CN101351093A - Method for preparing microwave high-frequency multi-layer circuit board - Google Patents
Method for preparing microwave high-frequency multi-layer circuit board Download PDFInfo
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- CN101351093A CN101351093A CNA2008101963612A CN200810196361A CN101351093A CN 101351093 A CN101351093 A CN 101351093A CN A2008101963612 A CNA2008101963612 A CN A2008101963612A CN 200810196361 A CN200810196361 A CN 200810196361A CN 101351093 A CN101351093 A CN 101351093A
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- single piece
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- piece plate
- internal layer
- circuit board
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 208000003351 Melanosis Diseases 0.000 claims description 10
- -1 polytetrafluoroethylene copper Polymers 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000009832 plasma treatment Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 150000003254 radicals Chemical class 0.000 claims description 6
- 230000008719 thickening Effects 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004634 thermosetting polymer Substances 0.000 claims description 4
- 230000002411 adverse Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 55
- 150000002500 ions Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a making method of a microwave and high frequency multilayer circuit board, and the method comprises the following steps: step one, making gerber templates and outer graphics; step two, making inner graphics; step three, laminated making and surface coating. The making method is high in precision and steady in the performance of the made circuit board, and besides dielectric constants are stable and dielectric loss is small.
Description
Technical field
The present invention relates to a kind of manufacture method of microwave high-frequency multi-layer circuit board, particularly be applied to the manufacture method of the multilayer circuit board of high-frequency signal transmission electronic product and high-speed logic signal transmission signals electronic product.
Background technology
Along with the direction of electronic product to miniaturization, high frequencyization, digitlization, high reliabilityization develops, the microwave current high-frequency multi-layer circuit board adopts epoxy resin board (FR-4) to be adhesive sheet in the course of processing, but its kind is single, solderability is low, and dielectric loss is big, and dielectric constant is big, and the processing of hole wall is to adopt sodium salt solution to handle in the present in addition manufacturing process, but so just reduced the stability of circuit board, particularly the stability of Zhu Cuning.
Summary of the invention
The invention provides a kind of manufacture method of microwave high-frequency multi-layer circuit board, it makes the precision height, the circuit board stable performance that makes, and also dielectric constant is stable, and dielectric loss is little.
The present invention has adopted following technical scheme: a kind of manufacture method of microwave high-frequency multi-layer circuit board, it may further comprise the steps: step 1, light is painted the making of template and outer graphics: 1, in template, carry out graphic designs on the outer single piece plate, 2, in template, outer single piece plate is carried out blanking, 3, punching out four groove location holes on outer single piece plate, 4, pad pasting on outer single piece plate, position exposure, develop, according to video outer single piece plate is repaiied plate, 5, carry out etching according to the figure that designs on the outer single piece plate, carry out repairing the second time plate, 6 again, adopting numerical control to mill local form to outer monolithic carries out the part and mills processing; Step 2, the making of interior layer pattern: 1, at internal layer single piece plate upper punch system location hole, 2, in the enterprising line number control boring of internal layer single piece plate, 3, adopt numerical control to mill according to the designing requirement of figure on the internal layer single piece plate and on the internal layer single piece plate, mill the system square groove, 4, internal layer single piece plate using plasma is handled, 5, hole metallization is carried out in hole on the internal layer single piece plate to be handled, 6, the internal layer single piece plate is carried out the electro-coppering thickening, 7, processing before the brush board, on the internal layer single piece plate, carry out pad pasting, position exposure then, develop, 8, outer single piece plate is repaiied plate, 9, carry out etching according to the figure that designs on the internal layer monolithic; 10, inner plating being carried out melanism handles; Step 3, laminates and surface-coated: 1, adopt numerical control to mill the part of bonding sheet is cleaned, the part that to expose the internal layer single piece plate mills, 2, outer single piece plate and internal layer single piece plate are arranged plate, by the adhesive sheet formation multi-layer sheet that bonds, outer single piece plate, internal layer single piece plate and bonding sheet are for alternately overlapping with outer single piece plate and internal layer single piece plate; 3, multi-layer sheet is carried out lamination; 4, carry out digital control hole drilling at multi-layer sheet; 5, multiple-plate external form and square groove are carried out NC Milling; deburring; 6, protect at multiple-plate surface brush peelable glue; 7, again multi-layer sheet is carried out plasma treatment; 8, metallized in the inboard of hole on the multi-layer sheet and square groove again; 9, multi-layer sheet is carried out electro-coppering thickening and electrogilding; 10, peelable glue is removed, carried out making microwave high-frequency multi-layer circuit board after gold-plated on the figure that inner plating is drawn.
What described internal layer single piece plate and outer single piece plate adopted is that glass fibre strengthens tetrafluoroethene copper coated foil plate, ceramic filled polytetrafluoroethylene copper coated foil plate or ceramic filled thermoset resin coating copper foil plate.
Adopt CAD that figure on the inside and outside layer single piece plate of the template of circuit board is designed in the step 1 of the present invention.Melanism in the step 2 of the present invention is handled and comprised following process: at first carry out upper plate, the oil of then removing on the plate is washed, and microetch is carried out the washing of secondary adverse current then, preimpregnation, and melanism is washed for the third time again, reduction, hot water wash is carried out lower plate at last.The process of the plasma treatment described in step 2 of the present invention and the step 3 is that the phase of plasma is because the state of electronics that intensifies in the atom and molecular disorder motion, in the internal vacuum chamber gas molecule, apply energy, the collision of accelerated electron makes molecule, the outermost electron of atom is intensified, and production ion or reactive high free radical, the ion that produces like this, free radical is by continuous collision and destroy the number micrometer range with interior molecular link, induce reduction thickness, produce convex-concave surface, form functional group's Surface Physical of gas componant simultaneously, chemical change.Bonding sheet described in the step 3 of the present invention is a polytetrafluoroethylene vitrifying cloth.
The present invention has following beneficial effect: the present invention has carried out the secondary pore metalized in manufacturing process, satisfy the requirement that the circuit board internal layer buries through hole like this.The present invention has adopted plasma treatment in manufacturing process, can remove the fluoride of polytetrafluoroethylene like this, increase the stability of storing, improve the wettability on copper-plated adhesion and surface, change the form and the wettability on internal layer surface, improve the interlayer adhesion.Bonding sheet of the present invention is a polytetrafluoroethylene vitrifying cloth, can improve the stability of multilayer circuit board like this, has guaranteed less dielectric constant and lower dielectric loss, has improved solderability and pull-off strength simultaneously.Adopt the melanism treatment technology in the manufacturing process of the present invention, so also can improve the adhesion of interlayer.What internal layer single piece plate of the present invention and outer single piece plate adopted is that glass fibre strengthens tetrafluoroethene copper coated foil plate, ceramic filled polytetrafluoroethylene copper coated foil plate or ceramic filled thermoset resin coating copper foil plate, can improve the dielectric property and the mechanical performance of circuit board like this.The present invention adopts CAD that internal layer single piece plate and outer single piece plate are carried out graphic designs, can improve the precision of board design like this, satisfies requirement of mass production.
Description of drawings
Fig. 1 is a process chart of the present invention
Embodiment
In Fig. 1, the invention provides a kind of manufacture method of microwave high-frequency multi-layer circuit board, it may further comprise the steps: step 1, light is painted the making of template and outer graphics: 1, adopt CAD in template, carry out graphic designs on the outer single piece plate, what internal layer single piece plate and outer single piece plate adopted is that glass fibre strengthens the tetrafluoroethene copper coated foil plate, pottery filled polytetrafluoroethylene copper coated foil plate or ceramic filled thermoset resin coating copper foil plate, 2, in template, outer single piece plate is carried out blanking, 3, punching out four groove location holes on outer single piece plate, 4, pad pasting on outer single piece plate, position exposure, develop, according to video outer single piece plate is repaiied plate, 5, carry out etching according to the figure that designs on the outer single piece plate, carry out repairing the second time plate, 6 again, adopting numerical control to mill operation carries out the part to the local form of outer monolithic and mills processing; Step 2, the making of interior layer pattern: 1, at internal layer single piece plate upper punch system location hole, 2, in the enterprising line number control boring of internal layer single piece plate, 3, adopt numerical control to mill according to the designing requirement of figure on the internal layer single piece plate and on the internal layer single piece plate, mill the system square groove, 4, internal layer single piece plate using plasma is handled, 5, hole metallization is carried out in hole on the internal layer single piece plate to be handled, 6, the internal layer single piece plate is carried out the electro-coppering thickening, 7, processing before the brush board, on the internal layer single piece plate, carry out pad pasting, position exposure then, develop, 8, outer single piece plate is repaiied plate, 9, carry out etching according to the figure that designs on the internal layer monolithic; 10, inner plating is carried out melanism and handle, melanism is handled and comprised following process: at first carry out upper plate, the oil of then removing on the plate is washed, microetch, carry out the washing of secondary adverse current then, preimpregnation, melanism is washed for the third time again, reduction, hot water wash is carried out lower plate at last; Step 3, laminates and surface-coated: 1, adopt numerical control to mill the part of bonding sheet is cleaned, the part that to expose the internal layer single piece plate mills, bonding sheet is a polytetrafluoroethylene vitrifying cloth, 2, outer single piece plate and internal layer single piece plate are arranged plate, by the adhesive sheet formation multi-layer sheet that bonds, outer single piece plate, internal layer single piece plate and bonding sheet are for alternately overlapping with outer single piece plate and internal layer single piece plate; 3, multi-layer sheet is carried out lamination; 4, carry out digital control hole drilling at multi-layer sheet; 5, multiple-plate external form and square groove are carried out NC Milling; deburring; 6, protect at multiple-plate surface brush peelable glue; 7, again multi-layer sheet is carried out plasma treatment; 8, metallized in the inboard of hole on the multi-layer sheet and square groove again; 9, multi-layer sheet is carried out electro-coppering thickening and electrogilding; 10, peelable glue is removed, carried out making microwave high-frequency multi-layer circuit board after gold-plated on the figure that inner plating is drawn.
The process of plasma treatment of the present invention is that the phase of plasma is because the state of electronics that intensifies in the atom and molecular disorder motion, in the internal vacuum chamber gas molecule, apply energy, the collision of accelerated electron makes the outermost electron of molecule, atom intensified, and production ion or reactive high free radical, so the ion that produces, free radical is by continuous collision and destroy the number micrometer range with interior molecular link, induce reduction thickness, produce convex-concave surface, form functional group's Surface Physical, the chemical change of gas componant simultaneously.
Claims (6)
1, a kind of manufacture method of microwave high-frequency multi-layer circuit board, it may further comprise the steps;
Step 1, light is painted the making of template and outer graphics: 1, carry out graphic designs on the inside and outside layer single piece plate of template, 2, the inside and outside layer single piece plate of template carried out blanking, 3, punching out four groove location holes on outer single piece plate, 4, pad pasting on outer single piece plate, position exposure, develop, according to video outer single piece plate is repaiied plate, 5, carry out etching according to the figure that designs on the outer single piece plate, carry out repairing the second time plate again, 6, adopt numerical control to mill local form to outer monolithic to carry out the part and mill processing;
Step 2, the making of interior layer pattern: 1, at internal layer single piece plate upper punch system location hole, 2, in the enterprising line number control boring of internal layer single piece plate, 3, adopt numerical control to mill according to the designing requirement of figure on the internal layer single piece plate and on the internal layer single piece plate, mill the system square groove, 4, internal layer single piece plate using plasma is handled, 5, hole metallization is carried out in hole on the internal layer single piece plate to be handled, 6, the internal layer single piece plate is carried out the electro-coppering thickening to be handled, 7, processing before the brush board, on the internal layer single piece plate, carry out pad pasting, position exposure then, develop, 8, outer single piece plate is repaiied plate, 9, carry out etching according to the figure that designs on the internal layer monolithic; 10, inner plating being carried out melanism handles;
Step 3, laminates and surface-coated: 1, adopt numerical control to mill the part of bonding sheet is cleaned, the part that to expose the internal layer single piece plate mills, 2, outer single piece plate and internal layer single piece plate are arranged plate, by the adhesive sheet formation multi-layer sheet that bonds, outer single piece plate, internal layer single piece plate and bonding sheet are for alternately overlapping with outer single piece plate and internal layer single piece plate; 3, multi-layer sheet is carried out lamination; 4, carry out digital control hole drilling at multi-layer sheet; 5, multiple-plate external form and square groove are carried out NC Milling; deburring; 6, protect at multiple-plate surface brush peelable glue; 7, again multi-layer sheet is carried out plasma treatment; 8, metallized in the inboard of hole on the multi-layer sheet and square groove again; 9, multi-layer sheet is carried out electro-coppering thickening and electrogilding processing; 10, peelable glue is removed, carried out making microwave high-frequency multi-layer circuit board after gold-plated on the figure that inner plating is drawn.
2, the manufacture method of microwave high-frequency multi-layer circuit board according to claim 1, what it is characterized in that the employing of described internal layer single piece plate and outer single piece plate is that glass fibre strengthens tetrafluoroethene copper coated foil plate, ceramic filled polytetrafluoroethylene copper coated foil plate or ceramic filled thermoset resin coating copper foil plate.
3, the manufacture method of microwave high-frequency multi-layer circuit board according to claim 1 is characterized in that adopting in the described step 1 CAD that figure on the inside and outside layer single piece plate of the template of circuit board is designed.
4, the manufacture method of microwave high-frequency multi-layer circuit board according to claim 1, it is characterized in that it is characterized in that the melanism processing in the described step 2 comprises following process: at first carry out upper plate, the oil of then removing on the plate is washed, microetch, carry out the washing of secondary adverse current then, preimpregnation, melanism, wash for the third time again, reduction, hot water wash is carried out lower plate at last.
5, the manufacture method of microwave high-frequency multi-layer circuit board according to claim 1, the process that it is characterized in that the plasma treatment described in described step 2 and the step 3 is that the phase of plasma is because the state of electronics that intensifies in the atom and molecular disorder motion, in the internal vacuum chamber gas molecule, apply energy, the collision of accelerated electron makes molecule, the outermost electron of atom is intensified, and production ion or reactive high free radical, the ion that produces like this, free radical is by continuous collision and destroy the number micrometer range with interior molecular link, induce reduction thickness, produce convex-concave surface, form functional group's Surface Physical of gas componant simultaneously, chemical change.
6, the manufacture method of described microwave high-frequency multi-layer circuit board according to claim 1 is characterized in that the bonding sheet described in the described step 3 is a polytetrafluoroethylene vitrifying cloth.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2008101963612A CN101351093B (en) | 2008-09-08 | 2008-09-08 | Method for preparing microwave high-frequency multi-layer circuit board |
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| CN2008101963612A CN101351093B (en) | 2008-09-08 | 2008-09-08 | Method for preparing microwave high-frequency multi-layer circuit board |
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| CN101351093A true CN101351093A (en) | 2009-01-21 |
| CN101351093B CN101351093B (en) | 2010-12-08 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN102006735A (en) * | 2010-12-11 | 2011-04-06 | 汕头超声印制板（二厂）有限公司 | Method for manufacturing multilayer printed circuit board |
| CN102159027A (en) * | 2011-01-17 | 2011-08-17 | 开平依利安达电子第三有限公司 | Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils |
| CN102497735A (en) * | 2011-11-30 | 2012-06-13 | 常州市协和电路板有限公司 | Production method of copper sheet gluing of outer layer window of multi-layer board and selective plated through hole (PTH) |
| CN102695374A (en) * | 2012-06-14 | 2012-09-26 | 广州美维电子有限公司 | Processing method for enhancing lamination bonding force of rigid and flexible boards |
| CN103096628A (en) * | 2012-12-31 | 2013-05-08 | 深圳市博敏电子有限公司 | High-frequency printed circuit board production method capable of improving third-order intermodulation stability |
| CN103200792A (en) * | 2013-03-14 | 2013-07-10 | 洛阳伟信电子科技有限公司 | Machining method of multilayer non-intersection blind buried hole circuit board |
| CN103200791A (en) * | 2013-04-25 | 2013-07-10 | 无锡江南计算技术研究所 | High-frequency board-holed plating method of glass cloth reinforced PTFE (Poly Tetra Fluoro Ethylene) material |
| CN103338599A (en) * | 2012-09-24 | 2013-10-02 | 惠州中京电子科技股份有限公司 | Manufacturing process of rigid-flex combined PCB (printed circuit board) |
| CN106658951A (en) * | 2017-02-23 | 2017-05-10 | 南京宏睿普林微波技术股份有限公司 | Manufacturing method for polytetrafluoroethylene and epoxy resin mixed and pressed circuit board |
| CN109714907A (en) * | 2018-12-18 | 2019-05-03 | 安徽四创电子股份有限公司 | A kind of production method of the multi-layer PCB for 5G communication |
| CN110798963A (en) * | 2019-09-24 | 2020-02-14 | 惠州市金百泽电路科技有限公司 | Control method for amplitude consistency of 5G antenna PCB |
| CN111901985A (en) * | 2020-05-25 | 2020-11-06 | 重庆星轨科技有限公司 | Composite lamination method based on microwave circuit board |
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| CN101720173B (en) * | 2009-11-20 | 2012-07-04 | 深南电路有限公司 | Method for processing PCB |
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2008
- 2008-09-08 CN CN2008101963612A patent/CN101351093B/en active Active
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN102006735A (en) * | 2010-12-11 | 2011-04-06 | 汕头超声印制板（二厂）有限公司 | Method for manufacturing multilayer printed circuit board |
| CN102159027A (en) * | 2011-01-17 | 2011-08-17 | 开平依利安达电子第三有限公司 | Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils |
| CN102159027B (en) * | 2011-01-17 | 2012-08-08 | 开平依利安达电子第三有限公司 | Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils |
| CN102497735A (en) * | 2011-11-30 | 2012-06-13 | 常州市协和电路板有限公司 | Production method of copper sheet gluing of outer layer window of multi-layer board and selective plated through hole (PTH) |
| CN102695374A (en) * | 2012-06-14 | 2012-09-26 | 广州美维电子有限公司 | Processing method for enhancing lamination bonding force of rigid and flexible boards |
| CN102695374B (en) * | 2012-06-14 | 2014-10-08 | 广州美维电子有限公司 | Processing method for enhancing lamination bonding force of rigid and flexible boards |
| CN103338599B (en) * | 2012-09-24 | 2016-08-17 | 惠州中京电子科技股份有限公司 | A kind of Rigid Flex processing technology |
| CN103338599A (en) * | 2012-09-24 | 2013-10-02 | 惠州中京电子科技股份有限公司 | Manufacturing process of rigid-flex combined PCB (printed circuit board) |
| CN103096628A (en) * | 2012-12-31 | 2013-05-08 | 深圳市博敏电子有限公司 | High-frequency printed circuit board production method capable of improving third-order intermodulation stability |
| CN103096628B (en) * | 2012-12-31 | 2015-06-17 | 深圳市博敏电子有限公司 | High-frequency printed circuit board production method capable of improving third-order intermodulation stability |
| CN103200792A (en) * | 2013-03-14 | 2013-07-10 | 洛阳伟信电子科技有限公司 | Machining method of multilayer non-intersection blind buried hole circuit board |
| CN103200791A (en) * | 2013-04-25 | 2013-07-10 | 无锡江南计算技术研究所 | High-frequency board-holed plating method of glass cloth reinforced PTFE (Poly Tetra Fluoro Ethylene) material |
| CN103200791B (en) * | 2013-04-25 | 2016-02-10 | 无锡江南计算技术研究所 | A kind of glass cloth strengthens PTFE material high frequency plate hole electro-plating method |
| CN106658951A (en) * | 2017-02-23 | 2017-05-10 | 南京宏睿普林微波技术股份有限公司 | Manufacturing method for polytetrafluoroethylene and epoxy resin mixed and pressed circuit board |
| CN106658951B (en) * | 2017-02-23 | 2019-04-16 | 南京宏睿普林微波技术股份有限公司 | A kind of manufacturing method of polytetrafluoroethylene (PTFE) and epoxy resin mixed compression circuit board |
| CN109714907A (en) * | 2018-12-18 | 2019-05-03 | 安徽四创电子股份有限公司 | A kind of production method of the multi-layer PCB for 5G communication |
| CN110798963A (en) * | 2019-09-24 | 2020-02-14 | 惠州市金百泽电路科技有限公司 | Control method for amplitude consistency of 5G antenna PCB |
| CN111901985A (en) * | 2020-05-25 | 2020-11-06 | 重庆星轨科技有限公司 | Composite lamination method based on microwave circuit board |
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| CN101351093B (en) | 2010-12-08 |
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Assignee: TAIZHOU BOTAI ELECTRONICS CO., LTD. Assignor: Shi Jilian Contract record no.: 2011320000612 Denomination of invention: Method for preparing microwave high-frequency multi-layer circuit board Granted publication date: 20101208 License type: Exclusive License Open date: 20090121 Record date: 20110420 |
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Owner name: TAIZHOU BOTAI ELECTRONIC CO., LTD. Free format text: FORMER OWNER: SHI JILIAN Effective date: 20150326 |
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Free format text: CORRECT: ADDRESS; FROM: 225327 TAIZHOU, JIANGSU PROVINCE TO: 225300 TAIZHOU, JIANGSU PROVINCE |
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Effective date of registration: 20150326 Address after: 225300, Ma 10 road, Yongan Town, Taizhou port, Jiangsu, China Patentee after: TAIZHOU BOTAI ELECTRONICS CO., LTD. Address before: 225327 No. 2 West boat Road, Yongan Town, Taizhou, Jiangsu, China Patentee before: Shi Jilian |