KR101493410B1 - Method of manufacturing organic light emitting display apparatus - Google Patents

Abstract

A method of manufacturing an organic light emitting display device according to the present invention includes the steps of preparing an element substrate on which an organic light emitting element is formed, applying an encapsulation material to an edge of the encapsulation substrate, Applying a filling material to the corresponding position and a wall portion surrounding the filling material; bonding the element substrate and the sealing substrate; and sealing the sealing material.

Description

[0001] The present invention relates to a method of manufacturing an organic light emitting display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an organic light emitting display device, and more particularly, to a method of manufacturing an organic light emitting display device in which penetration of external impurities such as oxygen or moisture is effectively prevented and durability is improved.

2. Description of the Related Art In recent years, a display device has been replaced by a portable flat-panel display device. Among the flat panel display devices, the electroluminescent display device is a self-luminous display device, and has a wide viewing angle, excellent contrast, and fast response speed, and is attracting attention as a next generation display device. In addition, the organic light emitting display device in which the material for forming the light emitting layer is composed of an organic material has excellent luminance, driving voltage, and response speed characteristics and is capable of multi-coloring as compared with an inorganic light emitting display device.

A typical organic light emitting display device has a structure in which at least one organic layer including a light emitting layer is interposed between a pair of electrodes, that is, a first electrode and a second electrode. The first electrode is formed on the substrate and serves as an anode for injecting holes, and an organic layer is formed on the first electrode. A second electrode serving as a cathode for injecting electrons is formed on the organic layer so as to face the first electrode.

However, in the organic light emitting display device, when external moisture or oxygen is introduced into the device, the electrode material is oxidized and peeling occurs, shortening the lifetime of the device, lowering the luminous efficiency, And the like.

Therefore, when the organic light emitting display device is manufactured, a sealing process is performed to isolate the device from the outside and prevent moisture or oxygen from penetrating. As a typical sealing treatment method, an organic polymer such as PET (polyester) is laminated on the second electrode of the organic light emitting display device, or a sealing substrate containing a moisture absorbent is disposed on the element substrate, and nitrogen gas After that, a method of encapsulating the element substrate and the sealing substrate by using an epoxy or acrylic organic sealant is used.

However, since it is impossible to seal the element substrate and the sealing substrate with 100% of the device destructive factors by using the organic sealant, external oxygen or moisture can be introduced into the device through the organic sealant. In addition, it is not effective to apply an encapsulation method using an organic sealant to an organic light emitting display device having an active top emission structure in which the device structure is particularly vulnerable to moisture, and a process for realizing this is complicated.

In order to solve the above problems, a capsule sealing method has been devised in which a frit is used as a sealing material to improve airtightness between the element substrate and the sealing substrate.

When the organic light emitting display device is sealed by applying a frit to the glass substrate, the space between the element substrate and the sealing substrate can be effectively sealed. However, when an impact is transmitted from the outside, a load is concentrated on the frit disposed at the edge of the sealing substrate And the phenomenon such as peeling or cell breaking may occur. Furthermore, when sealing with the frit, the frit is cured by irradiating a laser to the frit applied to the sealing region of the element substrate and the sealing substrate, and the frit is cracked during the process of rapid heating after being rapidly heated by laser irradiation So that a peeling phenomenon may occur.

It may be considered to arrange a filler between the element substrate and the sealing substrate in order to compensate the mechanical strength when sealing the element substrate and the sealing substrate by using the frit so as not to peel off or break the cell. However, when the frit is irradiated with a laser to complete the sealing, the filler disposed between the element substrate and the sealing substrate may interfere with the sealing between the element substrate and the sealing substrate by the frit. That is, the already-filled filler may separate the element substrate and the sealing substrate from each other by a predetermined distance or more, and the flatness of the substrates may be lowered, resulting in a problem of poor sealing.

It is an object of the present invention to provide a method of manufacturing an organic light emitting display device in which penetration of external impurities such as oxygen and moisture is blocked.

Another object of the present invention is to provide a method of manufacturing an organic light emitting display device in which a phenomenon of peeling or cell cracking does not occur when a frit is used as a sealing material.

Another object of the present invention is to provide a method of manufacturing an organic light emitting display device having a sealing effect and an improved durability by disposing a filler between an element substrate and a sealing substrate and sealing the substrates using the frit as a sealing material.

Another object of the present invention is to provide a method of manufacturing an organic light emitting display device in which sealing is not hindered by a filler when the frit is sealed by irradiating laser light even when a filler is disposed between the element substrate and the sealing substrate .

The present invention provides a method of fabricating an organic light emitting display device in which cracking or peeling does not occur easily because a sealing material is sealed in a state in which the filler and the wall are not cured.

A method of manufacturing an organic light emitting display device according to the present invention includes the steps of preparing an element substrate on which an organic light emitting element is formed, applying an encapsulation material to an edge of the encapsulation substrate, Applying a filling material to the corresponding position and a wall portion surrounding the filling material; bonding the element substrate and the sealing substrate; and sealing the sealing material.

In the present invention, the sealing material may include a frit glass.

In the present invention, the step of sealing the sealing material may include a step of irradiating the sealing material with a laser.

In the present invention, it may further include a step of curing the filler and the wall portion after the step of sealing the sealing material.

In the present invention, the filler and the wall portion may have a volume change rate of more than 0% and 3% or less during the curing step.

In the present invention, the filler may include at least one of the group consisting of urethane series, epoxy series, acrylic series and silicone series.

In the present invention, the wall portion may include at least one of the group consisting of urethane series, epoxy series, acrylic series and silicon series.

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display device, comprising the steps of preparing an element substrate having an organic light emitting element formed thereon, applying an encapsulant to an edge of a surface of the element substrate having the organic light emitting element formed thereon, Applying a filler to the inside of the wall portion so as to cover the organic light emitting element, applying a filler to the inside of the sealing material of the substrate at a predetermined distance from the organic light emitting element and surrounding the organic light emitting element, And sealing the encapsulant.

The method of manufacturing an organic light emitting display device according to the present invention is characterized in that an encapsulating material including an element such as a frit is formed along the edge of the encapsulation substrate and the element substrate and the wall portion is disposed along the inner side of the encapsulation material, Since the ash and the filler are isolated, penetration of external impurities such as oxygen and moisture to the organic light emitting device is blocked.

In addition, since the filler disposed between the element substrate and the sealing substrate reinforces the mechanical strength, even when sealing the element substrate and the sealing substrate by using the sealing material including the frit, peeling or cracking phenomenon does not easily occur and durability is improved do.

Also, since the filling material and the wall portion are not cured during the sealing of the element substrate and the sealing substrate by melting / curing the sealing material, the sealing step is not disturbed by the filling material, and cracks Can be greatly reduced.

Hereinafter, the structure and operation of a method of manufacturing an organic light emitting display device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view schematically showing a part of an organic light emitting display device manufactured by a manufacturing method according to an embodiment of the present invention, and FIG. 2 is a side sectional view schematically showing the organic light emitting display device of FIG.

Referring to FIGS. 1 and 2, an organic light emitting diode 200 is provided on an element substrate 100.

The element substrate 100 may be made of a transparent glass material containing SiO ₂ as a main component. In the present invention, the material of the element substrate 100 is not limited to a glass material but may be formed of a transparent plastic material.

The plastic material forming the element substrate 100 may be an insulating organic material such as polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN) polyethyeleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC) , Cellulose acetate propionate (CAP), and the like.

In the case of a bottom emission type in which an image is realized in the direction of the element substrate 100, the element substrate 100 should be formed of a transparent material.

In the case of a front emission type in which an image is formed in a direction opposite to the element substrate 100, the element substrate 100 need not necessarily be formed of a transparent material. In this case, the element substrate 100 may be formed of a metal. When the element substrate 100 is formed of a metal, the element substrate 100 is formed of a material selected from the group consisting of carbon, iron, chromium, manganese, nickel, titanium, molybdenum, stainless steel (SUS), Invar alloy, Inconel alloy and Kovar alloy But it is not limited thereto. The element substrate 100 may be formed of a metal foil.

Although not shown, a buffer layer (not shown) may be further provided on the upper surface of the element substrate 100 to block the smoothness of the element substrate 100 and the penetration of impurities.

The element substrate 100 provided with the organic light emitting device 200 is bonded to the sealing substrate 300 disposed on the organic light emitting device 200. The sealing substrate 300 can be manufactured using various plastic materials such as acrylic as well as a substrate made of a glass material, and further can be made of a metal plate material.

The element substrate 100 and the sealing substrate 300 are bonded together by the sealing material 410. The sealing material 410 may be made of a material such as a sealing frit glass.

Generally, the term 'frit glass' is used in the meaning of powdery glass, but in the present invention, gel-state glass produced by adding organic matter to powdery glass, and solidified glass cured by irradiation with laser The term "

The frit paste may include glass, an absorber for absorbing the laser, a filler for reducing the thermal expansion coefficient, and an organic binder. The frit glass is baked at a temperature of about 300 ° C to 500 ° C to form an encapsulant 410. The organic binder, moisture, and the like are evaporated during the baking process.

The sealing material 410 is applied to the edge of the sealing substrate 300. In the organic light emitting device 200 formed on the element substrate 100, an image can be formed. Therefore, a region where the organic light emitting element 200 is located can be called an image region. The sealing material 410 is applied to the non-image area (or sealing area) of the edge of the sealing substrate 300 surrounding the area other than the image area where the image is realized by the organic light emitting element 200, that is, the image area .

A filling material 430 is provided on the inner side of the sealing material 410 of the sealing substrate 300. The filler 430 is formed at a position corresponding to the organic light emitting device 200 so as to fill the space between the element substrate 100 and the sealing substrate 300.

The filler 430 may be an organic sealant such as urethane resin, epoxy resin, acrylic resin, or inorganic sealant. As the urethane-based resin, for example, urethane acrylate and the like can be used. As the acrylic resin, for example, butyl acrylate, ethylhexyl acrylate and the like can be used.

A wall portion 420 functioning as a dam for isolating the sealing material 410 and the filler 430 is provided between the sealing material 410 and the filling material 430. The wall portion 420 is provided on the inner side of the sealing material 410 and spaced apart from the sealing material 410 to surround the filling material 430.

As the material of the wall portion 420, organic sealant, inorganic sealant, organic / inorganic composite sealant or a mixture thereof may be used.

The organic sealant may include at least one selected from the group consisting of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin and a cellulosic resin.

As the acrylic resin, for example, butyl acrylate, ethylhexyl acrylate and the like can be used. As the methacrylic resin, for example, propylene glycol methacrylate, tetrahydroperfomethacrylate and the like can be used. As the vinyl resin, for example, vinyl acetate, N-vinylpyrrolidone and the like can be used. As the epoxy resin, for example, cycloaliphatic epoxide can be used. As the urethane resin, for example, urethane acrylate and the like can be used. As the cellulose-based resin, for example, cellulose nitrate and the like can be used.

As the inorganic sealant, a metal oxide such as silicon, aluminum, titanium, zirconium or the like can be used as the nonmetallic material. For example, one or more selected from the group consisting of titania, silicon oxide, zirconia, alumina and their free- .

Organic / inorganic composite sealants are materials in which metals, non-metallic materials such as silicon, aluminum, titanium, and zirconium, and organic materials are covalently bonded. For example, at least one selected from the group consisting of an epoxy silane or a derivative thereof, a vinyl silane or a derivative thereof, an amine silane or a derivative thereof, a methacrylate silane, or a partial cure reaction product thereof may be included in the organic / inorganic composite sealant .

Specific examples of the epoxy silane or its derivative include 3-glycidoxypropyltrimethoxysilane or a polymer thereof. Specific examples of vinylsilane or a derivative thereof include vinyltriethoxysilane or a polymer thereof.

Specific examples of the aminosilane or a derivative thereof include 3-aminopropyltriethoxysilnae and a polymer thereof. Specific examples of the methacrylate silane or a derivative thereof include 3-tri (methoxy (Trimethylsilyl) propyl acrylate} and polymers thereof.

FIG. 3 is a cross-sectional view schematically showing a part of the organic light emitting display device of FIG. 1, and illustrates an exemplary structure of the organic light emitting device 200.

A plurality of thin film transistors 220 are provided on the element substrate 100 and an organic light emitting portion 230 is provided on the thin film transistors 220. The organic light emitting unit 230 includes a pixel electrode 231 electrically connected to the thin film transistor 220, a counter electrode 235 disposed over the entire surface of the device substrate 100, a pixel electrode 231, And an intermediate layer 233 disposed between the counter electrodes 235 and having at least one light emitting layer.

A thin film transistor 220 having a gate electrode 221, a source electrode and a drain electrode 223, a semiconductor layer 227, a gate insulating film 213 and an interlayer insulating film 215 is provided on the element substrate 100.

Various thin film transistors such as an organic thin film transistor formed of an organic material and a silicon thin film transistor formed of silicon can be used for the semiconductor layer 227 of the thin film transistor 220. A buffer layer 211 formed of silicon oxide, silicon nitride, or the like may be further provided between the thin film transistor 220 and the element substrate 100.

The organic light emitting portion 230 includes a pixel electrode 231 and a counter electrode 235 facing each other and an intermediate layer 233 made of an organic material interposed between these electrodes. The intermediate layer 233 may include at least one light emitting layer, and may be formed of a plurality of layers.

The pixel electrode 231 functions as an anode electrode, and the counter electrode 235 functions as a cathode electrode. The polarities of the pixel electrode 231 and the counter electrode 235 may be opposite.

The pixel electrode 231 may be formed of a transparent electrode or a reflective electrode. In the case of a transparent electrode, it may be formed of ITO, IZO, ZnO or In ₂ O _3. When the electrode is provided as a reflective electrode, Ag, Mg, Al, Pt, Pd, Au, Ni, A compound or the like, and a film formed thereon with ITO, IZO, ZnO, or In ₂ O ₃ .

The counter electrode 235 may also be formed of a transparent electrode or a reflective electrode. A film formed by depositing Li, Ca, LiF / Ca, LiF / Al, Al, Mg or a compound thereof so as to face the intermediate layer 233 between the pixel electrode 231 and the counter electrode 235 And an auxiliary electrode or a bus electrode line formed thereon with a transparent electrode forming material such as ITO, IZO, ZnO, or In ₂ O ₃ . LiF / Ca, LiF / Al, Al, Mg, or a compound thereof when forming the reflective electrode.

On the other hand, a pixel defining layer (PDL) 219 covers the edge of the pixel electrode 231 and is formed to have a thickness outside the pixel electrode 231. The pixel defining layer 219 has a function of defining the light emitting region and widening the interval between the edge of the pixel electrode 231 and the counter electrode 235 to prevent the electric field from concentrating at the edge portion of the pixel electrode 231 Thereby preventing a short circuit between the pixel electrode 231 and the counter electrode 235.

Between the pixel electrode 231 and the counter electrode 235, various intermediate layers 233 including at least one light emitting layer are provided. The intermediate layer 233 may be formed of a low molecular organic material or a polymer organic material.

When a low molecular organic material is used, a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL) : electron injection layer) may be stacked in a single or composite structure.

Organic materials that can be used for the intermediate layer 233 include copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N'- (naphthalene-1-yl) -N, N'-diphenyl-benzidine: NPB), tris-8-hydroxyquinoline aluminum (Alq3) and the like. The low-molecular organic material may be formed by a method such as vacuum deposition using masks.

In the case of a polymer organic material, the hole transporting layer (HTL) and the light emitting layer (EML) may be provided. PEDOT is used as the hole transporting layer, and polymer organic materials such as poly-phenylenevinylene (PPV) and polyfluorene are used as the light emitting layer.

When the planarization layer 217 covering the thin film transistor 220 is provided at this time, the organic light emitting portion 230 is electrically connected to the planarization layer 217, And the pixel electrode 231 of the organic light emitting portion 230 is electrically connected to the thin film transistor 220 through the contact hole provided in the planarization layer 217. [

The organic light emitting portion 230 formed on the element substrate 100 is sealed by the sealing substrate 300. The sealing substrate 300 may be formed of various materials such as glass or plastic material as described above.

A filling material 430 is provided between the organic light emitting part 230 and the sealing substrate 300 to fill the space between the organic light emitting part 230 and the sealing substrate 300 to prevent peeling or cell breaking.

1 and 2 are formed along the edge of the sealing substrate 300 and the wall portion 420 is formed along the edge of the sealing substrate 300. In the organic electroluminescence display device having the above- The sealant 410 and the filler 430 are disposed along the inner surface of the encapsulant 410 to effectively prevent external impurities from penetrating into the encapsulant 410 and damaging the organic light emitting device 200. [

In the case where the sealing material 410 includes frit, when an impact is transmitted from the outside, a load is concentrated on the sealing material 410 disposed at the edge of the sealing substrate 300, have. Further, when sealing with the frit, the frit is melted / cured by irradiating the sealing material 410 coated on the element substrate 100 and the sealing region of the sealing substrate 300 with laser, which is rapidly heated by the laser irradiation, A crack may be generated in the frit during the cooling process, resulting in peeling.

The filling material 430 disposed between the element substrate 100 and the sealing substrate 300 functions to prevent peeling or cell breaking in the sealing material 410 including the frit by supplementing mechanical strength . However, if the filling material 430 and the wall part 420 disposed between the element substrate 100 and the sealing substrate 300 are already cured when the frit is irradiated with the laser to complete the sealing, the element substrate 100 and the sealing substrate 300, Thereby hindering the sealing of the sealing member 300. That is, since the already-filled filler 430 separates the element substrate 100 and the sealing substrate 300 from each other by a predetermined distance or more, the flatness of the substrates may be greatly reduced and the sealing state may become poor.

According to the method for manufacturing a display device according to an embodiment of the present invention, such a problem can be solved.

4 is a cross-sectional view illustrating a step of preparing an element substrate in a method of manufacturing an organic light emitting display device according to an embodiment of the present invention. FIG. 5 is a cross-sectional view showing a step of applying an encapsulating material to an encapsulating substrate in the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, FIG. 6 is a step of applying a wall part to the encapsulating substrate of FIG. And Fig. 7 is a cross-sectional view showing the step of applying the filler to the sealing substrate of Fig.

A method of manufacturing an organic light emitting display device according to an embodiment of the present invention includes the steps of preparing an element substrate on which an organic light emitting diode is formed, applying an encapsulation material to an edge of the encapsulation substrate, Applying a wall portion surrounding the filling material and the filler to a position corresponding to the organic light emitting element, attaching the element substrate and the sealing substrate together, and sealing the sealing material.

First, a step of preparing the element substrate 100 is performed. The organic light emitting device 200 is formed on one surface of the element substrate 100. As the element substrate 100, not only a glass substrate but also various plastic substrates such as acrylic may be used, and further, a metal plate may be used. A buffer layer (not shown) may be further provided on the element substrate 100 if necessary.

The step of preparing the sealing substrate 300 together with the step of preparing the element substrate 100 is performed. The encapsulation substrate 300 may be made of various plastic substrates such as acrylic, as well as a glass substrate, and further, a metal plate may be used.

When the sealing substrate 300 is prepared, a step of applying the sealing material 410 to the edge of the sealing substrate 300 is performed. As the sealing material 410, a material such as a sealing frit glass may be used.

The sealing substrate 300 is coated with a wall 420 on the inner side of the sealing material 410. The wall portion 420 is formed to be spaced apart from the sealing material 410 by a predetermined distance along the inner side of the sealing material 410 in order to perform a function of a dam for isolating the sealing material 410 from the filling material 430 do. For this wall portion 420, organic sealant, inorganic sealant, organic / inorganic composite sealant or a mixture thereof may be used.

Next, as shown in FIG. 7, a filler 430 is applied to the inside of the wall portion 420 of the sealing substrate 300.

As the filler 430, for example, an epoxy resin which is an organic sealant, or silicone which is a inorganic sealant can be used. As the filler 430, an organic sealant, such as urethane resin, acrylic resin, or inorganic sealant, may be used.

5 to 7, the sealing material 410, the filler material 430, and the wall material 420 are all applied on the sealing substrate 300, but the present invention is not limited thereto. That is, the sealing material 410, the filler material 430, and the wall material 420 may be applied to the surface of the element substrate 100. In such a case, a sealing material 410 or the like may be coated on the element substrate 100 shown in FIG. 4, and the sealing substrate 300 may be attached and sealed thereon.

Fig. 8 is a cross-sectional view showing the step of sealing and sealing the sealing substrate of Fig. 7 and the element substrate of Fig. 4;

When the element substrate 100 and the sealing substrate 300 are prepared, the element substrate 100 and the sealing substrate 300 are bonded as shown in FIG. The encapsulation material 410 is melted / cured by locally irradiating the encapsulant 410 with a laser or by applying heat to the encapsulation substrate 300 using the laser irradiation apparatus to seal the encapsulation substrate 300 and the element substrate 100 Complete. The laser irradiation apparatus moves along the surface of the element substrate 100 and irradiates the sealing material 410 with a laser.

The organic light emitting display device manufactured by the method as described above is structured such that the mechanical strength is complemented by the filler 430 disposed between the element substrate 100 and the sealing substrate 300, Rinse cell cracking does not occur well.

For this purpose, the filling material 430 and the wall part 420 preferably have a volume change rate of 3% or less during curing so as to minimize the influence on the sealing material 410 during the sealing step.

When the encapsulant 410 is melted and cured by irradiating the encapsulant 410 applied to the encapsulation region of the element substrate 100 and the encapsulation substrate 300 with a laser beam, the encapsulant 410 is rapidly irradiated It is heated and then rapidly cooled down. However, the filler 430 and the wall portion 420 are disposed between the element substrate 100 and the sealing substrate 300 in a state in which they are not cured and have fluidity. Therefore, even if the sealing material 410 is heated and melted and cooled again and a clearance change occurs between the element substrate 100 and the sealing substrate 300 and the sealing material 410 during the curing, The wall portion 430 and the wall portion 420 can sufficiently absorb. As a result, the occurrence of cracks in the sealing material 410 is greatly reduced, and the problem of poor sealing such as peeling failure does not occur.

After the step of sealing the sealing material 410, a step of curing the filling material 430 and the wall part 420 may be further performed. The step of curing the filler 430 and the wall 420 may also be performed by locally irradiating laser or heating only the filler 430 and the wall 420. When the filler 430 and the wall 420 are cured, the overall strength of the filler 430 is improved, so that the organic light emitting diode 200 can be effectively protected from external shocks.

After the step of sealing the sealing material 410 as described above, the step of curing the filling material 430 and the wall part 420 may be performed, but the present invention is not limited thereto. That is, the material used for the filler 430 and the wall 420 is not limited to the curing type. Unfired materials may be used for the filler 430 and the wall 420. The filling material 430 and the wall part 420 may be made of a material having a certain degree of adhesion and stretching force such as gel when applied to the sealing substrate 300. [

The sealing substrate 300 and the element substrate 100 are directly bonded to each other without the need to perform a step of applying a laser or heat to cure after the filler 430 and the wall 420 made of a non- can do. At this time, the filler 430 can be sufficiently adhered to the organic light emitting device 200 to surround the organic light emitting device 200 due to the characteristic having the stretching force.

When the step of sealing the sealing material 410 by irradiating a laser or the like after the sealing substrate 300 and the element substrate 100 are attached to each other is performed, due to the stretching force of the filling material 430 and the wall portion 420, A gap change between the sealing substrate 300 and the element substrate 100, which occurs during the process of melting and curing the resin 410, can be sufficiently absorbed. Therefore, during the step of sealing the sealing material 410, cracks are not generated in the sealing material 410 and sealing of the element substrate 100 and the sealing substrate 300 can be performed well.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the appended claims.

1 is a plan view schematically showing a part of an organic light emitting display device manufactured by a manufacturing method according to an embodiment of the present invention.

2 is a side sectional view schematically showing the organic light emitting display device of FIG.

3 is a cross-sectional view schematically showing a part of the organic light emitting display device of FIG.

4 is a cross-sectional view illustrating a step of preparing an element substrate in a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

5 is a cross-sectional view illustrating a step of applying an encapsulating material to an encapsulating substrate in the method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

Fig. 6 is a cross-sectional view showing the step of applying the wall portion to the sealing substrate of Fig. 5;

7 is a cross-sectional view showing the step of applying a filler to the sealing substrate of Fig.

Fig. 8 is a cross-sectional view showing the step of sealing and sealing the sealing substrate of Fig. 7 and the element substrate of Fig. 4;

DESCRIPTION OF THE REFERENCE NUMERALS

100: element substrate 227: semiconductor layer

200: organic light emitting element 230: organic light emitting element

211: buffer layer 231: pixel electrode

213: gate insulating film 233:

215: interlayer insulating film 235: counter electrode

217: planarization film 300: sealing substrate

219: pixel definition film 410: sealing material

220: thin film transistor 420: wall portion

221: gate electrode 430: filler

223: source electrode and drain electrode

Claims (14)

Preparing an element substrate on which an organic light emitting element is formed; Applying an encapsulant to an edge of the encapsulation substrate; Applying a filler and a wall portion surrounding the filler to a position corresponding to the organic light emitting element on the inner side of the sealing material of the sealing substrate; Attaching the device substrate and the sealing substrate; And And sealing the encapsulation material, Further comprising the step of curing the filler and the wall portion after the step of sealing the encapsulation material. The method according to claim 1, Wherein the sealing material comprises a frit glass. 3. The method of claim 2, Wherein the step of sealing the sealing material includes a step of irradiating the sealing material with a laser. delete The method according to claim 1, Wherein the filler and the wall portion have a volume change rate of more than 0% and 3% or less during the curing step. The method according to claim 1, Wherein the filler comprises at least one of the group consisting of urethane-based, epoxy-based, acrylic-based, and silicon-based materials. The method according to claim 6, Wherein the wall portion includes at least one of the group consisting of a urethane series, an epoxy series, an acrylic series, and a silicon series. Preparing an element substrate on which an organic light emitting element is formed; Applying an encapsulant to an edge of a surface of the device substrate on which the organic light emitting device is formed; Applying a filler to the inside of the wall portion so as to cover the organic light emitting device, and applying a wall portion to the inside of the sealing material of the device substrate at a predetermined distance from the organic light emitting device to surround the organic light emitting device; Attaching the device substrate and the sealing substrate; And And sealing the encapsulation material, Further comprising the step of curing the filler and the wall portion after the step of sealing the encapsulation material. 9. The method of claim 8, Wherein the sealing material comprises a frit glass. 10. The method of claim 9, Wherein the step of sealing the sealing material includes a step of irradiating the sealing material with a laser. delete 9. The method of claim 8, Wherein the filler and the wall portion have a volume change rate of more than 0% and 3% or less during the curing step. 9. The method of claim 8, Wherein the filler comprises at least one of the group consisting of urethane-based, epoxy-based, acrylic-based, and silicon-based materials. 14. The method of claim 13, Wherein the wall portion includes at least one of the group consisting of a urethane series, an epoxy series, an acrylic series, and a silicon series.

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