JP4736602B2 - Organic EL element sealing method and sealing device - Google Patents

Description

  The present invention relates to an organic EL element forming member in which an organic EL element is formed on one surface side of a plate-like first base material, on the entire surface of the organic EL element forming surface or around the organic EL element forming region. The present invention relates to a sealing method and a sealing device in which a plate-like second base material is bonded and disposed through an adhesive portion as a material to isolate an organic EL element from the atmosphere.

In recent years, flat display devices (hereinafter also referred to as flat displays) have been used in many fields and places, and their importance has been increasing as information technology advances.
Currently, a typical flat display is a liquid crystal display (hereinafter also referred to as LCD), but organic EL, inorganic EL, and plasma display panels (hereinafter also referred to as PDP) are flat displays based on a display principle different from LCD. A light emitting diode display device (hereinafter also referred to as LED), a fluorescent display tube display device (hereinafter also referred to as VFD), a field emission display (hereinafter also referred to as FED), and the like are being actively developed.
Each of these new flat displays is called a self-luminous type, and differs greatly from the LCD in the following points, and has an excellent feature that the LCD does not have.
The LCD is called a light-receiving type, and the liquid crystal does not emit light by itself, but operates as a so-called shutter that transmits and blocks external light, and constitutes a display device.
For this reason, a light source is required, and generally a backlight is required.
In contrast, the self-luminous type does not require a separate light source because the device itself emits light.
In a light receiving type such as an LCD, the backlight is always lit regardless of the state of display information, and power that is almost the same as that in the full display state is consumed.
On the other hand, the self-luminous type has an advantage that the power consumption is lower than that of the light receiving type display device because only the portion that needs to be lit according to the display information consumes power.
In LCD, the light from the backlight source is shielded to obtain a dark state, so even if it is a small amount, it is difficult to completely eliminate light leakage. Therefore, an ideal dark state can be easily obtained, and the self-luminous type is overwhelmingly superior in contrast.
Further, since the LCD uses polarization control based on the birefringence of the liquid crystal, the so-called viewing angle dependency that the display state largely changes depending on the viewing direction is strong, but the self-luminous type has almost no problem.
Furthermore, since the LCD uses an orientation change derived from the dielectric anisotropy of liquid crystal, which is an organic elastic material, in principle, the response time to an electric signal is 1 msec or more.
On the other hand, the above-described technology, which is under development, uses so-called carrier transitions such as electrons and holes, electron emission, plasma discharge, etc., so the response time is on the order of nsec. It is so fast that there is no problem of afterimages due to the slow response of the LCD.

Among these, research on organic EL is particularly active.
The organic EL is also referred to as OEL (Organic EL) or organic light emitting diode (OLED).
The OEL element and the OELD element have a structure in which an organic compound (EL layer) is sandwiched between a pair of electrodes of an anode and a cathode, such as Tang et al., “Anode electrode / hole injection layer / light emitting layer / cathode electrode”. "Is a basic structure. (Patent No. 1526026)
In addition, Tang et al. Uses a low molecular weight material, whereas Nakano et al. Uses a high molecular weight material. (Japanese Patent Laid-Open No. 3-273087)
In addition, the efficiency is improved by using a hole injection layer or an electron injection layer, or the emission color is controlled by doping a light emitting layer with a fluorescent dye or the like.
Here, the pixel electrode and the counter electrode correspond to either an anode or a cathode, and constitute a pair of electrodes.
All layers provided between the pair of electrodes are collectively called an EL layer, and include the hole injection layer, hole transport layer, light emitting layer, electron transport layer, and electron injection layer described above. It is.
Japanese Patent No. 1526026 JP-A-3-230787

FIG. 4 shows a cross-sectional structure of the organic EL element.
Organic EL emits light by applying an electric field between the electrodes and passing an electric current through the EL layer. Conventionally, it used only fluorescence emission when returning from the excited state to the ground state. As a result, the phosphorescence emission upon returning from the triplet excited state to the ground state can be used effectively, and the efficiency is improved.
Usually, after forming the opposite electrode 3 on a translucent support substrate (substrate 2) such as a glass substrate or a plastic substrate, a light emitting layer (also referred to as an organic EL layer) 4 and a counter electrode 5 are formed in this order. Is done.
In general, the anode is often a translucent electrode such as ITO, and the cathode is often made of a metal and is a non-translucent electrode.
Although not shown in FIG. 4, the organic EL element is significantly deteriorated in characteristics due to moisture and oxygen. Therefore, in general, after filling the substrate with an inert gas so that the element does not touch moisture or oxygen, a separate substrate is formed. Used or sealed by thin film deposition to ensure reliability.

As a method for forming the EL layer, a vacuum deposition method is generally used for a low molecular material, and a solution is used for a polymer material, and a spin coating, a printing method, or a transfer method is used.
When forming a fine pixel as a display device, a mask vapor deposition method is used for a low molecular material, and an inkjet method, a printing method, a transfer method, or the like is used for a high molecular material.
In recent years, low molecular weight materials that can be applied have also been reported.

Such an organic EL device is sealed in an environment with as little oxygen and moisture as possible in order to overcome its lifetime problem, and can continue to be shut off from the outside air by a sealing function even in the subsequent atmospheric environment. is required.
Conventionally, as a sealing method, a method of adhering the outer periphery of a substrate on which an organic EL element is arranged and a back substrate with an adhesive for sealing in an inert gas-filled environment has been adopted.
However, this sealing method is performed in an inert gas-filled environment, but there is a disadvantage that a minute amount of oxygen or moisture is unavoidable, and an inert gas is present in the sealing portion during sealing adhesion. There is a possibility that the portion where the air is bitten is connected to the outside air, and there is a problem that a sufficient sealing effect cannot be achieved in the atmosphere.

As described above, in recent years, a self-luminous organic EL element has attracted attention and has been developed as a flat display. However, in a conventional inert gas-filled environment, the substrate and the back substrate on which the organic EL element is arranged are arranged. In the sealing method in which the outer periphery is bonded with an adhesive for sealing, there is a disadvantage that a minute amount of oxygen or moisture is unavoidably mixed into the organic EL element. There is a possibility that the portion where the inert gas is bitten is connected to the outside air, and a sufficient sealing effect cannot be achieved in the atmosphere.
The present invention corresponds to these, and there is a problem of mixing a small amount of oxygen and moisture into the organic EL element in the conventional sealing method, and an inert gas is caught in the sealing part at the time of bonding for sealing. An attempt to provide an organic EL element sealing method and an organic EL element sealing device that can solve the problem that the part may later become a continuity with the outside air and cannot provide a sufficient sealing effect in the atmosphere. Is.

In the organic EL element sealing method of the present invention, an organic EL element forming member in which an organic EL element is formed on one surface of a plate-like first base material is formed on the entire surface of the organic EL element forming surface or on the organic EL element. A sealing method for adhering and arranging a plate-like second base material via an adhesive portion as a sealing material disposed around an element formation region, and isolating the organic EL element from the atmosphere, the organic EL element and forming member, and an adhesive layer mounting member to the sealing adhesive layer arranged in a region corresponding to the entire surface or organic EL element forming region near a surface of the second substrate as a sealing material, an inert gas In the chamber placed in the inert gas chamber filled with , the organic EL element side and the sealing adhesive side face each other in a state where they are separated and the pressure of the inert gas atmosphere is reduced The organic EL element forming member and the adhesive layer arrangement portion DOO superimposed and parallel, and further stacking pressed both members, and, heated, and is characterized in that the sealing.
And it is the sealing method of the organic EL element of any one of said 1st, Comprising: Both the said organic EL element formation member and an adhesive bond arrangement | positioning member are laminated-pressurized at 10 Pa-10,000 Pa. It is characterized by this.
Also, any one of the above-described organic EL element sealing methods, wherein at least one of the organic EL element forming member and the adhesive layer disposing member is held by an electrostatic holding method. It is.
Further, in any one of the above-described organic EL element sealing methods, the sealing adhesive layer is made of a thermosetting adhesive, and is cured by the heating. At least one of the organic EL element forming member and the adhesive layer arranging member is held by an electrostatic method, and the heating is performed at 50 ° C. to 100 ° C.
Also, in any one of the above-described organic EL element sealing methods, the first base material and the second base material are a glass substrate or a resin film.

Here, an organic EL element forming member in which an organic EL element is formed on one surface side of a plate-like first base material is also referred to as an organic EL forming substrate, and light emission is emitted from the first substrate side. The second substrate as a sealing body for isolating the organic EL element from the atmosphere is also referred to as a back substrate.
Here, the arrangement of the organic EL element forming member and the adhesive layer arranging member is not limited.
Further, the timing of depressurization and opening of the chamber may be various as long as it is after the lamination pressurization of both members.
In addition, here, the inert gas is a gas type that does not cause deterioration of the function of the organic EL element, preferably high safety, good workability, inexpensive and general purpose, N ² gas corresponds to this.

The organic EL element sealing device according to the present invention includes an organic EL element forming member in which an organic EL element is formed on one surface side of a plate-like first substrate, the entire surface of the organic EL element forming surface side, or an organic EL element. The organic EL element forming member is a sealing method in which a plate-like second base material is bonded and disposed through an adhesive portion as a sealing material disposed around the element forming region, and the organic EL element is isolated from the atmosphere. And an adhesive layer arrangement member in which an adhesive layer for sealing as a sealing material is disposed on the entire surface of one surface of the second substrate or a region corresponding to the periphery of the organic EL element formation region, in an inert gas atmosphere. The organic EL element forming member and the adhesive layer are arranged in an environment apart from each other, with the pressure of the inert gas atmosphere reduced, and the organic EL element side and the sealing adhesive side facing each other. Laminate with the arrangement member parallel to each other, and further laminate both members A sealing device for performing a method of sealing an organic EL element to be pressed and heated to seal, and an inert gas chamber filled with an inert gas, and the inert gas chamber disposed in the sealing device A chamber having a decompression mechanism, and in the chamber, the organic EL element forming member and the adhesive layer disposing member are respectively held in parallel by a pair of plate-shaped holding portions, A holding pressure adjusting unit capable of adjusting the pressure at the time of laminating and pressing the two members held by the holding unit, and a heating unit for performing the heating; It is characterized by this.
And it is said organic EL element sealing apparatus, Comprising: The said holding | maintenance pressurization adjustment part is equipped with the 1st holding | maintenance part in the ground side, and the 2nd holding | maintenance part in the top | side, The organic EL element forming member and the adhesive layer disposing member are respectively held, the gap between the two members is narrowed, the two members are sandwiched, and the two members are laminated with a pressure adjusted in a laminated state. The second holding unit on the top side is held by an electrostatic holding method.
Also, in any one of the above-described organic EL element sealing methods, at least one of the holding portions is a heat plate that also serves as a heating portion.

(Function)
The organic EL device sealing method of the present invention is configured as described above, so that there is a problem of mixing a small amount of oxygen or moisture into the organic EL device in the conventional sealing method, or when bonding for sealing. Providing a method for sealing an organic EL element that can solve the problem that a portion where an inert gas is entrained in the sealing portion may later become conductive with the outside air and a sufficient sealing effect cannot be achieved in the atmosphere. Is possible.
Specifically, after further reducing the pressure in an inert gas-filled environment, the organic EL element forming member provided with the organic EL element and the adhesive layer providing member are bonded to each other after sealing. The mixing of oxygen and moisture in the initial state is suppressed to a very low level, and the inert gas biting of the sealing part in the conventional sealing method can be eliminated, and as a result, a good sealing effect can be obtained. .
Specifically, the organic EL element forming member and the adhesive layer arrangement in which the sealing adhesive layer for the sealing material is arranged on the entire surface of the second substrate or the area corresponding to the periphery of the organic EL element forming area. In the chamber disposed in the sealed chamber filled with the inert gas , the installation member is disposed in a separated state, and the pressure of the inert gas atmosphere is reduced, and the organic EL element side is bonded to the sealing The agent sides face each other, the organic EL element forming member and the adhesive layer disposing member are overlapped in parallel, and further, both members are stacked and pressurized, and heated to be sealed. Have achieved .
Also, both the organic EL element forming member and the adhesive layer mounting member, by the form of the invention of claim 2 which applies stack pressure at 10Pa～10,000Pa, reliably, damage to the organic EL device Thus, sealing can be performed without giving any oxygen, thereby making it possible to suppress the mixing of oxygen and moisture.
In particular, at least one holding the organic EL element forming member adhesive layer mounting member, by the form of the invention of claim 3 carried out in an electrostatic holding system, in a reduced pressure environment, the organic EL element forming member And at least one of the adhesive layer arrangement members can be held.
In a reduced pressure environment, for example, the organic EL element forming member and the adhesive layer disposing member are directed to the ground side and held by vacuum suction from the first base material side or the second base material side. If it is, it cannot be held against its own weight, and when held by a jig, each member may become wrinkled, and when each substrate is a film, it can also be kept flat. It is also difficult to do.
In addition, the sealing adhesive layer is made of a thermosetting adhesive and is cured by the heating. In this case, the organic EL element forming member and the adhesive layer arranging member In the case where at least one holding is performed by an electrostatic holding method, a normal commercially available electrostatic adhesive chuck cannot be 100 ° C. or higher, and is 50 ° C. or higher from the viewpoint of the curing treatment. It is necessary to perform the heating at 0 ° C.
Moreover, a glass substrate or a resin film is mentioned as a 1st base material and a 2nd base material.

  The organic EL element sealing device of the present invention has such a configuration, so that a problem of mixing of a small amount of oxygen and moisture into the organic EL element in the conventional sealing method, and sealing adhesion can be achieved. Providing a sealing device for organic EL elements that can solve the problem that the portion where the inert gas is entrained in the sealing portion may later become a continuity with the outside air and the sufficient sealing effect cannot be achieved in the atmosphere. Is possible.

  As described above, the present invention has a problem of mixing a small amount of oxygen and moisture into the organic EL element in the conventional sealing method, and a portion where an inert gas is bitten into the sealing portion at the time of bonding for sealing. Is capable of providing a method for sealing an organic EL element and a sealing device for an organic EL element, which can solve the problem that a sufficient sealing effect cannot be achieved in the atmosphere. did.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view showing an example of an apparatus for carrying out an organic EL element sealing method of the present invention, and FIG. 2 is an example of an embodiment of an organic EL element sealing method of the present invention. FIG. 3 is a cross-sectional view showing an example of an organic EL element forming substrate sealed by the organic EL element sealing method of the present invention.
In addition, S1-S8 in FIG. 2 shows a processing step.
1-3, 10 is an inert gas chamber, 11 is a wall, 12 is a holding pressure adjusting unit, 12a is a holding unit (also referred to as a first holding unit), and 12b is an electrostatic holding unit. Part (also referred to as second holding part), 12c is a pressure adjusting part, 13 is a chamber, 14 is a pressure reducing part, 15 is a pressure reducing opening part (also called a valve), 16 is a heating part, and 20 is an organic EL element forming member. , 21 is a first substrate (here, a glass substrate), 22 is an organic EL element portion, 22a is a first electrode wiring, 22b is an organic EL portion, 22c is a second electrode wiring, and 30 is an adhesive layer arrangement. The installation member, 31 is a second substrate (here, a film substrate), 32 is a sealing adhesive layer, 32A is a cured sealing adhesive layer (also referred to as an adhesive portion), and 40 is (sealed). E) Display member.

One example of an embodiment of a method for sealing an organic EL element of the present invention will be described with reference to the drawings.
This example is a sealing method for producing a display member using an organic EL element. As shown in FIG. 3, the organic EL element 22 is provided on one surface side of a plate-like first base material 21 made of a glass substrate. A plate-like second base material 31 made of a resin film is bonded to the organic EL element forming member 20 formed with a resin film on the surface side of the organic EL element forming 22 via an adhesive portion 32A serving as a sealing material. This is an example of a sealing method when a display unit having a structure in which the organic EL element is disposed and isolated from the atmosphere is manufactured.
Briefly, an organic EL element forming member 20 in which an organic EL element 22 is formed on one surface side of a plate-like first base material 21 made of a glass substrate, and a thermosetting sealing adhesive for a sealing material The adhesive layer disposing member 30 having the layer 32 disposed on the entire surface of the second substrate 31 is disposed in a separated state in an inert gas atmosphere, and the pressure of the inert gas atmosphere is reduced. In this state, the organic EL element 22 side and the sealing adhesive 32 side face each other, the organic EL element forming member 20 and the adhesive layer disposing member 30 are overlapped in parallel, and both the members are stacked. Pressurization and heating are performed, sealing is performed, and the reduced pressure is released to obtain the above-described display unit.

First, an example of an apparatus for carrying out the organic EL element sealing method of this example will be briefly described with reference to FIG.
In addition, it replaces with description of the embodiment of the sealing apparatus of the organic EL element of this invention by this. The organic EL element sealing device shown in FIG. 1 includes an inert gas chamber 10 filled with an inert gas N ² gas and a chamber filled with the inert gas disposed in the inert gas chamber 10. 13 is provided with a decompression section 14 for decompressing the pressure in 13 and a decompression release section 15.
Further, in the chamber 13, the organic EL element forming member 20 and the adhesive layer disposing member 30 are electrostatically connected to a pair of plate-like holding portions, a mounting holding portion (first holding portion) 12 a. In the expression holding part (second holding part) 12b, each pressure is held in parallel and can be overlapped in parallel, and the pressure when the members 20 and 30 held by both holding parts are stacked and pressurized is applied. A holding pressure adjusting unit 12 that can be adjusted, and a heating unit 16 for performing the heating are provided.

As the first holding portion 12a, aluminum (hereinafter referred to as Al) is used from the viewpoint of thermal conductivity, etc., but it has good thermal conductivity, good workability, and can hold the organic EL element forming member 20 with good flatness. If there is, it is not limited to this.
Since the second holding portion 12b is movable in the vertical direction and is held by an electrostatic method, the material of the surface on the holding side is limited.
In the electrostatic system, the electrode part is housed in the second holding part, and the electric charge is generated by control to hold the adhesive layer arrangement member 30. At present, the electrostatic chuck or the like is used. It is marketed under the name of.
Here, the holding surfaces of the first holding unit 12a and the second holding unit 12b are parallel to each other.
As will be described later, in the case of this example, the cylinder is moved in the ground direction by the positive pressure pressurization by the pressurization adjustment unit 12c, and the cylinder (not shown) is moved upward by the negative pressure pressurization by the pressurization adjustment unit 12c. To move the second holding portion 12b connected to the cylinder. Here, aluminum is used as the base material of the second holding portion 12b, but this is not a limitation.

The holding pressure adjusting unit 12 includes a first holding unit 12a for placing the organic EL element forming member 20 on the entire surface of the first base material 21 on the ground side, and an adhesive layer arranging member 30 on the top side. A second holding portion 12b that uniformly and electrostatically holds the entire surface of the second base material 31, and each holding portion 12a, 12b holds both members 20, 30, respectively, In the state where the interval 30 is narrowed, the both members 20 and 30 are sandwiched and the both members are laminated, the lamination pressure is applied with the pressure adjusted by the pressure adjusting unit 12c.
Examples of the pressure adjusting unit 12c include those having an air cylinder configuration that controls the pressure to be pressurized by air for positive pressure and air for negative pressure.
The pressurization depends on the thickness of the sealing adhesive layer 32 and the material thereof, but the sealing effect is obtained at about 10,000 Pa or less that does not damage the organic EL element. Control is performed at 10 Pa or more at which a suitable spread of the stopping adhesive layer 32 can be expected.
Preferably, it is 3000 Pa to 6000 Pa.
In the case of this example, the second holding part 12b uses an aluminum plate, and since the pressure due to the weight of the second holding part 12b is large, a negative pressure is applied by the pressure adjusting part 12c so as to reduce the pressure of the own weight. To adjust the lamination pressure.
In this example, the pressure adjusting unit 12c of the holding pressure adjusting unit 12 is a driving source for moving the second holding unit 12b to the first holding unit 12a side, and the pressure adjusting unit 12c The cylinder is moved as a predetermined positive pressure and moved in the ground direction, and the pressure adjusting unit 12c is moved as a predetermined negative pressure and moved in the upward direction.

Further, in this example, the first holding portion 12a includes the overheating portion 16 capable of uniformly heating the entire surface of the organic EL element forming member 20 or both the members 20 and 30, and the first holding portion 12a. Is also a heat plate.
When the adhesive layer 32 is thermosetting, the heating is required to be higher than the curing temperature. However, since the electrostatic second holding portion is used, the heating is generally not 100 ° C. or lower. And since a holding | maintenance function will be impaired, normally, it heats in the range of 50 to 100 degreeC.

The chamber is required to be capable of withstanding decompression and decompression and capable of operating each part without problems.
The decompression unit 14 performs evacuation and is a VAC pump or the like.
The decompression release unit 15 performs vacuum release, and here is an open / close valve.
Usually, the lower the pressure, the better the oxygen content from the viewpoint of the oxygen content, but 30,000 Pa or less is sufficient from the aspect of the sealing effect.
Since it is 30,000 Pa to 5,000 Pa, preferably 30,000 Pa to 20,000 Pa, the wall portion of the chamber 13 may be made of resin such as acrylic, but is not limited thereto.

Next, an example of processing of the organic EL element sealing method of this example when the sealing device shown in FIG. 1 is used will be described based on FIG.
First, an organic EL element forming member 20 in which an organic EL element is formed on one surface of a first base 31 made of a glass substrate in advance, and a sealing adhesive layer 32 for a sealing material are provided on the second substrate 31. The adhesive layer disposing member 30 disposed on the entire surface of the surface is prepared, and both the members 20 and 30 are put into the inert gas chamber 10 filled with an inert gas atmosphere made of N ² . (S1)
Normally, in the inert gas chamber 10 filled with an inert gas atmosphere made of N ² , the oxygen content can be 1 ppm or less.
Next, in a state where the chamber 13 is opened and the inert gas atmosphere is filled, the organic EL element forming member 20 is placed on the first holding portion 12a in the chamber with the organic EL layer portion 22 side on the top side. In addition, the second base material 31 is electrostatically held by the second holding portion 12b in the chamber with the adhesive layer arranging member 30. (S2)
Next, the chamber is closed, and the members 20 and 30 are separated from each other. (S3)
Generally, the lower the pressure is, the lower the pressure is, from the viewpoint of the oxygen content. Here, the pressure is reduced to a range of 30, 0 to 5,000 Pa, preferably 30,000 Pa to 20,000 P. Next, the cylinder is moved as a predetermined positive pressure by the pressurizing adjustment unit 12c, and the distance between the first holding unit 12a and the second holding unit 12b is narrowed, whereby the organic EL element forming member 20 and the adhesive layer The space between the mounting member 30 is narrowed, and the both members 20 and 30 are sandwiched between the holding portions 12a and 12b. (S4)
In this example, the pressure adjusting unit 12c of the holding pressure adjusting unit 12 is a driving source for moving the second holding unit 12b to the first holding unit 12a side, and the pressure adjusting unit 12c The cylinder is moved as a predetermined positive pressure and moved in the ground direction, and the cylinder is moved as the predetermined negative pressure in the upward direction by the pressurizing adjustment unit 12c.
Next, after sandwiching, the pressure of the pressure adjusting unit 12c is adjusted to a predetermined pressure, the members 20 and 30 are stacked and pressurized, and simultaneously heated to a predetermined temperature (S5), and the sealing adhesive layer 32 is formed. Harden. (S6) The pressurization is performed in a range of 10 Pa to 10,000 Pa, preferably 3000 Pa to 6000 Pa, although it depends on the thickness of the sealing adhesive layer 32 and its material.
Heating is usually performed in the range of 50 ° C to 100 ° C.
Next, after the decompression is released (S7), the display unit (see FIG. 3) sealed from the inert gas 10 is further taken out from the chamber 13. (S8)
In this way, sealing is performed.

In addition, this example is one example and this invention is not limited to this.
In this example, a sealing adhesive layer for sealing material is disposed on the entire surface of the second substrate, and sealing is performed, but the periphery of the organic EL element forming region on the surface of the second substrate is used. There is also a mode in which sealing is performed by providing a sealing adhesive layer for sealing material only on the top.
In this example, a thermosetting adhesive layer is used as the sealing adhesive layer 32, but the present invention is not limited to this.
For example, a UV curable adhesive layer having a good sealing effect may be used.
In addition, as the thermosetting adhesive layer, an epoxy type or the like is generally used.

It is the schematic sectional drawing which showed one example of the apparatus for enforcing the sealing method of the organic EL element of this invention. It is the flowchart which showed one example of the processing flow of one example of embodiment of the sealing method of the organic EL element of this invention. It is sectional drawing which showed one example of the organic EL element formation board | substrate sealed with the sealing method of the organic EL element of this invention. It is sectional drawing which showed one example of the cross-sectional structure of an organic EL element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emission 2 Board | substrate 3 Transparent electrode 4 Light emitting layer 5 Heavy rain electrode 10 Inert gas chamber 11 Wall part 12 Holding | maintenance pressurization adjustment part 12a Mounting holding part (it is also called 1st holding part)
12b Electrostatic holding part (also referred to as second holding part)
12c Pressurization adjustment unit 13 Chamber 14 Decompression unit 15 Depressurization release unit (also referred to as valve)
16 heating part 20 organic EL element formation member 21 1st base material (here glass substrate)
22 organic EL element part 22a 1st electrode wiring 22b organic EL part 22c 2nd electrode wiring 30 Adhesive layer arrangement | positioning member 31 2nd base material (here film base material)
32 Sealing adhesive layer 32A Hardened sealing adhesive layer (also referred to as adhesive)
40 (sealed) display member

Claims (10)

Adhesion as an organic EL element forming member having an organic EL element formed on one surface side of a plate-like first base material as a sealing material disposed on the entire surface of the organic EL element forming surface or around the organic EL element forming region A sealing method for adhering and arranging a plate-like second base material through a section and isolating the organic EL element from the atmosphere, wherein the organic EL element forming member is used for sealing as a sealing material A chamber in which an adhesive layer disposing member in which an adhesive layer is disposed on the entire surface of one surface of the second substrate or an area corresponding to the periphery of the organic EL element forming region is disposed in an inert gas chamber filled with an inert gas. The organic EL element side and the sealing adhesive side face each other with the pressure of the inert gas atmosphere reduced, and the organic EL element forming member and the adhesive layer arrangement Laminate them in parallel with each other, and further Wood laminated pressurized, and heated to, sealing method of an organic EL element characterized in that sealing. It is the sealing method of the organic EL element of Claim 1 , Comprising: Both the said organic EL element formation member and an adhesive bond arrangement | positioning member are laminated-pressurized at 10 Pa-10,000 Pa, It is characterized by the above-mentioned. Organic EL element sealing method. 3. The organic EL element sealing method according to claim 1, wherein at least one of the organic EL element forming member and the adhesive layer disposing member is held by an electrostatic holding method. A method for sealing an organic EL element, which is performed. It is a sealing method of the organic EL element of any one of Claim 1 thru | or 3 , Comprising: The said adhesive layer for sealing consists of a thermosetting adhesive agent, and is hardened | cured by the said heating. An organic EL element sealing method. It is a sealing method of the organic EL element of Claim 4 , Comprising: At least one holding | maintenance of the said organic EL element formation member and an adhesive bond layer arrangement | positioning member is performed by an electrostatic system, 50 to 100 degreeC. A method for sealing an organic EL element, wherein the heating is performed at a temperature of ° C. A method of sealing an organic EL device according to any one of claims 1 to 5, the first substrate, organic second substrate, which is a glass substrate or a resin film EL element sealing method. Adhesion as an organic EL element forming member having an organic EL element formed on one surface side of a plate-like first base material as a sealing material disposed on the entire surface of the organic EL element forming surface or around the organic EL element forming region The organic EL element forming member and the sealing adhesive as a sealing material are sealed in a manner of adhering and arranging the plate-like second base material through the section and isolating the organic EL element from the atmosphere. An adhesive layer disposing member in which a layer is disposed on the entire surface of one surface of the second substrate or an area corresponding to the periphery of the organic EL element forming region, and disposed in a remote state in an inert gas atmosphere environment, In a state where the pressure of the inert gas atmosphere is reduced, the organic EL element side and the sealing adhesive side face each other, the organic EL element forming member and the adhesive layer disposing member are overlapped in parallel, Both members are laminated and pressurized, heated and sealed A sealing device for performing a sealing method of an EL element, which is an inert gas chamber filled with an inert gas, a chamber disposed in the inert gas chamber and provided with a decompression mechanism, and the chamber Inside, the organic EL element forming member and the adhesive layer disposing member are held in parallel by a pair of plate-like holding portions, and can be superposed in parallel and held by the holding portion. An organic EL element sealing device comprising: a holding pressure adjusting unit capable of adjusting a pressure at the time of laminating and pressurizing both members, and a heating unit for performing the heating. . 8. The organic EL element sealing device according to claim 7 , wherein the holding pressure adjusting unit includes a first holding unit on the ground side and a second holding unit on the top side, and each holding unit. Respectively, hold the organic EL element forming member and the adhesive layer disposing member, reduce the distance between the two members, sandwich the two members, and adjust the pressure in a state where the two members are stacked. A device for sealing an organic EL element, wherein the organic EL element is laminated and pressurized. 9. The organic EL element sealing device according to claim 8 , wherein the second holding portion is held on the top side by an electrostatic holding method. 10. The method for sealing an organic EL element according to claim 7 , wherein at least one holding part is a heat plate that also serves as a heating part. apparatus.

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