CN101364135A - Heat radiation model set and computer with the heat radiation model set - Google Patents
Heat radiation model set and computer with the heat radiation model set Download PDFInfo
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- CN101364135A CN101364135A CNA2008101698072A CN200810169807A CN101364135A CN 101364135 A CN101364135 A CN 101364135A CN A2008101698072 A CNA2008101698072 A CN A2008101698072A CN 200810169807 A CN200810169807 A CN 200810169807A CN 101364135 A CN101364135 A CN 101364135A
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- heat radiation
- radiation module
- computer
- metal material
- porous metal
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Abstract
The invention provides a thermal module and a computer provided with the thermal module, wherein at least a part of the thermal module is made of porous metal materials. The thermal module comprises a pedestal and cooling fins fixed on the pedestal. The pedestal or the cooling fins are made of the porous metal materials, or the whole thermal module is made of the porous metal material. The invention also provides a computer which includes the thermal module and is used for cooling at least one heat element in the computer. The thermal module made of the porous metal materials can effectively achieve the purposes of temperature reduction and heat dissipation.
Description
Technical field
The present invention relates to the module that dispels the heat, particularly relate to the heat radiation module of computer, include but not limited to the heat radiation module of heater members such as electric battery of CPU, display chip, memory chip, the notebook computer of all kinds of desktop computers, notebook computer, server etc.The invention still further relates to computer with this heat radiation module.
Background technology
See that with traditional viewpoint in a single day the inside of the metal material of a bulk matter densification exist hole and bubble, illustrate that undoubtedly this piece metal exists critical defect.But look at problem from opposite viewpoint,, perhaps just become a kind of new type of metal material if a metal inside exists the consistent relatively bubble of size or connects hole.This porous metal material proportion is lighter, has special structure and causes impact strength constant (even also having corresponding the raising), can present the physical characteristics different with the dense materials metal material.
Before more than ten years, Russia (Ukraine) scientist has just begun the exploration of porous metal material controllable type technology of preparing.The scientist of China and Japan had also obtained many gratifying progress in this research field in recent years.
Since 2000, professor Li Yanxiang of department of mechanical engineering of Tsing-Hua University of China just studied metal/gas eutectic directional solidification technique and regular porous metal material problem.It is roughly orderly that the metal material that the porous metal material technology of preparing is produced has the distribution of pores arrangement, the feature that pore diameter is roughly the same and hole connects.When professor Li Yanxiang participates in international academic conference abroad, scientists such as Ukraine, Japan before once seeing.Professor Li Yanxiang has disclosed ultimate principle and physical and chemical condition that porous metal material generates from the angle of metal-gas eutectic directional solidification theory, and basic laws such as the arrangement of apertures of the porous metal material that has shown under what environment to be generated with mathematic curve, pore size.
Along with the development of industrial technology and society, the application of porous metals has also presented wide prospect more.Because have the porous structure of rule, specific surface area is bigger, so porous metal material can carry out cooling well, efficiently.
Summary of the invention
The present invention's purpose is that porous metal material is applied to the module that dispels the heat, particularly the cooling module of heating such as the electric battery of the CPU of electronic products such as desktop computer, notebook computer, server, display chip, memory chip, notebook computer components and parts.
The invention provides a kind of heat radiation module, wherein, this heat radiation module at least a portion is made by porous metal material.
Preferably, this heat radiation module comprises base and the heat radiator that is fixed on the base, and described base or heat radiator are made by described porous metal material, and perhaps whole described heat radiation module is made by described porous metal material.
Preferably, described porous metal material is copper base or aluminium base porous metal material.
Preferably, the distribution of pores of described porous metal material is arranged roughly rule, and pore diameter is roughly the same.
Preferably, the hole of described porous metal material connects.
Preferably, the heat radiation modular construction becomes to be suitable for the heat radiation module form of cooling of the heating components and parts of electronic product.
Preferably, described electronic product comprises desktop computer, notebook computer and server.
Preferably, described heating components and parts comprise the electric battery of CPU, display chip, memory chip and notebook computer.
The present invention also provides a kind of computer, and wherein, this computer comprises above-mentioned heat radiation module, is used at least one the heating components and parts cooling in the described computer.
Preferably, also comprise fan in the described computer, the heat on the described heat radiation module is directly got rid of.
Preferably, comprise also in the described computer that promoting liquid coolant carries out the round-robin pump housing in described heat radiation module internal.
Description of drawings
Fig. 1 is for using the embodiment of a heat radiation module of the present invention.
The porous metals heat radiation module of Fig. 2 for designing for notebook computer.
Fig. 3 is the porous metals heat radiation module for designs such as desktop computer, servers.
Embodiment
As described in Figure 1, it is a heat radiation module 30 of the present invention.It can be the heat radiation module of cooling of heating components and parts such as electric battery of CPU, display chip, memory chip, the notebook computer of electronic products such as desktop computer, notebook computer, server.Certainly, the present invention is not limited to this, and heat radiation module of the present invention also can be applied in remaining electronic product or on other the heating components and parts.
This heat radiation module 30 comprises base 10 and the heat radiator 20 that is fixed on the base, and described base or heat radiator are made by porous metal material, and perhaps entire heat dissipation module 30 is made by described porous metal material.
Described porous metal material can be copper base or aluminium base porous metal material.The distribution of pores of described porous metal material is arranged roughly rule, and pore diameter is roughly the same, and its hole connects.
For example, when this heat radiation module 30 is used for computer, it can be deformed into the version of at least one the heating components and parts cooling that is suitable in the described computer, it for example is the heat radiation module form of CPU, display chip or memory chip cooling, its concrete structure is as well known to those skilled in the art, repeats no more.
The present invention utilizes in the specific embodiment of porous metal material as the heat radiation module of CPU of desktop computer, notebook computer and server etc., can be close on CPU etc. as conducting strip by the base 10 of the copper or aluminium matter that will make with porous metal material, the heats that heat generating components produced such as CPU are carried out first order heat radiation, unnecessary heat is continued to conduct on the heat radiator 20 of top simultaneously.The heat radiator 20 that is positioned at base 10 tops that whole porous metal material makes carries out second level heat radiation, helps the decline of system temperature.In addition, can be based on the hot swapping of the direct-firing fan of high-level efficiency, base 10 that porous metal material is made and the heat on the heat radiator 20 are directly got rid of.If carry out liquid coolant when heat radiation, just promote liquid coolant and constantly circulate, thereby take the heat that parts produced such as CPU out of and heat is passed to the purpose that heat radiator reaches cooling in porous metal material inside by being built in the pump housing in the host computer.
Fig. 2 and Fig. 3 are the examples that principle of the present invention specifically is applied to desktop computer, notebook computer, server etc.
The porous metals heat radiation module of Fig. 2 for designing for notebook computer.Usually the body interior space of notebook computer is less, requires the heat radiation module compact.As shown in the figure, porous metals heat radiations module 50 is a bluff body, is used for the heat radiation of the heat that CPU etc. produced.
This porous metals heat radiation module 50 comprises porous metals heat conducting base 51.In addition, also can comprise second level radiating module, heat radiation fan module, coolant circulation system (for example can comprise liquid coolant, liquid coolant conduit, the liquid coolant pump housing) etc. extraly so that strengthen cooling effect.And porous metals heat conducting base 51 is as first order radiating module.
There is shown the example of heat radiation fan module 54, this heat radiation fan module comprises fan, exhaust outlet 52 and ventilator cowling 53.
Porous metals heat conducting base 51 contacts with heater element as first order radiating module or presses close to, absorbs through the first order heat dissipating layer that porous metals constituted, and by air-cooled or liquid coolant cooling (optional).Remaining heat continues to be transmitted to the more large-area heat dissipating layer in the second level that is positioned at above the porous metals (optional), make heater element for example the temperature of CPU be in good working order all the time.
Fig. 3 is for being designed porous metals heat radiation module such as desktop computer, server.This porous metals heat radiation module 60 comprises porous metals heat conducting base 61.In addition, also can comprise second level radiating module 64, heat radiation fan module 63, coolant circulation system 62 (for example can comprise liquid coolant, liquid coolant conduit, the liquid coolant pump housing) etc. extraly so that strengthen cooling effect.And porous metals heat conducting base 51 as first order radiating module and heater element for example CPU contact or press close to.
The heat that CPU etc. produced absorbs through the first order heat dissipating layer that porous metals constituted, and by air-cooled or liquid coolant cooling.Remaining heat continues to be transmitted to the more large-area heat dissipating layer in the second level that is positioned at above the porous metals, makes the temperature of CPU be in good working order all the time.
In sum, the computer heat radiation module that the present invention adopts porous metal material to make, arrange roughly orderly by distribution of pores on the section, roughly the same and the hole of pore diameter connects the heat radiation module of electric battery of CPU, display chip, memory chip, the notebook computer of all kinds of desktop computers that the expanded metals of characteristics form, notebook computer, server, reaches the purpose of cooling then by blowing cooling and liquid cooling.Owing to have the porous structure of rule, specific surface area is bigger, thus the computer heat radiation module made of porous metal material can be well, efficiently the electric battery of the CPU of desktop computer, notebook computer, server, display chip, memory chip, notebook computer is carried out cooling.
Claims (11)
1, a kind of heat radiation module is characterized in that, this heat radiation module at least a portion is made by porous metal material.
2, heat radiation module as claimed in claim 1, it is characterized in that, this heat radiation module comprises base and the heat radiator that is fixed on the base, and described base or heat radiator are made by described porous metal material, and perhaps whole described heat radiation module is made by described porous metal material.
3, heat radiation module as claimed in claim 1 is characterized in that, described porous metal material is copper base or aluminium base porous metal material.
4, heat radiation module as claimed in claim 1 is characterized in that, the distribution of pores of described porous metal material is arranged roughly rule, and pore diameter is roughly the same.
5, heat radiation module as claimed in claim 1 is characterized in that, the hole of described porous metal material connects.
6, heat radiation module as claimed in claim 1 is characterized in that, described heat radiation modular construction becomes to be suitable for the heat radiation module form of cooling of the heating components and parts of electronic product.
7, heat radiation module as claimed in claim 6 is characterized in that, described electronic product comprises desktop computer, notebook computer and server.
8, heat radiation module as claimed in claim 6 is characterized in that, described heating components and parts comprise the electric battery of CPU, display chip, memory chip and notebook computer.
9, a kind of computer is characterized in that, this computer comprises as each described heat radiation module among the claim 1-5, is used at least one the heating components and parts cooling in the described computer.
10, computer as claimed in claim 9 is characterized in that, described computer also comprises fan, and the heat on the described heat radiation module is directly got rid of.
11, computer as claimed in claim 9 is characterized in that, described computer comprises that also promoting liquid coolant carries out the round-robin pump housing in described heat radiation module internal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101698072A CN101364135A (en) | 2008-10-07 | 2008-10-07 | Heat radiation model set and computer with the heat radiation model set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101698072A CN101364135A (en) | 2008-10-07 | 2008-10-07 | Heat radiation model set and computer with the heat radiation model set |
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| Publication Number | Publication Date |
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| CN101364135A true CN101364135A (en) | 2009-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008101698072A Pending CN101364135A (en) | 2008-10-07 | 2008-10-07 | Heat radiation model set and computer with the heat radiation model set |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112351642A (en) * | 2020-10-20 | 2021-02-09 | 南京航空航天大学 | Radiator of integrated foam metal imbibition core and fin |
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2008
- 2008-10-07 CN CNA2008101698072A patent/CN101364135A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112351642A (en) * | 2020-10-20 | 2021-02-09 | 南京航空航天大学 | Radiator of integrated foam metal imbibition core and fin |
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Open date: 20090211 |