KR101795678B1 - Encapsulation apparatus and method for encapsulating using the same - Google Patents

Encapsulation apparatus and method for encapsulating using the same Download PDF

Info

Publication number
KR101795678B1
KR101795678B1 KR1020160009853A KR20160009853A KR101795678B1 KR 101795678 B1 KR101795678 B1 KR 101795678B1 KR 1020160009853 A KR1020160009853 A KR 1020160009853A KR 20160009853 A KR20160009853 A KR 20160009853A KR 101795678 B1 KR101795678 B1 KR 101795678B1
Authority
KR
South Korea
Prior art keywords
substrate
tray
sealing
process chamber
suction plate
Prior art date
Application number
KR1020160009853A
Other languages
Korean (ko)
Other versions
KR20170089526A (en
Inventor
최지현
Original Assignee
주식회사 선익시스템
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 선익시스템 filed Critical 주식회사 선익시스템
Priority to KR1020160009853A priority Critical patent/KR101795678B1/en
Publication of KR20170089526A publication Critical patent/KR20170089526A/en
Application granted granted Critical
Publication of KR101795678B1 publication Critical patent/KR101795678B1/en

Links

Images

Classifications

    • H01L51/5237—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H01L51/56—
    • H01L2251/56—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

According to an aspect of the present invention, there is provided an apparatus for sealing and sealing a substrate and an encapsulating substrate, comprising: a process chamber in which an inner space is formed; A substrate holder fixed to the process chamber to be located in an inner space of the process chamber; A substrate tray on which the substrate is mounted, the substrate tray being drawn into the process chamber and being supported by the substrate holder; A suction plate disposed at an upper portion of the substrate and coupled to the process chamber so as to be able to ascend and descend, for suctioning the substrate supported by the substrate tray; And an encapsulation substrate tray positioned at a lower portion of the process chamber opposite to the substrate, wherein the encapsulation substrate is seated.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an encapsulation device and an encapsulation method using the encapsulation device,

The present invention relates to an encapsulating device and a sealing method using the same. More particularly, the present invention relates to an encapsulation device capable of performing an encapsulation process on substrates of various sizes using a substrate tray, and a encapsulation method using the encapsulation device.

BACKGROUND ART Organic light emitting diodes (OLEDs) are self-light emitting devices that emit light by using an electroluminescent phenomenon that emits light when a current flows through a fluorescent organic compound. A backlight for applying light to a non- Therefore, a lightweight thin flat panel display device can be manufactured.

The organic electroluminescent device comprises an organic thin film such as a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer which are the remaining constituent layers except for the anode and the cathode. / RTI >

In the vacuum thermal deposition method, a substrate is disposed in a vacuum chamber, a shadow mask having a predetermined pattern is aligned on a substrate, heat is applied to an evaporation source containing the evaporation material, Evaporation.

On the other hand, the evaporation material deposited on the substrate forms an organic thin film, and since the organic thin film easily reacts with oxygen or moisture, when the organic thin film deposited on the substrate comes in contact with moisture, the characteristics of the organic electroluminescence device are degraded do. Therefore, a method for protecting an organic thin film used for manufacturing an organic electroluminescent device from water, oxygen, or the like, is a method in which a substrate made of a polymer film, stainless steel or the like as a main material An encapsulation process is needed to cover the substrate. In the case of an encapsulating device for a general encapsulating process, the size of a substrate holder for supporting the substrate and a suction plate for sucking the substrate are determined according to the size of the substrate. In order to carry out the encapsulating process on substrates of different sizes, Sized substrate holder and a suction plate. Therefore, when the substrate for sealing is changed, there has been a problem in that the sealing device must be changed.

Korean Patent Publication No. 10-2013-0059634 (published on Mar. 06, 2007)

The present invention provides an encapsulation device capable of encapsulating substrates of various sizes using a substrate tray, and a encapsulation method using the encapsulation device.

According to an aspect of the present invention, there is provided an apparatus for sealing and sealing a substrate and an encapsulating substrate, comprising: a process chamber in which an inner space is formed; A substrate holder fixed to the process chamber to be located in an inner space of the process chamber; A substrate tray on which the substrate is mounted, the substrate tray being drawn into the process chamber and being supported by the substrate holder; A suction plate disposed at an upper portion of the substrate and coupled to the process chamber so as to be able to ascend and descend, for suctioning the substrate supported by the substrate tray; And an encapsulation substrate tray positioned at a lower portion of the process chamber opposite to the substrate, wherein the encapsulation substrate is seated.

The substrate tray may have an opening to expose the deposition surface of the substrate.

And an encapsulation substrate holder disposed at the bottom of the process chamber to set the position of the encapsulation substrate tray.

The substrate tray may be formed with a plurality of fixing pins for positioning the corners of the substrate so that the substrate is correctly positioned.

In the suction plate, a plurality of insertion grooves may be formed to allow the fixing pins of the substrate tray to be inserted when the substrate is sucked by the suction plate.

According to another aspect of the present invention, there is provided a sealing method for sealing and sealing a substrate and an encapsulating substrate, comprising the steps of: drawing a substrate tray on which a substrate is placed into an inner space of a process chamber; Placing the substrate tray in a substrate holder; Lowering a suction plate liftably coupled to the process chamber to adsorb the substrate; Raising the suction plate in a state where the substrate is adsorbed; Withdrawing the substrate tray out of the process chamber; And lowering the suction plate on which the substrate is adsorbed so as to be brought into contact with the sealing substrate which is disposed below the substrate and opposed to the substrate.

The present invention can use the substrate tray to carry out the sealing process for substrates of various sizes.

1 is a perspective view of an encasing device according to an embodiment of the present invention.
2 is a perspective view of an arrangement of an encasing device according to an embodiment of the present invention.
3 to 6 are views for explaining an operation state of the sealing apparatus according to an embodiment of the present invention.
7 is an explanatory view for explaining an encapsulation method using an encapsulation device according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. A duplicate description will be omitted.

1 is a perspective view of an encasing device according to an embodiment of the present invention.

1, a process chamber 10, a substrate holder 12, a substrate tray 14, an opening 22, a substrate 16, a sealing substrate 18, a sealing substrate tray 20, a sealing substrate holder 24 A suction plate 40, a suction plate shaft 34, a fixing pin 36, an insertion groove 38, and a suction hole 40 are formed on the upper surface of the bellows 28, the bellows 28, the lift plate 30, the tray holder 32, Respectively.

The sealing apparatus according to this embodiment is a sealing apparatus for sealing and sealing the substrate 16 and the sealing substrate 18, the sealing apparatus comprising: a process chamber 10 in which an inner space is formed; A substrate holder (12) secured to the process chamber (10) to be located in the interior space of the process chamber (10); A substrate tray (14) on which the substrate (16) is seated and which is drawn into the process chamber (10) and supported by the substrate holder (12); A suction plate 26 disposed above the substrate 16 and movably coupled to the process chamber 10 for adsorbing the substrate 16 supported by the substrate tray 14; And an encapsulation substrate tray 20 located at the bottom of the process chamber 10 opposite the substrate 16 and on which the encapsulation substrate 18 is seated, .

The process chamber 10 is provided with an internal space in which the sealing process of the substrate 16 and the sealing substrate 18 proceeds, and the internal space may be formed in a vacuum.

The substrate holder 12 is fixed to the process chamber 10 so as to be located in the interior space of the process chamber 10. The substrate holder 12 is seated on the substrate tray 14, which will be described later, and is fixed to the process chamber 10. Since the substrate holder 12 according to the present embodiment is fixed to the process chamber 10, the lifting and lowering device for lifting and lowering the substrate holder 12 is not needed, The space utilization of the user can be increased. The substrate holder 12 is disposed in the inner space of the process chamber 10 such that a pair of plate-shaped support plates are spaced apart from each other to support both ends of the substrate tray 14.

A substrate 16 is seated in the substrate tray 14 and the substrate tray 14 is drawn into the process chamber 10 and supported by the substrate holder 12. The substrate tray 14 is formed in a rectangular plate shape and supports the edge portion of the substrate 16. Specifically, the opening portion 22 is formed at the center of the substrate tray 14 so that the deposition surface of the substrate 16 is exposed downward. A supporting surface is formed along the periphery of the opening portion 22 of the substrate tray 14 And supports the edge portion of the substrate 16. The substrate tray 14 is formed to correspond to the width of the substrate holder 12 and the opening 22 of the substrate tray 14 is formed to have a different size depending on the size of the substrate 16. For example, when the size of the substrate 16 is 100 * 100 mm, the opening 22 is formed so that the deposition surface of the substrate 16 is exposed, and the size of the substrate 16 is 200 * (Mm), the edge of the substrate 16 is supported so as to expose the deposition surface of the substrate 16, as compared with the case where the opening 22 is 100 * 100 (mm). As described above, by using the substrate tray 14 to support the substrate 16 of various sizes, it is not necessary to use a substrate holder or suction plate of different sizes depending on the size of the substrate 16. As described above, according to the sealing device of the present embodiment, the sealing process can be performed on the substrate 16 having various sizes using one sealing device.

The substrate tray 14 may be formed with a plurality of fixing pins 36 for positioning the edges of the substrate 16 so that the substrate 16 is positioned correctly. A plurality of fixing pins 36 are formed to protrude from one side of the substrate tray 14 along the outer periphery of the opening 22 and support the four corners of the rectangular substrate 16, 14).

A tray holder 32 for storing the substrate tray 14 may be provided outside the process chamber 10. A plurality of receiving spaces are formed in the tray holder 32 to accommodate the substrate tray 14. [ A plurality of the substrate trays 14 may be provided according to the size of the substrate 16, and the unused substrate trays 14 are accommodated in the tray holder 32 and stored.

A suction plate 26 is disposed on the top of the substrate 16 and is movably coupled to the process chamber 10 and adsorbs the substrate 16 supported by the substrate tray 14. Specifically, the suction plate 26 is laterally coupled to one end of a suction plate shaft 34 provided to penetrate the upper wall of the process chamber 10, and is lifted and lowered together with the movement of the suction plate shaft 34 . The other end of the suction plate 26 is coupled to the lifting plate 30 and the suction plate shaft 34 moves as the lifting plate 30 moves up and down and the suction plate 26 coupled to the suction plate shaft 34 is lifted . At this time, the suction plate shaft 34 may be received in the bellows 28 to maintain the vacuum of the process chamber 10.

Referring to FIG. 2, a plurality of suction holes 40 are formed on one surface of the suction plate 26, and the substrate 16 is sucked through the plurality of suction holes 40. A plurality of insertion grooves 38 may be formed in the suction plate 26 so that the fixing pins 36 of the substrate tray 14 are inserted. The suction plate 26 and the substrate tray 14 must be in close contact with each other to attract the substrate 16 seated on the substrate tray 14 by the suction plate 26. At this time, The suction plate 26 is formed with a plurality of insertion grooves 38 for insertion of the fixing pins 36 at positions corresponding to the fixing pins 36 so as not to be interfered with by the fixing pins 36. [

The encapsulation substrate tray 20 is positioned below the process chamber 10 to face the substrate 16 and the encapsulation substrate 18 is seated. An encapsulation substrate 18 that is bonded and sealed with the substrate 16 is placed under the process chamber 10 to be seated on the encapsulation substrate tray 20 and opposite the substrate 16. An opening may be formed in the encapsulation substrate tray 20 to accommodate the encapsulation substrate 18. An encapsulation substrate holder 24 may be provided on the bottom of the process chamber 10 to position the encapsulation substrate tray 20. The sealing substrate holder 24 supports the edge of the sealing substrate tray 20 to position the substrate tray 14 in position. A glue for sealing the substrate 16 and the sealing substrate 18 can be applied to the upper surface of the sealing substrate 18 that is seated on the sealing substrate tray 20 and the substrate 16 and the sealing substrate 18 The substrate 16 and the sealing substrate 18 are sealed by UV irradiation to cure the glue.

Hereinafter, the operation of the sealing device according to the present embodiment will be described with reference to FIGS. 3 to 6. FIG. The substrate tray 14 is seated in the substrate holder 12 with the substrate 16 seated in the substrate tray 14 (see Fig. 1). Next, the suction plate 26 is lowered so that the suction plate 26 and the substrate 16 come into close contact with each other, and the substrate 16 is sucked onto the suction plate 26 through the plurality of suction holes 40 Reference). Thereafter, the suction plate 26 is lifted (see Fig. 4) with the suction plate 26 sucking the substrate 16, and the substrate tray 14 is lifted up from the substrate holder 12 (See Fig. 5). After the substrate tray 14 is removed, the suction plate 26 descends, and the sealing substrate 18 provided below the process chamber 10 and the substrate 16 adsorbed to the suction plate 26 are joined together, 16 and the sealing substrate 18 are sealed.

According to another aspect of the present invention, there is provided a sealing method for sealing and sealing a substrate 16 and a sealing substrate 18, wherein a substrate tray 14 on which a substrate 16 is placed is introduced into an inner space of the process chamber 10 ; Placing the substrate tray (14) in the substrate holder (12); Lowering the suction plate (26) that is liftably coupled to the process chamber (10) to adsorb the substrate (16); Raising the suction plate (26) with the substrate (16) adsorbed; Withdrawing the substrate tray (14) out of the process chamber (10); Lowering the sucking plate 26 on which the substrate 16 has been adsorbed and bonding it with the sealing substrate 18 disposed below the substrate 16 against the substrate 16. [

Since the sealing device used in this embodiment is the same as the sealing device according to the previous embodiment, the description of the same configuration will be omitted from the description of the previous embodiment, and the sealing method using the sealing device will be specifically described below do.

In the process chamber 10, a sealing process is performed in which the substrate 16 and the sealing substrate 18 are bonded and sealed. First, the substrate tray 14, on which the substrate 16 is placed, (S100). At this time, a different substrate tray 14 may be used depending on the size of the substrate 16. The substrate tray 14 that is drawn into the process chamber 10 is seated on the substrate holder 12 so that both ends of the substrate tray 14 are supported (S200). Next, the suction plate 26 is lowered to attract the substrate 16 to the suction plate 26 (S300). Specifically, the suction plate 26 is vertically coupled to the process chamber 10 and moves up and down during the sealing process. A plurality of suction holes 40 are formed on the lower surface of the suction plate 26, 16 are adsorbed and adhered to the suction plate 26. The suction plate 26 is raised in a state in which the substrate 16 is adsorbed, and the substrate 16 is separated from the substrate tray 14 (S400). When the substrate 16 is separated from the substrate tray 14, the substrate tray 14 is removed from the substrate holder 12 and the substrate tray 14 is taken out of the process chamber 10 (S500). When the substrate tray 14 is drawn out of the process chamber 10, the substrate 16 is lowered with the sucking plate 26 to be adhered to the sealing substrate 18 disposed at the lower portion of the substrate 16 (S600 ). Specifically, an encapsulation substrate 18 is placed on the encapsulation substrate tray 20 and disposed below the process chamber 10 to face the substrate 16. [ A glue for sealing is applied to the upper surface of the sealing substrate 18. When the substrate 16 and the sealing substrate 18 are closely contacted by the lowering of the suction plate 26, Is hardened, whereby the substrate 16 and the sealing substrate 18 are sealed. Through this process, the sealing process of the substrate 16 and the sealing substrate 18 proceeds, and the sealing process can be performed on the substrate 16 of various sizes by using the same sealing device using the substrate tray 14 .

In the above-described encapsulation apparatus and encapsulation method using the same, the encapsulation process can be performed on substrates of various sizes using the substrate tray.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the appended claims. And changes may be made without departing from the spirit and scope of the invention.

10: process chamber 12: substrate holder
14: substrate tray 22: opening
16: substrate 18: sealing substrate
20: sealing substrate tray 24: sealing substrate holder
26: Suction plate 28: bellows
30: lift plate 32: tray holder
34: Suction plate shaft 36: Fixing pin
38: insertion groove 40: adsorption ball

Claims (6)

A sealing apparatus for sealing and sealing a substrate and an encapsulating substrate,
A process chamber in which an internal space is formed;
A substrate holder fixed to the process chamber to be located in an inner space of the process chamber;
A substrate having an opening formed to expose a deposition surface of the substrate downwardly and a substrate having an edge portion formed on an outer periphery of the opening to support an edge portion of the substrate and having both ends supported by the substrate holder, A tray;
A suction plate disposed at an upper portion of the substrate and coupled to the process chamber so as to be able to ascend and descend, for suctioning the substrate supported by the substrate tray; And
And an encapsulation substrate tray positioned at a lower portion of the process chamber opposite to the substrate and on which the encapsulation substrate is seated.
delete The method according to claim 1,
And an encapsulation substrate holder disposed at a bottom of the process chamber to set the position of the encapsulation substrate tray.
The method according to claim 1,
The substrate tray includes:
Wherein a plurality of fixing pins are formed to set the position of the edge of the substrate so that the substrate is correctly positioned.
5. The method of claim 4,
In the suction plate,
Wherein a plurality of insertion grooves are formed so that the fixing pins of the substrate tray are inserted when the substrate is sucked by the suction plate.
A sealing method for sealing and sealing a substrate and a sealing substrate,
Drawing a substrate tray on which a substrate is placed into an inner space of the process chamber;
Placing the substrate tray in a substrate holder;
Lowering a suction plate liftably coupled to the process chamber to adsorb the substrate;
Raising the suction plate in a state where the substrate is adsorbed;
Withdrawing the substrate tray out of the process chamber;
And lowering the suction plate on which the substrate is adsorbed so as to be bonded to the sealing substrate disposed at the lower portion of the substrate opposite to the substrate.
KR1020160009853A 2016-01-27 2016-01-27 Encapsulation apparatus and method for encapsulating using the same KR101795678B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160009853A KR101795678B1 (en) 2016-01-27 2016-01-27 Encapsulation apparatus and method for encapsulating using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160009853A KR101795678B1 (en) 2016-01-27 2016-01-27 Encapsulation apparatus and method for encapsulating using the same

Publications (2)

Publication Number Publication Date
KR20170089526A KR20170089526A (en) 2017-08-04
KR101795678B1 true KR101795678B1 (en) 2017-11-08

Family

ID=59654530

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160009853A KR101795678B1 (en) 2016-01-27 2016-01-27 Encapsulation apparatus and method for encapsulating using the same

Country Status (1)

Country Link
KR (1) KR101795678B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200082169A (en) 2018-12-28 2020-07-08 주식회사 선익시스템 Substrate transfer apparatus and encapsulation system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216173A (en) 1999-01-26 2000-08-04 Matsushita Electronics Industry Corp Manufacture of semiconductor device
JP2005189255A (en) 2003-12-24 2005-07-14 Internatl Business Mach Corp <Ibm> Carrier truck
JP2006191038A (en) 2005-01-05 2006-07-20 Samsung Sdi Co Ltd Aligning system for tray and tray holder
KR100689199B1 (en) 2005-12-30 2007-03-02 두산디앤디 주식회사 Encapsulation method of organic light emitting diodes and apparatus of the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216173A (en) 1999-01-26 2000-08-04 Matsushita Electronics Industry Corp Manufacture of semiconductor device
JP2005189255A (en) 2003-12-24 2005-07-14 Internatl Business Mach Corp <Ibm> Carrier truck
JP2006191038A (en) 2005-01-05 2006-07-20 Samsung Sdi Co Ltd Aligning system for tray and tray holder
KR100689199B1 (en) 2005-12-30 2007-03-02 두산디앤디 주식회사 Encapsulation method of organic light emitting diodes and apparatus of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200082169A (en) 2018-12-28 2020-07-08 주식회사 선익시스템 Substrate transfer apparatus and encapsulation system

Also Published As

Publication number Publication date
KR20170089526A (en) 2017-08-04

Similar Documents

Publication Publication Date Title
JP6535206B2 (en) Exposure method and exposure apparatus
CN108198958B (en) Display substrate, manufacturing method and manufacturing equipment thereof, and display device
KR20190129871A (en) Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
KR20140119993A (en) Substrate holding apparatus and method
KR101795678B1 (en) Encapsulation apparatus and method for encapsulating using the same
KR100987944B1 (en) Spread Equipment AND Spread Method To Liquid Glue For Active Matrix Organic Light-Emitting Diode
CN106654065B (en) It is a kind of for the peel-off device of flexible panel substrate and the manufacture method of flexible screen
CN112956009B (en) Apparatus for supporting peeling and peeling method using the same
TWI624098B (en) Sealing apparatus and method for fabricating display device using the same
JP2003317956A (en) Encapsulating method for organic light emitting device
KR100793368B1 (en) Vertical encapsulation apparatus and method of fabricating oled using the same
KR20170003129A (en) Deposition apparatus
JP2015115185A (en) Organic el module and method for manufacturing the same
JP2005139493A (en) Mask attachment and detachment device
KR101418711B1 (en) Substrate align module and apparatus for deposition having the same
KR20120136001A (en) Mixed-type chuck having member with adhesive strength based on van der waals&#39; force
KR101456665B1 (en) Apparatus for clamping substrate
KR20100068112A (en) Apparatus and method of organic thin film formation
KR102525220B1 (en) Chucking module and deposition apparatus of substrate having the same
KR100635512B1 (en) Align apparatus and its operating method for the same
KR102422443B1 (en) Deposition method
KR102141855B1 (en) Mask align apparatus
KR102682786B1 (en) Substrate supporting apparatus and method of deposition device
KR20180000959A (en) Substrate alignment apparatus to prevent movement of the substrate and deposition device having the same
KR100649938B1 (en) Glass suction apparatus for oled and method thereof

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
GRNT Written decision to grant