KR101493409B1 - Organic light emitting display apparatus and method of manufacturing thereof - Google Patents

Abstract

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device in which penetration of external impurities such as oxygen or moisture is prevented, and a method of manufacturing the same.

The present invention provides a semiconductor device comprising: a substrate; A display unit disposed on the substrate; An encapsulation substrate disposed above the display unit; A sealant for bonding the substrate and the sealing substrate; And a filler disposed between the substrate and the encapsulation substrate, wherein the filler is filled in a space between the substrate and the encapsulation substrate by a difference between the thickness of the sealant and the thickness of the display unit. Device.

Description

[0001] The present invention relates to an organic light emitting display device and a method of manufacturing the same,

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device in which penetration of external impurities such as oxygen or moisture is prevented, and a method of manufacturing the same.

2. Description of the Related Art In recent years, a display device has been replaced by a portable flat-panel display device. Among the flat panel display devices, the electroluminescent display device is a self-luminous display device, and has a wide viewing angle, excellent contrast, and fast response speed, and is attracting attention as a next generation display device. In addition, the organic light emitting display device in which the material for forming the light emitting layer is composed of an organic material has excellent luminance, driving voltage, and response speed characteristics and is capable of multi-coloring as compared with an inorganic light emitting display device.

1 is a cross-sectional view schematically showing a conventional organic light emitting display device. Referring to FIG. 1, a display unit 20 is provided on a substrate 10, and an encapsulation substrate 30 is provided on the display unit 20. Then, the substrate 10 and the sealing substrate 30 are bonded together with the sealant 41.

Flat panel display devices, particularly organic light emitting devices, provided in flat panel displays have deterioration due to internal factors such as deterioration of the light emitting layer due to oxygen from ITO used as an electrode, deterioration due to reaction between the light emitting layer and the interface, Oxygen, ultraviolet rays, and manufacturing conditions of the device. Particularly, the packaging of the organic light emitting device is very important because external oxygen and moisture have a serious effect on the lifetime of the device.

However, in the conventional organic light emitting display device as shown in FIG. 1, impurities such as oxygen or moisture penetrate into the substrate through the sealant 41 for bonding the substrate 10 and the sealing substrate 30 The display unit 20 may be damaged. In addition, since only the sealing area of the outer periphery of the sealing substrate 30 is in contact with the sealant 41, there is a problem that the external impact is concentrated on the sealant 41 side, resulting in peeling or cell cracking.

In order to solve such a problem, a method of further providing a filler (not shown) between the substrate 10 and the sealing substrate 30 has been developed.

However, if a viscous material is used as such a filler, there is a problem that it is not easy to fill the uneven portion of the organic light emitting device of the display unit 20 with the filler. On the contrary, if a material having a small viscosity is used as the filler, the filler rapidly spreads under a high vacuum, so that there is a problem that the sealant 41 is contaminated and peeling failure occurs.

Since the filler is filled on the side of the substrate 10 on which the display portion 20 having the concavoconvex structure is formed, filling of the filler is not easy and the display portion 20 is heated by heat and pressure There was a risk of being destroyed.

It is an object of the present invention to solve the above problems and to provide an organic light emitting display device which is resistant to external impact and is easy to manufacture and a method of manufacturing the same.

The present invention provides a semiconductor device comprising: a substrate; A display unit disposed on the substrate; An encapsulation substrate disposed above the display unit; A sealant for bonding the substrate and the sealing substrate; And a filler provided between the substrate and the encapsulation substrate, wherein the filler is provided on the encapsulation substrate side by a difference between the thickness of the sealant and the thickness of the display unit.

The display unit may include a plurality of light emitting regions through which light is emitted and a non-light emitting region protruding from the light emitting region between the plurality of light emitting regions, The thickness of the area can be.

In the present invention, the filling material may be filled in a space from the region of the display portion protruding from the substrate to the sealing substrate.

In the present invention, the filler may be formed so as to be in contact with an area of the display portion protruding most from the substrate.

In the present invention, the filler may be provided to fill a space between the substrate and the encapsulation substrate.

In the present invention, the filler may be provided to cover the display unit.

According to another aspect of the present invention, there is provided a method of manufacturing a display device, comprising: forming a display portion on one surface of a substrate; Forming a sealant on one surface of the sealing substrate; Filling the filler inside the sealant of the sealing substrate; Disposing the sealing substrate on the substrate; And bonding the sealing member to the substrate via the sealant.

In the present invention, filling the filler inside the sealant of the sealing substrate may fill the filler by a difference between the thickness of the sealant and the thickness of the display portion.

The display unit may include a plurality of light emitting regions through which light is emitted and a non-light emitting region protruding from the light emitting region between the plurality of light emitting regions, May be the thickness of the region.

In the present invention, when the substrate and the sealing member are bonded to each other via the sealant, the filling material may be provided between the sealing substrate and the non-emitting region.

In the present invention, when the substrate and the sealing member are bonded to each other via the sealant, the filler may not be filled in the light emitting region.

According to the organic light emitting display device and the method of manufacturing the same of the present invention as described above, it is possible to obtain an effect of being strong against impact from the outside and being easy to manufacture.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a plan view schematically showing a part of an organic light emitting display device according to a preferred embodiment of the present invention, and FIG. 3 is a cross-sectional view schematically showing the organic light emitting display device of FIG. For reference, FIG. 2 shows a structure in which the sealing substrate 300 shown in FIG. 3 is removed.

Referring to FIG. 1, a display unit 200 including an organic light emitting device is provided on a substrate 100.

The substrate 100 may be made of a transparent glass material having SiO ₂ as a main component. The substrate 100 is not necessarily limited to this, and may be formed of a transparent plastic material. The plastic material forming the substrate 100 may be an insulating organic material such as polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethyelenene napthalate, polyethyeleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC) And cellulose acetate propionate (CAP).

The substrate 100 should be formed of a transparent material in the case of a bottom emission type in which an image is realized in the direction of the substrate 100. [ However, in the case of a front emission type in which an image is implemented in the opposite direction to the substrate 100, the substrate 100 does not necessarily have to be formed of a transparent material. In this case, the substrate 100 can be formed of metal. When the substrate 100 is formed of metal, the substrate 100 may include at least one selected from the group consisting of carbon, iron, chromium, manganese, nickel, titanium, molybdenum, stainless steel (SUS), Invar alloy, Inconel alloy and Kovar alloy But is not limited thereto. The substrate 100 may be formed of a metal foil.

Although not shown, a buffer layer (not shown) may be further provided on the upper surface of the substrate 100 to block smoothness of the substrate 100 and penetration of impurities.

The substrate 100 having the display unit 200 is bonded to the sealing substrate 300 disposed on the display unit 200. The encapsulation substrate 300 may be formed of various plastic substrates such as acrylic, as well as a glass substrate, and further, a metal plate may be used.

The substrate 100 and the sealing substrate 300 are bonded together by a sealant 410. The sealant 410 may be a sealant glass frit or the like that is conventionally used.

A filling material 420 is provided on the inner side of the sealant 410. More specifically, the filling material 420 is provided to fill a space between the substrate 100 and the sealing substrate 300. [

As described above, in the case of the conventional organic light emitting display device, impurities such as oxygen or moisture penetrate into the substrate through the sealant for bonding the substrate and the sealing substrate, thereby damaging the display unit. In addition, since only a part of the sealing area of the seal substrate is in contact with the sealant, there is a problem that external impact is concentrated on the sealant side, resulting in peeling or cell cracking. In order to solve such a problem, a method of further providing a filler between the substrate and the sealing substrate has been developed. However, if such a viscous material is used as the filler, it is not easy to fill the concavo-convex portion of the organic light emitting element of the display portion with the filler. On the contrary, if a small viscosity material is used as the filler, There was a problem of contamination. Furthermore, since the filling material is filled in the substrate on which the display portion of the concavo-convex structure is formed, there is a risk that the filling is not easy and the display portion may be damaged by heat, pressure, etc. during the charging process.

In order to solve such a problem, the present invention is characterized in that the filler material 420 is filled by the difference between the thickness of the sealant 410 and the thickness of the display unit 200.

2 and 3, the display unit 200 has a predetermined concavo-convex structure (the structure of the display unit will be described in detail with reference to FIG. 4). Then, The filling material 420 provided to fill the space between the substrate 100 and the sealing substrate 300 is formed to be in contact with the upper portion of the concave and convex structure, . In other words, the filler 420 is filled in the space between the convex portions of the concave / convex portions of the display unit 200 and the sealing substrate 300, and is not filled in the concave portions of the concave / convex portions of the display unit 200.

That is, the filling material 420 is filled to a predetermined thickness on the sealing substrate 300 side. The predetermined thickness is substantially the same as the difference between the thickness of the sealant 410 and the thickness of the display unit 200. Accordingly, the filler 420 is formed to be in contact with the convex portion of the concave-convex portion of the display portion 200.

In this manner, by filling the filler material 420 with the predetermined thickness, that is, the thickness of the sealant 410 and the thickness of the display portion 200, on the side of the sealing substrate 300, The effect of facilitating manufacture can be obtained.

As the filler 420, an organic material, an inorganic material, an organic / inorganic composite material, or a mixture thereof may be used.

As the organic material, at least one selected from the group consisting of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin and cellulosic resin can be used. As the acrylic resin, for example, butyl acrylate, ethylhexyl acrylate and the like can be used. As the methacrylic resin, for example, propylene glycol methacrylate, tetrahydroperfomethacrylate and the like can be used. As the resin, for example, vinyl acetate, N-vinylpyrrolidone and the like can be used. As the epoxy resin, for example, cyclooleficic epoxide can be used. As the urethane resin, for example, urethane acrylate and the like can be used. For example, cellulose nitrate and the like can be used.

As the inorganic material, a metal such as silicon, aluminum, titanium, zirconium or the like or a metal oxide can be used as the nonmetal material. For example, one or more selected from the group consisting of titania, silicon oxide, zirconia, alumina and their free- .

The organic / inorganic composite binder is a material in which a metal, a non-metal material such as silicon, aluminum, titanium, or zirconium, and an organic material are covalently bonded. For example, at least one selected from the group consisting of epoxy silane or a derivative thereof, vinyl silane or a derivative thereof, amine silane or a derivative thereof, methacrylate silane, or a partial curing reaction product thereof. Specific examples of the epoxy silane or its derivative include 3-glycidoxypropyltrimethoxysilane or a polymer thereof. Specific examples of vinylsilane or a derivative thereof include vinyltriethoxysilane or a polymer thereof. Specific examples of the amine silane or a derivative thereof include 3-aminopropyltriethoxysilane and a polymer thereof. Specific examples of the methacrylate silane or a derivative thereof include 3-tri (methoxy (Trimethylsilyl) propyl acrylate} and polymers thereof.

According to the present invention as described above, it is possible to obtain an effect of being strong against impact from outside and being easy to manufacture.

FIG. 4 is a cross-sectional view schematically showing a part of the organic light emitting display device of FIG. 2, and shows a specific configuration of the display unit 200 by way of example.

Referring to FIG. 4, a plurality of thin film transistors 220 are formed on a substrate 100, and organic light emitting devices 230 are formed on the thin film transistors 220. The organic light emitting diode 230 includes a pixel electrode 231 electrically connected to the thin film transistor 220, a counter electrode 235 disposed over the entire surface of the substrate 100, And an intermediate layer 233 disposed between the electrodes 235 and including at least a light emitting layer.

A thin film transistor 220 having a gate electrode 221, a source electrode and a drain electrode 223, a semiconductor layer 227, a gate insulating film 213, and an interlayer insulating film 215 is provided on the substrate 100. Of course, the thin film transistor 220 is not limited to that shown in FIG. 5, and various thin film transistors such as an organic thin film transistor in which the semiconductor layer 227 is made of an organic material and a silicon thin film transistor formed in silicon can be used. A buffer layer 211 formed of silicon oxide, silicon nitride, or the like may be further provided between the thin film transistor 220 and the substrate 100 as needed.

The organic light emitting diode 230 includes a pixel electrode 231 and a counter electrode 235 facing each other and an intermediate layer 233 made of an organic material interposed between the pixel electrode 231 and the counter electrode 235. The intermediate layer 233 includes at least a light emitting layer and may include a plurality of layers. These layers will be described later.

The pixel electrode 231 functions as an anode electrode, and the counter electrode 235 functions as a cathode electrode. Of course, the polarities of the pixel electrode 231 and the counter electrode 235 may be reversed.

The pixel electrode 231 may be a transparent electrode or a reflective electrode. In the case of a transparent electrode, it may be formed of ITO, IZO, ZnO or In ₂ O _3. When the electrode is provided as a reflective electrode, Ag, Mg, Al, Pt, Pd, Au, Ni, A compound or the like, and a film formed thereon with ITO, IZO, ZnO, or In ₂ O ₃ .

The counter electrode 235 may be a transparent electrode or a reflective electrode. When the counter electrode 235 is provided as a transparent electrode, Li, Ca, LiF / Ca, LiF / A film deposited to face the intermediate layer 233 between the electrodes 235 and an auxiliary electrode or bus electrode line formed thereon with a transparent electrode forming material such as ITO, IZO, ZnO, or In ₂ O ₃ . When the reflective electrode is provided, it may be provided by depositing Li, Ca, LiF / Ca, LiF / Al, Al, Mg, or a compound thereof.

On the other hand, a pixel defining layer (PDL) 219 covers the edge of the pixel electrode 231 and has a thickness outside the pixel electrode 231. The pixel defining layer 219 serves to define a light emitting region and to widen the interval between the edge of the pixel electrode 231 and the counter electrode 235 to prevent the electric field from concentrating at the edge portion of the pixel electrode 231 Thereby preventing a short circuit between the pixel electrode 231 and the counter electrode 235.

Between the pixel electrode 231 and the counter electrode 235, various intermediate layers 233 including at least a light emitting layer are provided. The intermediate layer 233 may be formed of a low molecular organic material or a polymer organic material.

When a low molecular organic material is used, a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL) : electron injection layer) may be laminated in a single or a composite structure, and organic materials that can be used include copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) N-diphenyl-benzidine (NPB), tris-8-hydroxyquinoline aluminum (N, N'-diphenyl- Alq3), and the like. These low molecular weight organic substances can be formed by a method such as vacuum deposition using masks.

In the case of the polymer organic material, the hole transport layer (HTL) and the light emitting layer (EML) may be generally used. In this case, PEDOT is used as the hole transport layer and polyphenylenevinylene (PPV) (Polyfluorene) based polymer organic materials are used.

When the planarization layer 217 covering the thin film transistor 220 is provided at this time, the organic light emitting diode 230 is electrically connected to the planarization layer 220 And the pixel electrode 231 of the organic light emitting diode 230 is electrically connected to the thin film transistor 220 through the contact hole provided in the planarization layer 217.

Meanwhile, the organic light emitting device 230 formed on the substrate is sealed by the sealing substrate 300. The sealing substrate 300 may be formed of various materials such as glass or plastic material as described above.

A filling material 420 is provided between the organic light emitting device 230 and the sealing substrate 300 to fill the space between the organic light emitting device 230 and the sealing substrate 300 to prevent peeling or cell breaking do.

The sealant 410 may be provided along the edge of the sealing substrate 300 or may be disposed to cover the display unit 200 and the filler 420 may be disposed along the inner surface of the sealant 410 do.

Here, the display unit 200 has a predetermined concavo-convex structure. That is, the light emitting region where the pixel electrode 231 is located corresponds to the concave portion of the concave-convex structure. The region where the pixel defining layer 219 is formed to cover the edge of the pixel electrode 231 and has a thickness outside the pixel electrode 231, that is, the non-light emitting region corresponds to the convex portion of the concave-convex structure.

The thickness of the display part 200 is the same as the thickness of the display part 200 in the region where the pixel defining layer 219 is located Is the thickness of the non-emission region. In other words, the filling material 420 is formed so as to be in contact with the non-light emitting region corresponding to the convex portion of the concavo-convex structure from the sealing substrate 300, and is not filled in the light emitting region of the display portion 200.

According to the present invention as described above, it is possible to obtain an effect of being strong against impact from outside and being easy to manufacture.

5A to 5E are schematic cross-sectional views sequentially illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

5A to 5E, a method of manufacturing an OLED display device according to an exemplary embodiment of the present invention includes forming a display portion on one side of a substrate, forming a sealant on one side of the sealing substrate, Filling the filler inside the sealant, disposing the encapsulation substrate on the substrate, and bonding the substrate and the encapsulation member via the sealant.

First, as shown in FIG. 5A, a display unit 200 is formed on one surface of a substrate 100. FIG. Here, as the substrate 100, not only a glass substrate but also various plastic substrates such as acrylic may be used, and further, a metal plate may be used. The substrate 100 may further include a buffer layer (not shown) if necessary. As described above, the display unit 200 includes a plurality of light emitting regions through which light is emitted, and a non-light emitting region protruding from the light emitting region between the plurality of light emitting regions, Respectively.

Next, as shown in FIG. 5B, the sealing substrate 300 is prepared, and the sealant 410 is formed on one surface of the sealing substrate 300. The sealant 410 may be a sealant such as a sealing glass frit or the like.

Next, as shown in FIG. 5C, the filler 420 is filled inside the sealant 410 of the sealing substrate 300. That is, the filling material 420 is provided to fill the space between the substrate 100 and the sealing substrate 300.

The filling material 420 is filled inside the sealant 410 of the sealing substrate 300 by the difference between the thickness of the sealant 410 and the thickness of the display portion 200. [ As described above, in the present invention, the display unit 200 includes a plurality of light emitting regions in which light is emitted, and a non-light emitting region protruding from the light emitting regions between the plurality of light emitting regions, (200) indicates the thickness of the non-light emitting region.

In more detail, the display unit 200 has a predetermined concavo-convex structure. The filler 420 is filled to a predetermined thickness on the sealing substrate 300 side. Here, the predetermined thickness is substantially the same as the difference between the thickness of the sealant 410 and the thickness of the display portion 200. Therefore, when the substrate 100 and the sealing substrate 300 are bonded to each other, the filler 420 is formed so as to contact the convex portion of the concave-convex portion of the display portion 200.

Next, as shown in FIG. 5D, the sealing substrate 300 is disposed on the upper side of the substrate 100.

Finally, as shown in FIG. 5E, the substrate 100 and the sealing substrate 300 are bonded to each other via the first sealant 410. That is, the first sealant 410 is hardened by a method of locally irradiating the first sealant 410 with a laser using a laser beam or the like, thereby bonding the substrate 100 and the sealant 300 together.

The filling material 420 filled in the space between the substrate 100 and the sealing substrate 300 is placed in contact with the upper portion of the concave and convex structure of the display unit 200, do. In other words, the filling material 420 is filled in the space between the non-emitting area of the display part 200 and the sealing substrate 300, and is not filled in the light emitting area of the display part 200.

According to the present invention as described above, it is possible to obtain an effect of being strong against impact from outside and being easy to manufacture.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1 is a cross-sectional view schematically showing a conventional organic light emitting display device.

2 is a plan view schematically showing a part of an organic light emitting display device according to a preferred embodiment of the present invention.

3 is a cross-sectional view schematically showing the organic light emitting display device of FIG.

4 is a cross-sectional view schematically showing a part of the organic light emitting display device of FIG.

5A to 5E are schematic cross-sectional views sequentially illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

Description of the Related Art

100: substrate 200:

300: sealing substrate 410: sealant

420: filler

Claims (11)

Board; A display unit disposed on the substrate; An encapsulation substrate disposed above the display unit; A sealant for bonding the substrate and the sealing substrate; And And a filler provided between the substrate and the sealing substrate, The filler is provided on the sealing substrate side by a difference between the thickness of the sealant and the thickness of the display portion, Wherein the filler is formed to be in contact with the encapsulation substrate, the sealant, and the display unit, and is not in contact with the substrate. The method according to claim 1, Wherein the display unit includes a plurality of light emitting regions in which light is emitted and a non-emitting region protruding from the light emitting region between the plurality of light emitting regions, And the thickness of the display portion is a thickness of the non-emission region. The method according to claim 1, Wherein the filler is filled in a space from an area of the display unit protruding from the substrate to the sealing substrate. The method of claim 3, Wherein the filler is formed so as to be in contact with a region of the display portion protruding most from the substrate. The method according to claim 1, Wherein the filler is provided to fill a space between the substrate and the encapsulation substrate. The method according to claim 1, Wherein the filler is provided to cover the display unit. Forming a display portion on one side of the substrate; Forming a sealant on one surface of the sealing substrate; Filling the filler inside the sealant of the sealing substrate; Disposing the sealing substrate on the substrate; And And bonding the substrate and the sealing substrate via the sealant, Wherein the filler is formed so as to be in contact with the encapsulation substrate, the sealant, and the display unit, and is not in contact with the substrate. 8. The method of claim 7, The step of filling the filler inside the sealant of the sealing substrate comprises: And filling the filler by a difference between the thickness of the sealant and the thickness of the display unit. 8. The method of claim 7, Wherein the display unit includes a plurality of light emitting regions in which light is emitted and a non-emitting region protruding from the light emitting region between the plurality of light emitting regions, Wherein the thickness of the display portion is a thickness of the non-emission region. 10. The method of claim 9, When the substrate and the sealing substrate are bonded to each other through the sealant, Wherein the filler is provided between the encapsulation substrate and the non-emission region. 10. The method of claim 9, When the substrate and the sealing substrate are bonded to each other through the sealant, Wherein the filling material is not filled in the light emitting region.

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