CN101295657A - Method for fixing bent circuit board of die bonder and die bonder apparatus - Google Patents
Method for fixing bent circuit board of die bonder and die bonder apparatus Download PDFInfo
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- CN101295657A CN101295657A CNA2008100832784A CN200810083278A CN101295657A CN 101295657 A CN101295657 A CN 101295657A CN A2008100832784 A CNA2008100832784 A CN A2008100832784A CN 200810083278 A CN200810083278 A CN 200810083278A CN 101295657 A CN101295657 A CN 101295657A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a fixing method for a bending circuit board of a chip welding machine, a program, a record medium and a chip welding machine device. The subject of the invention is that the fixing method for the bending circuit board of the chip welding machine efficiently fixes the bending circuit board on a welding table or a table for bonding thin films. The solution of the invention is that a circuit adsorption face (24a) of the welding table (24) which adsorbs the circuit board (35) is provided with vacuum adsorption cavities (28a -28e). The air of the vacuum adsorption cavities (28a -28e) is adsorbed via a vacuum device while the circuit board (35) is push-pressed by a collet chuck for installation of the chip (16) which is installed at the front end of the circuit board (35). The circuit board (35) is adsorbed to the welding table (24) by using the circuit board (35) to seal at least one upper face of the vacuum adsorption cavities (28a -28e), to chain-seal at least one upper face of other vacuum adsorption cavities (28a -28e), and to seal the upper faces of all the vacuum adsorption cavities (28a -28e).
Description
Technical field
The present invention relates to the bent circuit board of die bonder (die bonder) is adsorbed, is fixed on chips welding platform or bonding fixing means, program, recording medium and the chips welding machine of using on the platform of film.
Background technology
The die bonder that semiconductor chip is bonded on the circuit board is fixed on and carries out the semiconductor chip welding on the chips welding platform under the surface state will transporting the circuit board vacuum suction of coming.On the other hand, according to the slimming requirement of in recent years semiconductor subassembly, high functional requirement and make the high efficiency requirement, the slimming of circuit board, maximizing obtains progress, and simultaneously, using the assembling of chip multilayer mostly is so-called closed assembly (for example, with reference to patent documentation 1).If the circuit board attenuation, circuit board itself can bend or warpage, can not carry out vacuum at chips welding platform absorption circuit board sometimes and fix, and can not carry out chips welding.Again, the multistage assembling occasion of using mostly in recent years, since the bond semiconductor chip, circuit board generation warpage, therefore, it is many more that hop count is installed, and the circuit board warpage is big more, is difficult to sometimes be adsorbed on the chips welding platform, can not carry out chips welding.
In recent years, when joining to semiconductor chip on the circuit board, use following joint method: after being bonded in the thermo-compressed film on the circuit board, from this thermo-compressed film, crimping, heating semiconductor chip join semiconductor chip on the circuit board (for example, with reference to patent documentation 1).During by this method multistage laminated semiconductor chip, the thermo-compressed film is bonded on the semiconductor chip, crimping more from it, heating semiconductor chip carry out the multistage lamination.Be bonded on circuit board or the hypomere semiconductor chip in order to make semiconductor chip connect airtight, thin thermo-compressed film need be bonded on circuit board or the semiconductor chip equably.For this reason, identical with the chips welding platform that carries out chips welding, film is bonding with under the state of platform in that the circuit board vacuum suction is fixed on, bonding thermo-compressed film.Multistage laminated semiconductor chip occasion increases along with hop count is installed, and circuit board is crooked to become big, even can not adsorb circuit board with platform in that film is bonding sometimes, can not weld.
As can be reliably the circuit board of bending or bent circuit board that semiconductor chip is housed being absorbed and fixed at the method for chips welding platform etc., following absorption fixation device is arranged: suction tube inside is provided with vacuum and inhales the hole, make described suction tube be applied on the chips welding platform, it is moved up and down.If being housed, the bent circuit board of semiconductor chip is transported to the chips welding platform, just make suction tube rise, the butt circuit board, vacuum by inside is inhaled the hole, the absorption circuit board makes this suction tube descend, and inhales the hole with the vacuum of circuit board adsorption plane, absorption fixing circuit board (for example, with reference to patent documentation 2).In addition, following method is arranged: the movable up and down vacuum fixture of ripple type is installed, circuit board is introduced circuit board adsorption plane (for example, with reference to patent documentation 3) in the through hole of chips welding platform.
On the other hand, join semiconductor chip on circuit board occasion, or join semiconductor chip stack on the semiconductor chip that joins on circuit board occasion, need the heater circuit plate sometimes, or the semiconductor chip on the circuit board.But, patent documentation 2, the adsorbing mechanism of the circuit board of the prior art shown in 3 is provided with absorbing cylinder or makes the reciprocating mechanism that vacuum fixture moves up and down in chips welding platform bottom, in chips welding platform bottom heating arrangements can not be installed, existence can not be used for welding simultaneously and the problem of the welder that heats.
Therefore, following method has been proposed: be not circuit board to be introduced on the chips welding platform, but circuit board down pressed against on the chips welding platform from circuit board top from chips welding platform below.For example, as shown in figure 20, following method is arranged: along framework feeder 17, the circuit board 35 of bending is transported on the chips welding platform 24, air nozzle 71 is provided in circuit board 35 tops,, circuit board 35 is pressed against on the circuit board adsorption plane 24a of chips welding platform 24 to circuit board 35 injection airs from described air nozzle 71, inhale hole 27 absorption fixing circuit boards 35 (for example, with reference to patent documentation 2) by vacuum.Shown in Figure 21 A-21C, following method is arranged: semiconductor chip 25 is installed on the circuit board 35, is used hold assembly 73a, 73b clamping circuit board 35 both sides towards the both sides drawing, make it smooth, simultaneously, make anchor clamps 73 move down, circuit board 35 is pressed against on the chips welding platform 24.And, circuit board 35 is pressed against on the circuit board adsorption plane 24a of chips welding platform 24, inhale hole 27 absorption fixing (for example, with reference to patent documentation 4) by vacuum.
[patent documentation 1] spy opens the 2004-6599 communique
[patent documentation 2] spy opens the 2000-138253 communique
[patent documentation 3] spy opens the 2001-203222 communique
[patent documentation 4] spy opens the 2001-176915 communique
But in prior art shown in Figure 20, have following problem: if from top injection air, the lead-in wire 34 that then has been connected between semiconductor chip 25 and the circuit board 35 can be because of the blast bending, contact between the lead-in wire 34.In prior art shown in Figure 21, have following problem: horizontal although need not set the anchor clamps driving mechanism at chips welding platform 24 in chips welding platform 24 bottoms, big driving mechanism need to be installed, install large-scale, complexity.
Summary of the invention
The present invention puts forward for solving the existing problem of above-mentioned prior art, the objective of the invention is to, and in die bonder, effectively the circuit board of bending is fixed on chips welding platform or the bonding usefulness of the film platform by short-cut method.
In order to achieve the above object, the present invention proposes following technical scheme.
(1) a kind of chips welding machine comprises:
Welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
Chip is installed and is used collet chuck, and semiconductor chip is installed on the welding object;
Control part 83b, control is installed by described chip and with collet chuck bent circuit board is pushed towards welding bench, makes this bent circuit board seal at least one vacuum suction chamber.
(2) a kind of chips welding machine by semiconductor core chip bonding film, is bonded on semiconductor chip on the welding object, and it comprises:
Welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
Chip is installed and is used collet chuck, and semiconductor chip is installed on the welding object;
The bonding platform of using of film is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
The bonding collet chuck of using of film is bonded in the semiconductor core chip bonding on the welding object with film;
(3) in above-mentioned (2) described chips welding machine, it is characterized in that:
Further comprise control part 83g, control, make when being stacked in the semiconductor chip multistage on the circuit board, by film bonding with collet chuck by being positioned at the middle section that one or more snippets is installed in the semiconductor chip of the epimere of semiconductor chip on the bent circuit board, bent circuit board is pushed with platform towards film is bonding;
The bonding front end face size with collet chuck of described film is littler than the middle section that is positioned at the inboard, electrode pad zone that is configured in the semiconductor chip periphery.
(4) in above-mentioned (2) or (3) described chips welding machine, it is characterized in that:
Further comprise control part 83g, control, make when being bonded on semiconductor chip multistage lamination on the circuit board, install with collet chuck by being positioned at bonding semiconductor core chip bonding film on one or more snippets semiconductor chip that is installed in the epimere of semiconductor chip on the bent circuit board by chip, bent circuit board is pushed towards welding bench.
(5) in above-mentioned (4) described chips welding machine, it is characterized in that:
Described chip is installed with the front end face size of collet chuck littler than the middle section that is positioned at the inboard, electrode pad zone that is configured in the semiconductor chip periphery.
(6) in above-mentioned (1)-(5), in any described chips welding machine, it is characterized in that:
Bonding towards welding bench or film with behind the platform pushing bent circuit board, further comprise:
(7) a kind of chips welding machine by semiconductor core chip bonding film, is bonded on semiconductor chip on the welding object, and it comprises:
Welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
Chip is installed and is used collet chuck, and semiconductor chip is installed on the welding object;
The bonding platform of using of film is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
The bonding collet chuck of using of film is bonded in the semiconductor core chip bonding on the welding object with film;
(8) a kind of fixing means of bent circuit board of die bonder, described die bonder is provided with welding bench and chip installation collet chuck, described welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board, described chip is installed and with collet chuck semiconductor chip is installed on the welding object;
Wherein, with collet chuck bent circuit board is pushed towards welding bench, make circuit board seal at least one vacuum suction chamber by the chip installation.
(9) a kind of fixing means of bent circuit board of die bonder, described die bonder is provided with welding bench, chip is installed and is used collet chuck, film is bonding with platform and the bonding collet chuck of using of film, described welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board, described chip is installed and with collet chuck semiconductor chip is installed on the welding object, described film is bonding to be provided with at least one vacuum suction chamber with platform on the circuit board adsorption plane of absorption circuit board, described film is bonding to be bonded in the semiconductor core chip bonding on the welding object with film with collet chuck, semiconductor chip is bonded on the welding object with film by the semiconductor core chip bonding;
Wherein, bonding bent circuit board is bonding with the platform pushing towards film by film with collet chuck, make circuit board seal at least one vacuum suction chamber.
(10) in the fixing means of the bent circuit board of above-mentioned (9) described die bonder, it is characterized in that:
The bonding front end face size with collet chuck of described film is littler than the middle section that is positioned at the inboard, electrode pad zone that is configured in the semiconductor chip periphery;
When being stacked in the semiconductor chip multistage on the circuit board, by film bonding with collet chuck by being positioned at the middle section that one or more snippets is installed in the semiconductor chip of the epimere of semiconductor chip on the bent circuit board, bent circuit board is pushed with platform towards film is bonding.
(11) in the fixing means of the bent circuit board of above-mentioned (9) or (10) described die bonder, it is characterized in that:
When being bonded on semiconductor chip multistage lamination on the circuit board, install with collet chuck by being positioned at bonding semiconductor core chip bonding film on one or more snippets semiconductor chip that is installed in the epimere of semiconductor chip on the bent circuit board by chip, bent circuit board is pushed towards welding bench.
(12) in the fixing means of the bent circuit board of above-mentioned (11) described die bonder, it is characterized in that:
Described chip is installed with the front end face size of collet chuck littler than the middle section that is positioned at the inboard, electrode pad zone that is configured in the semiconductor chip periphery;
By being installed in the semiconductor core chip bonding film of semiconductor chip middle section, bent circuit board is pushed towards welding bench.
(13) in above-mentioned (8)-(12), in the fixing means of the bent circuit board of any described die bonder, it is characterized in that:
Bonding towards welding bench or film with behind the platform pushing bent circuit board, comprise following operation:
Vacuum suction state confirmation operation confirms whether circuit board is bonding with on the platform at welding bench or film by vacuum suction;
Push operation again, in vacuum suction state confirmation operation, can not confirm vacuum suction state occasion, change pushing bent circuit board along X, the position of Y direction, after making that chip is installed with collet chuck or film is bonding and moving to change of location, once more towards welding bench or film is bonding pushes bent circuit board with platform with collet chuck.
(14) a kind of fixing means of bent circuit board of die bonder, described die bonder is provided with welding bench, chip is installed and is used collet chuck, film is bonding with platform and the bonding collet chuck of using of film, described welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board, described chip is installed and with collet chuck semiconductor chip is installed on the welding object, described film is bonding to be provided with at least one vacuum suction chamber with platform on the circuit board adsorption plane of absorption circuit board, described film is bonding to be bonded in the semiconductor core chip bonding on the circuit board with film with collet chuck, semiconductor chip is bonded on the welding object with film by the semiconductor core chip bonding;
Wherein, the fixing means of the bent circuit board of this die bonder comprises:
Circuit board is provided with operation, and affirmation starts the vacuum plant that is connected after being transported to welding bench or the bonding position with the bent circuit board on the platform of film with each;
Circuit board pushing set positions operation, after circuit board is provided with operation, set the pushing bent circuit board along X, the position of Y direction;
The collet chuck mobile process, make chip install with collet chuck or film bonding with collet chuck move to by described circuit board pushing set positions operation set along X, the position of Y direction;
The pushing operation, bonding bent circuit board is bonding with the platform pushing towards welding bench or film by the chip installation with collet chuck with collet chuck or film, make circuit board seal at least one vacuum suction chamber;
Vacuum suction state confirmation operation after the pushing operation, confirms whether circuit board is bonding with on the platform at welding bench or film by vacuum suction;
Push operation again, in vacuum suction state confirmation operation, can not confirm vacuum suction state occasion, change pushing bent circuit board along X, the position of Y direction, after making that chip is installed with collet chuck or film is bonding and moving to change of location, once more towards welding bench or film is bonding pushes bent circuit board with platform with collet chuck.
(15) a kind of fixed routine of bent circuit board, make the control part of die bonder carry out, described die bonder is provided with welding bench, chip is installed and is used collet chuck, the bonding platform of using of film, the bonding collet chuck of using of film, the computer that comprises control part, described welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board, described chip is installed and with collet chuck semiconductor chip is installed on the welding object, described film is bonding to be provided with at least one vacuum suction chamber with platform on the circuit board adsorption plane of absorption circuit board, described film is bonding to be bonded in the semiconductor core chip bonding on the welding object with film with collet chuck, semiconductor chip is bonded on the welding object with film by the semiconductor core chip bonding; Wherein, comprising:
Circuit board set handling program, affirmation start the vacuum plant that is connected after being transported to welding bench or the bonding position with the bent circuit board on the platform of film with each;
Circuit board pushing set positions handling procedure, after the circuit board set handling program, set the pushing bent circuit board along X, the position of Y direction;
Collet chuck moves handling procedure, make chip install with collet chuck or film bonding with collet chuck move to by described circuit board pushing set positions handling procedure set along X, the position of Y direction;
The pushing handling procedure, bonding bent circuit board is bonding with the platform pushing towards welding bench or film by the chip installation with collet chuck with collet chuck or film, make circuit board seal at least one vacuum suction chamber;
Vacuum suction state confirmation handling procedure behind the pushing handling procedure, confirms whether circuit board is bonding with on the platform at welding bench or film by vacuum suction;
Push handling procedure again, in vacuum suction state confirmation handling procedure, can not confirm vacuum suction state occasion, change pushing bent circuit board along X, the position of Y direction, after making that chip is installed with collet chuck or film is bonding and moving to change of location, once more towards welding bench or film is bonding pushes bent circuit board with platform with collet chuck.
(16) a kind of recording medium records the fixed routine of the bent circuit board described in above-mentioned (15), can read and carry out this fixed routine by computer.
The following describes effect of the present invention.
The present invention has following effect: in die bonder, can effectively bent circuit board be fixed on the bonding usefulness of welding bench or the film platform by short-cut method.
Description of drawings
Fig. 1 is the plane graph of expression die bonder structure.
Fig. 2 is the elevation of expression die bonder structure.
Fig. 3 is the fixing means of the expression bent circuit board that is used to carry out the invention process form and the die bonder system pie graph of program.
Fig. 4 is that the film of expression die bonder shown in Figure 1 is bonding with platform and the plane graph above the chips welding platform.
Fig. 5 is that the film of expression die bonder shown in Figure 1 is bonding with platform and chips welding platform sectional view.
Fig. 6 A-6B is that the chip installation of expression die bonder shown in Figure 1 constitutes key diagram with collet chuck.
Fig. 7 A-7B is that the film of expression die bonder shown in Figure 1 bondingly constitutes key diagram with collet chuck.
Fig. 8 is the program flow diagram that the bent circuit board of the invention process form is fixed on the bonding usefulness of film platform.
Fig. 9 is the program flow diagram that the bent circuit board of the invention process form is fixed on the chips welding platform.
Figure 10 is that expression is arranged on the bonding key diagram with the platform state of film with bent circuit board.
Figure 11 represents to make the bonding key diagram that moves to the pushing location status of bent circuit board with collet chuck of film.
Figure 12 is the bonding key diagram that begins to push the crooked circuit board status with collet chuck of expression film.
Figure 13 is the bonding key diagram that arrives the crooked circuit board status when moving down stop position with collet chuck of expression film.
Figure 14 is that the expression bent circuit board is absorbed and fixed at the bonding key diagram with the platform state of film.
Figure 15 represents that semiconductor chip joins that to be absorbed and fixed at film bonding with on the circuit board of platform to, is the key diagram that thermo-compressed film that semiconductor interface is share in expression is bonded in state on the described semiconductor chip.
Figure 16 is that the expression chip is installed the key diagram that begins to push the crooked circuit board status with collet chuck.
Figure 17 is the key diagram that the expression bent circuit board is absorbed and fixed at chips welding platform state.
Figure 18 represents that the hot pressing tape splicing is bonded on the semiconductor chip of the circuit board that is absorbed and fixed at the chips welding platform, is the key diagram that expression is crimped onto second section semiconductor chip state on the described hot pressing tape splicing.
Figure 19 be expression by the film distance piece with semiconductor chip stack on circuit board the key diagram of time absorption fixing circuit board.
Figure 20 represents the fixing means of the circuit board of prior art.
Figure 21 A-21C represents the fixing means of the circuit board of prior art.
Symbol description is as follows:
The 10-die bonder, the bonding head of 11-film, the bonding arm of 12-film, the bonding collet chuck of using of 13-film, the 13a-vacuum is inhaled the hole, 13b-vacuum suction chamber, the 14-plumb joint, the 15-welding arm, the 16-chip is installed and is used collet chuck, the 16a-vacuum is inhaled the hole, 16b-vacuum suction chamber, 17-framework feeder, the 18-wafer rack, 19-chip jack-up unit, 20-framework loader, the 21-framework unloads device, the bonding platform of using of 22-film, 22a-circuit board adsorption plane, 23-thermo-compressed film, the 24-welding bench, 24a-circuit board adsorption plane, the 25-semiconductor chip, 25a-electrode pad, the 25b-peripheral edge margin, the 25c-middle section, the 26-vacuum plant, the 27-vacuum is inhaled the hole, 27a～27e-vacuum is inhaled the hole, 28-vacuum suction chamber, 28a～28e-vacuum suction chamber, the 29-pressure sensor, the 30-fixture, the 31-heater block, the 31a-heating source, the 32-load transducer, 33-vacuum pipe arrangement, the 34-lead-in wire, the 35-circuit board, the 36-XY position detection means, the 37-pedestal, 38-Y direction center line, 39-X direction center line, 40-shooting means, 41, the 42-XY platform, 43,44-travel mechanism, 46-film distance piece, 51-thermo-compressed film conveyer, the 53-guide, 55-keeps substrate, 56-draws arm, 59-thermo-compressed film band, the 60-cutting knife, the 71-air nozzle, the 73-anchor clamps, 73a, the 73b-hold assembly, the 80-computer, 81-the 1st control part, the 82-data/address bus, 83-storage part (the 2nd control part), 84-vacuum plant interface, 85-thermal part interface, the 86-pressure sensor interface, 87-circuit board centering position fixture interface, 88-shooting means interface, 89-load transducer interface, 90-travel mechanism interface, 91-XY position detection means interface.
Embodiment
The preferable example of fixing means of the bent circuit board of die bonder of the present invention is described with reference to the accompanying drawings.In following example, though to inscape, kind, combination, shape, configuration waits and has done various qualifications relatively,, these only exemplify, and the present invention is not limited thereto.
Before the example of explanation bent circuit board fixing means, with reference to the formation of description of drawings die bonder.
As depicted in figs. 1 and 2, it is bonding with platform 22 that die bonder 10 is provided with film, bonding 11 of film, XY platform 41, welding bench 24, plumb joint 14, XY platform 42, framework feeder 17, cutting knife 60, thermo-compressed film conveyer 51, and wafer rack 18.Described film is bonding to be bonding semiconductor core chip bonding thermo-compressed film with platform 22, absorption fixing circuit board 35, bonding 11 of described film the semiconductor core chip bonding is bonded in circuit board 35 with thermo-compressed film 23 or the semiconductor chip 25 that welded on, described XY platform 41 is used for driving bonding 11 of film along the XY direction, described welding bench 24 has been installation semiconductor chip 25 absorption fixing circuit boards 35, described plumb joint 14 thermo-compressed semiconductor chip 25 from the thermo-compressed film 23, described XY platform 42 is used for driving plumb joint 14 along the XY direction, it is bonding with platform 22 and welding bench 24 that described framework feeder 17 is supplied with film with circuit board 35, described cutting knife 60 is used to cut off thermo-compressed film band 59 as thermo-compressed film 23, described thermo-compressed film conveyer 51 is used for transporting thermo-compressed film band 59 to cutting knife 60, and described wafer rack 18 keeps having welded wafer.In the following description, be directions X with the throughput direction of circuit board 35, being the Y direction with the rectangular direction of directions X in the horizontal plane, with upper and lower to being that the Z direction describes.
Plumb joint 14 is also identical with bonding 11 of film, can move freely in the XY plane, is provided with welding arm 15, and these welding arm 15 front ends are installed chip and installed with collet chuck 16.In plumb joint 14 inside, be provided with the Z direction motor that welding arm 15 front end edge Z directions are moved.The chip of welding arm 15 front ends is installed with the XY direction of collet chuck 16 owing to plumb joint 14 and is moved and Z direction motor, can move freely in the XYZ direction.
As shown in Figures 1 and 2, the Y direction position bonding 11 of film clips framework feeder 17, is provided with thermo-compressed film conveyer 51 and cutting knife 60.Thermo-compressed film conveyer 51 comprises the guide 53 that thermo-compressed film band 59 is led, and what thermo-compressed film band 59 was drawn in absorption draws arm 56, and absorption keeps the maintenance substrate 55 of derivative thermo-compressed film band 59.As shown in Figures 1 and 2, relative guide 53 and keep substrate 55, cutting knife 60 are located at the opposition side of bonding 11 of film, at guide 53 with keep between the substrate 55, cut off thermo-compressed film band 59, obtain thermo-compressed film 23.
As shown in Figures 1 and 2,, clip framework feeder 17, be provided with wafer rack 18 in the Y of plumb joint 14 direction position.On wafer rack 18, be provided with chip jack-up unit 19.Chip jack-up unit 19 is such devices: jack-up remains on a semiconductor chip 25 in the wafer on the wafer rack 18, make with other semiconductor chips 25 between produce difference in height, the chip installation can be adsorbed this semiconductor chip 25 with collet chuck 16.
The welding action of the die bonder 10 of the above-mentioned formation of simple declaration.Be drawn out to the thermo-compressed film band 59 that keeps on the substrate 55 from guide 53 by thermo-compressed film conveyer 51 and cut off, keeping forming thermo-compressed film 23 on the substrate 55 by cutting knife 60.On the other hand, the circuit board of supplying with from framework loader 20 35 is delivered to bonding platform 22 positions of using of film by framework feeder 17 along directions X.It is bonding with on the platform 22 that the circuit board of sending here 35 is absorbed and fixed at film.If it is fixing that circuit board 35 is adsorbed, then bonding 11 of film makes the bonding collet chuck 13 of using of film along X, Y, and the action of Z all directions is picked up thermo-compressed film 23 from keeping substrate 55, is bonded in institute's allocation of circuit board 35.Thermo-compressed film 23 finishes to bonding one of whole positions, and circuit board 35 separates with platform 22 with film is bonding, delivers to welding bench 24 positions by framework feeder 17 along directions X.The circuit board of sending here 35 is absorbed and fixed at welding bench 24 positions.If circuit board 35 is absorbed and fixed at welding bench 24 positions, then plumb joint 14 makes the chip installation use collet chuck 16 along X, Y, the action of Z all directions, wafer on the wafer rack 18 picks up the semiconductor chip 25 by chip jack-up unit 19 jack-up, is crimped on the thermo-compressed film 23 of circuit board 35.At this moment, circuit board 35 is heated, and the joint of thermo-compressed film 23 melts with resin, and semiconductor chip 25 is fixed on the circuit board 35.Carry out above-mentioned action repeatedly, after the feasible semiconductor chip 25 that should carry on circuit board 35 all carries,, the circuit board 35 of fixing semiconductor chip 25 is transported to framework unloads device 21 by framework feeder 17, take out, be sent to semiconductor manufacturing process after this.
The fixing means of the bent circuit board of said chip bonding machine 10 is described.In the following description, the X among each figure, Y, Z direction and Fig. 1, X illustrated in fig. 2, Y, Z direction unanimity.In addition, the same position mark same-sign that illustrated in Fig. 1, Fig. 2 illustrates omission.
As shown in Figure 3, the die bonder 10 of this example comprises bonding 11 of the film that is arranged on the XY platform 41,42 and plumb joint 14, and bonding 11 of film and plumb joint 14 are respectively equipped with bonding arm 12 of film and welding arm 15.It is bonding with collet chuck 13 at bonding arm 12 front ends of film film to be installed, the bonding thermo-compressed film of the semiconductor core chip bonding being used with collet chuck 13 23 of described film is bonded in as the circuit board 35 of welding object or is bonded on the semiconductor chip 25 on the circuit board 35, at welding arm 15 front ends chip is installed and installs with collet chuck 16, described chip is installed with collet chuck 16 and is installed in semiconductor chip as the circuit board 35 of welding object or is bonded on the semiconductor chip 25 on the circuit board 35.Each XY platform 41,42 and each 11,14 each travel mechanism 43 of formation, 44, each travel mechanism 43,44 is by each XY platform 41,42 can make each 11,14 in horizontal plane (in the XY face) move freely, by along the film bonding arm 12 of Z direction drive installation on it, welding arm 15, can make the film that is installed in bonding arm 12 front ends of film bonding with collet chuck 13, the chip installation that is installed in welding arm 15 front ends uses collet chuck 16 along X, Y, and the Z direction moves freely.Be provided with at each XY platform 41,42 that to be used to detect film bonding with collet chuck 13, chip install with the front end of collet chuck 16 along X, the XY position detection means 36 of the position of Y direction.The institute that this XY position detection means 36 detects bonding 11 of film and plumb joint 14 decide the XY coordinate position at place, by revisal this institute decide to locate with the front end of each collet chuck 13,16 along X, the distance of Y direction detects the X of the front end of each collet chuck 13,16, Y position.XY position detection means 36 both can be an electric, and such contactless such as optical profile type also can be the such contact of mechanical type.In addition, if XY position detection means 36 can be measured the X of the front end of each collet chuck 13,16, the Y position then also can be the XY position transducer, bonding 11 of not revisal film and plumb joint 14 decide the measured value of XY position at place, directly measure the front position of each collet chuck 13,16.Again, XY position detection means 36 also can be a line detecting element.On bonding 11 of film and plumb joint 14, be provided with load transducer 32, detect the load that is applied to each collet chuck 13,16 front end.Again, on bonding 11 of film and plumb joint 14, be provided with shooting means 40, be used for each collet chuck 13,16, semiconductor chip 25, the thermo-compressed film 23 that the semiconductor core chip bonding is used and the image of circuit board 35 are made a video recording.
Bonding being installed in platform 22 and welding bench 24 of film of absorption fixing circuit board 35 do not have on the illustrated chips welding framework.Be fixed for framework feeder 17 that circuit board 35 is led and transports in the bonding both sides with platform 22 and welding bench 24 of film, mounting circuit boards position centering fixture 30 sandwiches circuit board 35 near framework feeder 17, moves it institute's allocation.Forms the vacuum suction chamber (cavity) 28 of plural number respectively with platform 22 and welding bench 24 in that film is bonding, by circuit board 35, above sealed, become vacuum state, have vacuum suction hole 27 in 28 bottoms, vacuum suction chamber.Vacuum is inhaled hole 27 and is connected with vacuum plant 26 by vacuum pipe arrangement 33.And, near film bonding usefulness platform 22 and welding bench 24, the pressure sensor 29 that is used to detect vacuum suction chamber 28 pressure is installed respectively.Pressure sensor 29 both can be that continuously the pressure signal person is measured in output, also can be the pressure switch of output signal during level pressure power when reaching.Pressure sensor 29 both can have been installed a plurality of, so that detect the pressure in each vacuum suction chamber 28, the vacuum that also can be installed in 28 belows, vacuum suction chamber is inhaled on the hole 27, also can be installed in to be used to connect a place or the many places that vacuum plant 26 and vacuum are inhaled the vacuum pipe arrangement 33 in hole 27.Bonding with platform 22 and welding bench 24 bottoms at film, installation heater block 31 is used to heat the circuit board 35 by the installation semiconductor chip 25 of vacuum suction.
Each travel mechanism 43,44 are connected with travel mechanism interface 90, be located at each 11, each XY position detection means 36 on 14 is connected with XY position detection means interface 91, be located at each 11, each load transducer 32 on 14 is connected with load transducer interface 89, each 11,14 are provided with each shooting means 40, it is provided with digital image sensor, each shooting means 40 is connected with shooting means interface 88, circuit board position centering fixture 30 is connected with circuit board position centering fixture interface 87, bonding each pressure sensor 29 with platform 22 and welding bench 24 of film is connected with pressure sensor interface 86, and vacuum plant 26 is connected with vacuum plant interface 84, is located at bonding each heater block 31 with platform 22 and welding bench 24 of film and is connected with heater block interface 85.And each interface is connected with the 1st control part 81 of control chip bonding machine 10 by data/address bus 82.The 1st control part 81 inside comprise control CPU, storage control is connected with data/address bus 82 with storage part (being also referred to as the 2nd control part) 83 of data and program, storage part 83 comprises the control data, the control program, with bent circuit board towards the bonding pushing program (control part 83a) of film with platform pushing, with the pushing program (control part 83b) of bent circuit board towards the welding bench pushing, vacuum suction state confirmation program (control part 83c), once more with bent circuit board towards the bonding pushing program again (control part 83d) of welding bench or film with the platform pushing, circuit board setting program (control part 83e), circuit board pushing set positions program (control part 83f), collet chuck device mobile process (control part 83g).The 1st control part 81, each interface 84～91, storage part 83, data/address bus 82 constitutes computer 80.Above-mentioned each interface 84～91 both can be relatively each 11,14 be provided with one by one, also can be relatively each 11,14 general interface is set respectively.The 1st control part 81 too, both can be relatively each 11,14 be provided with one shared, also can be relatively each 11,14 be provided with respectively.
With reference to Fig. 4 and Fig. 5, the film that describes said chip bonding machine 10 in detail is bonding with around platform 22 and the welding bench 24.As shown in Figure 4, film is bonding is the square plate pieces that are provided between the framework feeder 17 with platform 22 and welding bench 24.And, the bonding substrate adsorption plane 22a of film with platform 22 and welding bench 24, a plurality of vacuum suction chamber 28a～28e is arranging along forming on the Y direction center line 38 in 24a central authorities.Vacuum suction chamber 28a～28e is the square-section groove, and Y direction center line 38 and directions X center line 39 both sides are roughly 45 degree inclinations relatively, intersect mutually, become the X type, have vacuum at its each central point and inhale hole 27a～27e.The length of the X type groove of above-mentioned vacuum suction chamber 28a～28e is shorter slightly than the catercorner length that is installed in the semiconductor chip 25 on the circuit board 35.The cross sectional shape of the groove of above-mentioned vacuum suction chamber 28a～28e is not limited to square, also can be other shapes, for example semicircle etc.In addition, being formed centrally radial groove if flat shape is inhaled the 27a～27e of hole from vacuum, so that can adsorb circuit board 35 effectively, then being not limited to the X type, also can be cross shape or star-like shape etc.In thermo-compressed film 23 that the semiconductor core chip bonding is used bonding, it is bonding with on the Y direction center line 38 of platform 22 that circuit board 35 positions are arranged so that the mounting center position of the semiconductor chip 25 of circuit board 35 becomes film.This position of circuit board 35 is called the film bonding location.In the welding of semiconductor chip 25, the position of circuit board 35 is arranged so that the center, installation site of the semiconductor chip 25 of circuit board 35 becomes on the Y direction center line 38 of welding bench 24 again.This position of circuit board 35 is called the welding position.
Fig. 5 is along the bonding sectional view with platform 22 and welding bench 24 of the film of Y direction center line 38 shown in Figure 4, expression 28 cross sections along the slot length direction, vacuum suction chamber.As shown in Figure 5, heater block 31 is fixed on the pedestal 37, and film is bonding with platform 22 and welding bench 24 superimposed being fixed on the described heater block 31.Each vacuum at the center of above-mentioned each vacuum suction chamber 28a～28e is inhaled hole 27a～27e and is connected with concetrated pipe with welding bench 24 inside at the bonding platform 22 of using of film, and is bonding with platform 22 and welding bench 24 guide bases 37 bottoms from film.And,, be connected with vacuum pipe arrangement 33 in pedestal 37 bottoms.Each vacuum is inhaled hole 27a～27e and also can be constituted not bonding with platform 22 and welding bench 24 inner formation concetrated pipes at film, connect the bonding downside of film respectively with platform 22 or welding bench 24, vacuum pipe arrangement 33 is connected with each breakthrough part, at vacuum pipe arrangement 33 midway, be aggregated into a concetrated pipe, be connected with vacuum plant 26.Vacuum plant both can be bonding general with platform 22 and welding bench 24 at film, also each 22,24 setting one by one relatively.
Fig. 6 A, 6B represent chip installation collet chuck 16 in detail, and wherein, Fig. 6 A is that the expression chip is installed the plane graph with collet chuck 16 end faces, and Fig. 6 B is its side cross-sectional view.As Fig. 6 A, shown in the 6B, the chip installation is provided with at front end with collet chuck 16 and is used to adsorb vacuum suction hole 16a and the vacuum suction chamber 16b that keeps semiconductor chip 25.Vacuum is inhaled hole 16a and is not connected with there being illustrated vacuum plant.Vacuum suction chamber 16b is the square-section groove of X type, is roughly 45 degree inclinations, intersects mutually, has vacuum at its each central point and inhales hole 16a.The cross sectional shape of the groove of above-mentioned vacuum suction chamber 16b is not limited to square, also can be other shapes, for example semicircle etc.In addition, being formed centrally radial groove if flat shape is inhaled the 16a of hole from vacuum, so that can adsorb semiconductor chip 25 effectively, then being not limited to the X type, also can be cross shape or star-like shape etc.Electrode pad (pad) 25a is located at semiconductor chip 25 peripheries, be positioned at peripheral edge margin 25b, chip is installed littler than the middle section 25c that is positioned at described peripheral edge margin 25b inboard with the front end face size of collet chuck 16, even semiconductor chip 25 multi-discs are stacked in occasion on the circuit board 35, can install with collet chuck 16 damages yet and connect the semiconductor chip 25 that formerly engages and the lead-in wire between the circuit board 35 with circuit board 35 because of chip.In addition, chip is installed both can metallic with the front end of collet chuck 16, also can constitute by vulcanies such as acrylonitrile-butadiene rubbers so that strain during welding, with semiconductor chip towards circuit board 35 pushings.
Fig. 7 A is the bonding plane graph with collet chuck 13 end faces of expression film, and Fig. 7 B is its side cross-sectional view.As Fig. 7 A, shown in the 7B, bonding also the installation with chip with collet chuck 13 of film uses collet chuck 16 identical, is provided with vacuum at front end and inhales hole 13a and vacuum suction chamber 13b.Its front end face size is littler than the middle section 25c of semiconductor chip 25.
Below, with reference to Fig. 8～Figure 18, the fixing means of bent circuit board is described, the action of program.Fig. 8 and Fig. 9 are the flow charts of this example of expression action, and Fig. 8～Figure 18 is the key diagram of expression operate condition.
If start die bonder 10, then the circuit board of supplying with from framework loader 20 shown in Figure 1 35 is transported to bonding platform 22 positions of using of film by framework feeder 17 along directions X.As shown in figure 10, on circuit board 35, first section semiconductor chip 25 is installed, by going between between 34 connection semiconductor chips 25 and the circuit board 35 by thermo-compressed film 23.Circuit board 35 is thin plates, owing to engaging first section semiconductor chip 25 warpage takes place, and produces macrobending, becomes the floating significantly state of going up from the bonding circuit board adsorption plane 22a with platform 22 of film.Front end is equipped with the bonding arm 12 of the bonding film with collet chuck 13 of film and is in the position of readiness that transports passage that is made of framework feeder 17 that departs from circuit board 35, make the film of front end bonding with collet chuck 13 as the lifting position standby.In this example, the position of readiness of the bonding arm 12 of film is in such position, framework feeder 17 outsides with collet chuck 13 and describes as the film of front end is bonding, but, as long as the bonding front end with collet chuck 13 of film is not interfered with the circuit board 35 that transports the bending that comes, this position of readiness also can be regional between the framework feeder 17 of both sides.Again, if start die bonder 10, then the 1st control part 81 of computer 80 is to the bonding heater block enabled instruction with platform 22 of heater block interface 85 output films, and thus, heater block interface 85 starts heating source 31a, the heating of beginning heater block 31.Be heated to for example 100～120 ℃ with platform 22 by heater block 31 with film is bonding.Can be according to the engagement characteristics change heating-up temperature of employed thermo-compressed film 23.
The 1st control part 81 beginnings program behavior that circuit board 35 is absorbed and fixed at the bonding usefulness of film platform 22 as shown in Figure 8 of computer 80.Shown in the step S101 of Fig. 8, when look for a fixture 30 by circuit board position, when circuit board 35 moves, detection is looked for a fixture 30 by circuit board position, whether circuit board 35 arrives institute's allocation, its detection signal looks for a fixture interface 87 to be transformed into the signal that can import the 1st control part 81 by circuit board position, imports the 1st control part 81.The 1st control part 81 of computer 80 is according to this signal, and as shown in figure 11, by the camera data that shooting means interface 88 detects by 40 shootings of shooting means, whether decision circuitry plate 35 arrives the film bonding location.
If circuit board 35 arrives the film bonding location, then look for a fixture 30 to send film bonding location arriving signal from circuit board position, this signal is looked for a fixture interface 87 inputs the 1st control part 81 from circuit board position.Shown in the step S102 of Fig. 8, the 1st control part 81 of computer 80 is because of importing above-mentioned signal, decision circuitry plate 35 arrive fixed film bonding location, to the instruction that does not have illustrated conveyer output stopping to transport action, circuit board 35 stops at the film bonding location.
Then, the 1st control part 81 of computer 80 starts vacuum plant 26 shown in the step S103 of Fig. 8.The circuit board 35 that is transported to the film bonding location as shown in figure 10, float significantly from circuit board adsorption plane 22a, therefore, even attract vacuum to inhale the air of hole 27a～27e by vacuum plant 26, the pressure of vacuum suction chamber 28a～28e does not become vacuum yet, can not adsorb fixing circuit board 35.Therefore, circuit board 35 keeps the floating state of going up.
Shown in the step S104 of Fig. 8, the 1st control part 81 of computer 80 is according to the data that are input to the circuit board 35 of storage part 83 in advance, set only circuit board 35 along X, the pushing position of Y direction.In this example, the pushing set positions is at the middle position of the semiconductor chip 25 of the central authorities of circuit board 35.This is owing to following reason: it is bonding with on the platform 22 that the middle position of circuit board 35 can press against circuit board integral body film equably; Do not go between 34 at semiconductor chip 25 central portions, can not damage the connection lead-in wire 34 of first section semiconductor chip 25 because of racking; This position is can more effectively adsorb circuit board 35 towards the position of pushing circuit board 35 under the center court of vacuum suction chamber 28c.So long as one of sealed vacuum adsorbent chamber 28a～28e, the pushing position also can be made as the position of central portion of semiconductor chip 25 of other positions of conduct of circuit board 35.In addition, the bonding front end size with collet chuck 13 of film is littler than the middle section 25c of the semiconductor chip 25 of Fig. 6 explanation, therefore, as long as film is bonding not outstanding from the middle section 25c of semiconductor chip 25 with collet chuck 13, the middle position that also can depart from semiconductor chip 25 can be set in the optimum position according to each semiconductor chip 25 structure.
If the pushing position of initialization circuit plate 35, then shown in the step S105 of Fig. 8, the 1st control part 81 of computer 80 will make film bonding with collet chuck 13 positions move to its setting along X, the instruction of the position of Y direction outputs to travel mechanism's interface 90.As Fig. 3 and shown in Figure 11, travel mechanism's interface 90 is according to this instruction, drives XY platform 41, begins mobile film bonding 11, make the bonding position of film of bonding arm 12 front ends of film with collet chuck 13 move to setting along X, the pushing position of Y direction.The 1st control part 81 of computer 80 is shown in the step S106 of Fig. 8, and the detection signal of obtaining from XY position detection means 36 from XY position detection means interface 91 monitors bonding front position and the pushing position of setting poor with collet chuck 13 of film.In addition, also can be bonding with collet chuck 13 by 40 pairs of films of shooting means, the image of semiconductor chip 25 and circuit board 35 is made a video recording, by shooting means interface 88 this view data is imported the 1st control part 81, at the 1st control part 81, carry out image processing, obtain the bonding front position of film, monitor the poor of and instruction value with collet chuck 13.And,, then shown in the step S107 of Fig. 8, stop the bonding instruction of moving of film with collet chuck 13 front positions to 90 outputs of travel mechanism's interface if the 1st control part 81 of computer 80 judges that above-mentioned difference surpasses threshold value.
Travel mechanism's interface 90 stops bonding 11 of film according to this instruction and moves, stop film bonding with collet chuck 13 front positions along X, the moving of Y direction.Stop when mobile with collet chuck 13 when film is bonding, as shown in figure 11, the bonding front position with collet chuck 13 of film arrives the middle position of the semiconductor chip 25 of circuit board 35 central authorities, and the Z direction position of the bonding front end with collet chuck 13 of film becomes the lifting position of leaving circuit board 35 or semiconductor chip 25.
Shown in the step S108 of Fig. 8, the 1st control part 81 of computer 80 makes the bonding instruction that moves down with collet chuck 13 front ends of film to travel mechanism's interface 90 output.According to this instruction, travel mechanism's interface 90 output drives the drive motor that is located at the bonding arm 12 of film on bonding 11 of the film, make film bonding with collet chuck 13 front ends such signal that moves down.Then, the motor that the driving film is bonding 11, the bonding arm 12 of film begins revolution towards the direction that moves down.The bonding load detection signal with collet chuck 13 front ends of the film of load transducer 32 is imported the 1st control part 81 from load transducer interface 89.The 1st control part 81 of computer 80 shown in the step S109 of Fig. 8, monitor this signal and the bonding ground connection load with collet chuck 13 of fixed film poor.Described ground connection load is that film is bonding with detected load during end in contact before the collet chuck 13, and the crimping load of the semiconductor chip during than common welding is little.
As shown in figure 12, because the down action of the bonding arm 12 of film, film is bonding to begin towards the circuit board 35 of bending down with collet chuck 13 front ends.Then, bonding front end and the semiconductor chip 25 with collet chuck 13 of film joins.Under this state, circuit board 35 from circuit board adsorption plane 22a floating significantly on, towards vacuum plant 26, air flows through this gap, vacuum suction chamber 28a～28e any all do not have sealed, can not vacuum suction circuit board 35.
The 1st control part 81 of computer 80 in the bonding arm 12 of film moves down by continue to monitor from the input signal of load transducer 32 be applied to the bonding load of film with collet chuck 13 front ends whether meet or exceed fixed ground connection load.Then, the 1st control part 81 of computer 80 is shown in the step S109 of Fig. 8, when surpassing the threshold value occasion from the input signal of load transducer 32 and the difference of ground connection load, judge that film is bonding with collet chuck 13 contacts, shown in the step S110 of Fig. 8, stop the bonding instruction that moves down with collet chuck 13 of film to 90 outputs of travel mechanism's interface.Travel mechanism 43 stops the motor of bonding 11 of film according to this instruction, stops the bonding arm 12 of film and moves down, and stops that film is bonding to move down with collet chuck 13.
At this moment, as shown in figure 13, move down with collet chuck 13 front ends because of film is bonding, pushing circuit board 35 central portions are towards the bonding circuit board adsorption plane 22a with platform 22 of film, circuit board 35 parts below the semiconductor chip 25 of central authorities join with circuit board adsorption plane 22a, simultaneously, circuit board 35 covers on the face of vacuum suction chamber 28c upside.Thus, blocked from vacuum suction chamber 28a～28e to the air flow circuit part of vacuum plant 26, tail off to the air mass flow of vacuum plant 26, vacuum suction chamber 28a～28e integral pressure is low.And if vacuum suction chamber 28a～28e integral pressure is lower than atmospheric pressure, then circuit board 35 is bonding with on the platform 22 because of atmospheric pressure begins to press against film.So, below circuit board 35, connect airtight around the 28c of gap minimum below the circuit board 35 and between the circuit board adsorption plane 22a, above the sealed vacuum adsorbent chamber 28c.Thus, circuit board 35 central portions are adsorbed on the circuit board adsorption plane 22a.As shown in figure 13, vacuum suction chamber 28a, 28b, 28d, the circuit board 35 on the 28e also are in the floating state of going up from circuit board adsorption plane 22a.But because vacuum suction chamber 28c is sealed, the air mass flow that vacuum plant 26 attracts further tails off, and vacuum suction chamber 28a～28e integral pressure is further low.Thus, be positioned at vacuum suction chamber 28a, further film is bonding to be used on the platform because of atmospheric pressure presses against powerfully for 28b, 28d, the circuit board 35 above the 28e.
And, if circuit board 35 sealed vacuum adsorbent chamber 28a, 28b, 28d, 28e are above any, and then air does not flow to vacuum plant 26 from this vacuum suction chamber, and vacuum suction chamber 28a～28e integral pressure is further low, becomes big with atmospheric pressure differential.And big if pressure differential becomes, the power that down pushes circuit board 35 also becomes greatly, and vacuum suction chamber 28a～28e is on every side sealed by circuit board 35 chainly gradually.If all vacuum suction chamber 28a～28e are sealed by circuit board 35, then circuit board 35 is adsorbed on the absorptive table by the perfect vacuum.Like this, if a vacuum suction chamber is sealed, then vacuum suction chamber integral pressure is chain low, because of with atmospheric pressure differential, circuit board 35 is adsorbed on the circuit board adsorption plane 22a quickly.If all vacuum suction chamber 28a～28e is sealed by circuit board 35, then as shown in figure 14, circuit board 35 is absorbed and fixed on the circuit board adsorption plane 22a, each vacuum suction chamber 28a～28e, each vacuum is inhaled hole 27a～27e, and the pressure of vacuum pipe arrangement 33 roughly becomes vacuum state.In this example, bonding by film with collet chuck 13 pushing circuit boards 35 central authorities, still, be not limited thereto, do not push circuit board 35 central authorities, from the vacuum suction chamber 28a of circuit board 35 ends according to 28b, 28c, 28d, the 28e order, it is also very suitable to push.
Shown in the step S111 of Fig. 8, the 1st control part 81 of computer 80 is obtained the pressure signal of the detected pressures of pressure sensor 29 as pressure sensor interface 86, judges that this pressure and institute decide the difference of vacuum pressure whether above decide threshold value.And, when surpassing institute, this difference decide the threshold value occasion, and the 1st control part 81 of computer 80 is judged as because of whole vacuum, and circuit board 35 is absorbed and fixed on the bonding usefulness of the film platform 22.
The 1st control part 81 of computer 80 then makes to travel mechanism's interface transmission to make the bonding collet chuck 13 of using of film rise the fixed routine of end bent circuit board by the bonding signal that rises with collet chuck 13 of film as if the vacuum suction state of confirming circuit board 35.
On the other hand, decide the threshold value occasion when above-mentioned pressure differential surpasses institute, the 1st control part 81 of computer 80 judges to become and does not seal certain vacuum suction chamber, sucks air state that circuit board 35 is adsorbed fully to be fixed.And when the vacuum suction state occasion that can not confirm circuit board 35, shown in the step S111 of Fig. 8, the 1st control part 81 of computer 80 is carried out the racking of circuit board 35 once more.
Shown in the step S112 of Fig. 8, the 1st control part 81 of computer 80 judges whether to have carried out number of times that pushing is again decided action earlier.Decide number of times and for example be meant once or the such number of times of secondary.And, carried out number of times that pushing is again decided action occasion, the 1st control part 81 of computer 80 is judged the bent circuit board 35 fixing action failures that take place, and shown in the step S114 of Fig. 8, carries out fault and stops to handle, and stops die bonder 10.
In the step S112 of Fig. 8, the 1st control part 81 of computer 80 is judged number of times racking occasion again that not implementation is decided, for example, once do not carry out racking occasion more yet, shown in the step S113 of Fig. 8, make the bonding instruction that highly resets to lifting position with collet chuck 13 of film to travel mechanism's interface 90 output.Make film bonding, finish the fixed routine of bent circuit board with collet chuck 13 risings.Travel mechanism's interface 90 drives the motor of bonding 11 of film according to this instruction, makes the bonding arm 12 of film rise, and the bonding front end with collet chuck 13 of film is reset to the lifting position of initial condition.And, the 1st control part 81 of computer 80 shown in the step S104 of Fig. 8, the change circuit board along X, the setting of the pushing position of Y direction.This also can be set in the middle position of adjacent semiconductor chip 25 of the pushing position of last time.In addition, also can set near the middle section of the semiconductor chip 25 in the highest vacuum suction chamber of pushing pressure in advance at each vacuum suction chamber 28a～28e setting pressure transducer 29.
Then, if the pushing set positions finishes, then the 1st control part 81 of computer 80 is shown in the step S105 of Fig. 8, make the bonding front position of film move to again the pushing position of setting by travel mechanism 43 once more with collet chuck 13, carry out Fig. 8 from step S108 to the racking once more shown in the step S110.Then, shown in the step S111 of Fig. 8, if confirm the vacuum state in vacuum suction chamber 28, it is bonding with on the platform 22 that then decision circuitry plate 35 is attracted to film, and the 1st control part 81 of computer 80 finishes the fixed routine of bent circuit board shown in Figure 8.
As shown in figure 15, film is bonding to be used on the platform 22 if circuit board 35 is absorbed and fixed at, but has then risen to the heater block 31 heater circuit plates 35 and the semiconductor chip 25 of heating-up temperature by the temperature of bottom, becomes the state of the bonding thermo-compressed film 23 of energy.The 1st control part 81 of computer 80 makes other thermo-compressed film bonding procedure start, and picks up thermo-compressed film 23 by film is bonding with collet chuck 13 absorption, bonds on the semiconductor chip 25.Then, if the bonding thermo-compressed film 23 in whole places of the bonding thermo-compressed film 23 of needs of circuit board 35 finishes, then remove the bonding vacuum of film with platform 22.If Vacuum solutions is removed, circuit board 35 is returned to the case of bending along last direction once more.The 1st control part 81 of computer 80 makes crooked circuit board 35 move to welding bench 24 by framework feeder 17.
Circuit board 35 beginnings are moved simultaneously to welding bench 24, the absorption fixed routine action to welding bench 24 of the 1st control part 81 beginnings circuit board 35 as shown in Figure 9 of computer 80.In Fig. 9, with the circuit board 35 of Fig. 8 explanation to the bonding fixed routine same section of film with platform 22, omission is described.As shown in figure 16, on circuit board 35, the thermo-compressed film 23 that second section semiconductor chip 25 engages usefulness is installed on first section semiconductor chip 25, therefore, the warpage of circuit board 35 is more some greatly than bonding platform 22 states of using of film that move to of above-mentioned explanation, and circuit board 35 becomes the floating significantly state of going up from the circuit board adsorption plane 24a of welding bench 24.Identical with above-mentioned explanation, front end is equipped with chip and welding arm 15 with collet chuck 16 is installed is in the position of readiness that transports passage that is made of framework feeder 17 that departs from circuit board 35, and the chip installation of front end becomes lifting position with collet chuck 16.In addition, by heater block 31 welding bench 24 is heated to for example 250～300 ℃.Can be according to the engagement characteristics change heating-up temperature of employed thermo-compressed film 23.But crooked circuit board 35 is from the welding bench 24 floating states of going up, and almost is not heated.
Shown in the step S201 of Fig. 9, when look for a fixture 30 by circuit board position, when circuit board 35 moves, detection is looked for a fixture 30 by circuit board position, whether circuit board 35 arrives institute's allocation, its detection signal looks for a fixture interface 87 to be transformed into the signal that can import the 1st control part 81 by circuit board position, imports the 1st control part 81.The 1st control part 81 of computer 80 is according to this signal, and as shown in figure 11, by the camera data that shooting means interface 88 detects by 40 shootings of shooting means, whether decision circuitry plate 35 arrives the welding position.
If circuit board 35 arrives the welding position, then look for a fixture 30 to send the welding position arriving signal from circuit board position, this signal is looked for a fixture interface 87 inputs the 1st control part 81 from circuit board position.Shown in the step S202 of Fig. 9, the 1st control part 81 of computer 80 is because of importing above-mentioned signal, decision circuitry plate 35 arrive fixed welding position, to the instruction that does not have illustrated conveyer output stopping to transport action, circuit board 35 stops at the welding position.
Then, the 1st control part 81 of computer 80 starts vacuum plant 26 shown in the step S203 of Fig. 9.Then, shown in the step S204 of Fig. 9, the 1st control part 81 of computer 80 set only circuit board 35 along X, the pushing position of Y direction.In this example, the middle position of the thermo-compressed film 23 of pushing set positions on the semiconductor chip 25 that is bonded in circuit board 35 central authorities is so that more effectively adsorb fixing circuit board 35.So long as one of sealed vacuum adsorbent chamber 28a～28e, the pushing position also can be made as the position of the thermo-compressed film 23 on semiconductor chip 25 middle sections of other positions of conduct of circuit board 35.In addition, chip is installed with the front end size of collet chuck 16 littler than the middle section 25c of the semiconductor chip 25 of Fig. 6 explanation, therefore, as long as it is not outstanding from the middle section 25c of semiconductor chip 25 that chip is installed with collet chuck 16, the middle position that also can depart from semiconductor chip 25 can be set in the optimum position according to each semiconductor chip 25 structure.
If the pushing position of initialization circuit plate 35, then shown in the step S205 of Fig. 9, the 1st control part 81 of computer 80 will make chip install with collet chuck 16 positions move to its setting along X, the instruction of the position of Y direction outputs to travel mechanism's interface 90, drive XY platform 42, the chip of mobile welding arm 15 front ends is installed the position with collet chuck 16.The 1st control part 81 of computer 80 monitors that chip installs poor with the pushing position of the front position of collet chuck 16 and setting shown in the step S206 of Fig. 9.And, if the 1st control part 81 of computer 80 judges that above-mentioned difference surpasses threshold value, then shown in the step S207 of Fig. 9, stop chip installing with collet chuck 16 front positions along X, the moving of Y direction.Install with collet chuck 16 when chip and to stop when mobile, chip is installed the middle position that arrives the semiconductor chip 25 of circuit board 35 central authorities with the front position of collet chuck 16, and the Z direction position that chip is installed with the front end of collet chuck 16 becomes the lifting position of leaving circuit board 35 or semiconductor chip 25.
Shown in the step S208 of Fig. 9, the 1st control part 81 beginning chips of computer 80 are installed and are moved down with collet chuck 16.Then, the chip of load transducer 32 is installed with the load detection signal of collet chuck 16 front ends and is imported the 1st control part 81 from load transducer interface 89, the 1st control part 81 of computer 80 shown in the step S209 of Fig. 9, monitor this signal and fixed chip poor with the ground connection load of collet chuck 16 is installed.Ground connection load is that chip is installed detected load when using collet chuck 16 front end ground connection, and the crimping load of the semiconductor chip 25 during than common chips welding is little.Again, even the load of this load during than bonding thermo-compressed film 23 is little also suitable.At this moment because littler than the bonding load of thermo-compressed film 23 by being made as, thermo-compressed film 23 is attached to the chip installation with on the collet chuck 16 in the time of preventing to push circuit board 35.
As shown in figure 16, because the down action of welding arm 15, chip is installed with collet chuck 16 front ends and is begun towards the circuit board 35 of bending down.The 1st control part 81 of computer 80 in welding arm 15 moves down by continue to monitor from the input signal of load transducer 32 be applied to chip install load with collet chuck 16 front ends whether meet or exceed fixed ground connection load.Install under thermo-compressed film 23 states that begin to push with collet chuck 16 on the semiconductor chip 25 that engages with circuit board 35 at chip, circuit board 35 floats from welding bench 24, therefore, its temperature is not high, even the chip installation is pressed against on the thermo-compressed film 23 with collet chuck 16, thermo-compressed film 23 can not melt yet and be attached to the chip installation with on the collet chuck 16.Then, the 1st control part 81 of computer 80 is shown in the step S209 of Fig. 9, and when surpassing the threshold value occasion from the input signal of load transducer 32 and the difference of ground connection load, the judgement chip is installed with collet chuck 16 ground connection, shown in the step S210 of Fig. 9, stop the chip installation and move down with collet chuck 16.
Install with collet chuck 16 pushing circuit boards 35 towards circuit board adsorption plane 24a by chip, if below circuit board 35, connect airtight around the vacuum suction chamber 28c of gap minimum below the circuit board 35 and between the circuit board adsorption plane 24a, above the sealed vacuum adsorbent chamber 28c, Zhou Wei vacuum suction chamber 28a then, 28b, 28d, 28e is sealed by circuit board 35 continuously one by one, as shown in figure 17, circuit board 35 is absorbed and fixed on the circuit board adsorption plane 24a, each vacuum suction chamber 28a～28e, each vacuum is inhaled hole 27a～27e, and the pressure of vacuum pipe arrangement 33 roughly becomes vacuum state.In this example, install with collet chuck 16 pushing circuit boards 35 central authorities by chip, still, be not limited thereto, do not push circuit board 35 central authorities, from the vacuum suction chamber 28a of circuit board 35 ends according to 28b, 28c, 28d, the 28e order, it is also very suitable to push.
Shown in the step S211 of Fig. 9, the 1st control part 81 of computer 80 then makes chip install with collet chuck 16 and rises if confirm the vacuum suction state of circuit board 35, finishes the fixed routine of bent circuit board.
On the other hand, decide the threshold value occasion when above-mentioned pressure differential surpasses institute, the 1st control part 81 of computer 80 judges to become and does not seal certain vacuum suction chamber, sucks air state that circuit board 35 is adsorbed fully to be fixed.And, as above-mentioned with reference to Fig. 8 illustrated, when the vacuum suction state occasion that can not confirm circuit board 35, shown in the step S211 of Fig. 9, the 1st control part 81 of computer 80 is carried out the racking of circuit board 35 once more.
Shown in the step S212 of Fig. 9, the 1st control part 81 of computer 80 judges whether to carry out number of times that pushing is again decided action, number of times racking occasion ("No" of step S212) again that implementation is decided, shown in the step S213 of Fig. 9, chip is installed the lifting position that resets to initial condition with the front end of collet chuck 16.And, the 1st control part 81 of computer 80 is shown in the step S204 of Fig. 9, the change circuit board along X, the setting of the pushing position of Y direction, shown in the step S205 of Fig. 9, the front position that makes chip install with collet chuck 16 by travel mechanism 44 moves to the pushing position of setting again once more, implementation Fig. 9 from step S208 to the racking once more shown in the step S210.Then, shown in the step S211 of Fig. 9, if confirm the vacuum state in vacuum suction chamber 28, then decision circuitry plate 35 is attracted on the welding bench 24, and the 1st control part 81 of computer 80 finishes the fixed routine of bent circuit board shown in Figure 9.
Shown in the step S212 of Fig. 9, carried out decide the occasion of racking again of number of times, the 1st control part 81 of computer 80 is judged the bent circuit boards 35 fixing action failures that take place, shown in the step S214 of Fig. 9, carry out fault and stop to handle, stop die bonder 10.
As shown in figure 18,, but then risen to the heater block 31 heater circuit plates 35 and the semiconductor chip 25 of heating-up temperature by the temperature of bottom if circuit board 35 is absorbed and fixed on the welding bench 24, become can bond semiconductor chip 25 state.The 1st control part 81 of computer 80 makes other welding procedure start, and the semiconductor chip crimping is joined on the thermo-compressed film 23 with collet chuck 16 by chips welding.Then,, then remove the vacuum of welding bench 24, make circuit board 35 move to framework by framework feeder 17 and unload device 21 if the whole local crimping bond semiconductor chip that needs bond semiconductor chip 25 of circuit board 35 25 finishes.
As mentioned above, this example has following effect: do not need to append special construction on common die bonder 10, Change Control Procedure only can be simply and effectively bent circuit board 35 vacuum suction to be fixed on film bonding with on platform 22 and the welding bench 24.Again, needn't dispose movable agency, therefore, have the effect that to carry out circuit board absorption and heating simultaneously, improve welding efficiency in the bottom.
This example is installed with collet chuck 16 with collet chuck 13 or chip by the front end size film littler than semiconductor chip 25 middle section 25c is bonding, the circuit board 35 that pushing is crooked, therefore, has following effect: even semiconductor chip 25 multistages are stacked in occasion on the circuit board 35, can not damage the first connection semiconductor chip 25 that engages and the lead-in wire 34 of circuit board 35 yet, circuit board 35 can be absorbed and fixed on film bonding usefulness platform 22 or the welding bench 24.
This example use the thermo-compressed film, one or more snippets is bonded in the die bonder on the circuit board 35 with semiconductor chip 25, has following effect: can sending to according to the circuit board 35 of bending, the pushing film is bonding with platform 22 and welding bench 24 continuously, and fixing circuit board 35 effectively.Again, in this example, before heater circuit plate 35, the face that pushes thermo-compressed films 23 with collet chuck 16 is installed by chip, therefore, has following effect: 23 fusings of thermo-compressed film can not take place be attached to the chip installation, circuit board 35 can be absorbed and fixed on the welding bench 24 with on the collet chuck 16.
Above with reference to description of drawings embodiments of the invention, but the present invention is not limited to above-mentioned example.Can do all changes in the technology of the present invention thought range, they all belong to protection scope of the present invention.
For example, in this example, be stacked in for semiconductor chip 25 little semiconductor chip 25 multistages that occasion describes on the circuit board 35 than hypomere, but the present invention is not limited to above-mentioned example, also can on circuit board 35, pass through film distance piece 46, the semiconductor chip 25 that lamination is onesize as shown in figure 19, even this occasion also can be suitable for this example.
Again, in this example, be installed in bent circuit board 35 on the circuit board 35 for first section semiconductor chip 25 by thermo-compressed film 23 and be absorbed and fixed at that film is bonding to be described with occasion on platform 22 and the welding bench 24, but the present invention is not limited to above-mentioned example, and this example is applicable to that also the bent circuit board 35 that semiconductor chip 25 is not installed is absorbed and fixed at occasion on film bonding usefulness platform 22 and the welding bench 24.
Claims (16)
1. chips welding machine comprises:
Welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
Chip is installed and is used collet chuck, and semiconductor chip is installed on the welding object;
Control part (83b), control are installed by described chip and with collet chuck bent circuit board are pushed towards welding bench, make this bent circuit board seal at least one vacuum suction chamber.
2. a chips welding machine by semiconductor core chip bonding film, is bonded on semiconductor chip on the welding object, and it comprises:
Welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
Chip is installed and is used collet chuck, and semiconductor chip is installed on the welding object;
The bonding platform of using of film is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
The bonding collet chuck of using of film is bonded in the semiconductor core chip bonding on the welding object with film;
Control part (83a), control are by the bonding collet chuck of using of described film, and bent circuit board is bonding with the platform pushing towards film, make this bent circuit board seal at least one vacuum suction chamber.
3. according to the chips welding machine described in the claim 2, it is characterized in that:
Further comprise control part (83g), control, make when being stacked in the semiconductor chip multistage on the circuit board, by film bonding with collet chuck by being positioned at the middle section that one or more snippets is installed in the semiconductor chip of the epimere of semiconductor chip on the bent circuit board, bent circuit board is pushed with platform towards film is bonding;
The bonding front end face size with collet chuck of described film is littler than the middle section that is positioned at the inboard, electrode pad zone that is configured in the semiconductor chip periphery.
4. according to the chips welding machine described in claim 2 or 3, it is characterized in that:
Further comprise control part (83g), control, make when being bonded on semiconductor chip multistage lamination on the circuit board, install with collet chuck by being positioned at bonding semiconductor core chip bonding film on one or more snippets semiconductor chip that is installed in the epimere of semiconductor chip on the bent circuit board by chip, bent circuit board is pushed towards welding bench.
5. according to the chips welding machine described in the claim 4, it is characterized in that:
Control part (83g) is controlled, and by being installed in the semiconductor core chip bonding film of semiconductor chip middle section, bent circuit board is pushed towards welding bench.
Described chip is installed with the front end face size of collet chuck littler than the middle section that is positioned at the inboard, electrode pad zone that is configured in the semiconductor chip periphery.
6. according to any described chips welding machine among the claim 1-5, it is characterized in that:
Bonding towards welding bench or film with behind the platform pushing bent circuit board, further comprise:
Control part (83c) carries out the vacuum suction state confirmation, confirms whether circuit board is bonding with on the platform at welding bench or film by vacuum suction;
Control part (83d), control, in the control of vacuum suction state confirmation, can not confirm vacuum suction state occasion, change pushing bent circuit board along X, the position of Y direction is after making that chip is installed with collet chuck or film is bonding and moving to change of location with collet chuck, once more towards welding bench or film is bonding pushes bent circuit board with platform.
7. a chips welding machine by semiconductor core chip bonding film, is bonded on semiconductor chip on the welding object, and it comprises:
Welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
Chip is installed and is used collet chuck, and semiconductor chip is installed on the welding object;
The bonding platform of using of film is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board;
The bonding collet chuck of using of film is bonded in the semiconductor core chip bonding on the welding object with film;
Control part (83e), the control setting circuit board, affirmation starts the vacuum plant that is connected after being transported to welding bench or the bonding position with the bent circuit board on the platform of film with each;
Control part (83f), control circuit board pushing set positions, circuit board is set after, set the pushing bent circuit board along X, the position of Y direction;
Control part (83g), the control collet chuck moves, make chip install with collet chuck or film bonding with collet chuck move to by described circuit board pushing set positions operation set along X, the position of Y direction;
Control part (83a, 83b), the control pushing, bonding bent circuit board is bonding with the platform pushing towards welding bench or film by the chip installation with collet chuck with collet chuck or film, make circuit board seal at least one vacuum suction chamber;
Control part (83c), the vacuum suction state is confirmed in control, after the pushing operation, confirms whether circuit board is bonding with on the platform at welding bench or film by vacuum suction;
Control part (83d), control is pushing again, in the control of vacuum suction state confirmation, can not confirm vacuum suction state occasion, change pushing bent circuit board along X, the position of Y direction is after making that chip is installed with collet chuck or film is bonding and moving to change of location with collet chuck, once more towards welding bench or film is bonding pushes bent circuit board with platform.
8. the fixing means of the bent circuit board of a die bonder, described die bonder is provided with welding bench and chip installation collet chuck, described welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board, described chip is installed and with collet chuck semiconductor chip is installed on the welding object;
Wherein, with collet chuck bent circuit board is pushed towards welding bench, make circuit board seal at least one vacuum suction chamber by the chip installation.
9. the fixing means of the bent circuit board of a die bonder, described die bonder is provided with welding bench, chip is installed and is used collet chuck, film is bonding with platform and the bonding collet chuck of using of film, described welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board, described chip is installed and with collet chuck semiconductor chip is installed on the welding object, described film is bonding to be provided with at least one vacuum suction chamber with platform on the circuit board adsorption plane of absorption circuit board, described film is bonding to be bonded in the semiconductor core chip bonding on the welding object with film with collet chuck, semiconductor chip is bonded on the welding object with film by the semiconductor core chip bonding;
Wherein, bonding bent circuit board is bonding with the platform pushing towards film by film with collet chuck, make circuit board seal at least one vacuum suction chamber.
10. according to the fixing means of the bent circuit board of the die bonder described in the claim 9, it is characterized in that:
The bonding front end face size with collet chuck of described film is littler than the middle section that is positioned at the inboard, electrode pad zone that is configured in the semiconductor chip periphery;
When being stacked in the semiconductor chip multistage on the circuit board, by film bonding with collet chuck by being positioned at the middle section that one or more snippets is installed in the semiconductor chip of the epimere of semiconductor chip on the bent circuit board, bent circuit board is pushed with platform towards film is bonding.
11. the fixing means according to the bent circuit board of the die bonder described in claim 9 or 10 is characterized in that:
When being bonded on semiconductor chip multistage lamination on the circuit board, install with collet chuck by being positioned at bonding semiconductor core chip bonding film on one or more snippets semiconductor chip that is installed in the epimere of semiconductor chip on the bent circuit board by chip, bent circuit board is pushed towards welding bench.
12. the fixing means according to the bent circuit board of the die bonder described in the claim 11 is characterized in that:
Described chip is installed with the front end face size of collet chuck littler than the middle section that is positioned at the inboard, electrode pad zone that is configured in the semiconductor chip periphery;
By being installed in the semiconductor core chip bonding film of semiconductor chip middle section, bent circuit board is pushed towards welding bench.
13. the fixing means of the bent circuit board of any described die bonder according to Claim 8-12 is characterized in that:
Bonding towards welding bench or film with behind the platform pushing bent circuit board, comprise following operation:
Vacuum suction state confirmation operation confirms whether circuit board is bonding with on the platform at welding bench or film by vacuum suction;
Push operation again, in vacuum suction state confirmation operation, can not confirm vacuum suction state occasion, change pushing bent circuit board along X, the position of Y direction, after making that chip is installed with collet chuck or film is bonding and moving to change of location, once more towards welding bench or film is bonding pushes bent circuit board with platform with collet chuck.
14. the fixing means of the bent circuit board of a die bonder, described die bonder is provided with welding bench, chip is installed and is used collet chuck, film is bonding with platform and the bonding collet chuck of using of film, described welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board, described chip is installed and with collet chuck semiconductor chip is installed on the welding object, described film is bonding to be provided with at least one vacuum suction chamber with platform on the circuit board adsorption plane of absorption circuit board, described film is bonding to be bonded in the semiconductor core chip bonding on the circuit board with film with collet chuck, semiconductor chip is bonded on the welding object with film by the semiconductor core chip bonding;
Wherein, the fixing means of the bent circuit board of this die bonder comprises:
Circuit board is provided with operation, and affirmation starts the vacuum plant that is connected after being transported to welding bench or the bonding position with the bent circuit board on the platform of film with each;
Circuit board pushing set positions operation, after circuit board is provided with operation, set the pushing bent circuit board along X, the position of Y direction;
The collet chuck mobile process, make chip install with collet chuck or film bonding with collet chuck move to by described circuit board pushing set positions operation set along X, the position of Y direction;
The pushing operation, bonding bent circuit board is bonding with the platform pushing towards welding bench or film by the chip installation with collet chuck with collet chuck or film, make circuit board seal at least one vacuum suction chamber;
Vacuum suction state confirmation operation after the pushing operation, confirms whether circuit board is bonding with on the platform at welding bench or film by vacuum suction;
Push operation again, in vacuum suction state confirmation operation, can not confirm vacuum suction state occasion, change pushing bent circuit board along X, the position of Y direction, after making that chip is installed with collet chuck or film is bonding and moving to change of location, once more towards welding bench or film is bonding pushes bent circuit board with platform with collet chuck.
15. the fixed routine of a bent circuit board, make the control part of die bonder carry out, described die bonder is provided with welding bench, chip is installed and is used collet chuck, the bonding platform of using of film, the bonding collet chuck of using of film, the computer that comprises control part, described welding bench is provided with at least one vacuum suction chamber on the circuit board adsorption plane of absorption circuit board, described chip is installed and with collet chuck semiconductor chip is installed on the welding object, described film is bonding to be provided with at least one vacuum suction chamber with platform on the circuit board adsorption plane of absorption circuit board, described film is bonding to be bonded in the semiconductor core chip bonding on the welding object with film with collet chuck, semiconductor chip is bonded on the welding object with film by the semiconductor core chip bonding; Wherein, comprising:
Circuit board set handling program, affirmation start the vacuum plant that is connected after being transported to welding bench or the bonding position with the bent circuit board on the platform of film with each;
Circuit board pushing set positions handling procedure, after the circuit board set handling program, set the pushing bent circuit board along X, the position of Y direction;
Collet chuck moves handling procedure, make chip install with collet chuck or film bonding with collet chuck move to by described circuit board pushing set positions handling procedure set along X, the position of Y direction;
The pushing handling procedure, bonding bent circuit board is bonding with the platform pushing towards welding bench or film by the chip installation with collet chuck with collet chuck or film, make circuit board seal at least one vacuum suction chamber;
Vacuum suction state confirmation handling procedure behind the pushing handling procedure, confirms whether circuit board is bonding with on the platform at welding bench or film by vacuum suction;
Push handling procedure again, in vacuum suction state confirmation handling procedure, can not confirm vacuum suction state occasion, change pushing bent circuit board along X, the position of Y direction, after making that chip is installed with collet chuck or film is bonding and moving to change of location, once more towards welding bench or film is bonding pushes bent circuit board with platform with collet chuck.
16. a recording medium records the fixed routine of the bent circuit board described in the aforesaid right requirement 15, can read and carry out this fixed routine by computer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007112727A JP2008270591A (en) | 2007-04-23 | 2007-04-23 | Fixing method of curved circuit board in die bonder and program |
| JP2007-112727 | 2007-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101295657A true CN101295657A (en) | 2008-10-29 |
Family
ID=40049683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100832784A Pending CN101295657A (en) | 2007-04-23 | 2008-03-03 | Method for fixing bent circuit board of die bonder and die bonder apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008270591A (en) |
| KR (1) | KR20080095163A (en) |
| CN (1) | CN101295657A (en) |
| TW (1) | TW200842991A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966635A (en) * | 2010-10-18 | 2011-02-09 | 卓盈微电子（昆山）有限公司 | Improved quartz table for use in chip welding |
| CN104425326A (en) * | 2013-08-20 | 2015-03-18 | 致茂电子股份有限公司 | Film absorption device |
| CN110571160A (en) * | 2018-07-20 | 2019-12-13 | 安徽博辰电力科技有限公司 | semiconductor packaging chip bonding process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10714378B2 (en) | 2012-11-15 | 2020-07-14 | Amkor Technology, Inc. | Semiconductor device package and manufacturing method thereof |
| US9136159B2 (en) | 2012-11-15 | 2015-09-15 | Amkor Technology, Inc. | Method and system for a semiconductor for device package with a die-to-packaging substrate first bond |
| JP6490522B2 (en) * | 2015-07-14 | 2019-03-27 | 東レエンジニアリング株式会社 | Semiconductor mounting equipment |
| CN107498842A (en) * | 2017-08-16 | 2017-12-22 | 武汉华星光电半导体显示技术有限公司 | Laminating apparatus and applying method |
| WO2020032068A1 (en) * | 2018-08-06 | 2020-02-13 | ヤマハモーターロボティクスホールディングス株式会社 | Bonding head |
| KR102287439B1 (en) * | 2019-04-23 | 2021-08-09 | 주식회사 탑 엔지니어링 | Coating device with pressure unit and coating method using the same |
| KR102252734B1 (en) * | 2019-07-18 | 2021-05-17 | 세메스 주식회사 | Die bonder |
| KR102493421B1 (en) * | 2022-09-30 | 2023-01-27 | 한국전기연구원 | electromagnetic sensor with curved electrode for measuring impulse and manufacturing method thereof |
-
2007
- 2007-04-23 JP JP2007112727A patent/JP2008270591A/en not_active Withdrawn
- 2007-09-10 TW TW096133695A patent/TW200842991A/en unknown
- 2007-12-04 KR KR1020070125047A patent/KR20080095163A/en not_active Application Discontinuation
-
2008
- 2008-03-03 CN CNA2008100832784A patent/CN101295657A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966635A (en) * | 2010-10-18 | 2011-02-09 | 卓盈微电子（昆山）有限公司 | Improved quartz table for use in chip welding |
| CN104425326A (en) * | 2013-08-20 | 2015-03-18 | 致茂电子股份有限公司 | Film absorption device |
| CN104425326B (en) * | 2013-08-20 | 2017-06-09 | 致茂电子股份有限公司 | Film adsorption plant |
| CN110571160A (en) * | 2018-07-20 | 2019-12-13 | 安徽博辰电力科技有限公司 | semiconductor packaging chip bonding process |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200842991A (en) | 2008-11-01 |
| KR20080095163A (en) | 2008-10-28 |
| JP2008270591A (en) | 2008-11-06 |
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