CN101352100A - Method and apparatus for encapsulating organic light emitting diodes - Google Patents
Method and apparatus for encapsulating organic light emitting diodes Download PDFInfo
- Publication number
- CN101352100A CN101352100A CNA2006800501456A CN200680050145A CN101352100A CN 101352100 A CN101352100 A CN 101352100A CN A2006800501456 A CNA2006800501456 A CN A2006800501456A CN 200680050145 A CN200680050145 A CN 200680050145A CN 101352100 A CN101352100 A CN 101352100A
- Authority
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- China
- Prior art keywords
- glass substrate
- lid
- process chamber
- objective table
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000011521 glass Substances 0.000 claims abstract description 65
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 19
- 239000012790 adhesive layer Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000027756 respiratory electron transport chain Effects 0.000 description 2
- WMAXWOOEPJQXEB-UHFFFAOYSA-N 2-phenyl-5-(4-phenylphenyl)-1,3,4-oxadiazole Chemical compound C1=CC=CC=C1C1=NN=C(C=2C=CC(=CC=2)C=2C=CC=CC=2)O1 WMAXWOOEPJQXEB-UHFFFAOYSA-N 0.000 description 1
- AWXGSYPUMWKTBR-UHFFFAOYSA-N 4-carbazol-9-yl-n,n-bis(4-carbazol-9-ylphenyl)aniline Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(N(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 AWXGSYPUMWKTBR-UHFFFAOYSA-N 0.000 description 1
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 1
- 101000837344 Homo sapiens T-cell leukemia translocation-altered gene protein Proteins 0.000 description 1
- 102100028692 T-cell leukemia translocation-altered gene protein Human genes 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/80897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
- H01L2224/80898—Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a method and apparatus for encapsulating an organic light emitting diode. The encapsulating method for encapsulating a glass substrate with a cover according to the present invention comprises the steps of (a) carrying the glass substrate with an organic light emitting layer formed thereon and the cover with an adhesive made of an ultraviolet curable resin applied thereto and fixing the glass substrate and the cover to upper and lower stages, respectively; (b) causing the glass substrate and the cover to be brought into close contact with and primarily compressed toward each other by means of a relative movement between the upper and lower stages; and (c) secondarily compressing the glass substrate and the cover toward each other by means of a pressure difference produced by increasing pressure in the chamber in a state where the glass substrate and the cover are brought into close contact with each other. In particular, the step (b) is executed while the chamber is in a vacuum state, and the step (c) is executed by changing the chamber from the vacuum state to an atmospheric or positive pressure state.
Description
Technical field
The present invention relates to be used for the method and apparatus of encapsulating organic light emitting diodes, more specifically, relate to and be used for a kind of like this method of organic light emitting diodes of encapsulation and device, wherein under the first each other state of contact of glass substrate and lid, produce pressure differential between other space in inner space that between glass substrate and lid, limits and the process chamber except that the inner space, make because this pressure differential can press glass substrate and lid toward each other.
Background technology
Recently, along with the fast development of ICT (information and communication technology) and the expansion of relevant market, flat-panel monitor (FPD) has been widely used in display apparatus.Typically, LCD (LCD), plasma panel (PDP), Organic Light Emitting Diode (OLED) etc. are as flat-panel monitor.
In these displays, because OLED compare with traditional LC D have fast response time, high brightness, low-power consumption and its are in light weight, can be fabricated onto in the superthin structure and do not need unsurpassed advantages such as additional backlight, so OLED has been widely used as display apparatus of future generation.
Obtain such OLED by on substrate, sequentially forming anode, organic film and negative electrode.If between anode and cathode layer, apply voltage, then on whole organic film, produce enough energy differences, make and can launch light simultaneously from organic film.That is to say that the remaining excitation energy in back of recombinating each other in injected electrons and hole can form light.At this moment, owing to can adjust light wavelength according to the amount of alloy in the organic material, so can carry out panchromatic realization.
Although the concrete structure of not shown OLED forms OLED by sequentially anode, hole injection layer, hole moving layer, luminescent layer, electron transfer layer, electron injecting layer and cathode layer being pressed onto on the substrate in the accompanying drawings.In this case, anode is mainly made by indium tin oxide target (ITO), and described indium tin oxide target has lower sheet resistance and remarkable transmissivity.Organic film is to be made of a plurality of layers such as hole injection layer, hole moving layer, luminescent layer, electron transfer layer and electron injecting layer, and to improve the luminous efficiency of OLED, wherein luminescent layer is by for example Alq
3, TPD, PBD, m-MTDATA, TCTA and suchlike organic material make.In addition, negative electrode is made by the LiF-Al metal film.In addition, because very not anti-airborne moisture of organic film and oxygen, so encapsulate the useful life that a lid prolongs OLED.
The structure of the OLED 100 of lid 120 encapsulation made from glass material will be described with reference to figure 1.
As shown in FIG., drier 121 is connected to covers 120 inside, to reduce the influence of the gas that external moisture/oxygen and the organic luminous layer from Organic Light Emitting Diode 100 111 generate.Lid 120 has planar rectangular shape, and covers each marginal end portion of 120 and be formed with extension at the outstanding predetermined altitude of a direction.Apply adhesive 122,, permeate from the outside to prevent moisture and oxygen on the end surface of extension, to form potted line, to make cover cap 120 to be adhered on the glass substrate 110 that deposits organic luminous layer 111 thereon with preset width.At this moment, between lid 120 and glass substrate 110, limit the gap 123 of predetermined space.
To the conventional equipment 200 that be used for encapsulating organic light emitting diodes be described with reference to figure 2.As shown in FIG., conventional packaging system 200 comprises: process chamber 210, in this process chamber, under the state that keeps vacuum atmosphere, carry out adhesion process; Last objective table 220, it is formed with vacuum line 221, is used for keeping glass substrate 110 in process chamber 210 vacuum; Operating unit 223 and ball screw 222 are used in the vertical direction and move up or down objective table 220; And following objective table 240, it is positioned at the lower part of process chamber 210, and lamination has ultraviolet ray (UV) shielding shade 230 and the lid 120 that scribbles adhesive 122 thereon.Ball screw 222 can be formed in the bellows, to keep the air-tightness of process chamber 210.Although not shown, the operating unit that can move up or down down objective table 240 can be set.
Below, will conventional method for packing be described with reference to figure 3 and Fig. 4.As shown in Figure 3, drive operating unit 223,, make glass substrate 110 closely to contact with lid 120 to move down objective table 220.Under such state, make and can further press glass substrate 110 if further move down objective table 220, glass substrate 110 and lid 120 are closely contacted, with formation adhesive layer 122a as shown in Figure 4.Then, shine cured adhesive layer 122a with UV lamp (not shown), making can be bonded to each other with glass substrate 110 and lid 120.
Should under vacuum atmosphere, in process chamber, carry out above-mentioned conventional adhesion process, to prevent producing bubble in the contact portion of glass substrate and lid with glass substrate and lid.
Yet, in the vacuum atmosphere of process chamber, carry out under the situation of adhesion process, should only pass through last objective table, promptly press glass substrate and lid by the mechanical compression device.Thereby, exist on the whole surface and between glass substrate and lid, can not carry out the problem that evenly presses.
Summary of the invention
Technical problem
Conceive the present invention and solved the problems referred to above of the prior art.Therefore, the purpose of this invention is to provide the method and apparatus that is used for encapsulating organic light emitting diodes, wherein under the first each other state of contact of glass substrate and lid, produce pressure differential between other space in inner space that between glass substrate and lid, limits and the process chamber except that the inner space, make because this pressure differential can press glass substrate and lid toward each other.
Technical scheme
According to an aspect of of the present present invention that is used to realize this purpose, a kind of method that is used to utilize cap seal glaze substrate is provided, it comprises step: (a) transport the glass substrate that is formed with organic luminous layer thereon and have the lid that is applied to the adhesive of being made by ultraviolet curable resin on it, and respectively glass substrate and lid are fixed to upper and lower objective table; (b), glass substrate is closely contacted with lid, and press toward each other for the first time by the relative motion of upper and lower objective table; And, press glass substrate and lid once more toward each other (c) by under the tight each other state of contact of glass substrate and lid, increasing the pressure differential of generation owing to the pressure in the chamber.Preferably, when being in vacuum state, carries out process chamber described step (b), and by process chamber is become atmospheric pressure or barotropic state is carried out described step (c) from vacuum state.
According to a further aspect in the invention, a kind of device that is used to utilize cap seal glaze substrate is provided, it comprises: it is bonded to each other that process chamber, the glass substrate and having that will be formed with organic luminous layer in this process chamber thereon are applied to the lid of the adhesive of being made by ultraviolet curable resin on it; The substrate holding unit is used for glass substrate is fixed on process chamber; And the lid holding unit, be used for lid is fixed on process chamber.More specifically, the substrate holding unit can comprise the last objective table that places process chamber, operating unit and the chuck that is used to move up or down objective table, this chuck is formed with and is used at least one vacuum line that vacuum keeps glass substrate, and place under the objective table, so that can move up or down with last objective table.
Packaging system of the present invention can also comprise secondary operating unit, is used for moving up or down described chuck from last objective table individually.
Description of drawings
Fig. 1 is the sectional view that the structure of conventional Organic Light Emitting Diode is shown.
Fig. 2 is the sectional view that the conventional equipment that is used for encapsulating organic light emitting diodes is shown.
Fig. 3 and Fig. 4 are the views that the mode of operation of the packaging system shown in Fig. 2 is shown.
Fig. 5 is the sectional view that illustrates according to packaging system of the present invention.
Fig. 6 to 8 is figure that the mode of operation of the packaging system shown in Fig. 4 is shown.
Fig. 9 is the flow chart that illustrates according to encapsulation process of the present invention.
Embodiment
Below, will be described in detail with reference to the attached drawings configuration of the present invention and operation.
With reference to figure 5, the device 10 that is used for encapsulating organic light emitting diodes according to the present invention comprises: process chamber 11, and pressure wherein can be adjusted to vacuum, atmospheric pressure or malleation; Substrate holding unit 20 is used for glass substrate 110 is fixed on process chamber 11; And lid holding unit 40, wherein UV is shielded shade 30 and be pressed onto on this lid holding unit with lid 120 sequential layer in the bottom of process chamber 11.
Simultaneously, in order to keep glass substrate 110, UV shielding shade 30 as above-mentioned vacuum and to cover 120, obviously should shield shade 30 and cover 120 to keep glass substrate 110, UV than the big vacuum degrees of vacuum degree in the process chamber 11.
Preferably, ball screw 21a is formed in the bellows (not shown), so that process chamber 11 is remained under the airtight conditions.Although not shown, can be provided with and move up or down the additional operations unit that covers holding unit 40.
Below, will method for packing of the present invention be described with reference to figure 6 to 8.As shown in Figure 6, operating operation unit 21b moves upward objective table with downward (direction of arrow shown in the figure) under the state that is in vacuum state at process chamber.Then, chuck 22 and the glass substrate 110 that is fixed thereon also move down, thereby glass substrate 110 is closely contacted with lid 120.
At this moment, as shown in Figure 7, use secondary operating unit and bellows 22b to come to make glass substrate 110 is contacted with lid 120 from further downward individually (as the direction of arrow shown in this Fig) the mobile chuck 22 of last objective table 21.Then, form adhesive layer 122a at glass substrate 110 with between covering 120.At this moment, significantly, process chamber 11 still remains on vacuum state.
Then, if in process chamber 11, form atmospheric pressure or barotropic state, as shown in Figure 8, by glass substrate 110 with cover in 120 inner spaces that limit and the process chamber and produce pressure differential between other space except that the inner space.Such pressure official post glass substrate 110 and lid 120 further press (on the direction of arrow as shown in Figure 8) toward each other.Particularly, owing to be not to apply mechanical pressure but apply because the pressure that causes of pressure differential, so can further press glass substrate 110 and lid 120 toward each other, and make their further closely contacts each other on whole surface.
Below, will method for packing of the present invention be described with reference to figure 9.
At first, glass substrate is transported in the process chamber, keeps this glass substrate (step S11) by the chuck vacuum that is arranged on below the objective table then.Then, will cover and also be transported to (step S12) in the process chamber.Then, UV shielding shade is closely contacted with the upper surface of lid, and make UV shielding shade be kept (step S13) by vacuum with lid by the lid holding unit.
Then, move down objective table, and further move down chuck, make glass substrate closely to contact (step S14) with lid.Certainly, this step is to carry out under process chamber is in the state of vacuum state.
Under this state, process chamber turns back to atmospheric pressure or barotropic state, makes can produce pressure differential (step S15) between other space except that the inner space in inner space that is limited by glass substrate and lid and process chamber.Such pressure differential can make glass substrate and lid evenly be pressed toward each other, and makes their closely contacts each other on whole surface.
Then, after evenly being pressed toward each other, shine UV light and come cure adhesive (step S16) owing to pressure differential at glass substrate and lid.
Glass substrate that will said method is bonded together according to the present invention and lid are taken out (step S17) from process chamber.
Industrial usability
According to the present invention, following advantage is arranged: the state that contacts for the first time each other at glass substrate and lid Lower, if in the inner space that is limited by glass substrate and lid and process chamber except the inner space Other space between produce pressure differential, then since this pressure differential can be with glass substrate and Gai Chao Press towards each other.
Therefore, by because pressure, glass substrate and the lid that pressure differential and mechanical pressure cause Can on whole surface, evenly be pressed toward each other. Thereby, can make glass substrate and lid Further close contact each other.
Claims (8)
1. one kind is used to utilize lid to come the Organic Light Emitting Diode method for packing of packaged glass substrate, and the method comprising the steps of:
(a) transport the lid that the glass substrate that is formed with organic luminous layer thereon and having is applied to the adhesive of being made by ultraviolet curable resin on it, and respectively glass substrate and lid are fixed to upper and lower objective table;
(b), glass substrate is closely contacted with lid, and press toward each other for the first time by the relative motion of upper and lower objective table; And
(c) by under the tight each other state of contact of glass substrate and lid, increasing the pressure differential of generation, press glass substrate and lid once more toward each other owing to the pressure in the chamber.
2. method according to claim 1 wherein, is carried out described step (b) when process chamber is in vacuum state, and by process chamber is become atmospheric pressure or barotropic state is carried out described step (c) from vacuum state.
3. method according to claim 1, wherein, in step (a), described glass substrate and lid quilt vacuum respectively remain on the upper and lower objective table.
4. method according to claim 1 also comprises step: in step (a) afterwards, the ultraviolet screener shade is closely contacted with lid.
5. one kind is used to utilize lid to come the Organic Light Emitting Diode packaging system of packaged glass substrate, and this device comprises:
It is bonded to each other that process chamber, the glass substrate and having that will be formed with organic luminous layer in this process chamber thereon are applied to the lid of the adhesive of being made by ultraviolet curable resin on it;
The substrate holding unit is used for glass substrate is fixed on process chamber; And
The lid holding unit is used for lid is fixed on process chamber.
6. device according to claim 5, wherein, described substrate holding unit comprises:
Place the last objective table of process chamber;
Be used to move up or down the operating unit of objective table; And
Chuck, this chuck are formed with and are used at least one vacuum line that vacuum keeps glass substrate, and place objective table below so that can move up or down with last objective table.
7. device according to claim 6 also comprises secondary operating unit, is used for moving up or down described chuck from last objective table individually.
8. device according to claim 5, wherein, described lid tegmentum holding unit vacuum keeps.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050134759 | 2005-12-30 | ||
| KR1020050134759A KR100689199B1 (en) | 2005-12-30 | 2005-12-30 | Encapsulation method of organic light emitting diodes and apparatus of the same |
| KR10-2005-0134759 | 2005-12-30 | ||
| PCT/KR2006/005782 WO2007078090A1 (en) | 2005-12-30 | 2006-12-27 | Method and apparatus for encapsulating organic light emitting diodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101352100A true CN101352100A (en) | 2009-01-21 |
| CN101352100B CN101352100B (en) | 2010-06-16 |
Family
ID=38102327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800501456A Expired - Fee Related CN101352100B (en) | 2005-12-30 | 2006-12-27 | Method and apparatus for encapsulating organic light emitting diodes |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100689199B1 (en) |
| CN (1) | CN101352100B (en) |
| TW (1) | TW200725961A (en) |
| WO (1) | WO2007078090A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102184935A (en) * | 2011-04-02 | 2011-09-14 | 东莞宏威数码机械有限公司 | OLED (Organic Light Emitting Diode) display screen packaging equipment and compression packaging method |
| CN102270742A (en) * | 2011-08-29 | 2011-12-07 | 电子科技大学 | Organic optoelectronic device wrapper and device packaging method |
| CN103187542A (en) * | 2011-12-29 | 2013-07-03 | 丽佳达普株式会社 | Organic light emitting element packaging device and organic light emitting element packaging method |
| CN103247540A (en) * | 2012-02-08 | 2013-08-14 | 西安永电电气有限责任公司 | Device, system and method for encapsulating IGBT module |
| CN115312472A (en) * | 2022-08-02 | 2022-11-08 | 江苏东海半导体股份有限公司 | Copper frame for packaging switch diode |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101336018B (en) * | 2007-06-27 | 2011-05-25 | 东莞彩显有机发光科技有限公司 | Packaged solderless method and apparatus of organic electroluminescent device |
| KR101432819B1 (en) * | 2007-12-29 | 2014-08-27 | 엘지디스플레이 주식회사 | Apparatus and method for fabricating organic electroluminescence display device |
| KR101048667B1 (en) | 2009-06-08 | 2011-07-13 | (주)아이디에스 | Liquid Crystal Display Manufacturing Method |
| CN102881825B (en) * | 2012-09-28 | 2015-08-05 | 京东方科技集团股份有限公司 | A kind of method of packaging system and encapsulation organic optoelectronic device |
| CN104022234B (en) * | 2014-06-24 | 2016-10-26 | 深圳市华星光电技术有限公司 | OLED sealed in unit and the method for packing of oled panel |
| KR101795678B1 (en) | 2016-01-27 | 2017-11-08 | 주식회사 선익시스템 | Encapsulation apparatus and method for encapsulating using the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3646788B2 (en) * | 2001-08-31 | 2005-05-11 | 英夫 吉田 | Method and apparatus for activation treatment of base material surface |
| JP2003123996A (en) * | 2001-10-09 | 2003-04-25 | Sanee Denki Kk | Discharge lamp lighting circuit |
| US7102726B2 (en) * | 2002-03-15 | 2006-09-05 | Lg. Philips Lcd Co., Ltd. | System for fabricating liquid crystal display and method of fabricating liquid crystal display using the same |
| JP2005011648A (en) * | 2003-06-18 | 2005-01-13 | Sanyo Electric Co Ltd | Electroluminescent panel and manufacturing method of electroluminescent panel |
| JP2005243413A (en) * | 2004-02-26 | 2005-09-08 | Sony Corp | Manufacturing method of display device |
-
2005
- 2005-12-30 KR KR1020050134759A patent/KR100689199B1/en not_active IP Right Cessation
-
2006
- 2006-12-26 TW TW095148865A patent/TW200725961A/en unknown
- 2006-12-27 WO PCT/KR2006/005782 patent/WO2007078090A1/en active Application Filing
- 2006-12-27 CN CN2006800501456A patent/CN101352100B/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102184935A (en) * | 2011-04-02 | 2011-09-14 | 东莞宏威数码机械有限公司 | OLED (Organic Light Emitting Diode) display screen packaging equipment and compression packaging method |
| CN102184935B (en) * | 2011-04-02 | 2012-08-08 | 东莞宏威数码机械有限公司 | OLED (Organic Light Emitting Diode) display screen packaging equipment and compression packaging method |
| CN102270742A (en) * | 2011-08-29 | 2011-12-07 | 电子科技大学 | Organic optoelectronic device wrapper and device packaging method |
| CN102270742B (en) * | 2011-08-29 | 2013-04-17 | 电子科技大学 | Organic optoelectronic device wrapper and device packaging method |
| CN103187542A (en) * | 2011-12-29 | 2013-07-03 | 丽佳达普株式会社 | Organic light emitting element packaging device and organic light emitting element packaging method |
| CN103247540A (en) * | 2012-02-08 | 2013-08-14 | 西安永电电气有限责任公司 | Device, system and method for encapsulating IGBT module |
| CN103247540B (en) * | 2012-02-08 | 2015-11-25 | 西安永电电气有限责任公司 | IGBT module sealed in unit, system and method |
| CN115312472A (en) * | 2022-08-02 | 2022-11-08 | 江苏东海半导体股份有限公司 | Copper frame for packaging switch diode |
| CN115312472B (en) * | 2022-08-02 | 2024-02-23 | 江苏东海半导体股份有限公司 | Copper frame for packaging switch diode |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200725961A (en) | 2007-07-01 |
| KR100689199B1 (en) | 2007-03-02 |
| WO2007078090A1 (en) | 2007-07-12 |
| CN101352100B (en) | 2010-06-16 |
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