TW200725961A - Method and apparatus for encapsulating organic light emitting diodes - Google Patents

Method and apparatus for encapsulating organic light emitting diodes

Info

Publication number
TW200725961A
TW200725961A TW095148865A TW95148865A TW200725961A TW 200725961 A TW200725961 A TW 200725961A TW 095148865 A TW095148865 A TW 095148865A TW 95148865 A TW95148865 A TW 95148865A TW 200725961 A TW200725961 A TW 200725961A
Authority
TW
Taiwan
Prior art keywords
cover
glass substrate
brought
light emitting
organic light
Prior art date
Application number
TW095148865A
Other languages
Chinese (zh)
Inventor
Chang-Son Choi
Hyung-Dong Yoo
Taek-Sang Kang
Bon-Yee Ku
Original Assignee
Doosan Dnd Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Dnd Co Ltd filed Critical Doosan Dnd Co Ltd
Publication of TW200725961A publication Critical patent/TW200725961A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/808—Bonding techniques
    • H01L2224/80897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
    • H01L2224/80898—Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention relates to a method and apparatus for encapsulating an organic light emitting diode. The encapsulating method for encapsulating a glass substrate with a cover according to the present invention comprises the steps of (a) carrying the glass substrate with an organic light emitting layer formed thereon and the cover with an adhesive made of an ultraviolet curable resin applied thereto and fixing the glass substrate and the cover to upper and lower stages, respectively; (b) causing the glass substrate and the cover to be brought into close contact with and primarily compressed toward each other by means of a relative movement between the upper and lower stages; and (c) secondarily compressing the glass substrate and the cover toward each other by means of a pressure difference produced by increasing pressure in the chamber in a state where the glass substrate and the cover are brought into close contact with each other. In particular, the step (b) is executed while the chamber is in a vacuum state, and the step (c) is executed by changing the chamber from the vacuum state to an atmospheric or positive pressure state. According to the present invention, a pressure difference between an inner space, which is defined by the glass substrate and the cover, and the other space in the processing chamber excluding the inner space can be created in a state where the glass substrate and the cover are brought into primary contact with each other, and the glass substrate and the cover can be uniformly compressed toward each other throughout the entire surfaces due to the pressure difference. Therefore, the glass substrate and the cover can be further brought into close contact with each other.
TW095148865A 2005-12-30 2006-12-26 Method and apparatus for encapsulating organic light emitting diodes TW200725961A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050134759A KR100689199B1 (en) 2005-12-30 2005-12-30 Encapsulation method of organic light emitting diodes and apparatus of the same

Publications (1)

Publication Number Publication Date
TW200725961A true TW200725961A (en) 2007-07-01

Family

ID=38102327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148865A TW200725961A (en) 2005-12-30 2006-12-26 Method and apparatus for encapsulating organic light emitting diodes

Country Status (4)

Country Link
KR (1) KR100689199B1 (en)
CN (1) CN101352100B (en)
TW (1) TW200725961A (en)
WO (1) WO2007078090A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562425B (en) * 2011-12-29 2016-12-11 Lig Adp Co Ltd Encapsulating apparatus and method for organic light emitting device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101336018B (en) * 2007-06-27 2011-05-25 东莞彩显有机发光科技有限公司 Packaged solderless method and apparatus of organic electroluminescent device
KR101432819B1 (en) * 2007-12-29 2014-08-27 엘지디스플레이 주식회사 Apparatus and method for fabricating organic electroluminescence display device
KR101048667B1 (en) 2009-06-08 2011-07-13 (주)아이디에스 Liquid Crystal Display Manufacturing Method
CN102184935B (en) * 2011-04-02 2012-08-08 东莞宏威数码机械有限公司 OLED (Organic Light Emitting Diode) display screen packaging equipment and compression packaging method
CN102270742B (en) * 2011-08-29 2013-04-17 电子科技大学 Organic optoelectronic device wrapper and device packaging method
CN103247540B (en) * 2012-02-08 2015-11-25 西安永电电气有限责任公司 IGBT module sealed in unit, system and method
CN102881825B (en) * 2012-09-28 2015-08-05 京东方科技集团股份有限公司 A kind of method of packaging system and encapsulation organic optoelectronic device
CN104022234B (en) * 2014-06-24 2016-10-26 深圳市华星光电技术有限公司 OLED sealed in unit and the method for packing of oled panel
KR101795678B1 (en) 2016-01-27 2017-11-08 주식회사 선익시스템 Encapsulation apparatus and method for encapsulating using the same
CN115312472B (en) * 2022-08-02 2024-02-23 江苏东海半导体股份有限公司 Copper frame for packaging switch diode

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3646788B2 (en) * 2001-08-31 2005-05-11 英夫 吉田 Method and apparatus for activation treatment of base material surface
JP2003123996A (en) * 2001-10-09 2003-04-25 Sanee Denki Kk Discharge lamp lighting circuit
US7102726B2 (en) * 2002-03-15 2006-09-05 Lg. Philips Lcd Co., Ltd. System for fabricating liquid crystal display and method of fabricating liquid crystal display using the same
JP2005011648A (en) * 2003-06-18 2005-01-13 Sanyo Electric Co Ltd Electroluminescent panel and manufacturing method of electroluminescent panel
JP2005243413A (en) * 2004-02-26 2005-09-08 Sony Corp Manufacturing method of display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562425B (en) * 2011-12-29 2016-12-11 Lig Adp Co Ltd Encapsulating apparatus and method for organic light emitting device

Also Published As

Publication number Publication date
WO2007078090A1 (en) 2007-07-12
CN101352100A (en) 2009-01-21
CN101352100B (en) 2010-06-16
KR100689199B1 (en) 2007-03-02

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