JP2005139493A - Mask attachment and detachment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mask attachment and detachment device which changes a mask without breaking a vacuum in a vacuum vessel. <P>SOLUTION: The masks 381 and 382 are attracted to the undersurface of a substrate holder 21 through a magnetic force of a magnet 35 in a magnet holder 33. A mask transfer portion 23 has a mask-attaching pin 43 and a magnet-pushing-up pin 44 which is longer than the pin 43. When the mask is detached, the magnet-pushing-up pin 44 is inserted into an open hole 34 right under the magnet holder 33, and pushes up the magnet 35 (c). Then, the mask 381 cannot receive a sufficient magnetic force from the magnet 35, and is detached from the substrate holder 21. When the mask is attached, the mask-attaching pin 43 is inserted into the open hole 34 (e). At this time, the mask-attaching pin 43 does not have such a length as to push up the magnet 35, so that the mask 382 previously mounted on the mask transfer portion 23 is kept attracted by the substrate holder 21. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an apparatus for attaching / detaching a mask to / from the surface of a substrate in a vacuum processing apparatus such as a vacuum vapor deposition apparatus or an etching apparatus when a film is formed in a predetermined pattern on the substrate using a mask in a vacuum vessel. .

  When manufacturing various semiconductor elements such as electroluminescent elements (EL), solar cells, or field effect transistors (FETs), in many cases, semiconductor layers and terminals are formed in a predetermined shape (pattern) and stacked. Let For example, the EL device has a hole transport layer 13 and an electron transport layer / light emitting layer 14 between two electrode layers 11 and 12 as shown in FIG. At the time of manufacturing this EL element, these four layers are formed in different patterns on the substrate 10 and stacked. A solar cell can be formed in the same manner as this EL element. In the FET, as shown in FIG. 1B, for example, an insulating layer thin film 16 is formed on the gate electrode 15, a source electrode 17 and a drain electrode 18 are formed on the insulating layer thin film 16, and a source A channel layer 19 is formed between the electrode 17 and the drain electrode 18. At the time of manufacturing this FET, the four layers of the gate electrode 15, the insulating layer thin film 16, the source electrode 17, the drain electrode 18 (both electrodes are formed simultaneously), and the channel layer 19 are formed in different patterns and stacked.

  Conventionally, inorganic materials have been exclusively used as materials for such elements, but in recent years, elements such as organic EL and organic FETs using organic materials have been produced. By using an organic material, the range of material selection can be expanded and the element can be flexible. In the case of manufacturing an element using such an organic material, it is necessary to select a manufacturing method corresponding to the element.

  Photolithography is widely used as a method for forming a film with a predetermined pattern. However, since this method usually uses a developer or an etchant (liquid or gas), it is not suitable for manufacturing an element including a film made of an organic material that is not resistant to such liquid or gas. .

  One suitable method for forming a film made of an organic material in a predetermined pattern is a vacuum deposition method. In this method, the material is heated and evaporated in a vacuum vessel, and the material is deposited on the surface of the substrate or the underlying film. At that time, by using a mask cut into a predetermined pattern, a layer having the pattern can be formed. However, at this time, there is a problem that the density of the material evaporated in the vacuum container varies and the film thickness becomes non-uniform. In addition, when two or more materials are mixed to form a single layer, such as when a pigment is doped or when an alloy is formed, the mixture of materials evaporated in the vacuum vessel is not uniform. become. Therefore, in order to form a uniform layer with a uniform film thickness, vapor deposition is performed while rotating the substrate holder to which the substrate is attached. At this time, since the mask needs to be rotated in accordance with the rotation of the substrate, the mask is attached to the surface of the substrate. As an example of attaching a mask to the substrate surface and performing vacuum deposition, Patent Document 1 describes an apparatus that uses a mask having a layer of a magnetic material and draws the mask with a magnet so that the mask adheres to the substrate. Yes.

Japanese Patent Laid-Open No. 2002-47560 ([0021] to [0022], FIG. 3)

  In order to stack a plurality of layers having a predetermined pattern by vacuum deposition, it is necessary to replace the mask in accordance with the pattern of the layer to be formed next after forming one layer. As a device for moving objects in the vacuum vessel, there are devices called a linear introducer and a rotary introducer. When these devices are used, the mask to be used can be moved to the surface of the substrate. The mask cannot be rotated along with the substrate when performing.

  As described above, since the mask cannot be exchanged in the vacuum vessel in the conventional apparatus, the vacuum is broken every time one layer is formed, and the substrate (and the film formed on the substrate) is taken out of the vacuum vessel and the mask is exchanged. I had to. In this case, the film formed on the substrate deteriorates due to the influence of atmospheric oxygen and water, and it is necessary to evacuate the vacuum vessel again before the next layer is formed. There was a problem that extra time was required.

  The problem to be solved by the present invention is to provide a mask attaching / detaching device capable of exchanging a mask in a vacuum vessel without breaking a vacuum.

A mask attaching / detaching apparatus according to the present invention, which is made to solve the above-mentioned problems, is a mask attaching / detaching apparatus for attaching / detaching a mask made of a material containing a ferromagnetic material to / from the surface of the substrate in order to form a pattern on the substrate. There,
a) a substrate holder made of a non-ferromagnetic material having a substrate holder on the lower surface;
b) a magnet placed on top of the substrate holder;
c) a mask removing portion having a mask placement portion after use and a magnet push-up member having a length equal to or longer than a maximum distance to which the mask suction force by the magnet reaches,
d) a moving mechanism for positioning the substrate holder on the mask removal portion;
It is characterized by providing.

Embodiments and effects of the invention

  The mask attaching / detaching apparatus of the present invention is for exchanging a mask adsorbed on a substrate surface by a magnet without breaking a vacuum in a vacuum vessel. The mask used in this mask attaching / detaching apparatus is made of a ferromagnetic material, that is, a material attracted by a magnet. Such ferromagnetic materials include, for example, iron, nickel, cobalt, and alloys thereof. Note that the mask does not have to be made of only a ferromagnetic material, and for example, a mask made of a layer made of a ferromagnetic material and a layer made of another material may be laminated.

  A substrate holding portion is provided on the lower surface of the substrate holder, whereby the substrate is held at a predetermined position on the lower surface of the substrate holder. A magnet is disposed on the upper surface of the substrate holder, and the mask is attracted (indirectly) to the lower surface of the substrate by the attractive force of the magnet. At this time, if the substrate holder itself adsorbs the mask, the mask cannot be removed, so that the substrate holder is made of a non-ferromagnetic material. In this way, film formation on the substrate surface is performed by vacuum deposition or the like while the substrate and the mask are held on the lower surface of the substrate holder.

  The mask removal unit includes a post-use mask placement unit for placing the removed mask, and a magnet push-up member. The magnet push-up member pushes up the magnet on the substrate holder to a position where the attractive force does not reach the mask when the substrate holder and the mask removing portion are overlapped. Therefore, the length of the magnet push-up member is set to be equal to or longer than the maximum distance that the mask attractive force by the magnet can reach.

  The moving mechanism is for positioning the substrate holder on the mask removing portion. Of course, this is only required to relatively change the positional relationship between the substrate holder and the mask detaching portion, and those that move the substrate holder, those that move the mask detaching portion, both of them. Any of those to be moved may be used. The substrate holder is positioned on the mask detaching portion when the mask is attached / detached, and the substrate holder and the mask detaching portion are arranged at different positions so that the mask detaching portion does not interfere with the film forming operation during film formation.

  Hereinafter, in the mask attaching / detaching apparatus of the present invention, an operation when removing the mask from the substrate holder will be described. First, after the substrate holder is placed on the mask removing portion by the moving mechanism, the substrate holder is lowered and overlapped on the mask removing portion. At this time, the magnet push-up member pushes the magnet up to a position where the attractive force does not reach the mask. Thereby, the mask adsorbed to the substrate holder is detached from the substrate holder and falls to the mask mounting portion after use of the mask removing portion. Thereafter, even if the substrate holder is raised, the mask remains on the mask mounting portion after use without being attracted to the magnet. As described above, when the substrate holder is overlaid on the mask removal portion or raised from the mask removal portion, the positional relationship between the two may be changed relatively. In addition to lowering the holder, the mask removal portion may be raised, or both of them may be moved up and down.

  The mask attaching / detaching apparatus of the present invention preferably further includes a mask attaching portion for attaching the mask to the substrate holder. This mask attachment portion has a pre-use mask placement portion, and the mask placed on the pre-use mask placement portion is attached to the substrate holder as follows. First, a substrate holder to which a mask is not attached is placed on the mask attachment part by a moving mechanism. Thereafter, the substrate holder is overlaid on the mask mounting portion. The mask attaching portion does not have a magnet push-up member like the mask removing portion, and the magnet is not pushed up from the upper surface of the substrate holder. Therefore, the mask is attracted to the substrate surface by the magnet's attractive force.

  By providing the mask attaching portion in this way, in addition to removing the mask, the mask can be attached without breaking the vacuum in the vacuum vessel. Further, by repeatedly attaching and removing the mask as described above, it is possible to form a film of three or more layers on the substrate using each mask.

  Further, instead of separately providing the mask attaching portion and the mask removing portion, a mask attaching / detaching portion serving as both may be provided. In this case, a rotation mechanism that rotates the substrate holder or the mask attaching / detaching portion about a substantially vertical axis is provided, and an angle at which the magnet exists on the magnet push-up member (referred to as a first rotation angle) by the rotation angle. In addition, the substrate holder and the mask attaching / detaching portion can be arranged at an angle at which no magnet exists on the magnet push-up member (the second rotation angle). When removing the mask, the substrate holder is placed on the mask attaching / detaching portion by the moving mechanism, and then the substrate holder and the mask attaching / detaching portion are adjusted to the first rotation angle by the rotating mechanism. Thereafter, when the substrate holder is lowered and overlapped with the mask attaching / detaching portion, the magnet is pushed up by the magnet push-up member, and the mask falls onto the mask attaching / detaching portion. When the mask is attached, it is adjusted to the second rotation angle by the rotation mechanism. In this case, since the magnet is not pushed up, the mask placed on the mask attaching / detaching portion is attracted to the substrate surface by the attractive force of the magnet.

  Furthermore, it is desirable to provide a magnet holder on the upper surface of the substrate holder that can hold the magnet in a state where it can move in the vertical direction. As such a magnet holder, for example, a magnet holder that supports a magnet from the side can be used. Thereby, when the magnet is pushed up by the magnet push-up member, the magnet does not lose its balance, and the stability of the magnet is ensured when the substrate holder is moved.

  As the moving mechanism in the mask attaching / detaching apparatus of the present invention, a linear introducer or a rotary introducer can be used. The linear introducer moves the equipment linearly, and the rotary introducer rotates the equipment. All of these can move the equipment installed inside the vacuum vessel without breaking the vacuum.

  As described above, by using the mask attaching / detaching apparatus of the present invention, the mask can be exchanged without breaking the vacuum in the vacuum vessel. This eliminates the need to expose the formed film to the atmosphere when exchanging the mask, so that it is possible to prevent deterioration of the film due to atmospheric oxygen and water, and there is no need to redraw the vacuum each time the mask is exchanged. Therefore, the time required for work can be shortened. Furthermore, since a plurality of layers can be formed in one vacuum apparatus, the apparatus can be miniaturized. In addition, since a person does not touch the mask when attaching and removing the mask, a thin mask can be handled without being damaged.

  The mask attaching / detaching apparatus of the present invention is preferably used for manufacturing an element made of an organic material such as an organic EL or an organic FET by a vacuum evaporation method, but used for manufacturing an element made of an inorganic material by a vacuum evaporation method. May be. Moreover, you may use the mask attachment / detachment apparatus of this invention for other uses, such as sputtering, besides using it for vacuum evaporation. For example, the mask having a predetermined pattern is attached to the front surface of the substrate by the mask attaching / detaching apparatus of the present invention, and the target material is deposited on the substrate by depositing the material released by sputtering the target on the substrate. Can be formed.

  In FIG. 2, the schematic block diagram of one Example of the mask attachment / detachment apparatus of this invention is shown. In the present embodiment, a substrate holder 21, a linear introducer 22, and a mask transfer unit 23 are provided in the vacuum container 20. The mask transfer unit 23 is attached to the linear introducer 22, and a mask attachment unit 41 and a mask removal unit 42 are provided there. The straight line introducer 22 moves the mask transfer unit 23 in the horizontal direction. The substrate holder 21 is movable in the vertical direction, and can rotate around a substantially vertical axis 211. The inside of the vacuum vessel 20 is maintained in a high vacuum state by a pump.

  A detailed configuration of the substrate holder 21 will be described with reference to FIG. (a) is a perspective view seen obliquely from above, (b) is a perspective view seen obliquely from below, and (c) is a cross-sectional view taken along the alternate long and short dash line A shown in (a) and (b). In the center of the lower surface of the base 31, there is provided a substrate support portion 32 constituted by a recess slightly deeper than the thickness of the substrate. The substrate is positioned with respect to the substrate holder 21 by the substrate support portion 32. Each of the bases 31 on both sides of the substrate support portion 32 is provided with four through holes 34 parallel to each side. A cylindrical magnet holder 33 is provided on the upper surface side of the base 31 around each of the two (a total of four). Positioning pins 36 are fixed to the remaining two (four in total) on the lower surface side of the base 31. Each of these two magnet holders 33 and positioning pins 36 are arranged alternately on both sides of the base 31 and in an antisymmetric position on both sides.

  A cylindrical neodymium magnet 35 is held in the cylindrical portion of each magnet holder 33. The diameter of the neodymium magnet 35 is slightly larger than the diameter of the through hole 34 so that the neodymium magnet 35 does not fall from the through hole 34.

  FIG. 3D shows a state where the substrate 37 and the mask 38 are held on the substrate holder 21. The detailed configuration of the mask 38 will be described later. The mask 38 is attracted to the lower surface of the base 31 by the magnetic force of the neodymium magnet 35. As described above, since the depth of the substrate support portion 32 is slightly larger than the thickness of the mask 38, the mask 38 does not contact the substrate 37, and the film already formed on the substrate is not damaged by the mask. . The mask 38 is provided with holes corresponding to the positions of the through holes 34 and the positioning pins 36. The mask 38 is attracted to a predetermined position of the substrate holder 21 by the positioning pins 36 and the positioning holes of the mask 38. The Thereby, the mask 38 and the substrate are positioned.

  The detailed configuration of the mask transfer unit 23 will be described with reference to FIG. The mask transfer unit 23 has two claws 231 and 232 arranged substantially in parallel. On each nail, two magnet push-up pins 44 and two mask attachment pins 43 are erected. The positions of the magnet push-up pins 44 and the mask attachment pins 43 correspond to the positions of the through holes 34 of the substrate holder 21, respectively. The length of the magnet push-up pin 44 is set such that the neodymium magnet 35 can be pushed up to a position where the mask cannot be attracted when the pin is inserted through the through hole 34 of the substrate holder 21. On the other hand, the mask mounting pin 43, together with the positioning pin 36, is for accurately aligning the position of the mask and the substrate holder, is shorter than the magnet push-up pin 44, and has a length that prevents the magnet from being pushed up to the above position. To do. The mask transfer section 23 is provided with a hole 45 for allowing the positioning pin 36 of the substrate holder 21 to escape. Below, the area | region of the mask transfer part 23 in which the board | substrate holder 21 is mounted in the case of removal and attachment of a mask is called the mask removal part 42 and the mask attachment part 41, respectively.

  In FIG. 5, the example of the mask used with the mask attachment / detachment apparatus of a present Example is shown with a top view. The mask is made of an alloy of nickel and iron. In any mask, eight holes 51 are provided. Four of the holes 51 are provided with the positioning pins 36 and the remaining four are provided at positions where the mask mounting pins 43 and the magnet push-up pins 44 can be inserted. It plays a role of positioning for accurate mounting. (a) is a mask used for production of organic EL and solar cells. Among these, (a-1) is a mask for forming an organic material layer to be a hole transport layer or an electron transport layer, and (a-2) is a mask for electrode preparation. (b) is a mask for forming the source-drain electrodes of the FET. Among these, (b-1-1) and (b-1-2) are masks for forming the comb-shaped electrode shown in (b-1-3) as the source-drain electrode. In the comb-shaped electrode, the source electrode and the drain electrode are respectively formed in a comb shape, and are arranged so that the comb teeth of the two electrodes are engaged. When forming the comb-shaped electrode, first, the base of the comb is formed with the mask (b-1-1), and then the mask is replaced with the mask (b-1-2) to form the comb teeth To do. (b-2) is a mask for forming parallel plate electrodes as source-drain electrodes.

The operation of the mask attaching / detaching apparatus of this embodiment will be described with reference to FIG. 6 shows a cross-sectional view taken along the alternate long and short dash line B shown in FIGS. 3 (a) and 3 (b).
First, the substrate holder 21 holding the substrate 37 and the mask 381 to be used first is set in the vacuum container 20. In addition, a replacement mask 382 is placed in advance on the mask attachment portion 41. The inside of the vacuum vessel 20 is brought into a high vacuum state of 10 ⁻³ Pa or higher by a pump, and vapor deposition is performed on the substrate 37 using a mask 381 by the same method as in the past.

  After completion of the vapor deposition, the mask removing unit 42 of the mask transfer unit 23 is moved under the substrate holder 21 by the straight line introducer 22 while maintaining the high vacuum state ((a)). At this time, the magnet push-up pin 44 is positioned directly below the through-hole 34 by the alignment function of the linear introducer 22. Next, the substrate holder is lowered and the magnet push-up pin 44 is inserted through the through hole 34 ((b)). When the substrate holder is further lowered, the neodymium magnet 35 in the magnet holder 33 is gradually pushed upward with respect to the substrate holder 21 by the magnet push-up pin 44 (actually, the position of the neodymium magnet 35 is not changed). Only the substrate holder 21 is lowered). When the neodymium magnet 35 is pushed above a certain height with respect to the substrate holder 21, the mask 381 cannot be attracted by the magnetic force, so that the mask 381 moves away from the substrate holder 21 and falls onto the mask removing portion 42 (( c)).

  Next, after the substrate holder 21 is lifted and removed from the magnet push-up pin 44, the mask mounting portion 41 of the mask transfer portion 23 is moved below the substrate holder 21 by the linear introducer 22 ((d)). Then, the substrate holder 21 is lowered to insert the mask attachment pin 43 into the through hole 34, and the alignment pin 36 is inserted into the hole 51 of the mask and the hole 45 of the mask attachment portion ((e)). Since the mask mounting pin 43 does not push up the neodymium magnet 35, when the substrate holder 21 is lowered, the mask 382 is attracted by the magnet and is attracted to the lower surface of the substrate holder 21. Thereafter, the substrate holder 21 is raised ((f)), and vapor deposition using the mask 382 is performed.

  In the above, for simplification, an example in which only one mask is removed and attached has been described, but a plurality of masks can be continuously removed and attached in the same manner. In this case, there is no problem in the mask removing portion 42, but in the mask attaching portion 41, as shown in FIG. 7, the legs 53 are provided on the lower surface of each mask 52 and the strength of the magnet on the substrate holder 21 is increased. In order to prevent two or more masks from being simultaneously attracted by the magnet, a method such as adjusting the angle is adjusted.

  Although FIG. 2 shows an example using a linear introducer, FIG. 8 shows an example using a rotary introducer. In this example, two mask attaching portions 611 and 612 and one mask removing portion 62 are attached to the rotary introducer 63 radially. Here, although the number of mask attaching portions is two, the configuration is the same with one or three or more. The rotation introducer 63 rotates the mask attaching portions 611 and 612 and the mask removing portion 62 around a rotating shaft 64 extending in a substantially vertical direction, and is arranged so that the substrate holder 21 comes on the rotation trajectory. . When attaching the mask, the rotation introducer 63 is rotated to move the mask attaching portion to be replaced directly below the substrate holder 21. When removing the mask, the mask removing portion 62 is similarly placed directly below the substrate holder 21. Move to. The other operations are the same as when the linear introducer is used.

  FIG. 9 shows an example of a mask attaching / detaching device having a mask attaching / detaching portion that doubles as the mask attaching portion and the mask removing portion. The base 72 of the substrate holder 71 is provided with four through holes at positions corresponding to the apexes of the square, and a magnet holder 73 similar to the above is formed on the two through holes located at the diagonal of the square. Provided. A magnet holder is not provided in the remaining two through holes 74 located on the other diagonal. The substrate holder 71 can rotate about a substantially vertical axis by a rotation mechanism, and the substrate is held on the lower surface of the base 72 as in the above example. On the other hand, the mask attaching / detaching portion 76 is provided with four pins at positions corresponding to the through holes. Of these four pins, one pair of pins in one diagonal position is a magnet push-up pin 78, and the other pair of pins in the diagonal position is a mask attachment pin 77. The lengths of the mask mounting pin 77 and the magnet push-up pin 78 are the same as those in FIG.

The operation of the mask attaching / detaching apparatus of FIG. 9 will be described. First, a mask before use is placed on the mask attaching / detaching unit 76 in advance.
At the time of mask attachment, the mask attaching / detaching portion 76 is arranged immediately below the substrate holder 71 by a rotation introducer or the like, and the mask attaching pin 77 can be inserted into the through hole provided with the magnet holder 73 by the rotating mechanism. The substrate holder 71 is rotated. When the substrate holder 71 is lowered from that position, the magnet in the magnet holder 73 is not pushed up by the mask attachment pins 77, so that the mask on the mask attachment / removal unit 76 is attracted to the lower surface of the substrate holder 71.

  When removing the mask, the mask attaching / detaching portion 76 is disposed immediately below the substrate holder 71 in the same manner as described above, and the substrate holder 71 is placed so that the magnet push-up pin 78 can be inserted into the through hole in which the magnet holder 73 is provided. Rotate. When the substrate holder 71 is lowered from that position, the magnet in the magnet holder 73 is pushed up by the magnet push-up pin 78. Therefore, the mask adsorbed on the lower surface of the substrate holder 71 by the magnet is separated from the substrate holder 71 and falls onto the mask attaching / detaching unit 76.

  In the configuration of FIG. 9, since the used mask is placed again at the position before attachment, there is no need for the operator to place the mask again on the mask attaching / detaching portion 76 when the film forming operation is repeated. , Work efficiency is improved. When attaching and detaching a plurality of masks, it is only necessary to provide as many mask attaching / detaching portions as the number of masks to be used. In the configuration of FIG. 9, instead of providing only through holes at two locations on the base 72, two magnet holders located at diagonally opposite sides of the square are provided with a magnet holder 73 and through holes as in the other two locations. Only 73 may hold a magnet.

  Depending on the arrangement of the magnet, the mask may not be sufficiently attracted to the substrate holder at a position away from the magnet, and the mask may bend. In order to avoid this, for example, as shown in FIG. 10, a deflection preventing magnet 81 may be provided at a position away from the magnet holder 82. It is assumed that the deflection preventing magnet 81 has such a magnetic force that the mask cannot be held on the substrate holder by itself. Accordingly, the deflection preventing magnet 81 does not affect the removal of the mask, and the mask can be prevented from being bent by attracting the surrounding mask while the mask is held by the substrate holder.

  In each of the above examples, the substrate holder is provided with a through-hole so that the magnet push-up pin can come into contact with the magnet on the substrate holder. Instead, for example, as shown in FIG. The part may be lost. In the configuration of FIG. 11A, the substrate holder 91 is missing two locations 931 and 932 among the four corners of the base 92. The substrate is held on the lower surface of the base 92 as described above. A magnet holder 94 that holds the magnet 95 is provided on the upper surface of the base 92. The magnet 95 is plate-shaped having substantially the same area as the base 92, and is mounted on the upper surface of the base 92 so that two of the four corners correspond to the positions of the missing portions 931 and 932 of the base 92. Placed. In this example, the magnet holder 94 is provided so as to support two portions of the four corners of the magnet 95 that do not correspond to the positions of the missing portions 931 and 932. The mask removing portion 96 is provided with a magnet push-up member 97 having a shape corresponding to the shape of the defect portion at a position corresponding to the defect portions 931 and 932. Similarly, the mask attaching portion 98 is provided with a mask attaching member 99 corresponding to the positions and shapes of the defect portions 931 and 932. The lengths of the magnet push-up member 97 and the mask attachment member 99 are the same as those of the magnet push-up pin and the mask attachment pin of the other embodiments, and the tip of the magnet push-up member increases the stability when the magnet is pushed up. Make it flat. The means for preventing the pushed-up magnet from losing the balance when the mask is attached is not limited to the method of providing the magnet holder as described above or using the magnet pushing-up member having a flat top portion. Any means may be used as long as the magnet can be pushed up stably, such as a method of providing three or more deficient portions and magnet pushing pins.

  When removing the mask in the configuration of FIG. 11A, as shown in FIG. 11B, the substrate holder 91 is overlaid on the mask removal portion 96, and the magnet push-up member 97 is moved from the positions of the defect portions 931 and 932. By pushing up the magnet 95, the mask adsorbed on the substrate surface is removed. When attaching the mask, the substrate holder 91 is overlaid on the mask attaching portion 98. At this time, the magnet 95 is not pushed up, and therefore, the mask previously placed on the mask mounting portion 98 is attracted to the surface of the substrate by the magnetic force of the magnet 95.

Sectional drawing and perspective view which show the structural example of EL element ((a)) and FET ((b)). The schematic block diagram which shows one Example of the mask attachment / detachment apparatus of this invention. The perspective view and sectional drawing which show the structure of the board | substrate holder of a present Example. The perspective view which shows the structure of the mask transfer part of a present Example. The figure which shows an example of the mask used with the mask attachment / detachment apparatus of a present Example. Sectional drawing which shows operation | movement of the mask attachment / detachment apparatus of a present Example. The side view which shows the example which provided the leg | foot in the mask. The top view which shows the example using a rotation introducer. The perspective view which shows an example of the mask attachment / detachment apparatus which has the mask attachment / detachment part which serves as a mask attachment part and a mask removal part. The perspective view which shows an example of the board | substrate holder which has a bending prevention magnet. The perspective view which shows the other Example of a mask attachment / detachment apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Substrate 11, 12 ... Electrode layer 13 ... Hole transport layer 14 ... Electron transport layer / light emitting layer 15 ... Gate electrode 16 ... Insulating layer thin film 17 ... Source electrode 18 ... Drain electrode 19 ... Channel layer 20 ... Vacuum container 21, 71, 91 ... Substrate holder 22 ... Straight line introducers 23, 75 ... Mask transfer parts 231, 232 ... Claws 31, 72, 92 ... Base 32 ... Substrate support parts 33, 73, 82, 94 ... Magnet holders 34, 74 ... Through hole 35 ... Neodymium magnet 36 ... Positioning pin 37 ... Substrate 38, 52 ... Mask 41, 62, 98 ... Mask attaching portion 42, 611, 612, 96 ... Mask removing portion 43, 77 ... Mask attaching pin 44, 78 ... Magnet Push-up pin 51 ... Mask hole 53 ... Mask foot 63 ... Rotation introducer 76 ... Mask attachment / detachment part 81 ... Deflection prevention magnets 931, 932 ... Defect of base Part 95 ... Magnet

Claims (6)

A mask attaching / detaching device for attaching / detaching a mask made of a material containing a ferromagnetic material to / from a surface of the substrate in order to form a pattern on the substrate,
a) a substrate holder made of a non-ferromagnetic material having a substrate holder on the lower surface;
b) a magnet placed on top of the substrate holder;
c) a mask removing portion having a mask placement portion after use and a magnet push-up member having a length equal to or longer than a maximum distance to which the mask suction force by the magnet reaches;
d) a moving mechanism for positioning the substrate holder on the mask removal portion;
A mask attaching / detaching device comprising:   The mask attaching / detaching apparatus according to claim 1, further comprising a mask attaching portion having a pre-use mask placing portion.   The mask attaching / detaching apparatus according to claim 1, further comprising a magnet holder that holds the magnet on an upper surface of the substrate holder.   The mask attaching / detaching device according to claim 1, wherein the moving mechanism moves the mask attaching part or the mask removing part by a linear introducer.   The mask attaching / detaching device according to claim 1, wherein the moving mechanism moves a mask attaching portion or a mask removing portion by a rotation introducer.   A mask attaching / detaching portion that also serves as the mask attaching portion and the mask removing portion; and a rotating mechanism that rotates the substrate holder or the mask attaching / detaching portion about a substantially vertical axis, and the magnet push-up member according to the rotation angle thereof. The mask attaching / detaching device according to claim 1, wherein the mask attaching / detaching device can be disposed at any position where the magnet can be brought into contact with the magnet or at a position where the magnet cannot be brought into contact with the magnet.

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