CN109166826A - Display panel and display device with it - Google Patents
Display panel and display device with it Download PDFInfo
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- CN109166826A CN109166826A CN201810870724.XA CN201810870724A CN109166826A CN 109166826 A CN109166826 A CN 109166826A CN 201810870724 A CN201810870724 A CN 201810870724A CN 109166826 A CN109166826 A CN 109166826A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- Condensed Matter Physics & Semiconductors (AREA)
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- Electroluminescent Light Sources (AREA)
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Abstract
Display panel of the present invention, comprising: array substrate (1);Several luminescence units (2), are set to the array substrate surface;Pixel confining layer (3) has several openings for accommodating luminescence unit;Several support columns (4) are correspondingly arranged in the pixel confining layer and with the pixel confining layer;And buffer layer (5), buffer layer is arranged close to the support column and with support column same layer, and the height of the buffer layer is higher than the height of the support column.Display panel of the invention and the display device with it, by the way that buffer layer is rationally arranged around support column, support column caused by due to external impacts stress can not disperse is avoided to damage, the function element including neighbouring luminescence unit is avoided damage to simultaneously, by the anti-impact shake-proof ability for enhancing display panel, it finally prevents display area from generating the bad phenomenons such as blackspot, speck, variegation, influences the product quality of display screen.
Description
Technical field
The invention belongs to display screen technology fields, and in particular to a kind of display panel and the display device with it.
Background technique
OLED show equipment by several generations improving technology on graduallyd mature, obtain the favor of more and more manufacturers,
It is gradually adopted on a variety of electronic products.OLED screen curtain has frivolous, flexible etc. very bright with respect to the screen of the materials such as LCD
Aobvious advantage, another aspect market also proposed high requirement to the structural strength and crashworthiness of OLED series of products.OLED
Display screen is hit moment by weight, often because stress is concentrated can not disperse that support column is caused to damage, even display surface
Related elements are impaired below plate support column, eventually lead to display area and generate the bad phenomenons such as blackspot, speck, variegation.
Summary of the invention
Technical problem to be solved by the present invention lies in the deficiencies for being directed to traditional product resistant to damage performance, provide a kind of enhancing
Shield the display panel of body impact strength and the display device with such display panel.
A kind of display panel, comprising:
Array substrate;
Several luminescence units are set to the array substrate surface;
Pixel confining layer has several openings for accommodating luminescence unit;
Several support columns are correspondingly arranged in the pixel confining layer and with the pixel confining layer;
And buffer layer, buffer layer is arranged close to the support column and with support column same layer, and the height of the buffer layer
Higher than the height of the support column.
The buffer layer has close to the first end face of the array substrate and far from described in one of the embodiments,
The second end face of array substrate, the cross-sectional area of the first end face are not more than the cross-sectional area of the second end face.
The cross-sectional area of the first end face is less than the cross-sectional area of the second end face in one of the embodiments,.
The buffer layer is in inverted trapezoidal on the support column extending direction in one of the embodiments,.
The buffer layer directly contacts setting with the side wall of the support column in one of the embodiments,.
The cushioning layer material is selected from any one of pressure sensitive adhesive or UV glue in one of the embodiments,.
It in one of the embodiments, further include encapsulating structure, the encapsulating structure includes glass-encapsulated.
The buffer layer is higher than 1 to 6 microns of the support column in one of the embodiments,.
The buffer layer is disposed around the support column surrounding in one of the embodiments,.
Correspondingly, the present invention also provides a kind of display device, including described in any item display panels above-mentioned.
Display panel of the invention and the display device with it, by the way that buffer layer is rationally arranged around support column,
Support column caused by due to external impacts stress can not disperse is avoided to damage, while including avoiding damage to neighbouring luminescence unit
Function element finally prevents display area from generating blackspot, speck, variegation etc. by enhancing the anti-impact shake-proof ability of display panel
Bad phenomenon influences the product quality of display screen.
Detailed description of the invention
Fig. 1 is that the invention shows the cross-sectional views of one embodiment of panel;
Fig. 2 is that the invention shows the Longitudinal cross section schematics of one embodiment of panel;
Fig. 3 is that the invention shows the Longitudinal cross section schematics of another embodiment of panel.
Specific embodiment
Display screen in traditional technology, which is easy to appear, shows the problem of failing, such as the display area generation of display screen is black
The bad phenomenons such as spot, speck, variegation, through inventor's the study found that the basic reason for this problem occur is, display screen
Damping and buffering effect are bad, and when weight hits display screen, the stress that display screen is subject to is difficult to discharge, so as to cause display screen
Device inside fracture or display screen is impaired.Display panel is the major function area of display screen, and the antidetonation for promoting display panel is anti-
Impact property can be effectively improved the display Problem of Failure of display screen.
To solve the above problems, inventor increases buffer layer between pixel confining layer and encapsulating structure.Specifically, in picture
Plain confining layers are arranged close to the buffer layer of support column, and the height of buffer layer is greater than or equal to the height of support column.That is,
Buffer layer is arranged close to support column and with support column same layer, that is, is arranged in pixel confining layer.The height of buffer layer be higher than or
Equal to the height of support column, encapsulating structure is supported using buffer layer, avoids making because external impacts stress can not disperse
At support column damage.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with specific embodiment,
The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are only used to explain this hair
It is bright, it is not intended to limit the present invention.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more
Any and all combinations of relevant listed item.
Fig. 1 is that the invention shows the cross-sectional views of one embodiment of panel;Fig. 2 is that the invention shows one embodiments of panel
Longitudinal cross section schematic.
As shown in Fig. 2, the display panel of the present embodiment, including array substrate 1;Pixel confining layer 3 is located at array substrate 1
Surface, have to several pits for accommodating luminescence unit 2;Several luminescence units 2, are contained in corresponding pit;It is several
Support column 4 is located in pixel confining layer 3;Buffer layer 5, buffer layer 5 are arranged close to support column 4 and with 4 same layer of support column, and slow
The height for rushing layer 5 is higher than the height of support column 4;Further include encapsulating structure 6, is set to 1 in array substrate.
Array substrate 1 can be TFT (thin film transistor (TFT)) substrate, and surface is additionally provided with planarization layer.Pixel confining layer 3
The surface of planarization layer is set.Luminescence unit 2 is light emitting pixel, is deposited and is formed by luminescent material.It is recessed in pixel confining layer 3
Hole, also referred to as pixel accommodating chamber, for accommodating light emitting pixel, the shape of pixel accommodating chamber can be prismoid shape, square, length
The shapes such as cube, it is without limitation.Pixel confining layer 3 for pixel to be isolated prevents from that colour contamination occurs between adjacent light emitting pixel.
Support column 4 is distributed between adjacent luminescence unit 2, for supporting encapsulating structure 6.
Encapsulating structure 6, for multiple luminescence units 2 and pixel confining layer 3 to be packaged in array substrate 1, to avoid sky
Water oxygen molecule in gas enters luminescence unit and destroys luminescence unit 2.Encapsulating structure 6 can be glass cover-plate encapsulation, that is, pass through
Sealing material forms sealing, the also commonly referred to as hard screen encapsulation of such encapsulation between cover board and array substrate 1.In addition, encapsulation knot
Structure 6 is also possible to thin-film packing structure, i.e., is realized using the organic film and inorganic thin film structure being arranged alternately to luminescence unit
Sealing, referred to as soft screen encapsulation.In diagram, it is illustrated so that encapsulating structure 6 is glass cover-plate encapsulation as an example.
Support column 4 is for supporting encapsulating structure 6.When shielding body by external force collision, the external force that moment is subjected to is first
Be conducted to support column 4, support column 4 often because stress concentration can not disperse to cause to damage, cause display panel crack or
Fragment etc., causes screen phenomena such as blackspot, variegation occur.Therefore, buffer layer 5 is arranged in inventor around support column 4, and buffers
The height of layer 5 is higher than the height of support column 4, and buffer layer 5 is supported encapsulating structure 6, can be avoided because of external force
Impact stress can not disperse and caused by support column 4 damage, while avoiding damage to the function element including neighbouring luminescence unit.
Above-mentioned setting finally prevents display area from generating blackspot, speck, variegation etc. by enhancing the anti-impact shake-proof ability of display panel
Bad phenomenon influences the product quality of display screen.
The shape of buffer layer 5 be it is various, do not limited by the embodiment of the present invention.The height of buffer layer 5 is arranged to
Enough play a supporting role.For example, it may be the height of buffer layer 5 to be higher than to the height of support column 4, then buffer layer 5 can be prior to branch
4 stress of dagger simultaneously plays buffer function, plays direct cushioning and protection to luminescence unit 2 and its near zone.Wherein,
When the height of buffer layer 5 is higher than the height of support column 4, it is preferable that difference in height is 1 to 6 microns, specifically, can be 1 micron, 6
Micron or 3 microns.It can also be, the height of buffer layer 5 is set above to the height of support column 4, then buffer layer 5 and support column
4 stress and play buffer function together.
Buffer layer 5 has close to the first end face of array substrate 1 and far from array substrate 1 in one of the embodiments,
Second end face, the cross-sectional area of first end face is not more than the cross-sectional area of second end face.First end face is to be set to pixel limit
Given layer 3, second end face then face with encapsulating structure 6 and support encapsulating structure 6.Aforesaid way maximises the stress of buffer layer 5
Area, and biggish forced area helps to alleviate stress, increases buffering effect, is particularly useful to support column 4 and shines single
The protection of member 2, reduces the damage suffered by it.Specifically, the cross-sectional area of first end face can be less than the transversal of second end face
The cross-sectional area of area, i.e. second end face is bigger, to be used to support the area of encapsulating structure 6 bigger.In other embodiments
In, the cross-sectional area of first end face can also be equal to the cross-sectional area of second end face.
Buffer layer 5 is on above-mentioned 4 extending direction of support column (i.e. far from pixel confining layer 5 in one of the embodiments,
Direction) it is in inverted trapezoidal.That is, support column 4 is to rise to support the up-narrow and down-wide of display panel layer structure function in pixel confining layer 3
Trapezoid cylinder.Buffer layer 5 is correspondingly arranged according to the shape of support column 4.Specifically, as shown in figure 3, buffer layer 5 is in inverted trapezoidal,
Cooperate with 4 shape of support column, setting buffer layer 5 more as far as possible in the confined space may be implemented.5 structure of buffer layer of inverted trapezoidal
Stablize, changed gently by the proximal end of array substrate 1 to distal end, so that stress dispersion is more uniform.In other embodiments, delay
Rushing layer 5 can be in rectangle or trapezoid.
In order to be conducive to the illumination effect of luminescence unit 2, between luminescence unit 2 and support column 4, buffer layer 5 is actually set
It is placed in array substrate 1 closer to the position of support column 4, to avoid the normal work for influencing luminescence unit 2, this is conducive to shine
Unit 2 realizes good illumination effect.Above-mentioned buffer layer 5 is directly contacted with the side wall of support column 4 in one of the embodiments,
Setting.Specifically, buffer layer 5 can be adhered on support column 4, it can also be closely against on support column 4.So set, removing
Guarantee the illumination effect of luminescence unit 2, it can also be ensured that buffer layer 5 is effectively contacted with support column 4, increases possible contact surface
Product promotes the dispersion resolution to stress and acts on, reduces the impact of external force bring.
Buffer layer 5 is disposed around 4 surrounding of support column in one of the embodiments,.That is the surrounding of support column 4 is correspondingly arranged
Buffer layer 5 all has the function of buffering and decomposition to the stress of any direction.Specifically, the corresponding buffer layer of each support column 4
5 points are disconnected four parts each other, are located at the periphery on four sides of any 4 this cylinder of corresponding support column.At it
In his embodiment, buffer layer 5 is arranged around support column 4, and in a ring, the side wall of inner wall and support column 4 is direct for buffer layer 5 itself
Contact setting.Certainly, the setting of buffer layer 5 is not limited to aforesaid way, can be divided into two, three or each portion of other numbers
Point, as long as being distributed in around support column 4, have the function of decomposing and buffering stress to support column 4.
Above-mentioned 5 material of buffer layer is selected from any one of pressure sensitive adhesive or UV glue in one of the embodiments,.Pressure sensitive adhesive is
One kind has the adhesive for having sensibility to pressure, includes the pressure sensitive adhesive of the rubber type based on natural rubber, solidification temperature
Spend low, viscosity is good and temperature tolerance is good, and using silicon rubber and silicone resin as the organic pressure-sensitive gel of composition, peeling resistance is strong.
There are many adoptable form of pressure sensitive adhesive, no longer enumerate.Since pressure sensitive adhesive generally has preferable bond properties, wetting property
And peeling resistance, it is highly suitable for the material as buffer layer 5.And UV glue is also known as shadowless glue, ultraviolet cured adhesive, is a kind of
Must be by ultraviolet light irradiation just curable a kind of adhesive, it can be used as bonding agent use, and corresponding ultraviolet lamp can be with
It is easily mounted at existing production line, being not required to larger change production line can use.Very fast several seconds of the curing rate of UV glue is extremely
Solidification can be completed within tens seconds, is conducive to automatic production line, raises labour productivity.As optic-solidified adhesive, UV glue is very just
In bonding translucent material, in the material as buffer layer 5, ultraviolet light, which can pass through, enters buffer layer 5 outside display panel,
Complete solidification.Display panel is after by generation pressure conduction is hit, and pressure sensitive adhesive or the softening of UV glue, becoming sticky can form effectively
Buffering.Emulsion also can be used in the material of buffer layer 5, and above-mentioned emulsion is that raw material and organic solvent, emulsifier is molten by a certain percentage
Homogeneous liquid preparation is made in demodulation.Emulsion can be pressure sensitive adhesive emulsion, and raw material includes polyacrylic ester latex.Above-mentioned emulsion
Other raw materials, such as neopelex or nonylphenol polyoxyethylene ether, the emulsion after preparation can also be used equally may be used
To play to the buffer function by power.
When processing display panel, the packaged types such as (glass cover-plate encapsulation), thin-film package can be encapsulated by frit to be sent out
Funtion part including light unit 2 is packaged so that funtion part is sealed, prevent funtion part and external water and
Oxygen reacts.
Frit encapsulation is adopted in one of the embodiments, and encapsulating structure 6 includes glass cover-plate at this time, and is set to multiple
2 periphery of luminescence unit and the frit-sealed frame for being bonded array substrate 1 Yu glass cover-plate.Inventors have found that buffer layer 5 is also brought
The contact of contact position at the top of film interference phenomenon, i.e. buffer layer 5 and glass cover-plate, generates some light and dark annulus, this
The distance of a little annulus differs, and becomes narrow gradually with the increase with a distance from central point.They are by reflecting on spherical surface and in plane
Light interfere and the interference fringe that is formed, have a significant impact to the display effect of display panel.Inventor further grinds
The reason of studying carefully discovery, causing above-mentioned phenomenon is caused by the excessive height of buffer layer 5.For this purpose, in the present embodiment, buffer layer 5 with
The height of frit-sealed frame is set as consistent or close, to prevent Newton's ring, that is, film interference phenomenon occurs.It is theoretical
On, buffer layer 5 consistent with the height of frit-sealed frame is optimal cases, and in actual production, the two height can exist certain
Difference, if difference in height is acceptable within 1.08 microns.
Encapsulating structure 5 uses thin-film packing structure in one of the embodiments,.Display panel, especially OLED are shown
Luminous organic material in panel is particularly sensitive to water, oxygen, to meet basic service life, the usually infiltration to water, oxygen
Saturating rate has very strict requirements, therefore more stringent requirements are proposed to the encapsulation of panel.Thin-film package can more preferably meet above-mentioned
It is required that the water oxygen barrier wall that there is closing ring type structure to be formed by film for setting such as in array substrate 1, and cover packaging film
It is placed on luminescence unit 2, and seals packaging film periphery and water oxygen barrier wall and cooperates.Thin-film package is true using one layer or several layers
The film of sky deposit obstructs water oxygen, and the not path of shielding light outgoing or incidence, nor affects on the flexible of array substrate 1
Property.
The bottom of buffer layer 5 is bonded with above-mentioned array substrate 1 in one of the embodiments, the top of buffer layer 5 with it is upper
State encapsulating structure 5 fitting, with ensure first time, directly play buffer function.The bottom of buffer layer 5 and above-mentioned array base
While plate 1 is bonded, the top of buffer layer 5 is bonded with above-mentioned encapsulating structure 5, the lateral stress being subject to for encapsulating structure 5
There is preferable buffer function.
In other embodiments, it is contemplated that generally there are also packaging areas for the surrounding in display panel luminescence display region, and seal
Dress region can play very good anti-impact shockproof effect, and 5 bottom of buffer layer is bonded with above-mentioned array substrate 1, buffer layer 5
Then there is a fixed gap between top and above-mentioned encapsulating structure 5.5 bottom of buffer layer is bonded with above-mentioned array substrate 1, to forward direction
Impact force can play buffering effect.There are fixed gap settings between the top of buffer layer 5 and above-mentioned encapsulating structure 5 can be excellent
First make the packaging area stress in non-luminescent display area, then in 5 stress of buffer layer.
Correspondingly, the present invention also provides a kind of display device, the display panel including above-described embodiment.Display device can
Think tablet computer, the electronic equipments such as mobile phone.
In conclusion display panel of the invention and the display device with it, by rationally being set around support column
Buffer layer is set, support column caused by due to external impacts stress can not disperse is avoided to damage, while avoiding damage to nearby shine
Function element including unit finally prevents display area from generating blackspot, bright by enhancing the anti-impact shake-proof ability of display panel
The bad phenomenons such as spot, variegation influence the product quality of display screen.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. display panel characterized by comprising
Array substrate (1);
Several luminescence units (2), are set to the array substrate surface;
Pixel confining layer (3) has several openings for accommodating luminescence unit;
Several support columns (4) are correspondingly arranged in the pixel confining layer and with the pixel confining layer;
And buffer layer (5), buffer layer is arranged close to the support column and with support column same layer, and the height of the buffer layer is high
In the height of the support column.
2. display panel according to claim 1, which is characterized in that the buffer layer (5) has close to the array base
The second end face of the first end face of plate (1) and the separate array substrate, the cross-sectional area of the first end face is no more than described
The cross-sectional area of second end face.
3. display panel according to claim 2, which is characterized in that the cross-sectional area of the first end face is less than described the
The cross-sectional area of biend.
4. display panel according to claim 3, which is characterized in that the buffer layer (5) extends in the support column (4)
It is in inverted trapezoidal on direction.
5. display panel according to claim 1, which is characterized in that the side of the buffer layer (5) and the support column (4)
Wall directly contacts setting.
6. display panel according to claim 1, which is characterized in that buffer layer (5) material is selected from pressure sensitive adhesive or UV
Any one of glue.
7. display panel according to claim 1, which is characterized in that further include encapsulating structure (6), the encapsulating structure packet
Include glass-encapsulated.
8. display panel according to claim 7, which is characterized in that the buffer layer (5) is higher than the support column (4) 1
To 6 microns.
9. display panel according to claim 1, which is characterized in that the buffer layer (5) is disposed around the support column (4)
Surrounding.
10. a kind of display device, which is characterized in that including the described in any item display panels of claim 1 to 9.
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CN201810870724.XA CN109166826B (en) | 2018-08-02 | 2018-08-02 | Display panel and display device with same |
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Cited By (6)
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CN110429105A (en) * | 2019-06-25 | 2019-11-08 | 华为技术有限公司 | Display component and electronic equipment |
CN110678016A (en) * | 2019-08-29 | 2020-01-10 | 中国电子科技集团公司第三十八研究所 | Big cavity structure of spiro union stress decomposition combination laser seal welding |
CN110767846A (en) * | 2019-10-31 | 2020-02-07 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
CN111312096A (en) * | 2020-04-10 | 2020-06-19 | 昆山国显光电有限公司 | Display panel and display device |
CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
WO2023092594A1 (en) * | 2021-11-29 | 2023-06-01 | 京东方科技集团股份有限公司 | Light-emitting substrate and preparation method therefor, and display device |
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WO2023092594A1 (en) * | 2021-11-29 | 2023-06-01 | 京东方科技集团股份有限公司 | Light-emitting substrate and preparation method therefor, and display device |
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