CN101320847A - 磁性线圈的焊接方法 - Google Patents

磁性线圈的焊接方法 Download PDF

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CN101320847A
CN101320847A CNA2008100835316A CN200810083531A CN101320847A CN 101320847 A CN101320847 A CN 101320847A CN A2008100835316 A CNA2008100835316 A CN A2008100835316A CN 200810083531 A CN200810083531 A CN 200810083531A CN 101320847 A CN101320847 A CN 101320847A
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magnetic coil
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周铭璋
陈欢
林志民
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Abstract

本发明揭示一种磁性线圈的快速焊接方法，其包括以下步骤：提供一具有若干线头的磁性线圈；提供一设有若干导电片的电路板；提供一具有加热焊接部的焊接设备；提供设有容室的载具，该容室的一侧设有通孔；将磁性线圈固定于容室，并使所述磁性线圈的线头横跨过该通孔而固定于通孔的另一侧；将所述电路板固定于载具上，且使线头与电路板上的导电片对齐；使加热焊接部按压于固定在导电片上的线头一定时间，从而将线头焊接于导电片上。

Description

磁性线圈的焊接方法
【技术领域】
本发明涉及一种磁性线圈的焊接方法。
【背景技术】
1984年11月20日美国专利商标局公开的美国专利第4,484,054揭示一种快速将放置于电路板的导电片上并具有外绝缘层的线缆焊接于导电片上的方法。该方法包括以下步骤：(a)提供一种焊接治具，其提供的热量能够气化包覆在线缆外层的绝缘层，并将线连焊接于导电片上；(b)将焊接治具加热至接近但低于进行焊接的选定温度，以减少焊接治具的劣化；(c)将焊接治具接触放置在导电片上的线缆；(d)焊接治具上的热量可以提供(i)在治具与线缆接触点区域气化线缆的绝缘层(ii)气化线缆的与接触点相反一侧的绝缘层(iii)熔化导电片上的焊料；(e)并使该热量不会传入电路板或电路板上其他元件；(f)总的焊接接触时间不到500毫秒。
另外，该专利亦提供了一种线缆固定装置。如图1所示，电路板安装于一由计算机控制的可沿横轴纵轴点对点移动的安装平台。线缆导引装置、按压笔尖与焊接治具安装于电路板上方，并可以作为一个整体转动。具有绝缘层的铜线缆通过线缆导引装置导引到电路板表面并由笔尖按压住(如图2所示。
但上述方法所用设备成本较高，需要计算机控制，并且线缆导引装置与笔尖不适于磁性线圈细小的漆包线焊接，且不适于导电片分布密集的情形。
【发明内容】
本发明所要解决的技术问题是提供一种便于磁性线圈快速焊接的方法。
为解决上述技术问题，本发明之将磁性线圈快速焊接连接的方法包括以下步骤：提供一具有若干线头的磁性线圈；提供一设有若干导电表面的电子元件；提供一具有加热焊接部的焊接设备；提供设有容室的载具，容室的一侧设有通孔；将磁性线圈固定于容室，并使所述磁性线圈的线头横跨过该通孔而固定于通孔的另一侧；并将所述电子元件固定于载具上，且使线头于电子元件上的导电表面对齐；使加热焊接部按压于固定在导电表面上的线头一定时间，从而将线头焊接于导电表面上。
本发明之将磁性线圈的焊接方法，利用载具可以方便快捷的固定线缆，并便于多个焊点同时焊接的自动焊接技术的应用。
【附图说明】
图1是符合本发明的电路板的正视图。
图2是图1中电路板的后视图。
图3是一对符合本发明的磁性线圈的侧视图。
图4是图3所示磁性线圈的俯视图。
图5是符合本发明的载具的剖视图。
图6是图5所示载具的仰视图。
图7是装入磁性线圈后的载具剖视图。
图8图7所示载具与线圈的仰视图。
图9是图7所示载具与线圈的俯视图。
图10是自动焊接治具的示意图。
【具体实施方式】
如图1与图2所示为符合本发明的电路板10正视图与后视图。图1揭示电路板10的第一面，其上设有平行两排排列的导电片12。各导电片呈长方形，其长度为1.2毫米，宽度方向尺寸为0.6毫米，且其长度方向与前述两排的方向垂直(此种排不方式可以在保持焊点整齐密集排部的同时，导电片贴合于电路板上的面接较大，可以防止焊接时，导电片12被焊接枪带离电路板10，而导电片12整齐密集的排布可便于后续的手工刷焊)。电路板10在两排导电片12的外侧设有两排导电通孔14以连接导电端子(未图示)。图2揭示电路板10与第一面方向相反的第二面，若干被动元件16设置于其上。电路板10还设有若干电性连接导电片12、导电通孔14及被动元件16的导电路径18。
图3与图4为符合本发明的磁性线圈30的俯视图与侧视图。各磁性线圈30包括铁芯31及漆包线36，漆包线36具有缠绕于铁芯31上的中间部分362及子中间部分362延伸出的自由端364。
图5与图6为符合本发明的载具400的剖视图与仰视图。载具400设有四个并列排布用以收容磁性线圈30的容室40、及平行设置于容室40两侧的狭长通孔50，通孔50的相对两侧设有若干平行排列的定位槽52。
图10所示为符合本发明的自动焊接治具60。该自动焊接治具60设有用来放置载具400的水平导轨68、竖直方向延伸的立柱66、及安装于立柱66并可沿竖直方向移动的平台64，平台64于预定位置固设有四个加热焊接枪62，该等加热焊接枪62可以随平台64沿竖直方向移动。各焊接枪64的末端形成有矩形的热接触面，所述矩形长度为0.6毫米，宽度为0.59毫米。导轨68设有定位结构，可以将载具400定位于特定位置，使安装于载具400上的电路板10的特定导电片12与加热焊接枪62的末端对齐。
将磁性线圈30快速稳固焊接于电路板10的方法包括以下步骤：提供前述载具400、四对磁性线圈30、电路板10与焊接治具60；将磁性线圈30装入载具400的容室40；将磁性线圈30的漆包线36的自由端362引入定位槽52，自由端362的部分横跨过通孔50，形成便于焊枪焊接的焊接段366，其末端再固定于载具400外侧的固定槽(如图7-8所示)；将电路板10装于载具400上，使电路板10上的两列导电片12分别与两通孔50对齐，而磁性线圈30的自由端364分别贴近于导电片12上(如图9所示)；将装有磁性线圈30与电路板10的载具400放置于焊接治具60的导轨68上，并将其导引至预定位置，使一对加热焊接枪62在竖直方向上与一对特定位置的导电片12对齐，然后插入加热焊接枪62加热焊接；移动导轨68使其到达另一预定位置，使另一对加热焊接枪62对齐于其他导电片12，然后插入加热焊接枪62加热焊接(可视需要焊接的导电片数目重复该步骤)；从载具400中取出焊接有磁性线圈30的电路板10，清理焊接线头；最后，将漆包线36与导电片12的焊点重新手工刷焊一次，以加固焊接连接。

Claims (13)

1.一种磁性线圈的焊接方法，其包括以下步骤：
(1)提供一具有若干线头的磁性线圈；
(2)提供一设有若干导电表面的电子元件；
(3)提供一具有加热焊接部的焊接设备；
(4)将所述线头分别固定于所述电子元件的导电表面上；
(5)使加热焊接部按压于固定在导电表面上的线头一定时间，从而将线头焊接于导电表面上，其特征在于第(4)步是通过以下方法实现：
提供设有容室的载具，容室的一侧设有通孔，将磁性线圈固定于容室，并使所述磁性线圈的线头横跨过该通孔而固定于通孔的另一侧，并将所述电子元件固定于载具上，且使线头与电子元件的导电表面对齐。
2.如权利要求1所述的磁性线圈焊接方法，其特征在于：所述电子元件设为电路板，所述导电表面设为电路板上的导电片。
3.如权利要求2所述的磁性线圈焊接方法，其特征在于：所述通孔的两侧设有定位槽，所述线头通过定位槽而被定位于预定的位置。
4.如权利要求3所述的磁性线圈焊接方法，其特征在于：所述通孔的外侧设有固定槽，所述固定槽与线头干涉配合从而将线头固定。
5.如权利要求4所述的磁性线圈焊接方法，其特征在于：所述载具容室的与前述通孔相对的另一侧亦设有通孔，磁性线圈的部分线头亦同样固定于该通孔的另一侧。
6.如权利要求5所述的磁性线圈焊接方法，其特征在于所述焊接方法进一步包括步骤(6)：从载具上取出焊接有线圈的电路板，清理线头，并将焊点重新手工刷焊。
7.一种磁性线圈的焊接方法，其包括以下步骤：
(1)提供若干具有若干线头的磁性线圈；
(2)提供一设有若干导电表面的电子元件；
(3)提供一具有若干加热焊接部的焊接设备；
(4)将所述线头分别固定于所述电子元件的导电表面上；
(5)使加热焊接部按压于固定在导电表面上的线头一定时间，从而将线头焊接于导电表面上，其特征在于第(4)步是通过以下方法实现：
提供设有容室的载具，容室的相对两侧分别设有通孔，将磁性线圈固定于容室，并使所述磁性线圈的线头分别横跨过此两通孔而固定于通孔的另一侧，并将所述电子元件固定于载具上，且使线头与电子元件上的导电表面对齐。
8.如权利要求7所述的磁性线圈焊接方法，其特征在于：所述电子元件设为电路板，所述导电表面设为电路板上的导电片。
9.如权利要求8所述的磁性线圈焊接方法，其特征在于：所述通孔的两侧设有定位槽，所述线头通过定位槽而被定位于预定的位置。
10.如权利要求9所述的磁性线圈焊接方法，其特征在于：所述通孔的外侧设有固定槽，所述固定槽与线头干涉配合从而将线头固定。
11.如权利要求10所述的磁性线圈焊接方法，其特征在于：所述导电片分成两排排列，所述载具的通孔呈狭长形，并与且导电片排列方向平行。
12.如权利要求11所述的磁性线圈焊接方法，其特征在于：所述导电片呈狭长形，其长度方向与排列方向垂直，且长度方向尺寸是宽度方向尺寸的两倍以上。
13.如权利要求12所述的磁性线圈焊接方法，其特征在于所述焊接方法进一步包括步骤(6)：从载具上取出焊接有线圈的电路板，清理线头，并将焊点重新手工刷焊。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102833957A (zh) * 2011-06-16 2012-12-19 富士康(昆山)电脑接插件有限公司 磁性线圈的焊接方法
CN103008877A (zh) * 2012-11-28 2013-04-03 东莞立德精密工业有限公司 一种磁性线圈的自动化焊接设备

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452952B (zh) * 2011-07-06 2014-09-11 Hon Hai Prec Ind Co Ltd 磁性線圈的焊接方法
CN103594874B (zh) 2012-08-16 2018-03-06 富士康(昆山)电脑接插件有限公司 电连接器及其应用
CN104010451B (zh) * 2013-02-21 2017-07-14 东莞立德精密工业有限公司 磁性线圈的焊接方法
TWI573153B (zh) * 2015-09-07 2017-03-01 Bothhand Entpr Inc Coil device
CN105491816B (zh) * 2016-02-04 2018-07-20 东莞立德精密工业有限公司 磁性线圈焊接方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019206A (en) * 1971-09-08 1977-04-19 Peter Haas Method and apparatus for magnetic recording of data with a recording head having a plurality of physically parallel, serially connectable conductors
US4484054A (en) * 1982-05-10 1984-11-20 Kollmorgen Technologies Corporation Short pulse soldering system
US5525777A (en) * 1994-08-19 1996-06-11 Allen-Bradley Company, Inc. Apparatus and method for flexible point-to-point soldering
WO1997001263A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication
US5986894A (en) * 1997-09-29 1999-11-16 Pulse Engineering, Inc. Microelectronic component carrier and method of its manufacture
TW461560U (en) * 2000-10-24 2001-10-21 Chiou Su Li Surface mounted high-frequency core impedance device
JP2005026456A (ja) * 2003-07-02 2005-01-27 Toshiba Corp プリント配線板、電子部品実装方法および電子機器
CN1658476A (zh) * 2005-01-21 2005-08-24 程浩川 电子点焊工艺在片式振动电机线圈绕组引线连接上的应用

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102833957A (zh) * 2011-06-16 2012-12-19 富士康(昆山)电脑接插件有限公司 磁性线圈的焊接方法
CN102833957B (zh) * 2011-06-16 2015-10-07 富士康(昆山)电脑接插件有限公司 磁性线圈的焊接方法
CN103008877A (zh) * 2012-11-28 2013-04-03 东莞立德精密工业有限公司 一种磁性线圈的自动化焊接设备

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