KR100637182B1 - Flat display device and manufacturing method thereof - Google Patents

Abstract

The present invention is to provide a sealing structure that is simple in the manufacturing process, excellent in the function of blocking moisture and oxygen, and flexible, and includes a substrate, a light emitting element formed on the substrate, and a light emitting element bonded to the substrate. And a second encapsulation member for sealing the substrate, a first encapsulation member on which the substrate is seated, and an edge thereof joined to the first encapsulation member and covering the substrate and the encapsulation member. It is about.

Description

Flat display device and manufacturing method thereof

1 is an exploded perspective view of a flat panel display device according to an exemplary embodiment of the present invention;

FIG. 2 is a cross-sectional view of II of FIG. 1;

3 is a cross-sectional view illustrating an example of the image display unit of FIG. 1;

4 is a cross-sectional view illustrating another example of the image display unit of FIG. 1;

5 is a partially enlarged cross-sectional view of the second encapsulation member of FIG. 1;

6 is a cross-sectional view of a flat panel display device according to another exemplary embodiment of the present invention;

7 is a cross-sectional view of a flat panel display device according to another exemplary embodiment of the present invention;

8 is a cross-sectional view of a flat panel display device according to another exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

1: board | substrate 2: image display part

3: sealing member 4: first sealing member

5: second encapsulation member 51: matrix film

52: protective layer 6: FPC

71: first sealant 72: second sealant

73: bonding means

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display and a manufacturing method thereof, and more particularly, to a flat panel display having a sealing structure suitable for a flexible flat panel display and a method of manufacturing the same.

In general, a flat panel display such as an organic light emitting display, a TFT-LCD, and the like can be ultra-thin and flexible in view of driving characteristics, and thus many studies have been made.

In order to make the flat panel display device thin and flexible, a flexible substrate is used. In the past, a plastic substrate was mainly used as such a flexible substrate.

However, since flat panel display devices undergo very difficult process conditions such as an organic layer, a thin film transistor layer for driving, an electrode layer, or an alignment layer, the substrate may be deformed or processed by the process conditions. The thin film layers formed on the substrate are deformed, and there is a problem that the strength is also lower than that of the glass material.

In addition, when the plastic substrate is used in an organic light emitting display, it is difficult for the plastic substrate to effectively block the penetration of moisture or air.

In view of this point, a technique of coating a barrier layer for blocking the penetration of moisture or air to the plastic substrate is known.

For example, US Pat. Nos. 6,268,695 and 6,497,598 disclose organic electroluminescent display devices and methods for manufacturing the same, each of which employs a film via a ceramic layer of polymer layers as an encapsulation structure, and US Pat. An organic electroluminescent display device using a polymer layer and at least one inorganic layer as an encapsulation structure is disclosed. In addition, US Patent No. 6,522,067 also discloses an organic light emitting display device having at least one barrier layer and at least one polymer layer in an encapsulation structure, US Patent No. 6,548,912, at least one barrier layer and at least one A micro-electronic device having a polymer layer encapsulated is disclosed. In addition, US Pat. No. 6,570,325 discloses an organic light emitting display device having an encapsulation structure in which a barrier layer is interposed between buffer layers. U. S. Patent No. 6,573, 652 discloses a display device having an encapsulation structure of at least one barrier layer and at least one polymer layer.

However, when the barrier layer including the inorganic layer is directly applied to the sealing member of the flat panel display device, the barrier layer has a very low thickness and durability, and even when applied to a flexible plastic substrate, the process temperature is low and the process is difficult. have.

Therefore, there is a need for a new sealing structure that can be applied to a flexible flat panel display.

Meanwhile, Korean Patent Publication No. 2003-2946 discloses an organic electroluminescence sealing device by sealing and heating by using a plastic material as a seal cover without using an adhesive to seal the organic electroluminescent device. A device is disclosed. In this case, however, the process may be simply performed in the case of simply sealing by heating and pressing with a plastic material, but it is difficult to defend against the penetration of moisture and air with plastic alone, and thus has a limitation in life and durability.

US Patent Publication No. 2003/0027369 A1 uses an inorganic insulating film capable of preventing the transmission of oxygen and moisture when sealing a light emitting element, and a plastic film in which an organic insulating film having a lower internal stress than the inorganic insulating film is laminated inside. Disclosed is a method of manufacturing a light emitting device for vacuum sealing. By the way, when bending the plastic film in which the inorganic insulating film is formed in this way, a crack occurs in an inorganic insulating film and there exists a problem of the ability to prevent moisture and air penetration.

In Japanese Laid-Open Patent Publication No. 1993-144569, a thermoplastic hygroscopic film is laminated on the front and back surfaces of an electroluminescent element, the bonding cross section is heated and fused, the entire circumference of the electroluminescent element is encapsulated with the film, and this is again an envelope film. The manufacturing method of the electroluminescent element which seals with is disclosed. However, even in this case, there is a limit in that it is difficult to protect the penetration of moisture and air with a thermoplastic moisture absorbing film or an outer cover film and is difficult to apply to an organic electroluminescent device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a flat panel display device having a simple sealing process, excellent blocking function of water and oxygen, and having a flexible sealing structure and a method of manufacturing the same. .

In order to achieve the above object, the present invention, a substrate, a light emitting element formed on the substrate, a sealing member bonded to the substrate to seal the light emitting element, and the first sealing member on which the substrate is seated And a second sealing member whose edge is joined to the first sealing member and covers the substrate and the sealing member.

The present invention also provides a substrate, a light emitting element formed on the substrate, a sealing member bonded to the substrate to seal the light emitting element, a first sealing member on which the sealing member is seated, and an edge of the first sealing member. A flat panel display device is bonded to an encapsulation member and includes a second encapsulation member covering the substrate and the encapsulation member.

The present invention also provides a method for forming a light emitting device on a substrate, bonding a sealing member on the substrate to seal the light emitting device, and seating the substrate on a first sealing member. And arranging a second sealing member on the first sealing member to cover the substrate and the sealing member, and joining edges of the first sealing member and the second sealing member to each other. A method of manufacturing a display device is provided.

The present invention also provides a method of forming a light emitting device on a substrate, bonding the sealing member on the substrate to seal the light emitting device, mounting the sealing member on the first sealing member, and Disposing an encapsulation member on the first encapsulation member to cover the substrate and the encapsulation member; and bonding edges of the first encapsulation member and the second encapsulation member to each other. to provide.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a flat panel display device according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view of I-I of FIG. 1. The flat panel display device according to the exemplary embodiment of the present invention of FIGS. 1 and 2 may be an organic light emitting display device.

1 and 2, in an organic electroluminescent display device according to an embodiment of the present invention, an image display unit 2 including an organic electroluminescent element is formed on a substrate 1, and the image display unit 2 is formed. The sealing member 3 is bonded on the substrate 1 so that) is sealed against the outside air.

The image display unit 2 includes an organic electroluminescent element and becomes an area for implementing a predetermined image.

The organic electroluminescent element provided in the image display unit 2 can be applied in various forms, i.e., a passive matrix (PM) organic electroluminescent element of a simple matrix type, provided with a thin film transistor layer. Both active matrix (AM) organic electroluminescent devices can be applied.

First, FIG. 3 illustrates an example of a passive type (PM type) organic electroluminescent device. The first electrode layer 21 is formed in a stripe pattern on the substrate 1, and the first electrode layer 21 is formed. The organic layer 23 and the second electrode layer 24 are sequentially formed at the top of the. An insulating layer 22 may be further interposed between the lines of the first electrode layer 21, and the second electrode layer 24 may be formed in a pattern orthogonal to the pattern of the first electrode layer 21. .

The organic layer 23 may be a low molecular or polymer organic layer. When the low molecular organic layer is used, a hole injection layer (HIL), a hole transport layer (HTL), and an organic emission layer (EML) may be used. , Electron Transport Layer (ETL), Electron Injection Layer (EIL), etc. may be formed by stacking in a single or complex structure, and the usable organic materials may be copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N'-diphenyl-benzidine (N, N'-Di (naphthalene-1-yl) -N, N'-diphenyl-benzidine: NPB), Tris Various applications include, for example, tris-8-hydroxyquinoline aluminum (Alq3). These low molecular weight organic layers are formed by the vacuum deposition method.

In the case of the polymer organic layer, the structure may include a hole transporting layer (HTL) and a light emitting layer (EML). In this case, PEDOT is used as the hole transporting layer, and polyvinylvinylene (PPV) and polyfluorene are used as the light emitting layer. Polymer organic materials such as (Polyfluorene) are used and can be formed by screen printing or inkjet printing.

The first electrode layer 21 functions as an anode electrode, and the second electrode layer 24 functions as a cathode electrode. Of course, the polarities of the first electrode layer 21 and the second electrode layer 24 may be reversed.

In the case of the bottom emission type, the first electrode layer 21 may be formed of ITO which is a transparent electrode. In the case of the front-side invention type, the second electrode layer 24 may be provided as a transparent electrode. In this case, the second electrode layer 24 may be formed by forming a thin semi-permeable thin film made of metal such as Mg-Ag, and then depositing transparent ITO thereon.

4 illustrates an example of an AM type organic electroluminescent device. Each pixel of the image display portion 2 in Figs. 1 and 2 has a TFT structure as shown in Fig. 4 and an EL element which is a self-luminous element.

The TFT is not necessarily possible with the structure shown in FIG. 4, and the number and structure can be variously modified. The active driving organic electroluminescent device will be described in more detail as follows.

As can be seen in FIG. 4, the above-described TFT is provided on the substrate 1.

The TFT has an active layer 12 formed on the substrate 1, a gate insulating film 13 formed on the active layer 12, and a gate electrode 14 on the gate insulating film 13.

An inter-insulator 15 is formed on the gate electrode 14, and the source and drain regions of the active layer 12 are connected to the source electrode 16 and the drain electrode 17 through contact holes. It is formed to be in contact with.

A passivation film 18 made of an insulating material is formed on the source and drain electrodes 16 and 17, and a pixel definition film 19 is formed on the passivation film 18. The passivation film 18 may be formed in a single layer or a multilayer structure.

Although not shown in the drawings, at least one capacitor is connected to the TFT.

Meanwhile, the drain electrode 17 is connected to the first electrode layer 21 serving as an anode electrode of the organic light emitting diode. The first electrode layer 21 is formed on the passivation film 18, and an insulating pixel definition film 19 is formed thereon, and a predetermined opening is formed in the pixel definition film 19. After that, an organic electroluminescent element is formed.

The organic electroluminescent device emits red, green, and blue light according to the flow of current to display predetermined image information. The organic electroluminescent device is connected to the drain electrode 17 of the TFT and receives positive power therefrom. 21 and the second electrode layer 24 provided to cover all the pixels to supply negative power, and the organic layer 23 disposed between the first electrode layer 21 and the second electrode layer 24 to emit light. It consists of.

The first electrode layer 21 may be used as a reflective electrode, and after forming a reflective film with Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and the like, ITO, IZO, ZnO, or In 2 O 3 can be formed thereon.

The second electrode layer 24 may be provided as a transparent electrode, and a metal having a small work function, that is, Li, Ca, LiF / Ca, LiF / Al, Al, Mg, and a compound thereof, may face the organic layer 23. After the deposition, the auxiliary electrode layer or the bus electrode line may be formed on the transparent electrode forming material such as ITO, IZO, ZnO, or In 2 O 3.

The second electrode layer 24 is not necessarily deposited on the entire surface, but may be formed in various patterns. As described above, the first electrode layer 21 and the second electrode layer 24 may be stacked opposite to each other.

The structure of the TFT structure and the organic EL device as described above are not necessarily limited to the above embodiment, and embodiments of various structures are applicable.

Meanwhile, the substrate 1 on which the image display unit 2 is formed may be transparent or opaque. If the substrate 1 is transparent, a glass material or a plastic material may be used. If the substrate 1 is transparent, a glass material, a plastic material, or a metal material may be used. When the substrate 1 is transparent, light is emitted from the image display unit 2 in the direction of the substrate 1 and / or the sealing member 3, and when the substrate 1 is opaque, the light is emitted. The image display unit 2 emits light in the direction of the sealing member 3.

In a preferred embodiment of the present invention, the substrate 1 may be provided flexible. Therefore, it is preferable to use a plastic material as the substrate 1, but it is not limited thereto, and a thin glass material and a metal material may also be used.

In this case, when using a plastic material may be formed of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), or polyether sulfone (PES), but is not necessarily limited thereto. Of course.

In the case of the plastic substrate 1, as shown in Figs. 3 and 4 described above, the image display portion 2 must be formed on the substrate 1, thereby forming a protective layer that blocks the penetration of moisture and air. I never do that. Since this protective layer contains an inorganic material layer and is difficult to form, it is preferable not to form a protective layer on the board | substrate 1 in which the image display part 2 is formed directly.

The image display portion 2 is sealed by a sealing member 3, according to a preferred embodiment of the present invention, the sealing member 3 may be transparent or opaque. When the substrate 1 is transparent, both the transparent member and the opaque member can be used as the sealing member 3, and when the substrate 1 is opaque, the sealing member 3 is used only as the transparent member.

When the sealing member 3 is transparent, a glass material or a plastic material may be used, and when the sealing member 3 is opaque, a glass material, a plastic material, or a metal material may be used, which is preferable in the present invention as shown in FIGS. According to one embodiment, all are provided in a plate shape.

When the plastic member is used as the sealing member 3, a protective layer is not formed, as in the case of the substrate 1, but the present invention is not limited thereto, and the protective layer is formed on at least one surface thereof. The formed plastic substrate can be used. A detailed description of the protective layer will be described later.

On the other hand, the edge of the sealing member 3 is bonded to the substrate 1 by the first sealant 71. The first sealant 71 may be a thermosetting and / or ultraviolet curing adhesive, or a frit glass material.

Although not shown in the drawings, a moisture absorbent may be further provided in the space between the substrate 1 and the sealing member 3. Here, the moisture absorbent may be formed of barium oxide and / or calcium oxide as a material absorbing oxygen and moisture, and may also be formed of porous oxide. The porous oxide may be porous silica, hydrated amorphous alumina or a compound thereof, wherein at least one of bohemite (AlOOH) and bayerite (Al (OH) 3) may be used as a specific example of the hydrated amorphous alumina. Can be one. In addition to the moisture absorbent may be applied to any material that absorbs oxygen and moisture.

Meanwhile, terminals (not shown) electrically connected to the image display unit 2 are exposed at one end of the substrate 1, and FPC (Flexible Printed Circuit-board) 6 is bonded to the terminals. . The FPC 6 is connected with external electronic elements to supply power to the image display unit 2 and to supply various signals.

After forming the image display portion 2 on the substrate 1 and sealing it with the sealing member 3, and after bonding the FPC 6 to the terminals on the substrate 1, the substrate 1 It is seated on the first sealing member (4).

An adhesive means 73 is formed on the first encapsulation member 4, and the substrate 1 may be bonded to the adhesion means 73 and seated on the first encapsulation member 4. This adhesive means 73 can be a thermosetting and / or ultraviolet curable adhesive, and a double-sided adhesive tape can also be used. In addition, the adhesive means 73 may contain the moisture absorbent described above. Of course, only the moisture absorbent may be formed in place of the bonding means 73. This bonding means 73 does not necessarily need to be formed on the front surface of the first sealing member 4, and may be located at an outer position of the image display portion 2. In this case, since the light from the image display portion 2 does not pass through the bonding means 73, the image can be observed from the outside of the first sealing member 4 by using the first sealing member 4 as a transparent material. You can do that.

After the substrate 1 is seated on the first sealing member 4, the second sealing member 5 is bonded to the first sealing member 4.

The first sealing member 4 and the second sealing member 5 are joined to each other with a second sealant 72 interposed therebetween. As the second sealant 72, a thermosetting and / or ultraviolet curing adhesive may be used, and a frit glass material may be used.

The second sealant 72 is preferably applied to both the first sealing member 4 and the second sealing member 5 to be bonded. This is to ensure the sealing even in the part where the FPC 6 is drawn outward.

According to an exemplary embodiment of the present invention as shown in FIGS. 1 and 2, the first encapsulation member 4 may be provided flat, and the second encapsulation member 5 may be provided flexibly. Of course, the first encapsulation member 4 may also be formed of a flexible material. 1 and 2, the first encapsulation member 4 is flat, and the second encapsulation member 5 is joined to each other in a bent state to cover the substrate 1 and the sealing member 3. It is.

When the first encapsulation member 4 is made of a material having less flexibility, it may be formed of a glass material or a metal material.

As shown in FIG. 5, the second encapsulation member 5 may use the base film 51 having the protective layer 52 formed thereon.

According to a preferred embodiment of the present invention, a plastic film may be used as the base film 51.

In addition, the protective layer 52 may be a transparent blocking material may be used, but is not necessarily limited thereto. The protective layer 52 includes at least one inorganic layer 521, and the inorganic layer 521 includes metal oxide, metal nitride, and metal carbide. , Metal oxynitride and compounds thereof may be used. As the metal oxide, silica, alumina, titania, indium oxide, tin oxide, indium tin oxide, and compounds thereof may be used. Aluminum nitride, silicon nitride, and compounds thereof may be used as the metal nitride. Silicon carbide may be used as the metal carbide, and silicon oxynitride may be used as the metal oxynitride. In addition to the inorganic layer 521, silicon may be used, or ceramic derivatives of silicon and metal may be used. In addition, any inorganic material that can block the penetration of moisture and oxygen, such as diamond-like carbon (DLC) can be used.

On the other hand, such an inorganic layer 521 may be formed by vapor deposition, there is a limit that the voids provided in the inorganic layer 521 grows as it is when the inorganic layer 521 is vacuum deposited. Therefore, in order to prevent the voids from continuously growing in the same position, a polymer layer 522 is further provided in addition to the inorganic layer 521. The polymer layer 522 may be an organic polymer, an organic polymer, an organometallic polymer, a hybrid organic / inorganic polymer, or the like. .

This protective layer 52 does not necessarily need to be formed on the inner side of the base film 51 as shown in FIG. 5, and may be formed on the outer side as well.

Of course, the first encapsulation member 4 may also use a plastic film having a protective layer as shown in FIG. 5.

When the first sealing member 4 and the second sealing member 5 are formed of the same material as described above, the first sealing member 4 and the second sealing member 5 are joined by the second sealant 72. In addition to that, it can be joined by a thermocompression method. In other words, the protective layer 52 is not partially formed in the first and second sealing members 4 and 5, and this part is heat-compressed. This hot pressing is preferably performed at the portion joined to the FPC 6 because it can be joined to the FPC 6 in accordance with the hot pressing.

When the first and second sealing members 4 and 5 are used as the plastic base film 51 having the protective layer 52 in this way, the protective layer 52 may be formed in a separate process, and thus the process is simple. In addition, the process of forming the protective layer 52 may also be simplified. In addition, since the first and second encapsulation members 4 and 5 are not excessively bent, there is no fear that the inorganic layer 521 of the protective layer 52 may be damaged, thereby further increasing the effect of blocking moisture and outside air. have.

The structure of the first and second sealing members 4 and 5 as described above may be variously applied.

When light from the image display portion 2 emits light in the direction of the substrate 1, only the first sealing member 4 needs to be transparent, and the second sealing member 5 need not be transparent. Therefore, in this case, the second sealing member 5 may be formed of a metal material. For example, in the structure shown in FIG. 5, the metal foil of aluminum or SUS material is used as the base film 51, and an insulating film can be formed and used as the protective layer 52 here. In this case, the first encapsulation member 4 may use a glass material.

When light from the image display portion 2 emits light in the direction of the sealing member 3, only the second sealing member 5 needs to be transparent, and the first sealing member 4 need not be transparent. Therefore, in this case, the first sealing member 4 can be formed to have the base film of the metal foil as described above, and the second sealing member 5 can be formed of the glass material.

When the first and second encapsulation members 4 and 5 are formed as described above, the flexible flat panel display device can be implemented with a simple structure.

On the other hand, when the first sealing member 4 and the second sealing member 5 are joined, the inside thereof may be in a vacuum state or the inert gas may be filled.

To this end, when joining the first sealing member 4 and the second sealing member 5, this is done in a chamber in which a predetermined vacuum atmosphere is maintained, whereby the first sealing member 4 and the second sealing member 5 are formed. The space between the can be a vacuum atmosphere, and the process is performed while inert gas is injected into the upper chamber so that the space between the first sealing member 4 and the second sealing member 5 is filled with the inert gas. can do.

It may also proceed in the following way.

First, the second sealant 72 is applied to the edges of the first sealing member 4 and the second sealing member 5, and then, among the edges of the first sealing member 4 and the second sealing member 5. Join at least a portion to open. Thereafter, the space between these first and second sealing members 4 and 5 is exhausted, and in this state, the above opened portion is joined. In this case, there is a disadvantage in that the bonding process should be performed twice, but there is an advantage that the process can be performed more easily.

Similarly, in the case of filling the inert gas, at least part of the edges of the first sealing member 4 and the second sealing member 5 is opened, and then, the inert gas is put into the upper space, and the opened portions are joined. I can do it.

On the other hand, the sealing member 3 according to the present invention, as in the above-described embodiment, as well as formed of a plate-like member, as can be seen in Figure 6, may be formed into a film.

In another preferred embodiment of the present invention, the sealing member 3 on the film may be provided with at least one inorganic layer and at least one polymer layer, which is provided with a protective layer provided on the above-mentioned plastic film. The same can be formed. This is described as follows.

As the inorganic layer forming the film-like sealing member 3, a transparent blocking material may be used, but is not necessarily limited thereto. As the inorganic layer, metal oxide, metal nitride, metal carbide, metal oxynitride and compounds thereof may be used. As the metal oxide, silica, alumina, titania, indium oxide, tin oxide, indium tin oxide, and compounds thereof may be used. Aluminum nitride, silicon nitride, and compounds thereof may be used as the metal nitride. Silicon carbide may be used as the metal carbide, and silicon oxynitride may be used as the metal oxynitride. In addition to the inorganic layer, silicon may be used, or ceramic derivatives of silicon and metal may be used. In addition, any inorganic material that can block the penetration of moisture and oxygen, such as diamond-like carbon (DLC) can be used.

In addition to the inorganic layer, a polymer layer may be further provided. The polymer layer may be an organic polymer, an organic polymer, an organometallic polymer, a hybrid organic / inorganic polymer, or the like.

The structure of the film-like sealing member 3 as described above can be variously applied in addition to this. In the present invention, the sealing member 3 is preferably formed in a thin film in order to realize an ultra-thin shape, and any one may be applied as long as it can form the opposite film of the thin film in addition to the structures of the inorganic material layer and the polymer layer. .

7 is a cross-sectional view for explaining another preferred embodiment of the present invention, in which the substrate 1 is seated on the second encapsulation member 5.

At this time, since the second encapsulation member 5 is provided with flexibility, the second encapsulation member 5 is disposed in a frame capable of bending the second encapsulation member 5 in a shape as shown in FIG. The first sealing member 4 may be bonded to the substrate 1 in the above state. In this case, since the second sealing member 5 is bent in advance, it is easier to position the mounting position of the substrate 1. Since other components are the same as described above, detailed description thereof will be omitted.

FIG. 8 is a cross-sectional view for explaining another preferred embodiment of the present invention, in which the substrate 1 is mounted on the second sealing member 5. As the sealing member 3, as shown in FIG. The member was used. Since other components are the same as described above, detailed description thereof will be omitted.

The present invention described above is not necessarily applied only to an organic light emitting display device, but may be applied to various flat panel display devices such as a liquid crystal display, an inorganic electroluminescent display, and an electron emission display.

According to the present invention made as described above, the following effects can be obtained.

First, the manufacturing process of the ultra-thin and flexible flat panel display can be simplified.

Second, it is possible to be flexible while increasing moisture permeability and air permeability.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary and will be understood by those of ordinary skill in the art that various modifications and variations can be made therefrom.

Claims (29)

Board; A light emitting element formed on the substrate; A sealing member bonded to the substrate to seal the light emitting element; A first encapsulation member on which the substrate is mounted; And And a second sealing member whose edge is joined to the first sealing member and covers the substrate and the sealing member. Board; A light emitting element formed on the substrate; A sealing member bonded to the substrate to seal the light emitting element; A first sealing member on which the sealing member is seated; And And a second sealing member whose edge is joined to the first sealing member and covers the substrate and the sealing member. The method according to claim 1 or 2, The first encapsulation member is provided to be flat, and the second encapsulation member is provided to be flexible. The method according to claim 1 or 2, And the first sealing member is provided to be flexible. The method according to claim 1 or 2, And at least one of the first sealing member and the second sealing member is a plastic film including an inorganic layer. The method of claim 5, The inorganic layer may be silicon, metal oxide, metal nitride, metal carbide, metal oxynitride, metal oxynitride, ceramic derivatives of silicon, ceramic derivatives of metal, diamond diamond -like carbon) and a compound thereof. The method of claim 5, The plastic film further includes a polymer layer, wherein the polymer layer is an organic polymer, an organic polymer, an organometallic polymer, and a hybrid organic / inorganic polymer. Flat panel display, characterized in that provided with at least one of inorganic polymer. The method according to claim 1 or 2, And the first encapsulation member or the second encapsulation member includes a metal plate member or a glass member. The method of claim 1, And a bonding means is interposed between the substrate and the first encapsulation member. The method of claim 1, And a hygroscopic means interposed between the substrate and the first encapsulation member. The method of claim 2, And a bonding means is interposed between the sealing member and the first sealing member. The method of claim 2, And a hygroscopic means interposed between the sealing member and the first sealing member. The method according to claim 1 or 2, And the substrate is a glass material, a plastic material, or a metal material. The method according to claim 1 or 2, And the sealing member is provided in a plate shape. The method according to claim 1 or 2, And the sealing member is provided in the form of a film. Forming a light emitting element on the substrate; Bonding a sealing member on the substrate to seal the light emitting device; Mounting the substrate on a first encapsulation member; Disposing a second sealing member on the first sealing member to cover the substrate and the sealing member; And And joining edges of the first encapsulation member and the second encapsulation member to each other. Forming a light emitting element on the substrate; Bonding a sealing member on the substrate to seal the light emitting device; Mounting the sealing member on a first sealing member; Disposing a second sealing member on the first sealing member to cover the substrate and the sealing member; And And joining edges of the first encapsulation member and the second encapsulation member to each other. The method according to claim 16 or 17, Bonding the edges of the first sealing member and the second sealing member to each other, Applying an adhesive to edges of the first sealing member and the second sealing member; Bonding each other such that at least some of edges of the first sealing member and the second sealing member are opened; Exhausting a space between the first sealing member and the second sealing member; And And joining the opened portions of the edges of the first encapsulation member and the second encapsulation member to each other. The method according to claim 16 or 17, Bonding the edges of the first sealing member and the second sealing member to each other, Applying an adhesive to edges of the first sealing member and the second sealing member; Bonding each other such that at least some of edges of the first sealing member and the second sealing member are opened; Injecting an inert gas into a space between the first sealing member and the second sealing member; And And joining the opened portions of the edges of the first encapsulation member and the second encapsulation member to each other. The method according to claim 16 or 17, Bonding the edges of the first sealing member and the second sealing member to each other, Applying an adhesive to edges of the first sealing member and the second sealing member; Making a space between the first encapsulation member and the second encapsulation member into a vacuum atmosphere; And And bonding the edges of the first encapsulation member and the second encapsulation member coated with the adhesive to each other. The method according to claim 16 or 17, Bonding the edges of the first sealing member and the second sealing member to each other, Applying an adhesive to edges of the first sealing member and the second sealing member; Allowing the space between the first sealing member and the second sealing member to be an inert gas atmosphere; And And bonding the edges of the first encapsulation member and the second encapsulation member coated with the adhesive to each other. The method according to claim 16 or 17, Before mounting the sealing member on the first sealing member, And forming an adhesive means on a surface on which the sealing member of the first sealing member is to be seated. The method according to claim 16 or 17, Before mounting the sealing member on the first sealing member, And forming a moisture absorbing means on a surface on which the sealing member of the first sealing member is to be seated. The method according to claim 16 or 17, The first encapsulation member is provided to be flat, and the second encapsulation member is provided to be flexible. The method according to claim 16 or 17, And the first encapsulation member is provided to be flexible. The method according to claim 16 or 17, And at least one of the first encapsulation member and the second encapsulation member is a plastic film including an inorganic layer. The method of claim 26, The inorganic layer may be silicon, metal oxide, metal nitride, metal carbide, metal oxynitride, metal oxynitride, ceramic derivatives of silicon, ceramic derivatives of metal, diamond diamond -like carbon) and a method for manufacturing a flat panel display device characterized in that provided with at least one of these compounds. The method of claim 26, The plastic film further comprises a polymer layer, wherein the polymer layer is an organic polymer, an organic polymer, an organometallic polymer, and a hybrid organic / inorganic polymer. Method for manufacturing a flat panel display device characterized in that provided with at least one of an inorganic polymer. The method according to claim 16 or 17, The first encapsulation member or the second encapsulation member includes a metal plate member or a glass member.

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