CN104051669B - Base plate for packaging, method for packing, display floater - Google Patents
Base plate for packaging, method for packing, display floater Download PDFInfo
- Publication number
- CN104051669B CN104051669B CN201410231268.6A CN201410231268A CN104051669B CN 104051669 B CN104051669 B CN 104051669B CN 201410231268 A CN201410231268 A CN 201410231268A CN 104051669 B CN104051669 B CN 104051669B
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- Prior art keywords
- base plate
- packaging
- substrate
- bearing course
- barrier layer
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000012856 packing Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 238000005538 encapsulation Methods 0.000 claims abstract description 36
- 230000004888 barrier function Effects 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- BAZVSMNPJJMILC-UHFFFAOYSA-N triadimenol Chemical compound C1=NC=NN1C(C(O)C(C)(C)C)OC1=CC=C(Cl)C=C1 BAZVSMNPJJMILC-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention provides a kind of base plate for packaging, method for packing, display floater, belong to Display Technique field, it can solve the problem that existing base plate for packaging easily damages in encapsulation process.Base plate for packaging of the present invention comprises substrate, and is located at the bearing course of described substrate for the contact pressure head side when encapsulating, and described bearing course is at the area coincidence of suprabasil projection with described substrate corresponding encapsulation region when encapsulating.The present invention can be used for the encapsulation of organic LED display panel, the encapsulation of especially flexible organic LED display panel.
Description
Technical field
The invention belongs to Display Technique field, be specifically related to a kind of base plate for packaging, method for packing, display floater.
Background technology
Have many for carrying out the display structure shown in display floater, such as Organic Light Emitting Diode (OLED), liquid crystal layer etc., in use sustain damage for avoiding these display structures, therefore need in process of production they to be closed itself and external environment are separated, this process is called " encapsulation "; Wherein, the region be closed is called encapsulation region, is usually also provided with the marginal zone for arranging lead-in wire etc. outside encapsulation region.
Fig. 1 shows a kind of method for packing of organic LED display panel, barrier layer 22 (BF, Barrierfilm) be adhered in the substrate 21 (mostly being glass plate) of base plate for packaging 2, the encapsulation region Q1 of this barrier layer 22 just in time corresponding organic LED array substrate 1, pressurize with pressure head 9 pairs of base plate for packaging 2 afterwards, barrier layer 22 is bonded on the encapsulation region Q1 of organic LED array substrate 1 and (in barrier layer 22, can tack coat be comprised), thus close display structure 11 (such as Organic Light Emitting Diode) wherein; Afterwards, the substrate 21 of base plate for packaging 2 can be separated with barrier layer 22, only leave barrier layer 22 and protect display structure 11 (be used for flexible display panels, because substrate 21 is rigidity, therefore can not stay in flexible display panels).As can be seen from Fig. 1, for avoiding the structural damage in the Q2 of marginal zone, therefore base plate for packaging 2 is greater than encapsulation region Q1 (being namely greater than barrier layer 22), and pressure head 9 is as common apparatus, and its size will meet the requirement of maximum base plate for packaging 2; Therefore, in encapsulation process, base plate for packaging 2 does not have the part on barrier layer 22 (i.e. the part of corresponding array base palte marginal zone Q2) be under pressure yet, and without hindrance barrier 22 supports below the substrate 21 of this part base plate for packaging 2, therefore it is one side pressurized, therefore easily chipping, affect package quality.
Summary of the invention
Technical problem to be solved by this invention comprises, and for the problem that existing base plate for packaging easily damages in encapsulation process, provides a kind of non-damageable base plate for packaging, method for packing, display floater.
The technical scheme that solution the technology of the present invention problem adopts is a kind of base plate for packaging, and it comprises substrate, and
Be located at the bearing course of described substrate for the contact pressure head side when encapsulating, described bearing course is at the area coincidence of suprabasil projection with described substrate corresponding encapsulation region when encapsulating.
Preferably, described base plate for packaging also comprises: be located at the barrier layer of described substrate away from bearing course side, and the projection on the substrate of described barrier layer and bearing course overlaps.
Preferably, described bearing course is made up of transparent material.
Preferably, described bearing course is made up of resin material.
Further preferably, described bearing course is made up of Triafol T or PETG.
Preferably, the thickness of described bearing course is between 0.4 ~ 0.6 millimeter.
The technical scheme that solution the technology of the present invention problem adopts is a kind of method for packing, and it comprises:
Above-mentioned base plate for packaging is made not have the side of bearing course to contact with first substrate;
Pressure head is made to contact the bearing course of described base plate for packaging and to its pressurization, encapsulate described first substrate.
Preferably, described first substrate is organic LED array substrate, and described base plate for packaging is the above-mentioned base plate for packaging with barrier layer.
Preferably, after described first substrate is encapsulated, also comprise: the substrate of described base plate for packaging is separated with described barrier layer.
The technical scheme that solution the technology of the present invention problem adopts is a kind of display floater, and it is encapsulated by said method.
Because base plate for packaging of the present invention comprises bearing course, therefore substrate only has the part of band bearing course to be just stressed when encapsulating, and bearing course is corresponding with encapsulation region, barrier layer or other bearing structure (such as chock insulator matter) must be provided with in encapsulation region, therefore the substrate both sides of this part pressurized simultaneously, therefore the situations such as broken can not occur, thus improve package quality.
The present invention is applicable to the encapsulation of organic LED display panel, the encapsulation of especially flexible organic LED display panel.
Accompanying drawing explanation
Fig. 1 is structural representation when encapsulating with existing base plate for packaging;
Fig. 2 is the structural representation of the base plate for packaging of embodiments of the invention 1;
Fig. 3 is structural representation when encapsulating with the base plate for packaging of embodiments of the invention 1;
Wherein Reference numeral is: Q1, encapsulation region; Q2, marginal zone; 1, organic LED array substrate; 11, display structure; 2, base plate for packaging; 21, substrate; 22, barrier layer; 23, bearing course; 9, pressure head.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Embodiment 1:
As shown in Figure 2, the present embodiment provides a kind of base plate for packaging 2, and it comprises substrate 21, and this substrate 21 can be made up of materials such as glass.
Wherein, be also provided with bearing course 23 in substrate 21 for the side of the contact pressure head 9 when encapsulating, and the area coincidence of this bearing course 23 projection in substrate 21 and substrate 21 corresponding encapsulation region Q1 when encapsulating.
That is, in the one side of substrate 21 for pressurized, be also provided with bearing course 23, and when encapsulating, the shape, size, position etc. of this bearing course 23 are all just in time corresponding with encapsulation region Q1.The base plate for packaging 2 of the present embodiment comprises bearing course 23, therefore substrate 21 only has the part of band bearing course 23 to be just stressed when encapsulating, and bearing course 23 is corresponding with encapsulation region Q1, barrier layer 22 or other bearing structure (such as chock insulator matter) must be provided with in the Q1 of encapsulation region, therefore these part of substrate 21 both sides pressurized simultaneously, therefore the situations such as broken can not occur, thus improve package quality.
Preferably, base plate for packaging 2 also comprises barrier layer 22, and the side of substrate 21 away from bearing course 23 is located on this barrier layer 22, and it overlaps with the projection of bearing course 23 in substrate 21.
That is, at base plate for packaging 2 for carrying out the side encapsulated, the barrier layer 22 of same corresponding encapsulation region Q1 can be provided with, this barrier layer 22 is for being enclosed in wherein by the display structure 11 in the Q1 of encapsulation region, thus the substrate 21 of base plate for packaging 2 can be removed after having encapsulated, in display floater, only retain barrier layer 22.This base plate for packaging 2 with barrier layer 22 is used for the encapsulation of organic LED display panel, the encapsulation of especially flexible organic LED display panel, this is because, the substrate 21 of base plate for packaging 2 normally rigidity, therefore can not stay in flexible organic LED display panel.
Certainly, although above with the preferred version of base plate for packaging 2 as the present embodiment with barrier layer 22, but be to be understood that, barrier layer 22 can be there is no in the base plate for packaging 2 of the present embodiment, such as base plate for packaging 2 can comprise the sealed plastic box around encapsulation region Q1, thus after packaging is accomplished, base plate for packaging 2 forms a part for display floater, the substrate 21 of base plate for packaging 2 and sealed plastic box close encapsulation region Q1 jointly.This do not have the base plate for packaging 2 on barrier layer 22 to can be used for organic LED display device, can be used for liquid crystal indicator (now its can as color membrane substrates) simultaneously yet.
Preferably, bearing course 23 is made up of transparent material.
Because bearing course 23 is positioned at encapsulation region Q1, therefore the light that encapsulation region Q1 penetrates is possibly through its injection, and in order to avoid affecting display effect, therefore it is preferably transparent material.
Preferably, this bearing course 23 can be made up of resin material, such as Triafol T (PVA) or PETG (PET).
Resin material cost is low, be easy to preparation, therefore is preferred.
Above resin material directly forms bearing course 23 by modes such as impression, coatings, or also first can form complete resin bed, forms bearing course 23 more afterwards by photoetching process resin bed.
Certainly, above bearing course 23 preparation method is not limitation of the invention, and bearing course 23 is also formed by other known materials and mode.Such as, bearing course 23 can be independently pad pasting, thus namely assigned address pad pasting being attached to substrate 21 forms bearing course 23.
Preferably, the thickness of above-mentioned bearing course 23 is between 0.4 ~ 0.6 millimeter.
Obviously, bearing course 23 should have enough thickness, otherwise can not play the effect preventing substrate 21 from damaging, simultaneously in order to avoid it produces harmful effect to display effect, display floater outward appearance etc., therefore it should be too not thick yet, find after deliberation, above thickness range is proper.
As shown in Figure 3, the present embodiment also provides a kind of method for packing, and it uses above-mentioned base plate for packaging 2, and this method for packing specifically comprises:
S01, side first substrate with display structure 11 are placed on board upward.
Preferably, first substrate is organic LED array substrate 1, is also described as example in the present embodiment.
Of course it is to be understood that this first substrate also can be other forms, such as, can be the array base palte of liquid crystal display; Or first substrate also can be the form of motherboard, namely one piece of first substrate can have multiple independently encapsulation region Q1, thus can cut it after encapsulation, once obtain multiple display floater.
S02, above base plate for packaging 2 is made not have the side of bearing course 23 to contact with organic LED array substrate 1.
Wherein, preferably, base plate for packaging 2 can be the base plate for packaging 2 with above-mentioned barrier layer 22, thus barrier layer 22 now can be made to contact with the encapsulation region Q1 of organic LED array substrate 1.
S03, contact with pressure head 9 base plate for packaging 2 bearing course 23 and to its pressurization, organic LED array substrate 1 is encapsulated.
That is, pressure head 9 is pressed down, because now base plate for packaging 2 has bearing course 23 in side upward, therefore pressure head 9 can contact bearing course 23 and not contact with substrate 21; And the pressure conduction of bearing course 23 is on barrier layer 22, barrier layer 22 is made to close display structure 11 in the encapsulation region Q1 of organic LED array substrate 1.
Visible, the now substrate 21 of corresponding encapsulation region Q1 is clipped between barrier layer 22 and bearing course 23, and two sides is pressurized simultaneously, therefore not fragile; And substrate 21 two sides of corresponding edge district Q2 is all unsettled, therefore it is not stressed, not fragile equally; Therefore, the method for packing of the present embodiment can avoid the damage of substrate 21.
S04, preferred, the substrate 21 of base plate for packaging 2 is separated with barrier layer 22.
That is, when to prepare be flexible display panels time, the substrate 21 of base plate for packaging 2 can be made to be separated with barrier layer 22, in other words by the substrate 21 " peeling " of base plate for packaging 2, thus only make barrier layer 22 stay in prepared display floater, play the effect of protection display structure 11; And this substrate 21 can attach again barrier layer 22, form new base plate for packaging 2, continue on for encapsulating other organic LED array substrates 1.
Embodiment 2:
The present embodiment provides a kind of display floater, and it is encapsulated by the method for above-described embodiment.
Wherein, this display floater is preferably organic LED display panel, is more preferably flexible organic LED display panel.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a base plate for packaging, comprises substrate, it is characterized in that, described base plate for packaging also comprises:
Be located at the bearing course of described substrate for the contact pressure head side when encapsulating, described bearing course is at the area coincidence of suprabasil projection with described substrate corresponding encapsulation region when encapsulating.
2. base plate for packaging according to claim 1, is characterized in that, also comprises:
Be located at the barrier layer of described substrate away from bearing course side, the projection on the substrate of described barrier layer and bearing course overlaps.
3. base plate for packaging according to claim 1 and 2, is characterized in that,
Described bearing course is made up of transparent material.
4. base plate for packaging according to claim 1 and 2, is characterized in that,
Described bearing course is made up of resin material.
5. base plate for packaging according to claim 4, is characterized in that,
Described bearing course is made up of Triafol T or PETG.
6. base plate for packaging according to claim 1 and 2, is characterized in that,
The thickness of described bearing course is between 0.4 ~ 0.6 millimeter.
7. a method for packing, is characterized in that, comprising:
The base plate for packaging in claim 1 to 6 described in any one is made not have the side of bearing course to contact with first substrate;
Pressure head is made to contact the bearing course of described base plate for packaging and to its pressurization, encapsulate described first substrate.
8. method for packing according to claim 7, is characterized in that,
Described first substrate is organic LED array substrate;
Described base plate for packaging is base plate for packaging according to claim 2.
9. method for packing according to claim 8, is characterized in that, after encapsulating described first substrate, also comprises:
The substrate of described base plate for packaging is separated with described barrier layer.
10. a display floater, is characterized in that,
Described display floater is encapsulated by the method for packing in claim 7 to 9 described in any one.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410231268.6A CN104051669B (en) | 2014-05-28 | 2014-05-28 | Base plate for packaging, method for packing, display floater |
| PCT/CN2014/087528 WO2015180332A1 (en) | 2014-05-28 | 2014-09-26 | Encapsulation substrate and encapsulation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410231268.6A CN104051669B (en) | 2014-05-28 | 2014-05-28 | Base plate for packaging, method for packing, display floater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104051669A CN104051669A (en) | 2014-09-17 |
| CN104051669B true CN104051669B (en) | 2016-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410231268.6A Active CN104051669B (en) | 2014-05-28 | 2014-05-28 | Base plate for packaging, method for packing, display floater |
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| Country | Link |
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| CN (1) | CN104051669B (en) |
| WO (1) | WO2015180332A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104051669B (en) * | 2014-05-28 | 2016-02-03 | 京东方科技集团股份有限公司 | Base plate for packaging, method for packing, display floater |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6228688B1 (en) * | 1997-02-03 | 2001-05-08 | Kabushiki Kaisha Toshiba | Flip-chip resin-encapsulated semiconductor device |
| CN100377377C (en) * | 2004-10-29 | 2008-03-26 | 夏普株式会社 | Manufacturing method for semiconductor light emitting device |
| JP4736602B2 (en) * | 2005-07-28 | 2011-07-27 | 大日本印刷株式会社 | Organic EL element sealing method and sealing device |
| JP5192646B2 (en) * | 2006-01-16 | 2013-05-08 | Ｔｏｗａ株式会社 | Optical element resin sealing method, resin sealing apparatus, and manufacturing method thereof |
| JP2007242738A (en) * | 2006-03-06 | 2007-09-20 | Sumitomo Metal Electronics Devices Inc | Light-emitting element storage package |
| JP2010107935A (en) * | 2008-10-28 | 2010-05-13 | Samsung Mobile Display Co Ltd | Flat panel display device and method of fabricating the same |
| CN102152598A (en) * | 2009-12-29 | 2011-08-17 | 芝浦机械电子装置股份有限公司 | Apparatus for laminating substrate and method for laminating substrate |
| CN101964398A (en) * | 2010-10-11 | 2011-02-02 | 福建钧石能源有限公司 | Flexible thin film solar cell and manufacturing method thereof |
| CN104051669B (en) * | 2014-05-28 | 2016-02-03 | 京东方科技集团股份有限公司 | Base plate for packaging, method for packing, display floater |
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- 2014-05-28 CN CN201410231268.6A patent/CN104051669B/en active Active
- 2014-09-26 WO PCT/CN2014/087528 patent/WO2015180332A1/en active Application Filing
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| Publication number | Publication date |
|---|---|
| CN104051669A (en) | 2014-09-17 |
| WO2015180332A1 (en) | 2015-12-03 |
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