CN101369545B - Heating block and wire bonding method using the same - Google Patents
Heating block and wire bonding method using the same Download PDFInfo
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- CN101369545B CN101369545B CN2007101436056A CN200710143605A CN101369545B CN 101369545 B CN101369545 B CN 101369545B CN 2007101436056 A CN2007101436056 A CN 2007101436056A CN 200710143605 A CN200710143605 A CN 200710143605A CN 101369545 B CN101369545 B CN 101369545B
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
- H01L2224/78704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L2924/01082—Lead [Pb]
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Abstract
The invention provides a heating block for lead bonding process and a method for bonding by the heating block. The heating block comprises a heating hole formed in the center part of the heating block for heating a lead frame to be bonded; a vacuum adsorbing hole corresponding to pins of the lead frame distributed on periphery of the heating hole through the whole heating block for adsorbing the lead frame. The heating block can enable the lead frame to be fixed on the heating block firmly, thereby eliminating vibration and instability phenomenons of the pins of the lead frame in the course of bonding leads.
Description
Technical field
The present invention relates to a kind of vacuum type heat block and a kind of wire bonding method that utilizes this vacuum type heat block that is used for lead key closing process, more particularly, relate to a kind of in order to improve the lead frame pin lead-in wire in the bonding process vibration and vacuum type heat block and a kind of wire bonding method that utilizes this vacuum type heat block of wild effect.
Background technology
The encapsulation of chip is in order to make chip avoid the influence of external environment conditions such as mechanical stress, thermal stress, moisture, pernicious gas and radioactive ray, do like this, guaranteed on the one hand semiconductor device bring into play to greatest extent it electrology characteristic and operate as normal, on the other hand by encapsulating housing will make use convenient.
Assembly technology necessary in the encapsulation comprises: slide plate (tube core is cut apart), chip attach, lead-in wire bonding and mold pressing plastic packaging etc.
Recently, microelectronics VLSI (very large scale integrated circuit) designs and manufacturing process are constantly progressive, and chip size is miniaturization more and more, so also just advance updating and improving of encapsulation technology.And the lead key closing process in the encapsulation technology also becomes the key that whole encapsulation technology improves.The lead-in wire bonding is meant the operation that the interior pin position on pressure welding area on the large scale integrated chip and the lead frame is coupled together with the mode of wire by bonding.
In the lead-in wire bonding process, transfer member is loaded into lead frame between the heat block and pressing plate position that continues heating.After the position alignment of lead frame, pressing plate is pressed down, lead frame is fixed on the heat block.Then, carry out the lead-in wire bonding process by ultrasonic-thermocompression welding.Bonding unclamps pressing plate after finishing, and by transfer member lead frame is derived, thereby finishes lead key closing process.
Yet,, impel the pin of supporting with it lead frame and bonding spacing to do littler and littler along with the miniaturization of chip bonding pad.The vibration on pin top is very big to the influence of lead-in wire bonding process in the lead-in wire bonding process, and this just has higher requirement to go between bonding process center platen and heat block.
Fig. 1 is traditional heating block structured generalized section.
As shown in Figure 1, in the lead-in wire bonding process of packaging technology, in order to guarantee the stability of lead frame 4 in bonding process, when 2 pairs of lead frames 4 of heat block heat, lead frame 4 is played a supporting role, and press down by pressing plate 1 lead frame 4 is fixed on the heat block 2, and expose the pin part 4 ' of lead frame 4.The firing equipment (not shown) heats by 3 pairs of lead frames 4 of bottoming hole.Then, utilize the ultrasonic-thermocompression welding principle, carry out lead key closing process.
In traditional lead-in wire bonding process as shown in Figure 1, lead frame 4 is to be fixed on the heat block 2 by the method that pressing plate 1 presses down.Yet, in the production technology of reality, only utilize the pressing plate pressing to fix the effect of lead frame and bad, lead frame can not be securely fixed on the heat block.In modern production technology, because the operating frequency of lead-in wire bonding apparatus is fast, so in the production of reality, cause the pin of lead frame partly to produce vibration by a small margin easily.Under the very little situation of pin size, this vibration is easy to influence whole technology, and causes the product yield to descend.
Summary of the invention
The object of the present invention is to provide a kind of wire bonding method that can make lead frame be fixed on the heat block on the heat block more firmly and utilize this heat block.
The object of the present invention is to provide a kind of pin part that can eliminate lead frame in the lead-in wire bonding process the vibration and the heat block of wild effect and utilize the wire bonding method of this heat block.
To achieve these goals, the invention provides a kind of heat block that is used for lead key closing process, comprising: bottoming hole, be formed on the core of heat block, be used for the lead frame of want bonding is heated; Vacuum is inhaled the hole, corresponding to the pin of lead frame partly be distributed in bottoming hole around and run through whole heat block, be used to adsorb lead frame.
Preferably, the back side of described heat block can be provided with vacuum section, and described vacuum section is inhaled the hole with vacuum and is communicated with, and is used to make vacuum to inhale the hole and is in vacuum state.
Preferably, the back side of described vacuum section can be provided with the vacuum pump interface, is used for being connected with vacuum pump, is in vacuum state so that vacuum section and vacuum are inhaled the hole.
Preferably, described vacuum section can be in the form of a ring.
Preferably, described vacuum is inhaled the hole and can be radially distributed.
Preferably, the described vacuum layout of inhaling the hole can be determined by the layout of the pin part of lead frame.
Preferably, can be formed with first boss and second boss on the upper surface of heat block, first boss is formed on the core of heat block, is used to support the chip that will be fitted, second boss be formed on first boss around, be used for the supporting wire framework.
Preferably, described bottoming hole can be formed on first boss, and described vacuum is inhaled the hole and can be formed on second boss.
To achieve these goals, the present invention also provides a kind of method of the bonding that goes between, and the step that comprises has: confirm that the pin part of lead frame overlaps with the vacuum suction hole of heat block; Pressing plate is pressed down the anchor leg framework; Utilize the vacuum of heat block to inhale the pin part that lead frame is adsorbed in the hole; Carry out the lead-in wire bonding process; Discharge the pin part of lead frame.
Preferably, the back side of described heat block can be provided with vacuum section, and described vacuum section is inhaled the hole with vacuum and is communicated with, and is used to make vacuum to inhale the hole and is in vacuum state.
Preferably, the back side of described vacuum section can be provided with the vacuum pump interface, is used for being connected with vacuum pump, is in vacuum state so that vacuum section and vacuum are inhaled the hole.
Preferably, the step of utilizing the vacuum of heat block to inhale the pin part of hole absorption lead frame can comprise opens vacuum pump, makes vacuum inhale the hole and is in the pin part that vacuum state adsorbs lead frame.
Preferably, the step that discharges the pin part of lead frame can comprise closes vacuum pump, removes the vacuum state that vacuum is inhaled the hole, thereby discharges the pin part of lead frame.
Preferably, can after discharging the pin part of lead frame, unclamp pressing plate, remove fixing lead frame.
Preferably, can after unclamping pressing plate, lead frame be loaded in the lead frame box.
Preferably, this method also can comprise: before the vacuum of the pin part of confirming lead frame and heat block is inhaled the step that the hole overlaps, lead frame is loaded into the chip bonding zone from the lead frame box.
Preferably, the step that the pin part of affirmation lead frame overlaps with the vacuum suction hole of heat block can comprise whether the pin part of confirming lead frame overlaps with the vacuum suction hole of heat block, if coincidence then presses down pressing plate; If do not overlap, then continue to adjust the position till overlapping.
Preferably, described vacuum is inhaled the hole and can be radially distributed.
Preferably, the described vacuum layout of inhaling the hole can be determined by the layout of the pin part of lead frame.
Preferably, described vacuum section can be in the form of a ring.
Preferably, described lead-in wire bonding process can utilize metal wire to carry out bonding.
Preferably, described metal wire can be gold thread.
Description of drawings
In conjunction with the drawings embodiment is carried out following description, the present invention these and/or other aspect and advantage will become clear and be easier to and understand, wherein:
Fig. 1 is traditional heating block structured cutaway view;
Fig. 2 is the front schematic view of vacuum type heat block according to an exemplary embodiment of the present invention;
Fig. 3 is the generalized section of vacuum type heat block according to an exemplary embodiment of the present invention;
Fig. 4 is the schematic rear view of vacuum type heat block according to an exemplary embodiment of the present invention;
Fig. 5 is the method according to the lead-in wire bonding of exemplary embodiment of the present invention.
Will be in ensuing description part set forth the present invention other aspect and/or advantage, some will be clearly by describing, and perhaps can learn through enforcement of the present invention.
Embodiment
To describe embodiments of the invention in detail now, its example shows that in the accompanying drawings wherein, identical label is represented same parts all the time.Below, by describing embodiment with reference to the accompanying drawings to explain the present invention.For clear, omit detailed description to known configurations and function.
Fig. 2 is the front schematic view of vacuum type heat block according to an exemplary embodiment of the present invention.Fig. 3 is the generalized section of vacuum type heat block according to an exemplary embodiment of the present invention.
With reference to Fig. 2 and Fig. 3, heat block 2 comprises bottoming hole 3 and vacuum suction hole 5 according to an exemplary embodiment of the present invention.On the upper surface of heat block 2, be formed with boss 2a and 2b.Boss 2b is formed on the central part office of the upper surface of heat block 2, is used to support the chip (not shown) that will be fitted.Boss 2a be formed on boss 2b around, be used for supporting wire framework 4.The bottoming hole 3 of heat block 2 is positioned at the central part office of heat block 2, that is, be formed on the boss 2b, and the vacuum of heat block 2 inhale hole 5 be positioned at bottoming hole 3 around, promptly be formed on the boss 2a.And preferably, vacuum is inhaled hole 5 and is radially distributed.More particularly, the vacuum position of inhaling hole 5 and pressing plate 1 (see figure 3) press down the corresponding (see figure 3) in position of the pin part 4 ' of the lead frame 4 that is then come out.
Because it is that pin part 4 ' with lead frame 4 is adsorbed on the heat block 2 securely that vacuum is inhaled the effect in hole 5, specifically, is adsorbed on the boss 2a of heat block 2, so vacuum is inhaled the layout that the layout in hole 5 depends on the pin part 4 ' of lead frame 4.
Can clearly be seen that from Fig. 3 by pressing down of pressing plate 1, the boss 2a that lead frame 4 is fixed on heat block 2 goes up and exposes pin part 4 '.When 2 pairs of lead frames 4 of heat block heat, the boss 2a supporting wire framework 4 of heat block 2.Heat block 2 comprises bottoming hole 3 and vacuum suction hole 5 according to an exemplary embodiment of the present invention.Specifically, bottoming hole 3 is formed on the central part office of heat block 2, vacuum inhale hole 5 be formed on bottoming hole 3 around and with pressing plate 1 to press down the pin part 4 ' of the lead frame 4 that is come out the back corresponding.
As shown in Figure 3, whole heat block 2 formation are run through in bottoming hole 3 and vacuum suction hole 5 on the thickness direction of heat block 2.Specifically, the upper end that bottoming hole 3 and vacuum are inhaled hole 5 is communicated with the boss 2a of heat block 2 and the upper surface of 2b, and the lower end that bottoming hole 3 and vacuum are inhaled hole 5 is communicated with the lower surface of heat block 2.Vacuum section 6 is arranged on the bottom of heat block 2, and more particularly, vacuum section 6 is inhaled the bottom that hole 5 is arranged on heat block 2 corresponding to vacuum.The lower end that vacuum is inhaled hole 5 is communicated in vacuum section 6 by the lower surface of heat block 2 respectively.Under (that is, in the routing process), the space in the vacuum section 6 is in vacuum state in working order, is in vacuum state thereby make vacuum inhale hole 5.
Like this, in the lead-in wire bonding process, transfer member is loaded into lead frame 4 between the heat block 3 and pressing plate 1 that continues heating.Inhale after hole 5 aims at when the pin part 4 ' of lead frame 4 and vacuum, pressing plate 1 is pressed down, lead frame 4 is fixed on the heat block.Subsequently, under the control of control appliance (not shown), make vacuum section 6 be in vacuum state, also be in vacuum state thereby make vacuum inhale hole 5.Like this, the pin part 4 ' of lead frame 4 is adsorbed on the boss 2a of heat block 2 under the effect of the absorption affinity in vacuum suction hole 5 securely.Then, carry out routing technology by ultrasonic-thermocompression welding.Routing unclamps pressing plate after finishing, and by transfer member lead frame is derived, thereby finishes lead key closing process.
Fig. 4 is the schematic rear view of vacuum type heat block according to an exemplary embodiment of the present invention.
As shown in Figure 4, the inhaling corresponding zone, hole 5 with vacuum and be communicated with of heat block 2 back sides with vacuum section 6, and be provided with vacuum pump interface 7 at the back of vacuum section 6, be used for being connected with the vacuum pump (not shown).Before carrying out routing technology, under the control of control appliance, open vacuum pump, make vacuum section 6 and vacuum inhale hole 5 and be in vacuum state.Vacuum section 6 can be in the form of a ring, thereby can guarantee that vacuum inhales the consistency of vacuum degree in the hole, to guarantee to be used to adsorb the absorption intensity of force and the uniformity of the pin of lead frame.
Below, by reference Fig. 5 method according to the lead-in wire bonding of exemplary embodiment of the present invention is described.
At first, in step 101, lead frame 4 is loaded into the chip bonding zone from lead frame box (not shown) by loading system.
Then, in step 102, confirm by the identification equipment (not shown) whether the pin part 4 ' of lead frame 4 is inhaled hole 5 with the vacuum of heat block 2 and overlapped.Overlap if the pin part 4 ' of lead frame 4 is inhaled hole 5 with the vacuum of heat block 2, then this method proceeds to next procedure 103; If do not overlap, then turn back to step 101 up to the pin part 4 ' of lead frame 4 with till the vacuum suction hole 5 of heat block 2 overlaps.It is to inhale hole 5 when being in vacuum state in order to guarantee in vacuum that the pin part 4 ' of lead frame 4 and the vacuum of heat block 2 are inhaled overlapping of hole 5, and pin part 4 ' is had suction-operated.
Next, in step 104, open vacuum pump by the control appliance (not shown), make vacuum section 6 volume inside and vacuum inhale hole 5 and be in vacuum state, thereby the pin part 4 ' that makes lead frame 4 is adsorbed on the heat block 2 securely, that is, be adsorbed on the boss 2a of heat block 2.Inhale in the pressure of pressing plate 1 and vacuum under the effect of absorption affinity in hole 5, the pin part 4 ' of lead frame 4 can promptly, be fixed on the boss 2a of heat block 2 by more stable and be securely fixed on the heat block 2.
Finishing under the fixing situation of pin part 4 ',, carry out the routing process in step 105.Usually, employed lead-in wire is a metal wire in the routing process, preferably, can select gold thread for use.Because the routing process is known in those skilled in the art, so will omit the detailed description of air exercise line process.
In step 106, the routing process is closed vacuum pump by control appliance after finishing, and returns to the absorption affinity that initial condition discharges absorption pin part 4 ' by making vacuum section 6 and vacuum inhale hole 5.In step 107, unclamp pressing plate 1 then, thereby remove fixing fully lead frame 4.
Next, utilize and carry system, the lead frame of finishing the routing process is carried out to the lead frame box, thereby finish lead key closing process.
By utilizing vacuum type heat block according to an exemplary embodiment of the present invention, can eliminate vibration and the unsettled phenomenon of pin part in the lead-in wire bonding process of lead frame, thereby can improve the operation and the operation quality of lead key closing process.Especially under the tiny situation of the pin widths of lead frame and pin-pitch, improve particularly evident.
Although illustrated and described the present invention in conjunction with exemplary embodiment, it will be apparent to those skilled in the art, under the situation that does not break away from the spirit and scope of the present invention that are defined by the claims, can make and revising and conversion.
Claims (20)
1. heat block that is used for lead key closing process comprises:
Bottoming hole is formed on the core of heat block, is used for the lead frame of want bonding is heated;
Vacuum is inhaled the hole, corresponding to the pin of lead frame partly be distributed in bottoming hole around, and run through whole heat block, be used to adsorb the pin part of lead frame,
Wherein, be formed with first boss and second boss on the upper surface of heat block, first boss is formed on the core of heat block, is used to support the chip that will be fitted, second boss be formed on first boss around, be used for the supporting wire framework,
Wherein, described bottoming hole is formed on first boss, and described vacuum is inhaled the hole and is formed on second boss.
2. heat block according to claim 1, the back side of wherein said heat block is provided with vacuum section, and described vacuum section is inhaled the hole with vacuum and is communicated with, and is used to make vacuum to inhale the hole and is in vacuum state.
3. heat block according to claim 2, wherein, the back side of described vacuum section is provided with the vacuum pump interface, is used for being connected with vacuum pump, is in vacuum state so that vacuum section and vacuum are inhaled the hole.
4. heat block according to claim 2, wherein, described vacuum section in the form of a ring.
5. heat block according to claim 1, wherein, described vacuum is inhaled the hole and is radially distributed.
6. heat block according to claim 1, wherein, described vacuum is inhaled the layout in hole and is determined by the layout of the pin part of lead frame.
7. the method for the bonding that goes between, the step that comprises has:
The pin part of confirming lead frame overlaps with the vacuum suction hole of heat block;
Pressing plate is pressed down the anchor leg framework;
Utilize the vacuum of heat block to inhale the pin part that lead frame is adsorbed in the hole;
Carry out the routing process;
Discharge the pin part of lead frame,
Wherein, be formed with first boss and second boss on the upper surface of heat block, first boss is formed on the core of heat block, be used to support the chip that to be fitted, second boss be formed on first boss around, be used for the supporting wire framework, described vacuum is inhaled the hole and is formed on second boss.
8. the method for lead-in wire bonding according to claim 7, wherein, the back side of described heat block is provided with vacuum section, and described vacuum section is inhaled the hole with vacuum and is communicated with, and is used to make vacuum to inhale the hole and is in vacuum state.
9. the method for lead-in wire bonding according to claim 8, wherein, the back side of described vacuum section is provided with the vacuum pump interface, is used for being connected with vacuum pump, is in vacuum state so that vacuum section and vacuum are inhaled the hole.
10. the method for lead-in wire bonding according to claim 9, wherein, the step of utilizing the vacuum of heat block to inhale the pin part of hole absorption lead frame comprises opens vacuum pump, makes vacuum inhale the hole and is in the pin part that vacuum state adsorbs lead frame.
11. the method for lead-in wire bonding according to claim 9, wherein, the step that discharges the pin part of lead frame comprises closes vacuum pump, removes the vacuum state that vacuum is inhaled the hole, thereby discharges the pin part of lead frame.
12. the method for lead-in wire bonding according to claim 7 also comprises: after discharging the pin part of lead frame, unclamp pressing plate, remove fixing to lead frame.
13. the method for lead-in wire bonding according to claim 12 also comprises: after unclamping pressing plate, lead frame is loaded in the lead frame box.
14. the method for lead-in wire bonding according to claim 7 also comprises: before the vacuum of the pin part of confirming lead frame and heat block is inhaled the step that the hole overlaps, lead frame is loaded into the chip bonding zone from the lead frame box.
15. the method for lead-in wire bonding according to claim 7, wherein, the step that the pin part of affirmation lead frame overlaps with the vacuum suction hole of heat block comprises whether the pin part of confirming lead frame overlaps with the vacuum suction hole of heat block, if coincidence then presses down pressing plate; If do not overlap, then continue to adjust the position till overlapping.
16. the method for lead-in wire bonding according to claim 7, wherein, described vacuum is inhaled the hole and is radially distributed.
17. the method for lead-in wire bonding according to claim 7, wherein, described vacuum is inhaled the layout in hole and is determined by the layout of the pin part of lead frame.
18. the method for lead-in wire bonding according to claim 8, wherein, described vacuum section in the form of a ring.
19. the method for lead-in wire bonding according to claim 7, wherein, described lead-in wire bonding process utilizes metal wire to carry out bonding.
20. the method for lead-in wire bonding according to claim 19, wherein, described metal wire is a gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101436056A CN101369545B (en) | 2007-08-14 | 2007-08-14 | Heating block and wire bonding method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101436056A CN101369545B (en) | 2007-08-14 | 2007-08-14 | Heating block and wire bonding method using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101369545A CN101369545A (en) | 2009-02-18 |
| CN101369545B true CN101369545B (en) | 2011-07-20 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054658B (en) * | 2009-10-30 | 2013-03-27 | 日月光封装测试(上海)有限公司 | Heating fixture of packaging lineup process and method thereof |
| CN102310262A (en) * | 2011-08-23 | 2012-01-11 | 南通富士通微电子股份有限公司 | Heating block device |
| CN102842567B (en) * | 2012-08-20 | 2014-10-22 | 上海凯虹电子有限公司 | Lead frame fixing device and packaging method |
| CN105470189B (en) * | 2014-09-05 | 2018-09-21 | 无锡华润安盛科技有限公司 | A kind of twin islet frame bonding heat block and fixture |
| EP3550596A1 (en) * | 2018-04-04 | 2019-10-09 | Infineon Technologies AG | Arrangements and method for providing a wire bond connection |
| CN109048028A (en) * | 2018-08-07 | 2018-12-21 | 航天恒星科技有限公司 | wire bonding method and system |
| CN115410969B (en) * | 2022-10-28 | 2023-01-24 | 宁波德洲精密电子有限公司 | Conveying device for preheating processing of lead frame |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4790897A (en) * | 1987-04-29 | 1988-12-13 | Lsi Logic Corporation | Device for bonding of lead wires for an integrated circuit device |
| US6454158B1 (en) * | 2000-03-01 | 2002-09-24 | Mitsubishi Denki Kabushiki Kaisha | Wire bonding apparatus and wire bonding method of semiconductor device |
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2007
- 2007-08-14 CN CN2007101436056A patent/CN101369545B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4790897A (en) * | 1987-04-29 | 1988-12-13 | Lsi Logic Corporation | Device for bonding of lead wires for an integrated circuit device |
| US6454158B1 (en) * | 2000-03-01 | 2002-09-24 | Mitsubishi Denki Kabushiki Kaisha | Wire bonding apparatus and wire bonding method of semiconductor device |
Non-Patent Citations (4)
| Title |
|---|
| JP特开2003-124248A 2003.04.25 |
| JP特开2004-296649A 2004.10.21 |
| JP特开平1-274440A 1989.11.02 |
| JP特开昭64-4033A 1989.01.09 |
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| CN101369545A (en) | 2009-02-18 |
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