布线方式即可实现。

Description

软性电路板
技术领域
本发明涉及一种软性电路板，特别涉及一种可传输高速差分信号的软性电路板。
背景技术
软性电路板是用柔性的绝缘基材制成的印刷电路板，具有许多硬性印刷电路板不具备的优点。例如软性电路板厚度较薄，可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化。利用软性电路板可大大缩小电子产品的体积，适用电子产品向高密度、小型化、高可靠性方向发展的需要。因此，软性电路板在航天、军事、移动通讯、手提电脑、计算机外设、PDA、数码相机等领域或产品上得到了广泛的应用。
因为软性电路板厚度极薄，软性电路板上的传输线的阻抗偏低，因为传输高速信号要求较高的传输线阻抗，在软性电路板上，即使一般制程可达到的最细传输线宽度，例如4密尔(1密尔＝0.0254毫米)，也难以达到高速信号传输线阻抗的要求。
参考图1，现有技术提高传输线阻抗的方法，是将软性电路板50的接地层参考铜箔切割成网格状。但如果在信号层上传输差分对51时，会因为差分传输线52和差分传输线54对应的接地层铜箔网格排布不同，导致共模噪音的产生，这也是一般软性电路板无法传输高速差分信号的原因。
发明内容
鉴于上述内容，有必要提供一种可传输高速差分信号的软性电路板。
一种软性电路板，包括一信号层、一接地层，所述信号层与接地层之间填充一层绝缘介质，所述信号层上布设一差分对，所述差分对包括两条差分传输线，所述接地层上与所述差分传输线垂直相对的部分为一挖空区域，所述信号层上，在所述差分对两侧分别平行设置有一条接地导电材料，每一条接地导电材料与其相邻的传输线具有一间距。
所述软性电路板是在所述信号层上在差分对的两侧平行设置接地导电材料，并将差分对的两传输线垂直对应的接地层部分挖空，避免上层差分对与下层接地层的间距太近所导致的传输线阻抗偏低问题的产生，所述软性电路板可传输高速信号，并可消除现有技术中网格化接地层所衍生的共模噪音问题。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为现有技术软性电路板的结构示意图。
图2为本发明软性电路板的较佳实施方式的结构示意图。
具体实施方式
请参照图2，本发明软性电路板的较佳实施方式包括一信号层10及一接地层30，在信号层10及接地层30之间填充一层绝缘介质20。一差分对11包括两条差分传输线12及14，并布线于所述信号层10上。所述差分传输线12及14的下方所对应的接地层30的部分作挖空处理，以避免上层差分对11与下层接地层30的间距太近所导致的传输线阻抗偏低问题的产生，图2中所述接地层30中央的矩形挖空区域32即是铜皮挖空区域。在所述信号层10上，所述差分对11的两侧平行设置有与差分对11长度相等的接地导电材料，本较佳实施方式中所述接地导电材料为接地铜箔16，每一接地铜箔16与其对应相邻的传输线12及14具有一间距d，所述间距d根据差分对11传输的信号不同而不同，所述间距d可根据差分对11传输不同信号时的阻抗要求经由仿真软件仿真后确定，如当所述差分对11传输IEEE1394信号时，所述间距d的宽度为40密尔，当所述差分对11传输PCI-EXPRESS信号时，所述间距d的宽度为10密尔，当所述差分对11传输USB信号时，所述间距d的宽度为4密尔。所述接地层30上的铜皮挖空区域的宽度也根据差分对11传输不同信号时的阻抗要求，考虑软性电路板上每条差分传输线12及14的线宽、两条差分传输线12及14的间距、信号层10上接地铜箔16的宽度、信号层10上每条接地铜箔16至其对应差分传输线12及14的间距、及接地层30上的铜箔至每条差分传输线12及14的间距等条件，经由仿真软件仿真后确定。
所述软性电路板是在所述信号层10上，在差分对的两侧平行设置接地铜箔16，并将差分对11的两传输线12、14垂直对应的接地层部分挖空，避免上层的差分对11与下层的接地层30的间距太近所导致的传输线阻抗偏低问题的产生，并通过仿真软体仿真后设定所述接地铜箔16与传输线12、14的间距及接地层挖空区域32的宽度。本发明软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。本发明软性电路板无需增加额外成本，只需调整现有布线方式即可实现。

Claims (7)

1.一种软性电路板，包括一信号层、一接地层，所述信号层与接地层之间填充一层绝缘介质，所述信号层上布设一差分对，所述差分对包括两条差分传输线，其特征在于：所述接地层上与所述差分传输线垂直相对的部分为一挖空区域，所述信号层上，在所述差分对两侧分别平行设置有一条接地导电材料，每一条接地导电材料与其相邻的传输线具有一间距。
2.如权利要求1所述的软性电路板，其特征在于：当所述差分对传输IEEE1394信号时，所述间距的宽度为40密尔。
3.如权利要求1所述的软性电路板，其特征在于：所述差分对传输PCI-EXPRESS信号时，所述间距的宽度为10密尔。
4.如权利要求1所述的软性电路板，其特征在于：当所述差分对传输USB信号时，所述间距的宽度为4密尔。
5.如权利要求1所述的软性电路板，其特征在于：所述接地导电材料为铜箔。
6.如权利要求1所述的软性电路板，其特征在于：所述挖空区域为铜皮挖空区域。
7.如权利要求1所述的软性电路板，其特征在于：所述接地导电材料的长度与差分对的长度相等。
CN200710201390.9A 2007-08-17 2007-08-17 软性电路板 Expired - Fee Related CN101370351B (zh)

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US11/946,859 US8022309B2 (en) 2007-08-17 2007-11-29 Flexible printed circuit board

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Publication number Priority date Publication date Assignee Title
CN101965096A (zh) * 2009-07-24 2011-02-02 鸿富锦精密工业（深圳）有限公司 软性电路板
CN101983003A (zh) * 2010-08-31 2011-03-02 华为终端有限公司 电路板
CN101990222A (zh) * 2009-08-07 2011-03-23 鸿富锦精密工业（深圳）有限公司 信号传输装置
CN102238797A (zh) * 2010-04-20 2011-11-09 鸿富锦精密工业（深圳）有限公司 软性电路板
CN102264188A (zh) * 2010-05-24 2011-11-30 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN103098560A (zh) * 2010-08-30 2013-05-08 株式会社藤仓 差分信号传输电路及其制造方法
CN103108486A (zh) * 2013-01-18 2013-05-15 浪潮电子信息产业股份有限公司 一种跨层参考降低损耗的设计方法
CN105611718A (zh) * 2016-01-29 2016-05-25 武汉天马微电子有限公司 柔性电路板
CN109121286A (zh) * 2018-10-11 2019-01-01 郑州云海信息技术有限公司 一种电路板以及服务器
CN109743835A (zh) * 2018-09-21 2019-05-10 昆山联滔电子有限公司 一种柔性扁平电缆
CN109842989A (zh) * 2017-11-24 2019-06-04 广达电脑股份有限公司 高速电路及其高速差分线结构

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CN101965096A (zh) * 2009-07-24 2011-02-02 鸿富锦精密工业（深圳）有限公司 软性电路板
CN101990222A (zh) * 2009-08-07 2011-03-23 鸿富锦精密工业（深圳）有限公司 信号传输装置
CN102238797A (zh) * 2010-04-20 2011-11-09 鸿富锦精密工业（深圳）有限公司 软性电路板
CN102264188A (zh) * 2010-05-24 2011-11-30 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN102264188B (zh) * 2010-05-24 2013-12-11 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN103098560B (zh) * 2010-08-30 2015-11-25 株式会社藤仓 差分信号传输电路及其制造方法
CN103098560A (zh) * 2010-08-30 2013-05-08 株式会社藤仓 差分信号传输电路及其制造方法
US9055676B2 (en) 2010-08-30 2015-06-09 Fujikura Ltd. Differential signal transmission circuit and method for manufacturing same
CN101983003B (zh) * 2010-08-31 2014-04-02 华为终端有限公司 电路板
CN101983003A (zh) * 2010-08-31 2011-03-02 华为终端有限公司 电路板
CN103108486A (zh) * 2013-01-18 2013-05-15 浪潮电子信息产业股份有限公司 一种跨层参考降低损耗的设计方法
CN105611718A (zh) * 2016-01-29 2016-05-25 武汉天马微电子有限公司 柔性电路板
CN109842989A (zh) * 2017-11-24 2019-06-04 广达电脑股份有限公司 高速电路及其高速差分线结构
CN109842989B (zh) * 2017-11-24 2022-03-29 广达电脑股份有限公司 高速电路及其高速差分线结构
CN109743835A (zh) * 2018-09-21 2019-05-10 昆山联滔电子有限公司 一种柔性扁平电缆
CN109121286A (zh) * 2018-10-11 2019-01-01 郑州云海信息技术有限公司 一种电路板以及服务器

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