CN201868410U - Heat radiation device of multidirectional sound wave transmission heat source - Google Patents
Heat radiation device of multidirectional sound wave transmission heat source Download PDFInfo
- Publication number
- CN201868410U CN201868410U CN2010202967079U CN201020296707U CN201868410U CN 201868410 U CN201868410 U CN 201868410U CN 2010202967079 U CN2010202967079 U CN 2010202967079U CN 201020296707 U CN201020296707 U CN 201020296707U CN 201868410 U CN201868410 U CN 201868410U
- Authority
- CN
- China
- Prior art keywords
- heat
- temperature coefficient
- negative temperature
- sound wave
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a heat radiation device of a multidirectional sound wave transmission heat source. The heat radiation device is mounted on a heating component and comprises a first negative temperature coefficient component and a high thermal conductivity metal component, wherein the first negative temperature coefficient component is provided with a main body; a heat radiation surface and a bottom surface are arranged on the main body; an accommodation space with a contact furnace is arranged on the bottom surface in a sinking manner from outside to inside; and the high thermal conductivity metal component is provided with a main body identical with the accommodation space in shape, a surface and a binding face are arranged on the main body, the high thermal conductivity metal component is assembled in the accommodation space, the surface of the high thermal conductivity metal component is in contact with the contact surface and the binding face of the high thermal conductivity metal component is jointed with the heating component, so as to absorb heat generated by the heating component and transmit the heat to the first negative temperature coefficient component. After being absorbed by the first negative temperature coefficient component, the heat is radiated through multidirectional resonance vibration by the wavelength of the sound wave generated by crystal grating vibration effect, so as to achieve an optimal radiating effect.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular to the heat abstractor that a kind of polytropism sound wave transmits thermal source.
Background technology
Heat abstractor is one of composition indispensable in computer product or the precision instrument.Because the continuous progress of multimedia technology makes the arithmetic speed of microprocessor constantly promote, the radiating rate of the heat abstractor of being arranged in pairs or groups also will have enough quick heat radiating effects relatively, just can guarantee the normal operation of microprocessor.
The heat abstractor that present employed heat abstractor great majority are heat pipe-types is installed on an end of heat pipe on first heat-conducting block, and the other end is installed on second heat-conducting block, this second heat-conducting block is installed on radiating fin and the fan again.When this heat abstractor in use, first heat-conducting block is fitted on the surface of heat generating component or microprocessor, when heat generating component or microprocessor running, the heat that is produced will be absorbed by first heat-conducting block, heat absorbing end by heat pipe absorbs again, reach on the colling end through the internal work fluid, be passed on second heat-conducting block by colling end again, heat is left by radiating fin and fan.
Because the heat pipe of above-mentioned heat abstractor must have certain length, causes volume excessive, takes up space in use.And the radiating rate of the radiating fin that the colling end of heat pipe is assembled itself is slow, therefore need active fan be installed on radiating fin and dispel the heat.
The utility model content
Main purpose of the present utility model is to provide a kind of polytropism sound wave to transmit the heat abstractor of thermal source, and volume is little, and is simple in structure, rapid heat dissipation.
For achieving the above object, the utility model provides a kind of polytropism sound wave to transmit the heat abstractor of thermal source, is installed on the heat generating component, comprising:
The first negative temperature coefficient assembly has main body, has radiating surface and bottom surface on this main body, and this bottom surface ecto-entad is concaved with accommodation space, has contact-making surface in this accommodation space;
The high-thermal conductive metal assembly, have the body identical shaped with this accommodation space, have surface and binding face on this body, this high-thermal conductive metal arrangement of components is in this accommodation space, this surface contacts with this contact-making surface, fit in this binding face and heat generating component surface, to absorb the heat that this heat generating component is produced.
Aforementioned body is coniform, or the section of aforementioned body is circular-arc, and this radiating surface is circular cone or circular arc, and this bottom surface is a plane formula.
Compared with prior art, a kind of polytropism sound wave of the present utility model transmits the heat abstractor of thermal source, its first negative temperature coefficient arrangement of components makes the high-thermal conductive metal assembly that the heat that is absorbed is passed to the first negative temperature coefficient assembly with diffusion way on the high-thermal conductive metal assembly; After the first negative temperature coefficient assembly absorbed heat, the wavelength that produces sound wave because of the lattice vibration effect was gone out the heat that is absorbed with polydirectional resonance scattering, to reach best radiating effect.
Description of drawings
Fig. 1 is a heat abstractor decomposing schematic representation of the present utility model;
Fig. 2 is a heat abstractor combination cross-sectional schematic of the present utility model;
Fig. 3 is a circulation cooling curve schematic diagram of the present utility model;
Fig. 4 is the combination schematic diagram of heat abstractor of the present utility model and heat generating component;
Fig. 5 is the combination schematic diagram that heat abstractor of the present utility model is installed on light fixture;
Fig. 6 is the schematic diagram of another embodiment of heat abstractor of the present utility model;
Fig. 7 is the schematic diagram of an embodiment again of heat abstractor of the present utility model;
Fig. 8 is the schematic diagram of the another embodiment of heat abstractor of the present utility model;
Fig. 9 is the schematic diagram of an embodiment more again of heat abstractor of the present utility model.
Description of reference numerals
The first negative temperature coefficient assembly, 1 main body 11
High-thermal conductive metal assembly 2 bodies 21
End face 24 heat generating components 10
Light-emitting diode 202 second negative temperature coefficient assemblies 3
Conducting surface 31 back sides 32
Gap 4 end faces 25
Embodiment
Relevant the utility model technology contents and detailed description, existing conjunction with figs. is described as follows:
See also Fig. 1, Fig. 2, be respectively heat abstractor decomposition of the present utility model and combination cross-sectional schematic.As shown in Figure 1 and Figure 2: polytropism sound wave of the present utility model transmits the heat abstractor of thermal source, is installed on the heat generating component, comprising: the first negative temperature coefficient assembly 1 and high-thermal conductive metal assembly 2.
This first negative temperature coefficient assembly 1, be ceramic material, have coniform or section is circular-arc main body 11, the bottom surface 13 that has the radiating surface 12 and the plane formula of circular cone or circular arc on this main body 11, be concaved with coniform or section is circular-arc accommodation space 14 at these bottom surface 13 ecto-entads, have contact-making surface 15 in this accommodation space 14.
This high-thermal conductive metal assembly 2 is metal materials such as copper, aluminium or iron, has the body 21 identical shaped with this accommodation space 14, promptly body 21 be shaped as coniformly, or the section of this body 21 is circular-arc, has surface 22 and binding face 23 on this body 21.This high-thermal conductive metal assembly 2 is disposed at this accommodation space 14, and this surface 22 contacts with this contact-making surface 15, and binding face 23 is fitted with this heat generating component surface (not shown), to absorb the heat that this heat generating component is produced.
Because general pyroelectric ceramic substrate (as, the first negative temperature coefficient assembly) be a kind of overheated and transient overvoltage defence installation (Semiconducting ceramic board is one of a family of overheating ﹠amp; Transient overvoltage protective devices): the cooling of relevant heat, the utility model are the heat abstractors of new generation that utilizes the principle of peltier effect (Peltier effect) and Carnot efficiency (Carnot efficiency) to produce:
Peltier effect (Peltier effect):
α: seat seebeck coefficient (Seebeck coefficient);
σ: conductivity (Electrical conductivity);
κ: thermal conductivity (Thermal conductivity);
Carnot efficiency (Carnot efficiency):
(the big excellent in heat dissipation effect of the hot and cold temperature difference);
This peltier effect (Peltier effect) is the best heat pump Reversible Cycle process of efficient on the thermodynamics, and (S.Carnot) proposed by the Kano.That is, the pyroelectric ceramic substrate is followed as shown in Figure 3 from the material of the inner participation effect of body:
Isothermal expansion (A-B) has absorbed the thermal source that light-emitting diode discharged of electronic building brick or light fixture; Adiabatic expansion (B-C) must be by pyroelectric ceramic substrate self supply heat because of institute's work to external world, and its result descends temperature; Then emit heat energy through isotherm compression (C-D); Reply initial condition through adiabatic compression (D-A) again.Again and again the heat energy that light-emitting diode discharged of electronic building brick or light fixture is constant at the low temperature range of suitable operation by this process.
Therefore, this first negative temperature coefficient assembly 1 also can envelope high-thermal conductive metal assembly 2 (can coat fully) except having above-mentioned advantage, and the heat that high-thermal conductive metal assembly 2 is absorbed is passed on this first negative temperature coefficient assembly 1 with diffusion way.
Because the material behavior of the first negative temperature coefficient assembly 1, after heat absorption,, the lattice vibration effect produces sound wave (phonon) because of making the first negative temperature coefficient assembly 1, and with the wavelength of sound wave the heat that is absorbed is gone out with polydirectional resonance scattering, to reach best radiating effect.
Seeing also Fig. 4, is the combination schematic diagram of heat abstractor of the present utility model and heat generating component.As shown in Figure 4: at this first negative temperature coefficient assembly 1 of the present utility model with after this high-thermal conductive metal assembly 2 combines, the binding face 23 of this high-thermal conductive metal assembly 2 is attached on the surface of heat generating component 10, the heat that this heat generating component 10 is produced when running will be absorbed by high-thermal conductive metal assembly 2, after high-thermal conductive metal assembly 2 is with heat absorption, because of high-thermal conductive metal assembly 2 is coated by the first negative temperature coefficient assembly 1, so high-thermal conductive metal assembly 2 can pass to heat the first negative temperature coefficient assembly 1 effectively.
After the first negative temperature coefficient assembly 1 absorbs heat, because of making the first negative temperature coefficient assembly 1, the lattice vibration effect produces sound wave (phonon), and with the wavelength of sound wave the heat that is absorbed is scattered out by radiating surface 12 fast with polydirectional resonance, to reach best and radiating effect fast.In Fig. 4, this heat generating component 10 is the light-emitting diode of electronic building brick or light fixture.
Seeing also Fig. 5, is that heat abstractor of the present utility model is installed on the combination schematic diagram on the light fixture.As shown in Figure 5: the heat abstractor of the present utility model binding face 23 of high-thermal conductive metal assembly 2 can be fitted (or directly being used in combination) on the housing 201 that be installed on light fixture 20 with light-emitting diode 202, when light-emitting diode 202 is lighted, the heat that is produced will be absorbed by housing 201 and pass to high-thermal conductive metal assembly 2 again, by high-thermal conductive metal assembly 2 heat is passed to the first negative temperature coefficient assembly 1 again, by the first negative temperature coefficient assembly 1 heat is scattered out fast with polydirectional resonance again, make heat can not have influence on the normal operation of light-emitting diode 202.
Seeing also Fig. 6, is the schematic diagram of another embodiment of heat abstractor of the present utility model.As shown in Figure 6: the main body 11 of the first negative temperature coefficient assembly 1 of the present utility model and the body of high-thermal conductive metal assembly 2 21 bodies triangular in shape, after making this first negative temperature coefficient assembly 1 and 2 combinations of this high-thermal conductive metal assembly, can be installed on this heat generating component (not shown), the heat that this heat generating component produced is left.
Seeing also Fig. 7, is the schematic diagram of an embodiment again of heat abstractor of the present utility model.As shown in Figure 7: the main body 11 of the first negative temperature coefficient assembly 1 of the present utility model is the U font, in have in the form of sheets cuboid or cubic accommodation space 14, the body 21 of this high-thermal conductive metal assembly 2 is the cuboid of sheet, or cube, after making this first negative temperature coefficient assembly 1 and 2 combinations of this high-thermal conductive metal assembly, can be installed on this heat generating component (not shown), the heat that this heat generating component produced is left.
Consulting Fig. 8, is the schematic diagram of the another embodiment of heat abstractor of the present utility model.As shown in Figure 8: the main body 11 of the first negative temperature coefficient assembly 1 of the present utility model is a tubular body, the body 21 of this high-thermal conductive metal assembly 2 is a column, this high-thermal conductive metal assembly 2 is disposed in the columned accommodation space of this first negative temperature coefficient assembly, 1 inside 14, after making this first negative temperature coefficient assembly 1 and 2 combinations of this high-thermal conductive metal assembly, two end faces 24 of this high-thermal conductive metal assembly 2 or 25 can fit on these two heat generating component (not shown)s at least, and the heat that this heat generating component produced is left.
Seeing also Fig. 9, is the schematic diagram of an embodiment more again of heat abstractor of the present utility model.Shown in Fig. 9: in the present embodiment, this heat abstractor also comprises the second negative temperature coefficient assembly 3, this second negative temperature coefficient assembly 3 has the conducting surface 31 and the back side 32, the second negative temperature coefficient assembly 3 is a ceramic material, the binding face 23 of the body 21 of high-thermal conductive metal assembly 2 contacts with the conducting surface 31 of this second negative temperature coefficient assembly 3, the back side 32 of this second negative temperature coefficient assembly 3 contacts with this heat generating component (not shown), has gap 4 between the conducting surface 31 of the bottom surface 13 of this first negative temperature coefficient assembly 1 and this second negative temperature coefficient assembly 3, this the first negative temperature coefficient assembly 1 and the second negative temperature coefficient assembly 3 are not contacted and produce resonance, the heat energy that allows the second negative temperature coefficient assembly 3 be absorbed is polydirectional to conduct on this high-thermal conductive metal assembly 2, after conducting heat to this first negative temperature coefficient assembly 1 by this high-thermal conductive metal assembly 2 with diffusion way again, the heat that is absorbed is left in polydirectional mode by this first negative temperature coefficient assembly 1.
The above is preferred embodiment of the present utility model only, is not to be used for limiting the scope that the utility model is implemented.Be that all equalizations of being done according to the utility model claim change and modification, be all the utility model claim and contain.
Claims (11)
1. the heat abstractor of a polytropism sound wave transmission thermal source is installed on the heat generating component, it is characterized in that, comprising:
The first negative temperature coefficient assembly has main body, has radiating surface and bottom surface on this main body, and this bottom surface ecto-entad is concaved with accommodation space, has contact-making surface in this accommodation space;
The high-thermal conductive metal assembly, have the body identical shaped with this accommodation space, have surface and binding face on this body, this high-thermal conductive metal arrangement of components is in this accommodation space, this surface contacts with this contact-making surface, fit in this binding face and this heat generating component surface, to absorb the heat that this heat generating component is produced.
2. polytropism sound wave as claimed in claim 1 transmits the heat abstractor of thermal source, it is characterized in that the described first negative temperature coefficient assembly is a ceramic material.
3. polytropism sound wave as claimed in claim 2 transmits the heat abstractor of thermal source, it is characterized in that, described main body is coniform, trigone, tubular body or U font.
4. polytropism sound wave as claimed in claim 2 transmits the heat abstractor of thermal source, it is characterized in that the section of described main body is circular-arc.
5. transmit the heat abstractor of thermals source as claim 3 or 4 described polytropism sound waves, it is characterized in that, described accommodation space is the cuboid of coniform, cylindric, sheet or cubic.
6. as the heat abstractor of claim 3 or 4 described polytropism sound waves transmission thermals source, it is characterized in that the section of described accommodation space is circular-arc.
7. polytropism sound wave as claimed in claim 1 transmits the heat abstractor of thermal source, it is characterized in that described high-thermal conductive metal assembly is copper, aluminium or ferrous metal material.
8. polytropism sound wave as claimed in claim 7 transmits the heat abstractor of thermal source, it is characterized in that, the body of described high-thermal conductive metal assembly is the cuboid or the cube of coniform, trigone, column, sheet.
9. polytropism sound wave as claimed in claim 7 transmits the heat abstractor of thermal source, it is characterized in that the section of described body is circular-arc.
10. polytropism sound wave as claimed in claim 1 transmits the heat abstractor of thermal source, it is characterized in that, this heat abstractor also includes the second negative temperature coefficient assembly, this second negative temperature coefficient assembly has the conducting surface and the back side, this conducting surface contacts with the binding face of described high-thermal conductive metal assembly, this back side and described heat generating component are fitted, and have the gap between the conducting surface of the bottom surface of the described first negative temperature coefficient assembly and this second negative temperature coefficient assembly.
11. polytropism sound wave as claimed in claim 10 transmits the heat abstractor of thermal source, it is characterized in that the described second negative temperature coefficient assembly is a ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202967079U CN201868410U (en) | 2010-08-17 | 2010-08-17 | Heat radiation device of multidirectional sound wave transmission heat source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202967079U CN201868410U (en) | 2010-08-17 | 2010-08-17 | Heat radiation device of multidirectional sound wave transmission heat source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201868410U true CN201868410U (en) | 2011-06-15 |
Family
ID=44139557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202967079U Expired - Fee Related CN201868410U (en) | 2010-08-17 | 2010-08-17 | Heat radiation device of multidirectional sound wave transmission heat source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201868410U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035592A (en) * | 2011-10-09 | 2013-04-10 | 李明烈 | Heat dissipation device transmitting heat by using phonons |
-
2010
- 2010-08-17 CN CN2010202967079U patent/CN201868410U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035592A (en) * | 2011-10-09 | 2013-04-10 | 李明烈 | Heat dissipation device transmitting heat by using phonons |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203327471U (en) | Heat radiation structure and hand-held electronic device with heat radiation structure | |
| Cai et al. | Entropy generation minimization of thermoelectric systems applied for electronic cooling: Parametric investigations and operation optimization | |
| Chen et al. | Performance of a thermoelectric generator intensified by temperature oscillation | |
| TWM469730U (en) | Heat dissipation structure and heat dissipation structure having the same | |
| TW201528927A (en) | New heat spreading packaging design | |
| Ma et al. | Study of an LED device with a honeycomb heat sink | |
| Krishna et al. | Enhanced performance of thermoelectric cooler with phase change materials: An experimental study | |
| Wang | Thermoelectric transformation and illuminative performance analysis of a novel LED-MGVC device | |
| CN201868410U (en) | Heat radiation device of multidirectional sound wave transmission heat source | |
| Shilpa et al. | A systematic review of thermoelectric peltier devices: applications and limitations | |
| CN102404972A (en) | Radiating device | |
| CN105202800A (en) | Semiconductor cooling and heating chip | |
| CN206449955U (en) | Modular, semiconductor refrigerator | |
| KR20170099281A (en) | Thermoelectric generation apparatus for camping | |
| CN211750394U (en) | Head-wearing electronic fever reducing instrument | |
| CN111108809B (en) | Heating device and application thereof | |
| US20090308584A1 (en) | Thermal conduction principle and device of the multi-layers structure with different thermal characteristics | |
| CN201750667U (en) | Heat dissipation device capable of transmitting heat source with sound wave | |
| CN201836841U (en) | Heat-conducting radiating module | |
| CN206411592U (en) | A kind of virtual reality device | |
| CN205319145U (en) | Accurate temperature control device of laser instrument | |
| CN103035592A (en) | Heat dissipation device transmitting heat by using phonons | |
| JP2019030159A (en) | Thermoelectric power generation device | |
| US20100038065A1 (en) | Thermal conducting principle and device for prestressed clamping type multi-layered structure | |
| CN102480899A (en) | Cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110615 Termination date: 20140817 |
|
| EXPY | Termination of patent right or utility model |