KR20100009058A - Organic light emitting display apparatus and method of manufacturing thereof - Google Patents

Abstract

PURPOSE: An organic light emitting display device and a manufacturing method thereof are provided to improve impact resistance by filling a filler with the same thickness as the thickness difference between a sealant and a display unit. CONSTITUTION: A display unit(200) is arranged on a substrate(100). The display unit includes a light emitting region and a non-light emitting region. An encapsulation substrate(300) is arranged on the display unit. The substrate and the encapsulation substrate are bonded with a sealant(410). A filler(420) is interposed between the substrate and the encapsulation substrate. The filler is filled in the encapsulation substrate. The thickness of the filler is equal to the thickness difference between the sealant and the display unit.

Description

Organic light emitting display apparatus and method for manufacturing the same

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device and a method of manufacturing the same is prevented from the penetration of external impurities such as oxygen or moisture.

Recently, display devices have been replaced by portable thin flat display devices. Among the flat panel display devices, the electroluminescent display device is a self-luminous display device, and has attracted attention as a next generation display device because of its advantages of wide viewing angle, excellent contrast, and fast response speed. In addition, the organic light emitting display device in which the light emitting layer is formed of an organic material has excellent luminance, driving voltage, and response speed, and may be multicolored, as compared with the inorganic light emitting display device.

1 is a cross-sectional view schematically illustrating a conventional organic light emitting display device. Referring to FIG. 1, a display unit 20 is provided on a substrate 10, and an encapsulation substrate 30 is provided on the display unit 20. The substrate 10 and the encapsulation substrate 30 are bonded to the sealant 41.

The flat panel display device, particularly the organic light emitting device, included in the flat panel display device has a deterioration due to internal factors such as deterioration of the light emitting layer by oxygen from ITO used as an electrode, deterioration due to reaction between the light emitting layer and the interface, and external moisture, Deterioration easily occurs due to external factors such as oxygen, ultraviolet rays, and fabrication conditions of the device. In particular, the packaging of the organic light emitting device is very important because the external oxygen and moisture have a fatal effect on the life of the device.

However, in the conventional organic light emitting display device as illustrated in FIG. 1, impurities such as oxygen or moisture from the outside penetrate into the inside through the sealant 41 that bonds the substrate 10 and the encapsulation substrate 30. There was a problem that can damage the display unit 20. In addition, since only a part of the sealed area of the encapsulation substrate 30 is in contact with the sealant 41, there is a problem in that an external impact is concentrated on the sealant 41 and peeling or cell breakage occurs.

In order to solve this problem, a method of further including a filler (not shown) has been developed between the substrate 10 and the encapsulation substrate 30.

However, when a highly viscous material is used as the filler, it is not easy to fill the filler in the uneven portion of the organic light emitting element of the display unit 20. On the contrary, when a material having a small viscosity is used as the filler, the filler spreads rapidly under high vacuum, so that the sealant 41 is contaminated and peeling failure occurs.

In addition, since the filler is charged on the substrate 10 side on which the uneven structure of the display unit 20 is formed, the filling of the filler is not easy, and the display unit 20 is heated by pressure and the like during the filling process. There was a risk of breakage.

The present invention has been made to solve various problems including the above problems, and an object of the present invention is to provide an organic light emitting display device and a method of manufacturing the same, which are resistant to external shocks and are easy to manufacture.

The present invention, a substrate; A display unit disposed on the substrate; An encapsulation substrate disposed on the display unit; A sealant bonding the substrate to the encapsulation substrate; And a filler provided between the substrate and the encapsulation substrate, wherein the filler is provided on the encapsulation substrate side by a difference between the thickness of the sealant and the thickness of the display unit.

In the present invention, the display unit includes a plurality of light emitting regions for emitting light and a non-light emitting region protruding from the light emitting region between the plurality of light emitting regions, wherein the thickness of the display unit is non-light emitting. The thickness of the area can be.

In the present invention, the filler may be filled in the space from the region of the display portion that most protrudes from the substrate to the encapsulation substrate.

In the present invention, the filler may be formed to contact the area of the display portion most protruding from the substrate.

In the present invention, the filler may be provided to fill the space between the substrate and the encapsulation substrate.

In the present invention, the filler may be provided to cover the display unit.

According to another aspect of the present invention, there is provided a method including forming a display unit on one surface of a substrate; Forming a sealant on one surface of the encapsulation substrate; Filling a filler into the sealant of the encapsulation substrate; Disposing the encapsulation substrate on the substrate; And bonding the substrate and the sealing member through the sealant.

In the present invention, in the filling of the filler inside the sealant of the encapsulation substrate, the filler may be filled by a difference between the thickness of the sealant and the thickness of the display unit.

In the present invention, the display unit includes a plurality of light emitting regions for emitting light and a non-light emitting region protruding from the light emitting region between the plurality of light emitting regions, wherein the thickness of the display unit is non-light emitting. May be the thickness of the region.

In the present invention, when the substrate and the sealing member are bonded through the sealant, the filler may be provided between the encapsulation substrate and the non-light emitting region.

In the present invention, when the substrate and the sealing member are bonded through the sealant, the filler may not be filled in the light emitting region.

According to the organic light emitting display device and the manufacturing method of the present invention made as described above, it is possible to obtain the effect of being strong against the impact from the outside and at the same time easy to manufacture.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view schematically illustrating a part of an organic light emitting display device according to an exemplary embodiment of the present invention, and FIG. 3 is a cross-sectional view schematically showing the organic light emitting display device of FIG. 2. For reference, FIG. 2 illustrates a structure in which the encapsulation substrate 300 illustrated in FIG. 3 is removed.

Referring to the drawings, the display unit 200 is provided on the substrate 100 as an organic light emitting device.

The substrate 100 may be made of a transparent glass material mainly containing SiO ₂ . The substrate 100 is not necessarily limited thereto, and may be formed of a transparent plastic material. The plastic material forming the substrate 100 may be an insulating organic material, and may be polyethersulphone (PES), polyacrylate (PAR, polyacrylate), polyetherimide (PEI), polyethylene naphthalate (PEN, polyethyelenen). napthalate, polyethylene terephthalate (PET, polyethyeleneterepthalate), polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC), cellulose It may be an organic material selected from the group consisting of cellulose acetate propionate (CAP).

When the image is a bottom emission type implemented in the direction of the substrate 100, the substrate 100 should be formed of a transparent material. However, when the image is a top emission type implemented in the opposite direction of the substrate 100, the substrate 100 does not necessarily need to be formed of a transparent material. In this case, the substrate 100 may be formed of metal. When the substrate 100 is formed of metal, the substrate 100 may include at least one selected from the group consisting of carbon, iron, chromium, manganese, nickel, titanium, molybdenum, stainless steel (SUS), Invar alloy, Inconel alloy, and Kovar alloy. It may include, but is not limited thereto. The substrate 100 may be formed of a metal foil.

Although not shown, a buffer layer (not shown) may be further provided on the upper surface of the substrate 100 to block smoothness of the substrate 100 and penetration of impurities.

As such, the substrate 100 having the display unit 200 is bonded to the encapsulation substrate 300 disposed on the display unit 200. The encapsulation substrate 300 may also use various plastic substrates such as acryl as well as glass substrates, and may further use metal plates.

The substrate 100 and the encapsulation substrate 300 are bonded by the sealant 410. The sealant 410 may be one commonly used, such as sealing glass frit.

Meanwhile, the filler 420 is provided inside the sealant 410, and more specifically, the filler 420 is provided to fill a space between the substrate 100 and the encapsulation substrate 300.

As described above, in the conventional organic light emitting display device, there is a problem that impurities such as oxygen or moisture may penetrate into the inside and damage the display unit through a sealant bonding the substrate and the encapsulation substrate together. In addition, since only a part of the sealed area of the encapsulation substrate is in contact with the sealant, there is a problem in that external impact is concentrated on the sealant and peeling or cell breakage occurs. In order to solve this problem, a method for further providing a filler between the substrate and the encapsulation substrate has been developed. However, when a highly viscous material is used as the filler, it is not easy to fill the filler in the uneven portion of the organic light emitting element of the display part. On the contrary, when the small viscous material is used as the filler, the filler spreads quickly under high vacuum. There was a problem of contamination. Furthermore, since the filler is filled on the substrate side on which the uneven structure display part is formed, there is a risk that the display part may be damaged due to heat and pressure during the filling process while not being easy to fill.

In order to solve this problem, the present invention is characterized in that the filler 420 is filled by the difference between the thickness of the sealant 410 and the thickness of the display unit 200.

In more detail, as shown in FIGS. 2 and 3, the display unit 200 forms a predetermined uneven structure. (The configuration of the display unit will be described in detail with reference to FIG. 4). The filler 420 provided to fill the space between the substrate 100 and the encapsulation substrate 300 is in contact with an upper portion of the uneven structure, that is, an area of the display portion 200 protruding most from the substrate 100. It is formed to. In other words, the filler 420 is filled in the space between the convex portion and the encapsulation substrate 300 among the uneven portions of the display portion 200, and is not filled in the concave portion among the uneven portions of the display portion 200.

That is, the filler 420 is filled to the sealing substrate 300 side with a predetermined thickness. The predetermined thickness is substantially the same as the difference between the thickness of the sealant 410 and the thickness of the display unit 200. Therefore, the filler 420 is formed to contact the convex portion of the uneven portion of the display unit 200.

In this way, the filler 420 is filled on the side of the encapsulation substrate 300 with a predetermined thickness, that is, the same thickness as the difference between the thickness of the sealant 410 and the thickness of the display portion 200, thereby being resistant to external shocks. The effect which manufacture becomes easy can be acquired.

As the filler 420, an organic material, an inorganic material, an organic / inorganic composite material, or a mixture thereof may be used.

As the organic material, at least one selected from the group consisting of acrylic resins, methacryl resins, polyisoprene, vinyl resins, epoxy resins, urethane resins and cellulose resins may be used. In this case, for example, butyl acrylate and ethylhexyl acrylate may be used as the acrylic resin, and as methacryl resin, for example, propylene glycol methacrylate, tetrahydrofurfree methacrylate may be used, and vinyl based. As the resin, for example, vinyl acetate, N-vinylpyrrolidone and the like can be used. As the epoxy resin, for example, cycloaliphatic epoxide, etc., for the urethane resin, for example urethane acrylate, etc., and for the cellulose resin, For example, cellulose nitrate or the like can be used.

As the inorganic material, a metal oxide may be used as a metal or nonmetallic material such as silicon, aluminum, titanium, zirconium, or the like. For example, one or more selected from the group consisting of titania, silicon oxide, zirconia, alumina, and presucker thereof may be used. .

The organic / inorganic composite binder is a material in which metals, non-metallic materials such as silicon, aluminum, titanium, zirconium, and the organic material are covalently connected. For example, one or more selected from the group consisting of an epoxy silane or a derivative thereof, a vinyl silane or a derivative thereof, an amine silane or a derivative thereof, a methacrylate silane or a result of a partial curing reaction thereof can be used. Specific examples of the epoxy silane or its derivatives include 3-glycidoxypropyltrimethoxysilane or a polymer thereof. Specific examples of the vinyl silane or derivatives thereof include vinyltriethoxysilnae or polymers thereof. In addition, specific examples of the aminesilane or derivatives thereof include 3-aminopropyltriethoxysilnae and polymers thereof, and specific examples of methacrylate silane or derivatives thereof include 3-tri (methoxy). Silyl) propyl acrylate {3- (Trimethoxysilyl) propyl acrylate} and polymers thereof.

According to the present invention as described above, it is possible to obtain an effect of being strong against impact from the outside and facilitating manufacture.

4 is a cross-sectional view schematically illustrating a part of the organic light emitting display device of FIG. 2 and illustrates a specific configuration of the display unit 200.

Referring to FIG. 4, a plurality of thin film transistors 220 are provided on a substrate 100, and an organic light emitting element 230 is provided on the thin film transistors 220. The organic light emitting element 230 faces the pixel electrode 231 electrically connected to the thin film transistor 220, the counter electrode 235 disposed over the entire surface of the substrate 100, and the pixel electrode 231. An intermediate layer 233 is disposed between the electrodes 235 and includes at least a light emitting layer.

On the substrate 100, a thin film transistor 220 including a gate electrode 221, a source electrode and a drain electrode 223, a semiconductor layer 227, a gate insulating layer 213, and an interlayer insulating layer 215 is provided. Of course, the thin film transistor 220 is not limited to the form shown in FIG. 5, and various thin film transistors such as an organic thin film transistor having the semiconductor layer 227 as an organic material and a silicon thin film transistor having silicon may be used. A buffer layer 211 formed of silicon oxide or silicon nitride may be further provided between the thin film transistor 220 and the substrate 100 as necessary.

The organic light emitting diode 230 includes a pixel electrode 231 and a counter electrode 235 which are opposed to each other, and an intermediate layer 233 made of an organic material interposed between the electrodes. The intermediate layer 233 includes at least a light emitting layer and may include a plurality of layers. These layers will be described later.

The pixel electrode 231 functions as an anode electrode, and the counter electrode 235 functions as a cathode electrode. Of course, the polarities of the pixel electrode 231 and the counter electrode 235 may be reversed.

The pixel electrode 231 may be provided as a transparent electrode or a reflective electrode. When provided as a transparent electrode may be formed of ITO, IZO, ZnO or In ₂ O ₃ , when provided as a reflective electrode, Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or their A reflective film formed of a compound or the like and a film formed of ITO, IZO, ZnO, or In ₂ O ₃ can be provided thereon.

The counter electrode 235 may also be provided as a transparent electrode or a reflective electrode. When the counter electrode 235 is provided as a transparent electrode, Li, Ca, LiF / Ca, LiF / Al, Al, Mg, or a compound thereof may be opposed to the pixel electrode 231. And an auxiliary electrode or bus electrode line formed of a film deposited to face the intermediate layer 233 between the electrodes 235 and a transparent electrode forming material such as ITO, IZO, ZnO, or In ₂ O ₃ . . And, when provided as a reflective electrode can be provided by depositing Li, Ca, LiF / Ca, LiF / Al, Al, Mg or a compound thereof.

The pixel defining layer 219 may be formed to cover the edge of the pixel electrode 231 and to have a thickness outside the pixel electrode 231. In addition to defining the emission region, the pixel defining layer 219 widens the distance between the edge of the pixel electrode 231 and the counter electrode 235 to prevent a phenomenon in which an electric field is concentrated at the edge of the pixel electrode 231. As a result, a short circuit between the pixel electrode 231 and the counter electrode 235 is prevented.

Various intermediate layers 233 including at least a light emitting layer are provided between the pixel electrode 231 and the counter electrode 235. The intermediate layer 233 may be formed of low molecular weight organic material or high molecular weight organic material.

When using low molecular weight organic materials, hole injection layer (HIL), hole transport layer (HTL), organic emission layer (EML), electron transport layer (ETL), electron injection layer (EIL) The electron injection layer may be formed by stacking a single or complex structure, and the usable organic materials may be copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N '-Diphenyl-benzidine (N, N'-Di (naphthalene-1-yl) -N, N'-diphenyl-benzidine: NPB), tris-8-hydroxyquinoline aluminum ( Alq3) can be used in various ways. These low molecular weight organic materials may be formed by a method such as vacuum deposition using masks.

In the case of the polymer organic material, the structure may include a hole transporting layer (HTL) and a light emitting layer (EML). In this case, PEDOT is used as the hole transporting layer, and PPV (Poly-Phenylenevinylene) and polyfluorene are used as the light emitting layer. Polymer organic materials such as (Polyfluorene) are used.

The organic light emitting element 230 is electrically connected to the thin film transistor 220 below. When the planarization film 217 covering the thin film transistor 220 is provided, the organic light emitting element 230 is a planarization film ( The pixel electrode 231 of the organic light emitting element 230 is electrically connected to the thin film transistor 220 through a contact hole provided in the planarization layer 217.

On the other hand, the organic light emitting element 230 formed on the substrate is sealed by the encapsulation substrate 300. The encapsulation substrate 300 may be formed of various materials such as glass or plastic as described above.

On the other hand, a filler 420 is provided between the organic light emitting element 230 and the encapsulation substrate 300 to fill the space between the organic light emitting element 230 and the encapsulation substrate 300 to prevent peeling or cell breakage. do.

In the above structure, the sealant 410 is provided along the edge of the encapsulation substrate 300 or to cover the display unit 200, and the filler 420 is disposed along the inner surface of the sealant 410. do.

Here, the display unit 200 forms a predetermined concave-convex structure. That is, the light emitting region in which the pixel electrode 231 is located corresponds to the concave portion of the uneven structure. The region where the pixel defining layer 219 is disposed to cover the edge of the pixel electrode 231 and have a thickness outside the pixel electrode 231, that is, the non-light emitting region corresponds to the convex portion of the uneven structure.

Therefore, in the present invention, the filler 420 is filled by the difference between the thickness of the sealant 410 and the thickness of the display 200, wherein the thickness of the display 200 is a region in which the pixel defining layer 219 is located. It becomes the thickness of the phosphorescent non-emitting region. In other words, the filler 420 is formed to contact the non-light emitting area corresponding to the convex portion of the uneven structure from the encapsulation substrate 300, and is not filled in the light emitting area of the display unit 200.

According to the present invention as described above, it is possible to obtain an effect of being strong against impact from the outside and facilitating manufacture.

5A through 5E are schematic cross-sectional views sequentially illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

5A to 5E, the method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present disclosure may include forming a display unit on one surface of a substrate, forming a sealant on one surface of an encapsulation substrate, and the encapsulation substrate. Filling the inside of the sealant of the substrate; placing the encapsulation substrate on the upper side of the substrate; and bonding the substrate and the sealing member through the sealant.

First, as shown in FIG. 5A, the display unit 200 is formed on one surface of the substrate 100. Here, as the substrate 100, not only a glass substrate but also various plastic substrates such as acrylic may be used, and further, a metal plate may be used. The substrate 100 may further include a buffer layer (not shown) as necessary. As described above, the display unit 200 includes a plurality of light emitting regions in which light is emitted and a non-light emitting region protruding from the light emitting regions between the plurality of light emitting regions, thereby providing a predetermined uneven structure. It is formed to achieve.

Next, as shown in FIG. 5B, an encapsulation substrate 300 is prepared, and a sealant 410 is formed on one surface of the encapsulation substrate 300. The sealant 410 may be one commonly used, such as sealing glass frit.

Next, as shown in FIG. 5C, the filler 420 is filled into the sealant 410 of the encapsulation substrate 300. That is, the filler 420 is provided to fill the space between the substrate 100 and the encapsulation substrate 300.

In detail, the filler 420 is filled into the sealant 410 of the encapsulation substrate 300 by the difference between the thickness of the sealant 410 and the thickness of the display unit 200. As described above, in the present invention, the display unit 200 includes a plurality of light emitting regions for emitting light and a non-light emitting region protruding from the light emitting regions between the plurality of light emitting regions. The thickness of 200 indicates the thickness of the non-emitting region.

In more detail, the display unit 200 forms a predetermined uneven structure. The filler 420 is filled to the encapsulation substrate 300 side at a predetermined thickness. The predetermined thickness is substantially equal to the difference between the thickness of the sealant 410 and the thickness of the display unit 200. Therefore, when the substrate 100 and the encapsulation substrate 300 are bonded to each other, the filler 420 is formed to contact the convex portion among the uneven portions of the display unit 200.

Next, as shown in FIG. 5D, the encapsulation substrate 300 is disposed above the substrate 100.

Finally, as shown in FIG. 5E, the substrate 100 and the encapsulation substrate 300 are bonded to each other through the first sealant 410. That is, the substrate 100 and the encapsulation substrate 300 are bonded by hardening the first sealant 410 by a method of locally irradiating the laser to the first sealant 410 using a laser irradiator or the like.

Then, the filler 420 provided to fill the space between the substrate 100 and the encapsulation substrate 300 is in contact with the upper portion of the uneven structure of the display unit 200, that is, the non-light emitting region of the display unit 200. do. In other words, the filler 420 is filled in the space between the non-light emitting area of the display unit 200 and the encapsulation substrate 300, and is not filled in the light emitting area of the display unit 200.

According to the present invention as described above, it is possible to obtain an effect of being strong against impact from the outside and facilitating manufacture.

Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a cross-sectional view schematically illustrating a conventional organic light emitting display device.

2 is a plan view schematically illustrating a part of an organic light emitting display device according to an exemplary embodiment of the present invention.

3 is a cross-sectional view schematically illustrating the organic light emitting display device of FIG. 2.

4 is a cross-sectional view schematically illustrating a portion of the organic light emitting display device of FIG. 2.

5A through 5E are schematic cross-sectional views sequentially illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: substrate 200: display unit

300: sealing substrate 410: sealant

420: filling material

Claims (11)

Board; A display unit disposed on the substrate; An encapsulation substrate disposed on the display unit; A sealant bonding the substrate to the encapsulation substrate; And It includes a filler provided between the substrate and the encapsulation substrate, And the filler is provided at the side of the encapsulation substrate by a difference between the thickness of the sealant and the thickness of the display unit. The method of claim 1, The display unit includes a plurality of light emitting regions for emitting light and a non-light emitting region protruding from the light emitting region between the plurality of light emitting regions, The thickness of the display unit is an organic light emitting display device, characterized in that the thickness of the non-emitting area. The method of claim 1, And the filler is filled in a space from an area of the display portion protruding from the substrate to the encapsulation substrate. The method of claim 3, wherein And the filler is formed to be in contact with an area of the display unit which most protrudes from the substrate. The method of claim 1, The filler is provided to fill the space between the substrate and the encapsulation substrate. The method of claim 1, The filler is an organic light emitting display device, characterized in that provided to cover the display. Forming a display unit on one surface of the substrate; Forming a sealant on one surface of the encapsulation substrate; Filling a filler into the sealant of the encapsulation substrate; Disposing the encapsulation substrate on the substrate; And And bonding the substrate and the sealing member via the sealant. The method of claim 7, wherein Filling a filler inside the sealant of the encapsulation substrate, And filling the filler by a difference between the thickness of the sealant and the thickness of the display unit. The method of claim 7, wherein The display unit includes a plurality of light emitting regions for emitting light and a non-light emitting region protruding from the light emitting region between the plurality of light emitting regions, The thickness of the display unit is a manufacturing method of an organic light emitting display device, characterized in that the thickness of the non-emitting area. The method of claim 9, When the substrate and the sealing member are bonded through the sealant, The filler is a method of manufacturing an organic light emitting display device, characterized in that provided between the encapsulation substrate and the non-light emitting region. The method of claim 9, When the substrate and the sealing member are bonded through the sealant, And the filler is not filled in the light emitting area.

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