CN109166826B

CN109166826B - Display panel and display device with same

Info

Publication number: CN109166826B
Application number: CN201810870724.XA
Authority: CN
Inventors: 邓冰; 刘建立; 敖伟; 王冰; 张羿
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2018-08-02
Filing date: 2018-08-02
Publication date: 2020-10-27
Anticipated expiration: 2038-08-02
Also published as: CN109166826A

Abstract

The present invention relates to a display panel including: an array substrate (1); the light emitting units (2) are arranged on the surface of the array substrate; a pixel defining layer (3) having a number of openings to accommodate the light emitting cells; a plurality of support columns (4) which are positioned on the pixel limiting layer and are arranged corresponding to the pixel limiting layer; and the buffer layer (5) is close to the support column and arranged on the same layer with the support column, and the height of the buffer layer is higher than that of the support column. According to the display panel and the display device with the display panel, the buffer layer is reasonably arranged around the supporting column, so that the damage of the supporting column caused by the fact that the impact stress of external force cannot be dispersed is avoided, functional devices including nearby light-emitting units are prevented from being damaged, and the impact resistance and shock resistance of the display panel are enhanced, so that the bad phenomena of black spots, bright spots, color spots and the like in a display area are prevented from being generated, and the product quality of the display screen is influenced.

Description

Display panel and display device with same

Technical Field

The invention belongs to the technical field of display screens, and particularly relates to a display panel and a display device with the same.

Background

The OLED display device has become mature in several generations of improved technologies, and is favored by more and more manufacturers and is gradually applied to various electronic products. The OLED screen has the obvious advantages of being light, thin, bendable and the like compared with screens made of LCD and the like, and on the other hand, the market also puts higher requirements on the structural strength and the anti-collision performance of OLED series products. When an OLED display screen is hit by a heavy object, the supporting columns are often damaged due to the fact that stress concentration cannot be dispersed, and even related elements below the supporting columns of the display panel are damaged, and finally, bad phenomena such as black spots, bright spots and color spots are generated in a display area.

Disclosure of Invention

The invention aims to solve the technical problem of providing a display panel with enhanced screen body impact strength and a display device with the display panel aiming at the defect of insufficient damage resistance of the traditional product.

A display panel, comprising:

an array substrate;

the plurality of light emitting units are arranged on the surface of the array substrate;

a pixel defining layer having a number of openings to accommodate the light emitting cells;

the supporting columns are positioned on the pixel limiting layer and are arranged corresponding to the pixel limiting layer;

and the buffer layer is close to the support column and arranged on the same layer with the support column, and the height of the buffer layer is higher than that of the support column.

In one embodiment, the buffer layer has a first end surface close to the array substrate and a second end surface far away from the array substrate, and the cross-sectional area of the first end surface is not larger than that of the second end surface.

In one embodiment, the cross-sectional area of the first end face is smaller than the cross-sectional area of the second end face.

In one embodiment, the buffer layer is in an inverted trapezoid shape in the extending direction of the supporting pillar.

In one embodiment, the buffer layer is disposed in direct contact with the sidewalls of the support posts.

In one embodiment, the buffer layer material is selected from any one of a pressure sensitive adhesive or a UV adhesive.

In one embodiment, the package structure further comprises a glass package.

In one embodiment, the buffer layer is 1 to 6 microns above the support posts.

In one embodiment, the buffer layer is arranged around the support pillar.

Correspondingly, the invention further provides a display device which comprises the display panel.

According to the display panel and the display device with the display panel, the buffer layer is reasonably arranged around the supporting column, so that the damage of the supporting column caused by the fact that the impact stress of external force cannot be dispersed is avoided, functional devices including nearby light-emitting units are prevented from being damaged, and the impact resistance and shock resistance of the display panel are enhanced, so that the bad phenomena of black spots, bright spots, color spots and the like in a display area are prevented from being generated, and the product quality of the display screen is influenced.

Drawings

FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention;

FIG. 2 is a schematic longitudinal cross-sectional view of a display panel according to an embodiment of the present invention;

FIG. 3 is a schematic longitudinal sectional view of another embodiment of a display panel according to the invention.

Detailed Description

The inventor's research shows that the fundamental reason for the display failure of the display screen in the conventional technology is that the display screen has poor damping and buffering effects, and when a heavy object hits the display screen, the stress on the display screen is difficult to release, so that the display screen is broken or devices inside the display screen are damaged. The display panel is the main functional area of display screen, promotes display panel's antidetonation shock resistance, can effectively improve the demonstration inefficacy problem of display screen.

To solve the above problem, the inventors add a buffer layer between the pixel defining layer and the encapsulation structure. Specifically, the buffer layer is arranged on the pixel defining layer and close to the supporting columns, and the height of the buffer layer is higher than or equal to that of the supporting columns. That is, the buffer layer is disposed adjacent to and in the same layer as the support posts, i.e., both disposed on the pixel defining layer. The height of buffer layer is higher than or equal to the height of support column, utilizes the buffer layer to support packaging structure, avoids because of the unable dispersion of external force impact stress and the support column damage that causes.

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention; fig. 2 is a schematic longitudinal sectional view of a display panel according to an embodiment of the invention.

As shown in fig. 2, the display panel of the present embodiment includes an array substrate 1; a pixel defining layer 3 on the surface of the array substrate 1, having a plurality of recesses for receiving the light emitting units 2; a plurality of light emitting units 2 accommodated in the respective recesses; a plurality of support columns 4 on the pixel defining layer 3; the buffer layer 5 is close to the support column 4 and arranged on the same layer as the support column 4, and the height of the buffer layer 5 is higher than that of the support column 4; the array substrate further comprises a packaging structure 6 arranged on the array substrate 1.

The array substrate 1 may be a TFT (thin film transistor) substrate, the surface of which is also provided with a planarization layer. The pixel defining layer 3 is disposed on the surface of the planarization layer. The light-emitting unit 2 is a light-emitting pixel and is formed by vapor deposition of a light-emitting material. The recess on the pixel defining layer 3 is also referred to as a pixel accommodating cavity for accommodating a light emitting pixel, and the shape of the pixel accommodating cavity may be a prism, a cube, a rectangular parallelepiped, or the like, which is not limited thereto. The pixel defining layer 3 serves to isolate pixels and prevent cross color between adjacent light emitting pixels. The support posts 4 are disposed between the adjacent light emitting units 2 to support the package structure 6.

And the packaging structure 6 is used for packaging the plurality of light-emitting units 2 and the pixel limiting layer 3 on the array substrate 1 so as to prevent water and oxygen molecules in the air from entering the light-emitting units and damaging the light-emitting units 2. The package structure 6 may be a glass cover package, i.e. a seal is formed between the cover and the array substrate 1 by a sealing material, such package is also commonly referred to as a hard-screen package. In addition, the package structure 6 may also be a thin film package structure, i.e. the sealing of the light emitting unit is realized by using an organic thin film and an inorganic thin film structure which are alternately arranged, which is called soft screen package. In the drawings, the package structure 6 is exemplified as a glass cover package.

The support posts 4 are used to support the package structure 6. When the screen body is impacted by external force, the instantaneously suffered external force is firstly transmitted to the supporting columns 4, and the supporting columns 4 are often damaged because the stress concentration cannot be dispersed, so that cracks or fragments and the like are generated on the display panel, and the phenomena of black spots, color spots and the like appear on the screen are caused. Therefore, the inventor sets the buffer layer 5 around the support pillar 4, and the height of the buffer layer 5 is higher than that of the support pillar 4, so that the buffer layer 5 can support the package structure 6, damage to the support pillar 4 due to the fact that external impact stress cannot be dispersed can be avoided, and damage to functional devices including nearby light emitting units can be avoided. According to the arrangement, the impact resistance and the shock resistance of the display panel are enhanced, and the display area is finally prevented from generating bad phenomena such as black spots, bright spots and color spots, so that the product quality of the display screen is influenced.

The shape of the buffer layer 5 is various and is not limited by the embodiment of the present invention. The height of the cushioning layer 5 is set to be able to play a supporting role. For example, the height of the buffer layer 5 may be higher than that of the support posts 4, and the buffer layer 5 may be stressed and buffer before the support posts 4, so as to directly buffer and protect the light emitting unit 2 and the vicinity thereof. When the height of the buffer layer 5 is higher than that of the support posts 4, the height difference is preferably 1 to 6 micrometers, and specifically, may be 1 micrometer, 6 micrometers, or 3 micrometers. It is also possible that the height of the buffer layer 5 is set to be higher than that of the support pillar 4, and the buffer layer 5 and the support pillar 4 are stressed together and play a role in buffering.

In one embodiment, the buffer layer 5 has a first end surface close to the array substrate 1 and a second end surface far from the array substrate 1, and the cross-sectional area of the first end surface is not greater than that of the second end surface. The first end surface is disposed on the pixel defining layer 3, and the second end surface faces the package structure 6 and supports the package structure 6. The stress area of the buffer layer 5 is maximized in the above manner, and the larger stress area is helpful for relieving stress, increasing the buffering effect, particularly helping to protect the support column 4 and the light-emitting unit 2 and reducing the damage to the support column and the light-emitting unit. In particular, the cross-sectional area of the first end face may be smaller than the cross-sectional area of the second end face, i.e. the cross-sectional area of the second end face is larger, so that the area for supporting the package structure 6 is larger. In other embodiments, the cross-sectional area of the first end surface may be equal to the cross-sectional area of the second end surface.

In one embodiment, the buffer layer 5 has an inverted trapezoid shape in the extending direction of the support posts 4 (i.e., the direction away from the pixel defining layer 5). That is, the support columns 4 are trapezoidal columns having narrow top and wide bottom which function as a support structure for the display panel layer on the pixel defining layer 3. The buffer layer 5 is correspondingly arranged according to the shape of the support column 4. Specifically, as shown in fig. 3, the buffer layer 5 has an inverted trapezoid shape, and is matched with the support pillars 4 in shape, so that the buffer layer 5 can be arranged in a limited space as much as possible. The inverted trapezoidal buffer layer 5 is stable in structure, and changes gently from the near end to the far end of the array substrate 1, so that stress dispersion is uniform. In other embodiments, the buffer layer 5 may have a rectangular or regular trapezoidal shape.

In order to facilitate the light emitting effect of the light emitting unit 2, the buffer layer 5 is actually disposed on the array substrate 1 between the light emitting unit 2 and the supporting pillars 4 and closer to the supporting pillars 4, so as to avoid affecting the normal operation of the light emitting unit 2, which is beneficial to the light emitting unit 2 to achieve a good light emitting effect. In one embodiment, the buffer layer 5 is disposed in direct contact with the sidewalls of the support posts 4. Specifically, the cushioning layer 5 may be adhered to the support post 4 or may be in close proximity to the support post 4. So set up, except guaranteeing luminous unit 2's luminous effect, can also guarantee buffer layer 5 and support column 4's effective contact, increase possible area of contact promotes the dispersion digestion effect to stress, reduces the impact that external force brought.

In one embodiment, the cushioning layer 5 surrounds the support posts 4. The buffer layer 5 is correspondingly arranged around the support column 4, and the buffer layer has buffering and decomposing effects on the stress in any direction. Specifically, the buffer layer 5 corresponding to each support column 4 is divided into four parts that are not communicated with each other, and the four parts are respectively located at the periphery of four sides of the column of any corresponding support column 4. In other embodiments, the cushioning layer 5 is disposed around the support posts 4, and the cushioning layer 5 itself has a ring shape, and the inner wall thereof is disposed in direct contact with the side walls of the support posts 4. Of course, the arrangement of the cushioning layer 5 is not limited to the above manner, and may be divided into two, three or another number of portions as long as the portions are distributed around the supporting columns 4 and have the decomposing and cushioning effects on the supporting columns 4.

In one embodiment, the material of the buffer layer 5 is selected from any one of pressure sensitive adhesive or UV adhesive. The pressure-sensitive adhesive is an adhesive sensitive to pressure, and comprises a rubber type pressure-sensitive adhesive which mainly comprises natural rubber, has low curing temperature, good viscosity and good temperature resistance, and an organic silicon pressure-sensitive adhesive which takes silicon rubber and silicon resin as components and has strong stripping resistance. Pressure sensitive adhesives can take many forms, not to mention a few. Since the pressure-sensitive adhesive generally has good adhesive property, wetting property and peeling resistance, the pressure-sensitive adhesive is very suitable for being used as a material of the buffer layer 5. The UV adhesive is also called shadowless adhesive and ultraviolet curing adhesive, is an adhesive which can be cured only by ultraviolet irradiation, can be used as an adhesive, can be easily arranged on the existing production line corresponding to an ultraviolet lamp, and can be adopted without greatly changing the production line. The UV adhesive can be cured within several seconds to tens of seconds at a higher curing speed, so that an automatic production line is facilitated, and the labor productivity is improved. As the light curing glue, the UV glue is very convenient for bonding the light-transmitting material, and when the UV glue is used as the material of the buffer layer 5, ultraviolet rays can smoothly enter the buffer layer 5 through the outside of the display panel to finish curing. After the display panel is impacted to generate pressure conduction, the pressure-sensitive adhesive or the UV adhesive becomes soft and sticky to form effective buffering. The buffer layer 5 can also be made of emulsion, and the emulsion is prepared by dissolving the raw materials, organic solvent and emulsifier in a certain proportion to prepare a homogeneous liquid preparation. The emulsion may be a pressure sensitive adhesive emulsion whose raw materials include polyacrylate latex. The emulsion can also adopt other raw materials, such as sodium dodecyl benzene sulfonate or nonylphenol polyoxyethylene ether, and the prepared emulsion can also play a role in buffering stress.

When the display panel is processed, the functional portion including the light emitting unit 2 may be encapsulated by a packaging method such as a frit package (glass cover package) or a film package, so that the functional portion is sealed to prevent the functional portion from reacting with external water and oxygen.

In one embodiment, frat packaging is adopted, in which case the packaging structure 6 includes a glass cover plate, and a frit sealing frame disposed at the periphery of the plurality of light emitting units 2 and bonding the array substrate 1 and the glass cover plate. The inventor finds that the buffer layer 5 also brings about a thin film interference phenomenon, namely, the contact point of the buffer layer 5 and the top of the glass cover plate generates a plurality of light and dark rings which are different in distance and gradually become narrower with the increase of the distance from the central point. They are interference fringes formed by the mutual interference of light rays reflected on a spherical surface and light rays reflected on a plane, and have a great influence on the display effect of the display panel. The inventors further investigated that the cause of the above phenomenon is caused by the excessively high height of the buffer layer 5. For this reason, in the present embodiment, the buffer layer 5 is set to have a height identical or close to that of the frit sealing frame to prevent the occurrence of newton's rings, i.e., the occurrence of thin film interference. Theoretically, the height of the buffer layer 5 and the height of the frit sealing frame are the best conditions, and in actual production, the heights of the buffer layer and the frit sealing frame have certain difference, for example, the height difference is acceptable within 1.08 micrometers.

In one embodiment, the package structure 5 is a thin film package structure. Organic light emitting materials in display panels, especially OLED display panels, are particularly sensitive to water and oxygen, and generally have very strict requirements on permeability of water and oxygen in order to meet basic service life, so that higher requirements are put on the encapsulation of the panels. The film package can better meet the above requirements, for example, a water-oxygen barrier wall having a closed ring structure and formed by a film is disposed on the array substrate 1, and the package film covers the light-emitting unit 2, and the periphery of the package film is hermetically matched with the water-oxygen barrier wall. The film package adopts one or more layers of vacuum deposited films to block water and oxygen, does not block the path of light emergent or incident, and does not influence the flexibility of the array substrate 1.

In one embodiment, the bottom of the buffer layer 5 is attached to the array substrate 1, and the top of the buffer layer 5 is attached to the package structure 5, so as to ensure a first time and direct buffering effect. The bottom of the buffer layer 5 is attached to the array substrate 1, and the top of the buffer layer 5 is attached to the package structure 5, so that the package structure 5 is well buffered by transverse stress.

In other embodiments, considering that the periphery of the light emitting display region of the display panel generally has an encapsulation region, and the encapsulation region can have very good impact and shock resistant effects, the bottom of the buffer layer 5 is attached to the array substrate 1, and a gap exists between the top of the buffer layer 5 and the encapsulation structure 5. The bottom of the buffer layer 5 is attached to the array substrate 1, and the buffer layer can play a role in buffering the forward impact force. A gap is formed between the top of the buffer layer 5 and the package structure 5, so that the package region in the non-light-emitting display region is preferentially stressed, and then the buffer layer 5 is stressed.

Correspondingly, the invention further provides a display device which comprises the display panel of the embodiment. The display device can be a tablet computer, a mobile phone and other electronic equipment.

In summary, according to the display panel and the display device having the same of the present invention, the buffer layer is reasonably disposed around the supporting pillar, so as to avoid damage to the supporting pillar due to the fact that the impact stress of the external force cannot be dispersed, and avoid damage to functional devices including the neighboring light emitting units, and finally prevent the display area from generating undesirable phenomena such as black spots, bright spots, color spots, etc., and affecting the product quality of the display screen by enhancing the impact resistance and shock resistance of the display panel.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A display panel, comprising:

an array substrate (1);

the light emitting units (2) are arranged on the surface of the array substrate;

a pixel defining layer (3) having a number of openings to accommodate the light emitting cells;

a plurality of support columns (4) which are positioned on the pixel limiting layer and are arranged corresponding to the pixel limiting layer;

the buffer layer (5) is close to the support column and arranged on the pixel definition layer at the same layer as the support column, and the height of the buffer layer is higher than that of the support column;

the light-emitting diode array substrate is characterized by further comprising an encapsulation structure (6), wherein the encapsulation structure (6) comprises a glass cover plate and is arranged on the periphery of the light-emitting units (2) and is bonded with the array substrate (1) and a glass material sealing frame of the glass cover plate, and the buffer layer (5) is consistent with the glass material sealing frame in height.

2. The display panel according to claim 1, wherein the buffer layer (5) has a first end surface close to the array substrate (1) and a second end surface far from the array substrate, and a cross-sectional area of the first end surface is not larger than a cross-sectional area of the second end surface.

3. The display panel according to claim 2, wherein a cross-sectional area of the first end face is smaller than a cross-sectional area of the second end face.

4. A display panel according to claim 3, wherein the buffer layer (5) has an inverted trapezoidal shape in the direction in which the support columns (4) extend.

5. The display panel according to claim 1, wherein the buffer layer (5) is disposed in direct contact with a sidewall of the support pillar (4).

6. The display panel according to claim 1, wherein the buffer layer (5) material is selected from any one of a pressure sensitive adhesive or a UV adhesive.

7. The display panel of claim 1, wherein the encapsulation structure comprises a glass encapsulation.

8. The display panel according to claim 7, wherein the buffer layer (5) is 1 to 6 microns higher than the support posts (4).

9. The display panel according to claim 1, wherein the buffer layer (5) is arranged around the support pillar (4).

10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.