KR101124557B1 - OLED used flexible display substrate - Google Patents

Abstract

The present invention relates to an organic light emitting device, and more particularly, a support substrate is laminated on a glass substrate and an upper surface and a lower surface of the glass substrate, and a flexible support substrate having a thickness of 10 to 400 μm; An organic light emitting unit formed on one surface of the support substrate and including an organic light emitting layer between a pair of electrodes; And a flexible sealing substrate coupled to the support substrate and a sealing material so as to block the organic electroluminescent part from external air, wherein the sealing material is provided along an edge of the sealing substrate. An organic electroluminescent device is provided.

Flexible, organic EL device, sealing substrate, sealing material

Description

Organic EL device using flexible display substrate {OLED used flexible display substrate}

The present invention relates to an organic electroluminescent device, and more particularly, to an organic electroluminescent device in which a substrate is made of a thin glass plate and has flexible characteristics.

In the organic light emitting device, the organic light emitting unit is generally injected by injecting electrons and holes into the light emitting layer from the electron injection electrode and the hole injection electrode, respectively. It is a device that emits light when an exciton in which electrons and holes are combined falls from an excited state to a ground state.

Due to this principle, unlike the conventional thin film liquid crystal display device, since a separate light source is not required, there is an advantage in that the volume and weight of the device can be reduced.

In addition, the organic EL device exhibits high quality panel characteristics (low power, high brightness, high reaction rate, low weight). OELD is considered to be a powerful next-generation display that can be applied to new portable communication products such as mobile communication terminal, CNS (Car Navigation System), PDA (personal digital assistances), and Palm PC.

In general, the organic light emitting device is composed of a transparent support substrate and a sealing substrate spaced apart from each other, the support substrate and the sealing substrate is encapsulated with each other by a sealing material (encapsulation). An array portion including a plurality of thin film transistors, gates, data lines, and storage capacitors is formed on an upper portion of the support substrate. have. In this case, the organic layer expresses the colors of red (R), green (G), and blue (B), and in general, red (R), green (G), and blue (B) colors for each pixel. A separate organic material emitting light is used as a pattern.

A desiccant is formed below the sealing substrate, and the moisture absorbent is formed inside the sealing substrate. That is, the moisture absorbent serves to remove moisture that can penetrate into the seal formed by the support substrate and the sealing substrate.

In the bonding of the supporting substrate and the sealing substrate, a sealing material is placed on the edge of the sealing substrate. The sealing material is cured and acts as an adhesive to bond the supporting substrate and the sealing substrate to complete the organic light emitting device.

Since the organic light emitting device (OLED) is a self-luminous type, the viewing angle is wider than the LCD, the contrast is good, and since the backlight is not required, the organic light emitting device (OLED) can be reduced in weight and advantageous in terms of power consumption. In addition, it is easy to display video because it has a sensitive screen and quick response compared to other displays, and unlike LCD, it is attracting attention as next-generation display because it is composed of solid thin film, which is strong in vibration and has relatively wide use temperature range.

The display substrate utilized in the organic EL device is important for gas permeability such as oxygen or moisture through the substrate represented by gas barrier properties. This is because the durability of the material constituting the display element is affected by the transmitted oxygen or moisture, and since the material of the light emitting layer reacts very sensitively to oxygen or moisture and deteriorates, organic electroluminescence is emitted by these intrusions. There is a problem in that the performance of the device is degraded and the lifespan is shortened so that the luminous efficiency sharply decreases.

Glass is generally used as a material having good surface flatness, mechanical properties, and light transmittance, which are suitable for preventing gas from influencing the durability of the display device and forming a micro display device. However, in order to reduce the thickness of the glass plate and use it in a flexible display substrate, the cracking of the glass may be a problem.

In contrast, plastics are generally used as substrates for flexible display devices in the form of films having a thickness of 0.1 to 0.2 mm. Such plastic substrates have advantages of being more flexible, less fragile than glass, and having a smaller density than glass, thereby making a light display device possible. However, there is a problem in that the permeability of oxygen and moisture is higher than that of glass, and thus the device manufactured therefrom has a problem of shortening the lifespan.

On the other hand, the conventional sealing method is formed by attaching a moisture absorbent to the sealing substrate and bonding the substrate and the sealing substrate on which the organic light emitting element is formed. The method of attaching the moisture absorbent is complicated to process, the material and the cost of the process increases, the overall thickness of the substrate becomes thick, and the material used as the absorbent cannot be used for top emission or double-sided light emission.

Republic of Korea Patent Publication No. 2002-0065124 and the sealing substrate; A moisture absorbent formed into a thin film on an inner surface of the sealing substrate; A sealing material formed at an edge of the sealing substrate; To provide an organic electroluminescent device comprising a light emitting substrate which is bonded to the sealing material of the sealing substrate and the sealing substrate is configured to seal the light emitting layer formed on the lower surface to prevent the penetration of moisture, to manufacture such an organic electroluminescent device As an encapsulation method, an organic electroluminescent device characterized in that a moisture absorbent thin film is formed on a sealing substrate is disclosed, and glass or plastic material is used as the encapsulation substrate. However, such a holding EL device has a complicated process due to the use of a hygroscopic agent, thereby increasing the material and process cost and increasing the thickness of the entire substrate. Glass or plastic material is used as the sealing substrate. The problem of lightening and cracking when using and shortening the life due to the permeability of oxygen and moisture when using plastic occurs.

 In addition, there is a method of sealing in the form of a film, in which case there is a limit in preventing the penetration of water and there is a risk of damage during the manufacturing process or use, which is not suitable for mass production because the durability and reliability are not high.

Therefore, in manufacturing an organic light emitting device, it is desired to develop an organic light emitting device that is light and lightweight, can block moisture and oxygen, and has a flexible characteristic.

In order to solve the above problems, an object of the present invention is to manufacture a light weight and light organic light emitting device.

Another object of the present invention is to simplify the manufacturing cost and manufacturing process by eliminating the process of attaching the moisture absorbent.

Still another object of the present invention is to provide an organic light emitting device capable of improving durability and lifespan of an organic light emitting device by preventing moisture and oxygen infiltration.

Still another object of the present invention is to provide an organic electroluminescent device having a flexible characteristic and being transparent, which can be applied to a top emission type and a double side emission type.

In order to achieve the above object, a support substrate is laminated on a glass substrate and the upper and lower surfaces of the glass substrate, and the flexible support substrate has a thickness of 10 to 400 μm; An organic light emitting unit formed on one surface of the support substrate and including an organic light emitting layer between a pair of electrodes; And a flexible sealing substrate coupled to the support substrate and a sealing material so as to block the organic electroluminescent part from external air, wherein the sealing material is provided along an edge of the sealing substrate. An organic electroluminescent device is provided.

In another aspect, the present invention provides a flexible organic electroluminescent device, characterized in that the support is made of an optical film having a thickness of 10 ~ 200㎛.

In addition, the present invention is the optical film polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene sulfone (PES), transparent polyimide (PI), polyarylate (PAR), poly It provides an organic electroluminescent device utilizing a flexible display substrate, characterized in that at least one selected from the group consisting of cyclic olefin (PCO), crosslinked epoxy, crosslinked urethane film.

In another aspect, the present invention provides an organic electroluminescent device utilizing a flexible display substrate, characterized in that the intermediate adhesive layer between the glass substrate and the support is a urethane acrylate-based adhesive material which is an ultraviolet curable resin composition.

The present invention also provides an organic electroluminescent device utilizing a flexible display substrate further comprising a planarization layer functioning as a buffer layer between an upper surface of the support substrate and a lower surface of the organic light emitting unit.

In another aspect, the present invention provides an organic EL device utilizing a flexible display substrate, characterized in that the surface flatness (Ra) of the planarization layer is 0.5 to 5nm.

In another aspect, the present invention provides an organic EL device utilizing a flexible display substrate, characterized in that the sealing material is a thermosetting adhesive or a UV curing adhesive.

In another aspect, the present invention provides an organic light emitting device utilizing a flexible display substrate, characterized in that the sealing substrate is formed of the same material as the support substrate.

In another aspect, the present invention provides an organic EL device utilizing a flexible display substrate, characterized in that the inner space partitioned by the support substrate and the sealing substrate is filled with an inert gas of nitrogen, neon or argon. .

In another aspect, the present invention is an organic electroluminescence using a flexible display substrate, characterized in that the organic electroluminescent unit is sequentially stacked between the electrode layer and the electrode layer, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer Provide a device.

In another aspect, the present invention provides an organic light emitting device utilizing a flexible display substrate formed of the indium-ink oxide (IZO).

In another aspect, the present invention provides an organic electroluminescent device utilizing a flexible display substrate that can be formed as a top emission type or a double-sided emission type by forming the sealing substrate and the support substrate transparent.

The organic light emitting device according to the present invention has the effect of making the light emitting device light and thin by utilizing a lightweight and thin flexible display substrate.

In addition, the organic EL device according to the present invention has excellent moisture permeability due to the characteristics of the supporting substrate and the sealing substrate, so that the organic electroluminescent device can absorb moisture even without forming an absorbent, and thus the manufacturing process is simple because there is no process of attaching the absorbent.

In addition, the organic light emitting device according to the present invention has an excellent effect in improving the durability and lifespan of the organic light emitting device by forming a flexible display substrate as a transparent substrate to prevent moisture penetration.

In addition, since the sealing substrate and the support substrate have flexibility, the organic light emitting device according to the present invention can realize a flexible display, and since the sealing substrate is transparent, the organic light emitting device can be applied to the top emission type and the double side emission type. It is effective to provide.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. First, it should be noted that, in the drawings, the same components or parts have the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.

The terms " about ", " substantially ", etc. used to the extent that they are used herein are intended to be taken to mean an approximation to or in the numerical value of the manufacturing and material tolerances inherent in the meanings mentioned, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure.

The present invention relates to an organic light emitting device (OLED) using a flexible display substrate as a support substrate and a sealing substrate using flexible thin glass, and a support is laminated on the glass substrate and the upper and lower surfaces of the glass substrate. Flexible support substrate whose thickness is 10-400 micrometers; An organic light emitting unit formed on one surface of the support substrate and including an organic light emitting layer between a pair of electrodes; And a flexible sealing substrate coupled to the support substrate and a sealing material so as to block the organic electroluminescent part from external air, wherein the sealing material is provided along an edge of the sealing substrate. An organic electroluminescent device is featured.

First, the substrate used for the supporting substrate and the sealing substrate of the present invention will be described.

Glass is used for the substrate of the present invention, which is excellent in hardness and chemically very stable, has high heat resistance and resistance to reactive materials, and is excellent in transparency to light.

In gas permeability, moisture and oxygen attack all kinds of organic materials, causing chemical changes inside the display, shortening their lifespan. Glass is extremely poorly permeable to air and humidity, one of the key factors in display technology. The glass has a low transmittance because it has a very strong bond with oxygen and water. The transmittance values for oxygen and water in the glass plate are very low and difficult to measure. Therefore, oxygen and water hardly pass through the glass plate.

When the glass is used in a flat panel display, it is useful in the display industry because of its high heat resistance, transparency, and permeability, but when it is dropped, it is fragile and inflexible, and is relatively heavy so that there are many limitations in implementing a flexible display.

In order to utilize such glass as a flexible display substrate, light weight, light weight, and flexibility must be realized, and the problem of easily breaking must be solved, and the basic characteristics of the transmittance and optical properties of the existing flat panel display glass substrate must be satisfied. Therefore, the thin glass that can be used as the substrate of the flexible display having flexibility should be thin glass and maintain the properties of the existing glass substrate.

Glass used in the substrate of the present invention has been developed a technology that can be produced by etching the thickness of the glass to 10㎛ as the current technology, the present invention is intended to apply to a flexible display substrate using such ultra-thin glass.

1 is a cross-sectional view of a substrate used in an organic light emitting display device according to an embodiment of the present invention. In the substrate of the organic light emitting device according to FIG. 1, a thin glass 110 is formed between a pair of thin film optical films 130, and an urethane acryl as an ultraviolet curable resin composition as an intermediate adhesive layer 120 between the optical film 130 and the thin glass 110. Provided is a substrate laminated with a rate-based adhesive material.

The thin glass 110 is a glass having a thickness of 10 ~ 400㎛ prepared by using an etching technology and unlike the conventional glass has a feature that is flexible because it is flexible or bent or bent. The smaller the thickness of the glass, the more flexible it is but the more fragile it is. With the current technology, the technology to etch thin glass of 10㎛ has been developed. In addition, too thin laminated glass has a problem of being easily broken during the process. Moreover, when the thickness of thin glass exceeds 400 micrometers, it will become inflexible and will not bend or bend. Therefore, it is preferable that it is 10-400 micrometers, and, as for the thickness of the said thin glass, it is more preferable that it is 50-300 micrometers.

In addition, the thin glass 110 not only has excellent transparency, but also forms a barrier layer to block oxygen or moisture from the outside. In the case of high gas permeability such as oxygen or moisture through the substrate in relation to the barrier property, the material constituting the display element is affected by the transmitted oxygen or water, which shortens the lifespan and reduces the luminous efficiency. The quality of the product can depend on how good it is. As the thin glass is used as a flat panel display device, oxygen and water vapor permeability are measured, and as a result, excellent barrier properties and light transmittance can be obtained.

In the substrate of the present invention, the support laminated on the thin glass 110 is preferably a transparent optical film 130. The optical film may be implemented on both top and bottom surfaces of the thin glass 110 (see FIG. 1). By supporting the optical film as a support, the strength of the substrate becomes stronger, so that the glass does not easily break even when the glass is subjected to an external impact. In addition, more than 90% of the glass is damaged at the corners during the process, and the surface is laminated with the optical film. By manufacturing one substrate, glass strength is preserved. The thickness of the thin film optical film 130 is preferably set to 10 to 200㎛. When manufacturing the optical film 130 within the above range can maintain the flexible properties of the substrate as it is.

The optical film 130 used in the substrate of the present invention is polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene sulfone (PES), transparent polyimide (PI), polyarylate (PAR), polycyclic olefin (PCO), crosslinked epoxy, crosslinked urethane film may be used any one selected from the group consisting of.

Meanwhile, an adhesive layer 120 is formed between the thin glass 110 and the optical film 130. The material used as the adhesive layer 120 is a UV curable resin composition that uses a surface as a urethane acrylate-based adhesive material. It is preferable to process.

In addition, an adhesive layer 120 was formed between the thin glass 110 and the optical film 130. The material used as the adhesive layer 120 is a UV curable resin composition, which is treated with a urethane acrylate-based adhesive material. It is preferable.

Materials that can be used as the adhesive layer include acrylate adhesives, silicone adhesives, and epoxy adhesives, but silicone and epoxy adhesives require a long time to fully cure, resulting in low productivity. There is a disadvantage in that the adhesion between the films is poor. In addition, moisture permeation through the interface is easy to lower the crosslink density than the ultraviolet curable resin composition used in the present invention has a disadvantage in that the moisture permeation of the adhesive is also inferior.

Accordingly, the urethane acrylate-based adhesive material, which is an ultraviolet curable resin composition used as the adhesive layer of the present invention, has excellent adhesive strength due to the cohesion and toughness peculiar to urethane, and can maintain excellent adhesive strength even under high temperature and high humidity conditions. It has physical properties of moisture transmittance, and is excellent in transparency and high refractive index, which is effective for bonding thin layer adherends such as plastic films used as various optical members, and in particular, improves adhesion between optical films used in liquid crystal displays and the like. A stable flexible substrate can be manufactured.

In addition, the urethane acrylate-based adhesive material, which is an ultraviolet curable resin composition, can solve a problem of dimensional charge formed by thermal deformation or outgasing of a substrate as a solvent-free type.

The adhesive layer 120 may be applied to the thin glass 110 and / or the optical film 130, but may be manually performed in bonding the thin glass 110 and the optical film 130, but the lamination method is used as a non-limiting example of the present invention. do. Exemplary laminators have a pair of heatable rollers having adjustable pressure and moving at a fixed or adjustable speed, and the adhesive can be applied between both materials, and then passed between the rollers of the laminator after application. As such, when the laminating method is used, the thin glass 110 and the optical film 130 can be easily laminated without expensive equipment.

Flexible display substrate according to an embodiment of the present invention has a lightweight, thin, flexible feature, the thin glass of the flexible display substrate acts as a barrier (Barrier) to perform the function of the anti-diffusion film against moisture and oxygen from the outside There is a characteristic that can maintain the performance of the product and prolong the life, and also has excellent moisture absorption effect.

Next, an organic EL device utilizing the above-described flexible display substrate will be described.

The present inventors have conceived a flexible organic electroluminescent device using the above-mentioned flexible display substrate. Therefore, the organic light emitting device may be formed on the supporting substrate and the sealing substrate by utilizing the flexible display substrate.

2 is a cross-sectional view of an organic light emitting display device according to an embodiment of the present invention.

The organic light emitting device according to the preferred embodiment of the present invention includes a support substrate 210 having the above-mentioned flexible characteristics, an organic light emitting unit 240 formed on one surface of the support substrate, that is, the support substrate, and the organic The sealing substrate 220 is provided to be bonded to the support substrate 210 so as to block the electroluminescent unit from the outside air.

As mentioned above, the support substrate may be laminated on the glass substrate and the upper and lower surfaces of the glass substrate, and may be formed of a flexible substrate having a thickness of 10 to 400 μm.

In addition, the sealing substrate 220 is formed to be opposed to the support substrate is bonded, the sealing substrate 220 may be formed of the same material as the support substrate. Advantages of using the support substrate 210 and the sealing substrate 220 with the same material include: first, a flexible substrate is bonded to the organic light emitting device so that the organic light emitting device can have a flexible feature. Second, since the support substrate and the sealing substrate are formed of the same material, the thermal expansion coefficients of the support substrate and the sealing substrate are the same, so that the mechanical strength of the panel against temperature change can be improved. Third, by forming a sealing substrate with a substrate using glass, the panel can be thinner and lighter than in the case of employing a metal sealing substrate. Fourth, since the board | substrate which utilized glass has high surface smoothness compared with sealing substrates, such as a metal, it is hard to produce a gap in the interface with a sealing material, and adhesive force can be improved. Therefore, it is difficult for moisture or the like to invade from the outside, and the sealing performance can be improved.

Meanwhile, according to an exemplary embodiment of the present invention, a planarization layer functioning as a buffer layer may be formed on an upper surface of the support substrate. The flat layer may be obtained by partially hydrolyzing the composition for forming an organic or organic-inorganic hybrid layer to form a sol solution, and then coating and curing it on the support substrate 210 which is a transparent substrate. The coating method may be a method such as spin coating, roll coating, bar coating, dip coating, gravure coating, spray coating. The sol state curing method may be used, such as thermal curing, UV curing, infrared curing, high frequency heat treatment. The thickness after the flattening layer is cured is 0.1 µm to 50 µm, preferably 0.1 µm to 20 µm, and more preferably 0.1 µm to 10 µm. If the thickness is thinner than 0.1 μm, it is susceptible to pinhole defects, and later, a leakage current occurs, and when the thickness exceeds 50 μm, a crack phenomenon and There is a problem of surface irregularities formation.

In the present invention, the planarization layer serving as the buffer layer is important to have a surface flatness of roughness Ra. If the planarization layer is not flat, defects occur when the connection electrode and the organic light emitting layer on the planarization layer are deposited, and thus leak. Current is generated and the lifetime of the organic light emitting part is limited. Accordingly, in the present invention, the surface flatness of the flat layer is preferably 0.5 nm to 5 nm, and more preferably 0.5 to 1 nm, based on the stylus method. In addition, the organic material having a roughness of about 5 nm to 50 nm or a root-mean-square roughness (RMS value) in the maximum peak-to-valley roughness in the present invention. It is desirable to provide an electroluminescent device. In this case, the luminance is increased at the same voltage, thereby improving the quality of the organic light emitting device.

Meanwhile, referring to the organic light emitting unit, the organic light emitting unit 240 is formed of an electrode layer and an organic layer, the electrode layer supplying an anode electrode 241 for supplying holes and an electron. A cathode electrode 245 is disposed, and an organic light emitting layer 243 is disposed between the anode electrode 241 and the cathode electrode 245 to emit light. An anode electrode 241 is formed on the support substrate 210, an organic emission layer 243 is formed on the anode electrode 241, and a cathode electrode 245 is formed on the organic emission layer 243.

The anode electrode 241 may be formed as a transparent electrode, and may be formed of ITO, IZO, ZnO, or In ₂ O ₃ , and preferably, indium-zinc oxide (IZO) is used. The indium-zinc oxide (IZO) has a high conductivity in the atmospheric state, has excellent switching characteristics, and has an advantage of fast operating speed. In addition, the IZO can lower the process temperature compared to other materials, the process temperature of the IZO can be carried out at 80 ℃ or less.

An organic emission layer 243 may be formed on the anode 241, and a cathode electrode 245 may be formed on the organic emission layer 243. The cathode electrode 245 may be formed as a transparent electrode. Li, Ca, LiF / Ca, LiF / Al, Al, Mg, and compounds thereof are deposited to face the organic layer 243, and thereafter, ITO, IZO, and ZnO. Alternatively, the cathode electrode 245 may be formed by forming an auxiliary electrode or a bus electrode line with a transparent conductive material such as In ₂ O ₃ . It is preferable to use indium-zinc oxide (IZO) in the material, because the IZO can lower the process temperature compared to other materials, the process temperature of the IZO can be carried out at 80 ℃ or less.

The anode electrode 241 and the cathode electrode 245 may be formed in a predetermined pattern. In the case of an active emission type, the cathode electrode 245 may be deposited on the entire surface. However, the present invention is not limited thereto and may be patterned.

The organic light emitting layer 243 disposed between the anode electrode 241 and the cathode electrode 245 may be a low molecular or high molecular organic layer. When the low molecular organic layer is used, a hole injection layer (HIL) and a hole transport layer (HTL) are used. A transport layer (EML), an organic emission layer (EML), an electron injection layer (EIL), an electron injection layer (ETL) and the like may be formed by stacking a single or a composite structure, and these low molecular weight molecules may be formed. The organic layer may be formed by vacuum deposition.

In the case of the polymer organic layer, the structure may include a hole transporting layer (HTL) and a light emitting layer (EML). In this case, PEDOT is used as the hole transporting layer, and PPV (Poly-Phenylenevinylene) and polyfluorene are used as the light emitting layer. Polymer organic materials such as (Polyfluorene) are used and can be formed by screen printing or inkjet printing.

In the organic light emitting unit 240, as the anode and cathode voltages are applied to the anode electrode 241 and the cathode electrode 245, holes injected from the anode electrode 241 are moved to the light emitting layer, and electrons are injected from the cathode electrode 245 to the light emitting layer. In this light emitting layer, electrons and holes recombine to generate excitons, and as the excitons change from the excited state to the ground state, fluorescent molecules in the light emitting layer emit light to form an image. The light emitting layer has a light emitting layer formed of a three-layer structure by sequentially stacking light emitting layers implementing red (R), green (G), and blue (B), or a light emitting layer having a complementary color relationship. It may be formed in a single layer structure consisting of a light emitting layer to implement.

In addition, the support substrate 210 and the sealing substrate 220 may be bonded through the sealing material 250. The encapsulant 250 bonds the support substrate 210 and the encapsulation substrate 220 through a thermosetting adhesive or a UV curable adhesive, and may be positioned along an edge of the encapsulation substrate 220. The sealant 250 forms a sealant 250 in a width of 0.1 to 2 mm at an edge of the sealing substrate 220 in order to bond the supporting substrate 210 including the organic light emitting unit 240 to the sealing substrate 220. The sealant 250 may be formed by printing using a screen mask or by applying a sealant dispense or a syringe directly to a corresponding position. In one embodiment of the present invention was provided using a Nagase (XNR 5570) product as a UV (Ultra violate) curing adhesive provided in a rectangular frame shape installed on the outside of the light emitting area.

3 is a plan view of an organic light emitting display device according to an embodiment of the present invention. It can be seen that the sealing material is formed at the edge of the sealing substrate 220 in a rectangular frame shape.

On the other hand, the inner space partitioned by the support substrate 210 and the sealing substrate 220 is preferably formed in a vacuum or to fill the inert gas. The inert gas is preferably filled with a gas such as nitrogen, neon or argon. In particular, when the inert gas is filled, it is in a state capable of adequately protecting the penetration of oxygen and moisture.

The organic light emitting device has excellent moisture permeability due to the characteristics of the supporting substrate and the sealing substrate, so that the organic electroluminescent device can absorb moisture even without forming a moisture absorbent, and thus the manufacturing process is simple because there is no process of attaching the moisture absorbent.

In addition, the organic light emitting device according to the present invention can remove the moisture inside the seal without forming a moisture absorbent due to the excellent moisture absorption effect of the sealing substrate, the transparent substrate and the support substrate is formed as a front emission type or double-sided emission type It is possible to provide an organic light emitting device capable of forming.

Hereinafter, the physical properties of the flexible display substrate utilized for the supporting substrate and the sealing substrate will be described in detail.

Example 1

A thin glass having a thickness of 20 μm is prepared in a size of 100 mm × 100 mm, and a polyethylene terephthalate (PET) film having a thickness of 30 μm is coated with a urethane acrylate-based adhesive material which is an ultraviolet curable resin composition. The said film was bonded by the laminating method. The prepared substrate was produced by irradiating 1.5J / cm 2 to 2.0J / cm 2 of light of an ultraviolet lamp.

Examples 2 to 5

In the same manner as in Example 1, the thickness of the thin glass was 50 μm, 100, 200, 400 μm, respectively, and a polyethylene terephthalate (PET) film having a thickness of 100 μm was bonded to prepare a flexible display substrate.

Example 6

A 20 μm thick thin glass is prepared in a size of 100 mm × 100 mm, and a 30 μm thick polyethylene naphthalate (PEN) film is coated with a urethane acrylate adhesive material, which is an ultraviolet curable resin composition, on the upper surface of the thin glass. The film was bonded by the laminating method. The prepared substrate was produced by irradiating 1.5J / cm 2 to 2.0J / cm 2 of light of an ultraviolet lamp.

Examples 7-10

In the same manner as in Example 5, the thickness of the thin glass was 50 μm, 100, 200, 400 μm, respectively, and a polyethylene naphthalate (PEN) film having a thickness of 100 μm was bonded to prepare a flexible display substrate.

※ Analysis method

(1) Light transmittance: The transmittance was measured with a measuring instrument [Model: V-7100 UV / VIS / NIR Spectrophotometer].

(2) Measurement of oxygen permeability: The measurement of oxygen permeability was measured with a measuring instrument (model: OX-TRAN Model 2/21) manufactured by MOCON, USA under the condition of temperature 23 ° C. and humidity 90% RH.

(3) Measurement of water vapor permeability: The water vapor permeability was measured by a measuring instrument manufactured by MOCON, AQUATRAN W Model 1, under conditions of temperature 40 ° C. and humidity 90% RH.

The measurement results are as shown in the following [Table 1].

division Light transmittance (%) Oxygen Permeability
(cc / ㎡ / day) Water vapor transmission rate
(g / ㎡ / day) Example 1 91.4 0.005 0.0005 Example 2 91.4 0.005 0.0003 Example 3 91.3 0.004 0.0003 Example 4 91.2 0.005 0.0002 Example 5 91.2 0.004 0.0003 Example 6 90.4 0.005 0.0005 Example 7 90.1 0.003 0.0003 Example 8 90.1 0.005 0.0002 Example 9 89.7 0.004 0.0003 Example 10 89.5 0.003 0.0003

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. It will be clear to those who have knowledge of.

1 is a cross-sectional view illustrating a configuration of a flexible display substrate applied to a substrate of an organic light emitting display device according to an embodiment of the present invention.

2 is a cross-sectional view of an organic light emitting display device according to an embodiment of the present invention.

3 is a plan view of an organic light emitting display device according to an embodiment of the present invention.

Claims (12)

The support is laminated on the glass substrate and the upper and lower surfaces of the glass substrate, and is composed of an intermediate adhesive layer between the glass substrate and the support, wherein the intermediate adhesive layer is a urethane acrylate-based adhesive material which is an ultraviolet curable resin composition. A support substrate having a thickness of 10 to 400 µm and a support of 10 to 200 µm in thickness; An organic light emitting unit formed on one surface of the support substrate and including an organic light emitting layer between a pair of electrodes; And It includes a flexible sealing substrate coupled to the support substrate and a sealing material to block the organic electroluminescent unit from the outside air, The sealing material is provided along an edge of the sealing substrate, Organic electroluminescence using a flexible display substrate, characterized in that the optical transmittance of the support substrate is 89.5 ~ 91.4%, the oxygen transmittance is 0.002 ~ 0.005 g / ㎡ / day, and the water vapor transmission rate is 0.0002 ~ 0.0005 g / ㎡ / day Device. delete The method of claim 1 The support is polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene sulfone (PES), transparent polyimide (PI), polyarylate (PAR), polycyclic olefin (PCO) ), An organic electroluminescent device utilizing a flexible display substrate, characterized in that at least one selected from the group consisting of crosslinked epoxy, crosslinked urethane film. delete The method of claim 1, And a flattening layer functioning as a buffer layer between an upper surface of the support substrate and a lower surface of the organic light emitting unit. The method of claim 5, Surface flatness (Ra) of the planarization layer is an organic light emitting device utilizing a flexible display substrate, characterized in that 0.5 to 5nm. The method of claim 1, The sealing material is an organic electroluminescent device using a flexible display substrate, characterized in that the thermosetting adhesive or UV curing adhesive. The method according to any one of claims 1, 3 and 5, And the sealing substrate is formed of the same material as the support substrate. The method according to any one of claims 1, 3 and 5, The internal space partitioned by the support substrate and the sealing substrate is filled with an inert gas of any one of nitrogen, neon or argon, the organic light emitting device using a flexible display substrate. The method according to any one of claims 1, 3 and 5, The organic light emitting unit utilizes a flexible display substrate, in which a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked between an anode electrode, a cathode electrode, and the anode electrode and the cathode electrode. One organic electroluminescent device. The method according to any one of claims 1, 3 and 5, The organic light emitting device using a flexible display substrate, characterized in that the electrode layer in the organic light emitting layer is formed of indium-ink oxide (IZO). The method according to any one of claims 1, 3 and 5, The organic light emitting device is an organic light emitting device utilizing a flexible display substrate that can be formed of a top emission type or a double-sided emission type by forming the sealing substrate and the support substrate transparently.

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