CN101296582B - Method for replacing and mending bad circuit area on multi-layer printed circuit board - Google Patents
Method for replacing and mending bad circuit area on multi-layer printed circuit board Download PDFInfo
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- CN101296582B CN101296582B CN2007101047293A CN200710104729A CN101296582B CN 101296582 B CN101296582 B CN 101296582B CN 2007101047293 A CN2007101047293 A CN 2007101047293A CN 200710104729 A CN200710104729 A CN 200710104729A CN 101296582 B CN101296582 B CN 101296582B
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Abstract
The invention relates to a method for replacing and repairing a bad circuit block, which is applicable to a multilayer printed circuit board. The method mainly aims at removing the bad circuit block on a usable circuit board from the circuit board after an inner layer circuit is finished and before the layer of the bad circuit block is increased to an outer layer circuit, and taking out a good circuit block identical to the bad circuit block from an abandoned circuit board which fails to reach qualification rate in the same way, then replacing the original bad circuit block on the usable circuit board by means of changing and repairing; therefore, replacing and repairing operation can be carried out in advance so as to avoid continuous material feeding on the abandoned circuit board, follow-up layer increasing and the waste of raw materials in circuit manufacturing, and the discharge of hazardous wastes produced during the manufacturing and the damage to the environment can be reduced by decreasing the inventory rating. Simultaneously, the overall artistic appearance and the reliability of the circuit board are enhanced and the volumetric efficiency of subsequent manufacturers can be improved.
Description
Technical field
The present invention is relevant a kind of method for replacing and mending that is applicable to bad circuit area on multi-layer printed circuit board, it is changed repairing as early as possible at the bad circuit area on the available circuit plate of finishing behind the internal layer circuit, abandoning feeding intake and follow-uply increasing layer and circuit is made raw-material waste of circuit board to avoid continuing, and also can reduce the discharging of the bazardous waste that on the make produces by the decrement of inventory, to lower to environment damage, can improve simultaneously the overall appearance and the reliability of circuit board, and promote the manufacturer's packaging efficiency that increases the back system.
Background technology
The design of various e-machines is light day by day in recent years, thin, short and small, to various electronic components or in order to the printed circuit board (PCB) (PCB that described electronic component is used to be installed, Printed Circuit Board) also relatively miniaturization and becoming more meticulous, make printed circuit board (PCB) also by early stage list, double-circuit plate through hole insert design, develop into high wiring density (High Circuit Density) gradually and the multilayer circuit board that arrives (as 6 layers, 8 layers so that 10 laminates) design, comparatively speaking, because on behalf of the probability of manufacturing process generation defective products, the miniaturization of multilayer board and becoming more meticulous also increase.
Moreover, the making of present various multilayer boards, often look the size or the processing procedure needs of the circuit blocks of printed circuit board (PCB), and the plurality of circuits block is arranged on the circuit board, size difference because of various circuit blocks, the arrangement mode that causes on the circuit board is had nothing in common with each other, simultaneously, again in response to customer requirement or QC regulation, make the fraction defective of circuit blocks on each circuit board that different restrictions be arranged, as require the fraction defective below 20% of may allowing on a slice circuit board, then the design on the entire circuit plate is as being 10 circuit blocks, promptly bad circuit blocks; As below 2, promptly be considered as the available circuit plate, but bad circuit blocks surpasses 2 blocks, then is considered as bad circuit board, must abandon; Still to have circuit blocks quite a lot on the circuit board be non-defective unit but abandon, as it is given it up, unfortunate rather, and cost is increased, thereby development has the various bad method for updating of removing, use and reclaim the non-defective unit block of abandoning on the circuit board, and the faulty blocks on the circuit board removed, mend the non-defective unit block again replacing, as " bad circuit area that is applicable to various printed circuit board (PCB)s is removed and complementing method " of No. 513902, TaiWan, China notification number, " manufacture method of circuit board " that No. 443081, " recovery rebuilding method of bad printed circuit board (PCB) " that No. 428423, notification number and notification number etc.
The above-mentioned various method of on the available circuit plate, removing faulty blocks and repairing replacing with the non-defective unit block of abandoning circuit board, be to carry out making to finished product, no matter wherein whether this inner layer circuit board reaches the yields requirement, all carrying out the layer that increases of outer-layer circuit makes, but because the making of multilayer circuit board need repeat to paste Copper Foil and dielectric layer and carry out pressing, baking, circuit is made, develop, etching and blind buried via hole are made, thus, just the faulty blocks on the available circuit plate also is to carry out same steps as, regarding as future and abandoning circuit board also is the repetition same process, so if can find early, and change as early as possible and Hotfix, avoid continuing abandoning feeding intake and follow-uply increasing layer and circuit is made raw-material waste of circuit board, and also can reduce the discharging of bazardous waste on the make by the decrement of inventory, to lower to environment damage.
Moreover the replacement of above-mentioned bad circuit area and method for repairing and mending all increase floor to finished product finishing each layer line road, and the side carries out above-mentioned steps, and it has tangible repairing vestige in appearance in the circuit board of finishing.
Summary of the invention
The inventor has and states the disappearance of method when implementing in view of this, by studying intensively, further develops out the method for replacing and mending that is applicable to bad circuit area on multi-layer printed circuit board of this case.
A purpose of the present invention, behind the circuit that provides multilayer board finishing internal layer, find circuit board available and that abandon early, and when not increasing layer to outer-layer circuit as yet, to reach in the circuit board of yields faulty blocks earlier removes, and the non-defective unit block in the circuit board abandoned that will not reach yields is taken off and is alternatively in the available circuit plate, thus, screening early goes out to abandon circuit board, and with the inventory decrement, to reduce the discharging of the bazardous waste that is on the make produced, lower environment damage.
Another object of the present invention is carried out the replacement and the repairing of bad circuit area on the available circuit plate early, the vestige of repairing is hidden in internal layer circuit as far as possible, and the circuit board after finishing with increase is attractive in appearance, and improves client's assembling reliability and efficient.
Another purpose of the present invention, owing to replace repairing work is to finish before outer-layer circuit is made, therefore when can with the bad circuit area of circuit board when finishing outer-layer circuit and increasing layer making, can increase the firm connection of the circuit blocks of circuit board and repairing, its accuracy can improve in manufacturer on subsequent job to the back system.
By the present invention, the bad circuit area of available circuit plate can be changed repairing as early as possible, abandoning feeding intake and follow-uply increasing layer and circuit is made raw-material waste of circuit board to avoid continuing, and the decrement by inventory also can reduce the discharging of the bazardous waste that produces on the make, to lower to environment damage, can improve simultaneously the overall appearance and the reliability of circuit board, and promote manufacturer's packaging efficiency of back system.
Description of drawings
Fig. 1 is the configuration diagram of multilayer circuit board.
Fig. 1 a is the part enlarged diagram of multilayer circuit board connecting circuit block.
Fig. 2 is the bad circuit area schematic diagram on the available circuit plate.
Fig. 2 a is the non-defective unit circuit blocks schematic diagram of abandoning on the circuit board.
Fig. 3 is first kind and is implemented in available, as to abandon bad, the non-defective unit circuit blocks substitute mode on circuit board action schematic diagram.
Fig. 3 a has finished the schematic diagram that bad circuit area is replaced for the available circuit plate of Fig. 3.
Fig. 3 b finishes outer-layer circuit for the available circuit plate of Fig. 3 a and makes the enlarged diagram of hiding the repairing vestige.
Fig. 4 be second kind be implemented in available, abandon bad, non-defective unit circuit blocks scraper plane breach schematic diagram on the circuit board.
Fig. 4 a is the scraper plane barbed portion enlarged diagram of Fig. 4.
Fig. 5 for the third be implemented in available, abandon bad, non-defective unit circuit blocks scraper plane notch cuttype breach schematic diagram on the circuit board.
Fig. 5 a is the scraper plane notch cuttype barbed portion enlarged diagram of Fig. 5.
Fig. 6 is making step figure of the present invention.
Drawing reference numeral:
Available, abandon circuit board 10
Defective products, non-defective unit circuit blocks 11
Brace 13
Fracture port, breach 20
Connect salient angle 21
Embodiment
Please refer to Fig. 1, shown in Fig. 1 a, the present invention is a kind of method for replacing and mending that is applicable to bad circuit area on multi-layer printed circuit board, its mainly be at the bad circuit area on the available circuit plate of finishing behind the internal layer circuit when not increasing layer to outer-layer circuit as yet, it is removed from circuit board, and (indication equates herein never to reach the non-defective unit circuit blocks that taking-up equates with bad circuit area on the circuit board of abandoning of yields in the same manner, be shape, size is consistent), replace original bad circuit area on the available circuit plate to change repairing method again, the removal of this circuit blocks and replacement are not limited to any way and implement, for fully disclosing spirit of the present invention, (but be familiar with this skill person especially exemplified by three kinds of execution modes explanation wherein, not as limit), and illustrate that it is defined as follows:
Multilayer board is meant and finishes the circuit board that circuit is made, is designated hereinafter simply as circuit board;
Abandon circuit board 10, be meant that the circuit blocks on its circuit board does not reach the yields quantitative requirement, must give up need not, but some circuit blocks are wherein arranged still for non-defective unit, can be used as the defective products of changing in the available circuit plate (shown in Fig. 2 a);
Some circuit blocks 11, its be located at available, abandon on the circuit board, and divide into non-defective unit and defective products, and described circuit blocks 11 is to keep suitable distance by the groove 12 of separating usefulness with circuit board 10, described circuit blocks 11 also is connected with circuit board 10 with brace 13, circuit blocks 11 must be fused with circuit board 10, and again, described brace 13 is provided with breaking groove 14 and with convenient circuit blocks 11 is taken off (as shown in Figure 1a) from circuit board 10.
Please refer to Fig. 3, Fig. 3 a, shown in Fig. 3 b, it is the substitute mode of first kind of circuit blocks, the present invention can use the scraper plane instrument respectively at available earlier, abandon the defective products on the circuit board 10, locate the fracture port 20 of Precision Machining one proper range on the brace 13 of non-defective unit circuit blocks 11 in a location, and make these fracture port 20 two ends keep two connection salient angles 21 of proper width, and temporary transient the connection, and respectively with available and abandon the defective products that desire on the circuit board 10 is changed, non-defective unit circuit blocks 11 is taken off, described circuit blocks 11 congruences, and the non-defective unit circuit blocks 11 that will abandon circuit board 10 places the vacancy of the defective products circuit blocks 11 that is removed of available circuit plate 10, and will connect salient angle 21 connected the alignment after, fill up in the fracture port 20 with solid again, and fixed, what the available circuit plate 10 after fixing carried out outer circuit again pastes dielectric layer and copper foil layer to carry out outer field circuit production, and a replacing and a repairing of removing faulty blocks thus can complete.
Please refer to Fig. 4, shown in Fig. 4 a, it is the substitute mode of second kind of circuit blocks, the present invention can use the scraper plane instrument respectively at available earlier, abandon the defective products on the circuit board 10, (described breach be congruent in the breach 20 (shown in Fig. 4 a) of location place Precision Machining one proper range on the brace 13 of non-defective unit circuit blocks 11, in present embodiment is the T type, for being familiar with this skill person, still can the Ω type and random geometry implement), and respectively with available, abandon the defective products that desire is changed on the circuit board 10, non-defective unit circuit blocks 11 is taken off, described circuit blocks 11 congruences, and the non-defective unit circuit blocks 11 that will abandon circuit board 10 places the vacancy of the defective products circuit blocks 11 that is removed of available circuit plate 10, and with described breach 20 alignd the back fill up in the buckle mode, and fixed with adhesive agent, what the available circuit plate 10 after fixing carried out outer circuit again pastes dielectric layer and copper foil layer to carry out outer field circuit production, and a replacing and a repairing of removing faulty blocks thus can complete.
Please refer to Fig. 5, shown in Fig. 5 a, it is the substitute mode of the third circuit blocks, the present invention can use the scraper plane instrument respectively at available earlier, abandon the defective products on the circuit board 10, (described breach be the congruence complementation in the stairstepping breach 20 (shown in Fig. 5 a) of location place Precision Machining one proper range on the brace 13 of non-defective unit block 11, in present embodiment is the Z type, for being familiar with this skill person, still can embodied in other), and respectively with available, abandon the defective products that desire is changed on the circuit board 10, non-defective unit circuit blocks 11 is taken off, described circuit blocks 11 congruences, and the non-defective unit circuit blocks 11 that will abandon circuit board 10 places the vacancy of the defective products circuit blocks 11 that is removed of available circuit plate 10, and described notch cuttype breach 20 given filling up after the complementary alignment, fix with adhesive agent again, what the available circuit plate 10 after fixing carried out outer circuit again pastes dielectric layer and copper foil layer to carry out outer field circuit production, and a replacing and a repairing of removing faulty blocks thus can complete.
Please refer to shown in Figure 6ly, its method may further comprise the steps:
Step S01: after finishing the inner layer circuit board making, taken off respectively at defective products circuit blocks on the available circuit plate and the non-defective unit circuit blocks abandoned on the circuit board, and reserve interconnective point, and described defective products circuit blocks and non-defective unit circuit blocks are congruence; And
Step S02: will abandon the vacancy that non-defective unit circuit blocks on the circuit board is placed in the defective products circuit blocks of having removed on the available circuit plate, and after the tie point of reserving alignd mutually, fill up fixing again;
Step S03: the available circuit plate in finish fill up operation after, carry out follow-up paste dielectric layer and copper foil layer operation again, make to carry out outer field circuit;
Step S04: carry out the outer-layer circuit layer increase layer, circuit is made and follow-up flow processs such as insulating barrier making.
Above embodiment only is used to implementation process of the present invention is described, is not to be used to limit protection scope of the present invention.
Claims (9)
1. the method for replacing and mending of a bad circuit area on multi-layer printed circuit board is characterized in that, this method comprises the steps:
Step 1: after finishing the inner layer circuit board making, taken off respectively at bad circuit area on the available circuit plate and the non-defective unit circuit blocks abandoned on the circuit board, and reserve interconnective point or breach, and described bad circuit area and non-defective unit circuit blocks are congruence; And
Step 2: will abandon the vacancy that non-defective unit circuit blocks on the circuit board is placed in the bad circuit area of having removed on the available circuit plate, and with the tie point reserved or breach aligned with each other after, fill up fixing again; And
Step 3: the available circuit plate finish fill up operation after, carry out follow-up paste dielectric layer and copper foil layer operation again, make to carry out outer field circuit; And
Step 4: carry out outer-layer circuit layer and insulating barrier again and make.
2. the method for replacing and mending of bad circuit area on multi-layer printed circuit board as claimed in claim 1 is characterized in that, the replacement of described bad circuit area is implemented before carrying out arbitrary outer circuit plate making.
3. the method for replacing and mending of bad circuit area on multi-layer printed circuit board as claimed in claim 1 is characterized in that, the replacement of described bad circuit area is implemented before repeatedly carrying out arbitrary outer circuit plate making.
4. the method for replacing and mending of bad circuit area on multi-layer printed circuit board as claimed in claim 1 is characterized in that, the circuit blocks that described replacement is repaired is fixed on the circuit board in the buckle mode.
5. the method for replacing and mending of bad circuit area on multi-layer printed circuit board as claimed in claim 4 is characterized in that, the type shape of described buckle is T type or Ω type.
6. the method for replacing and mending of bad circuit area on multi-layer printed circuit board as claimed in claim 1 is characterized in that, the circuit blocks that described replacement is repaired is fixed on the circuit board in the notch cuttype mode.
7. the method for replacing and mending of bad circuit area on multi-layer printed circuit board as claimed in claim 1 is characterized in that, the circuit blocks that described replacement is repaired is fixed on the circuit board in adhesive agent gluing mode.
8. the method for replacing and mending of bad circuit area on multi-layer printed circuit board as claimed in claim 4 is characterized in that, the circuit blocks that described replacement is repaired is fixed on the circuit board in adhesive agent gluing mode.
9. the method for replacing and mending of bad circuit area on multi-layer printed circuit board as claimed in claim 6 is characterized in that, the circuit blocks that described replacement is repaired is fixed on the circuit board in adhesive agent gluing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101047293A CN101296582B (en) | 2007-04-25 | 2007-04-25 | Method for replacing and mending bad circuit area on multi-layer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101047293A CN101296582B (en) | 2007-04-25 | 2007-04-25 | Method for replacing and mending bad circuit area on multi-layer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101296582A CN101296582A (en) | 2008-10-29 |
| CN101296582B true CN101296582B (en) | 2010-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101047293A Expired - Fee Related CN101296582B (en) | 2007-04-25 | 2007-04-25 | Method for replacing and mending bad circuit area on multi-layer printed circuit board |
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| Country | Link |
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| CN (1) | CN101296582B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578764A (en) * | 2014-10-10 | 2016-05-11 | 苏州市三生电子有限公司 | Nickel-gold plating circuit board production technology |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036480B (en) * | 2010-07-30 | 2012-07-25 | 北大方正集团有限公司 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
| CN104284525A (en) * | 2014-09-29 | 2015-01-14 | 昆山思拓机器有限公司 | Method for repairing jointed PCB |
| CN112389078B (en) * | 2020-11-18 | 2024-01-16 | 东莞市凯格精机股份有限公司 | Printing equipment and printing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1642386A (en) * | 2004-01-14 | 2005-07-20 | 赖金泉 | Method for replacing and resetting imperfect multi-piece printed circuit board |
-
2007
- 2007-04-25 CN CN2007101047293A patent/CN101296582B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1642386A (en) * | 2004-01-14 | 2005-07-20 | 赖金泉 | Method for replacing and resetting imperfect multi-piece printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578764A (en) * | 2014-10-10 | 2016-05-11 | 苏州市三生电子有限公司 | Nickel-gold plating circuit board production technology |
| CN105578764B (en) * | 2014-10-10 | 2018-04-20 | 苏州市三生电子有限公司 | A kind of plating nickel gold board production technique |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101296582A (en) | 2008-10-29 |
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Granted publication date: 20100602 Termination date: 20190425 |