CN104425326B - Film adsorption plant - Google Patents
Film adsorption plant Download PDFInfo
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- CN104425326B CN104425326B CN201310364415.2A CN201310364415A CN104425326B CN 104425326 B CN104425326 B CN 104425326B CN 201310364415 A CN201310364415 A CN 201310364415A CN 104425326 B CN104425326 B CN 104425326B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Separation Of Gases By Adsorption (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Abstract
A kind of film adsorption plant includes support base, first passage, second channel and pump.Support base has adsorption plane.First passage runs through support base.First passage has the first opening and the second opening, and the first opening of first passage is located at adsorption plane.Second channel runs through support base.Second channel has the first opening and the second opening, and the first opening of second channel is located at adsorption plane.Pump is communicated in the second opening of second channel.When a film be positioned over adsorption plane and cover first passage the first opening and second channel the first opening when, pumping gas to drive an air-flow that the gap of adsorption plane and film is flowed into and through from the second of first passage the opening, with adsorbent thin film.
Description
Technical field
The present invention is a kind of relevant film adsorption plant.
Background technology
In general, measuring light emitting diode (Light Emitting Diode；LED) during the characteristics of luminescence of chip, can
To be pasted with after the blue film of multiple LED wafers (blue tape) is put on an adsorbent equipment, then to measure LED by measurement equipment brilliant
Piece.After adsorbent equipment Primary Location indigo plant film, blue film projection out-of-flatness may be made between blue film and adsorbent equipment because there is air, because
This need to be vacuumized to the space between blue film and adsorbent equipment, to reduce the error in measurement of LED wafer.
Known adsorbent equipment reaches the effect of positioning and the blue film of leveling generally by the way of two-part is vacuumized.Citing
For, it is known that adsorbent equipment can have inner side bleeding point and outside bleeding point.After blue film is positioned on adsorbent equipment, can first make
First stage pumping is first imposed to outside bleeding point with pump, allows blue film to reach Primary Location.Pump is then used by again to inner side bleeding point
Second stage pumping is imposed, after the air between blue film and adsorbent equipment is extracted, blue film just can be the level of state.
But in actual use, to wait blue film to reach the characteristics of luminescence for measuring LED wafer after horizontality again, then need
(such as 4 minutes) are devoted a tremendous amount of time, feeding inconvenience is caused.Additionally, blue film has elasticity and viscosity, in long-time to blue film
After space between adsorbent equipment vacuumizes, blue film can be caused to be pasted onto on fixture, and can cause to pull when blue film is taken
Situation, causes blanking inconvenience.
The content of the invention
A technical approach of the invention is a kind of film adsorption plant.
According to an embodiment of the present invention, a kind of film adsorption plant comprising support base, first passage, second channel with
Pump.Support base has adsorption plane.First passage runs through support base.First passage has the first opening with the second opening, and first
First opening of passage is located at adsorption plane.Second channel runs through support base.Second channel has the first opening and the second opening, and
First opening of second channel is located at adsorption plane.Pump is communicated in the second opening of second channel.When a film is positioned over adsorption plane
And cover first passage the first opening and second channel the first opening when, pumping gas is driving an air-flow from first passage
Second opening flows into and through the gap of adsorption plane and film, with adsorbent thin film.
In an embodiment of the present invention, above-mentioned film adsorption plant also includes third channel and fourth lane.Threeway
Road runs through support base.Third channel has the first opening and the second opening, and the first opening of third channel is located at adsorption plane.The
Four-way runs through support base.Fourth lane has the first opening with the second opening.First opening of fourth lane is located at adsorption plane.
In an embodiment of the present invention, above-mentioned film adsorption plant also includes the first valve and the second valve.First valve
Door has air inlet and gas outlet.The air inlet of the first valve is communicated in second opening and the second of fourth lane of third channel
Opening.The gas outlet of the first valve is communicated in pump.Second valve has air inlet and gas outlet.The air inlet connection of the second valve
In the second opening of second channel.The gas outlet of the second valve is communicated in pump.Lead to when film is positioned over adsorption plane and covers first
During the first opening of first opening in road, the first opening of second channel, the first opening of third channel and fourth lane, pump
Pumping, the first valve is first opened with vacuum suction film, is then turned on the second valve, makes second opening stream of the air-flow from first passage
Enter and by adsorption plane and the gap of film, with adsorbent thin film.
In an embodiment of the present invention, above-mentioned film adsorption plant also includes flow controller.Flow controller is installed
In the second opening of first passage, it is used to control the flow of air-flow.
In an embodiment of the present invention, above-mentioned film adsorption plant also includes temperature controller.Temperature controller is installed
In the second opening of first passage, it is used to control the temperature of air-flow.
A technical approach of the invention is a kind of film adsorption plant.
According to an embodiment of the present invention, a kind of film adsorption plant includes support base, carrier film, first passage, second
Passage and pump.Support base has adsorption plane.Carrier film is arranged on adsorption plane.First passage runs through support base.First passage has
There are the first opening and the second opening, and the first opening of first passage is located at adsorption plane.Second channel runs through support base.Second leads to
Road has the first opening with the second opening.First opening of second channel is located at adsorption plane.Pump is communicated in the second of first passage
Opening is open with the second of second channel, and being used to drive makes a fluid be flowed into from the second opening of first passage, and by absorption
Face and the gap of carrier film, pump is returned to by the second opening of second channel.
In an embodiment of the present invention, above-mentioned film adsorption plant also includes flow controller.Flow controller is connected
In the second opening of first passage and pump, it is used to control the flow of fluid.
In an embodiment of the present invention, above-mentioned film adsorption plant also includes temperature controller.Temperature controller is connected
In the second opening of first passage and pump, it is used to control the temperature of fluid.
In an embodiment of the present invention, when a film is positioned over carrier film, pump drive fluid circulation, make carrier film with
Vacuum is formed between film, with adsorbent thin film.
In an embodiment of the present invention, above-mentioned fluid is gas or liquid.
In above-mentioned implementation method of the invention, because the first opening of first passage is located at the first opening of second channel
The adsorption plane of support base, thus when a film be positioned over adsorption plane and cover first passage the first opening and second channel the
During one opening, being communicated in the second opening pump of second channel can be evacuated to drive second opening stream of the air-flow from first passage
Enter.This air-flow can sequentially pass through gap, the second channel of first passage, adsorption plane and film, when air-flow by adsorption plane with it is thin
During the gap of film, laminar flow stable state can be formed and negative pressure (bernoulli law) is produced, with adsorbent thin film.
Such suction type can allow film in the case of not Contact-sorption face up to horizontality, can save known wait
The time of second stage pumping, facilitate feeding.Additionally, film adsorption plant is not required to take out very the space between film and adsorption plane
Sky, can not only avoid film from being pasted onto on fixture, and can avoid the situation for causing to pull when removing film, facilitate blanking.
Brief description of the drawings
Fig. 1 shows the sectional view of film adsorption plant according to an embodiment of the present invention；
Fig. 2 shows that the adsorption plane of the support base of Fig. 1 places the sectional view after film；
Fig. 3 show the third channel of Fig. 2 and fourth lane vacuumize after sectional view；
Fig. 4 shows the sectional view after the second channel pumping of Fig. 3；
Fig. 5 shows the sectional view of film adsorption plant according to an embodiment of the present invention；
Fig. 6 shows that the adsorption plane of the support base of Fig. 5 places the sectional view after film；
Fig. 7 shows that the pump of Fig. 6 drives the sectional view after fluid circulation.
Specific embodiment
Hereinafter multiple implementation methods of the invention, as clearly stated, the details in many practices will be described with schema
Will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the present invention, the details in these practices is non-essential.Additionally, for the sake of simplifying schema, one
A little known usual structures will be shown in the way of simple signal in the drawings with element.
Fig. 1 shows the sectional view of film adsorption plant 100 according to an embodiment of the present invention.As illustrated, film is inhaled
Applying equipment 100 includes support base 110, first passage 120, second channel 130, third channel 140 and fourth lane 150.Wherein,
Support base 110 has adsorption plane 112.First passage 120 runs through support base 110.First passage 120 have first opening 122 with
Second opening 124, and the first opening 122 of first passage 120 is located at adsorption plane 112.Second channel 130 runs through support base 110.
Second channel 130 has the first opening 132 and the second opening 134, and the first opening 132 of second channel 130 is located at adsorption plane
112.Third channel 140 runs through support base 110.Third channel 140 has the first opening 142 and the second opening 144, and threeway
First opening 142 in road 140 is located at adsorption plane 112.Fourth lane 150 runs through support base 110.Fourth lane 150 has first
The opening 154 of opening 152 and second.First opening 152 of fourth lane 150 is located at adsorption plane 112.
Additionally, film adsorption plant 100 also includes pump 165, the first valve 160 and the second valve 170.Wherein, the first valve
Door 160 has air inlet 162 and gas outlet 164.What the air inlet 162 of the first valve 160 was communicated in third channel 140 second opens
Second opening 154 of mouth 144 and fourth lane 150.The gas outlet 164 of the first valve 160 is communicated in pump 165.Second valve 170
With air inlet 172 and gas outlet 174.The air inlet 172 of the second valve 170 is communicated in the second opening of second channel 130
134, and the gas outlet 174 of the second valve 170 is communicated in pump 165.Configuration more than, pump 165 can pass through the first valve 160
Selectively communicated with the second opening 144 of the second opening 134, third channel 140 of second channel 130 with the second valve 170
With the second opening 154 of fourth lane 150.
In the following description, state when will illustrate that film adsorption plant 100 is used.
Fig. 2 shows that the adsorption plane 112 of the support base 110 of Fig. 1 places the sectional view after film 210.Simultaneously refering to Fig. 1 and figure
2, multiple light emitting diodes (Light Emitting Diode are pasted with film 210；LED) chip 212.When clamping film
When the fixture (chuck) 220 at 210 edges is positioned over support base 110, the air between film 210 and support base 110 can make film
210 is convex, and forms gap d 1.In the present embodiment, film 210 can be blue film (blue tape), but not with limitation
The present invention.
Fig. 3 show the third channel 140 of Fig. 2 and fourth lane 150 vacuumize after sectional view.Simultaneously refering to Fig. 1 and figure
3, first opened when film 210 is positioned over adsorption plane 112 and covers first opening 122, second channel 130 of first passage 120
Mouthfuls 132, during the first opening 152 of the first opening 142 of third channel 140 and fourth lane 150, pump 165 is evacuated, the first valve
160 open, therefore moment can produce air-flow F1, F2, film 210 is opened by the first of the third channel 140 in the outside of support base 110
First 152 vacuum suctions of opening of mouth 142 and fourth lane 150, and reach the effect of Primary Location.Now, film 210 and branch
Air is still suffered between support seat 110, but the outside of film 210 has been adsorbed, therefore gap d 2 can be less than the gap d 1 of Fig. 2.
Fig. 4 shows the sectional view after the pumping of second channel 130 of Fig. 3.Fig. 1 and Fig. 4 is referred to simultaneously, in film 210 by the
Behind first opening 142 of triple channel 140 and the first 152 vacuum suctions of opening of fourth lane 150, the second valve of unlatching 170 (the
One valve 160 is still opening), air-flow F3 is driven from the second opening 124 of first passage 120 by pump 165 and flow into, air-flow
F3 can sequentially pass through gap d 3, the second channel 130 of first passage 120, adsorption plane 112 and film 210, and from second channel
Flow out 130 the second opening 134.When gap ds 3 of the air-flow F3 by adsorption plane 112 and film 210, laminar stable can be formed
State and produce negative pressure (bernoulli law), the negative-pressure adsorption for making film 210 be produced by air-flow F3.Therefore, gap d 3 can be less than
The gap d 2 of Fig. 3.The each position point of film 210 is roughly the same with the vertical range of adsorption plane 112, and film 210 can be the level of state.
Consequently, it is possible to the measurement equipment (not shown in figure) of the top of support base 110 just can accurate measurement light emitting diode crystalline substance
The characteristics of luminescence of piece 212, because film 210 has been the level of state, therefore can reduce error in measurement.In the present embodiment, prop up
Support seat 110 has transmission element 114 (such as sheet glass), is available for measurement equipment to detect the position of LED wafer 212.
The mode of the adsorbent thin film 210 of film adsorption plant 100 can allow film 210 in the case of not Contact-sorption face 112
Up to horizontality, the known time for waiting second stage to be evacuated can be saved, facilitate feeding (to be pasted with LED wafer
212 film 210).Additionally, film adsorption plant 100 is not required to vacuumize the space between film 210 and adsorption plane 112, not only
Film 210 can be avoided to be pasted onto on fixture 220, and the situation for causing to pull when removing film 210 can be avoided, facilitate blanking.
In the present embodiment, the air inlet 172 of the second valve 170 is provided with vacuum meter 176.Film adsorption plant 100 is also
Flow controller 180 can be included.Flow controller 180 is installed on the second opening 124 of first passage 120.User is available
Vacuum meter 176 learns the negative pressure that air-flow F3 is produced in gap d 3, and using the flow of the control air-flow of flow controller 180 F3, makes
Air-flow F3 reaches laminar stable state.
Additionally, film adsorption plant 100 can also include temperature controller 190.Temperature controller 190 is installed on first passage
120 the second opening 124, can be used to control the temperature of air-flow F3, have the LED wafer 212 on film 210 steady
Fixed measuring temperature, it is to avoid environment temperature causes the characteristics of luminescence difference.
Fig. 5 shows the sectional view of film adsorption plant 300 according to an embodiment of the present invention.Film adsorption plant 300
Comprising support base 310, carrier film 320, first passage 330, second channel 340 and pump 350.Wherein, support base 310 has absorption
Face 312.Carrier film 320 is arranged on adsorption plane 312.First passage 330 runs through support base 310.First passage 330 has first
The opening 334 of opening 332 and second, and the first opening 332 of first passage 330 is located at adsorption plane 312.Second channel 340 runs through
Support base 310.Second channel 340 has the first opening 342 and the second opening 344.First opening 342 of second channel 340
In adsorption plane 312.Pump 350 is communicated in the second opening 334 of first passage 330 and the second opening 344 of second channel 340, can
Driving makes fluid 430 be flowed into from the second opening 334 of first passage 330, and by adsorption plane 312 and the gap of carrier film 320
D, pump 350 is returned to by the second opening 344 of second channel 340.In the present embodiment, fluid 430 can be gas or liquid.
Additionally, film adsorption plant 300 can also be comprising flow controller 360 and temperature controller 370.Wherein, flow control
Device processed 360 is communicated in the second opening 334 and the pump 350 of first passage 330, can control the flow of fluid 430.Temperature controller
370 the second openings 334 for being communicated in first passage 330 and pump 350, can control the temperature of fluid 430.
Fig. 6 shows that the adsorption plane 312 of the support base 310 of Fig. 5 places the sectional view after film 410.Simultaneously refering to Fig. 5 and figure
6, multiple LED wafers 412 are pasted with film 410.When the fixture 420 at clamping film 410 edge is positioned over support base
When 310, the air that film 410 is positioned between carrier film 320, and film 410 and support base 310 can make film 410 convex.
Fig. 7 shows the sectional view after the driving circulation of fluid 430 of pump 350 of Fig. 6.Fig. 6 and Fig. 7 is referred to simultaneously, when film 410
When being positioned over carrier film 320, pump 350 can drive fluid 430 to be circulated with direction D1, when fluid 430 is by adsorption plane 312 and carrying
During the gap d of film 320, laminar flow stable state can be formed and negative pressure (bernoulli law) is produced, make carrier film 320 by fluid 430
The negative-pressure adsorption of generation, therefore gap d ' gap d can be less than.Consequently, it is possible to vacuum is formed between carrier film 320 and film 410,
Adsorb the carried film 320 of film 410 and moved toward direction D2, and then be the level of state.Consequently, it is possible to the top of support base 310
Measurement equipment (not shown in figure) just can accurate measurement LED wafer 412 the characteristics of luminescence, because film 410 has been in
Horizontality, therefore error in measurement can be reduced.
The mode of the adsorbent thin film 410 of film adsorption plant 300 can allow film 410 in the case of not Contact-sorption face 312
Up to horizontality, the time for vacuumizing can be saved, facilitate feeding, can not only avoid film 410 from being pasted onto on fixture 420, and can
The situation for causing to pull when removing film 410 is avoided, facilitates blanking.User can control fluid 430 using flow controller 360
Flow, make fluid 430 reach laminar stable state.Temperature controller 370 controls the temperature of fluid 430, makes the hair on film 410
Optical diode chip 412 has the measuring temperature of stabilization, it is to avoid environment temperature causes the characteristics of luminescence difference.
Although the present invention is described as above with implementation method, so it is not limited to the present invention, any art technology
Personnel, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations, therefore protection scope of the present invention
It is defined when depending on the appended claims person of defining.
Claims (10)
1. a kind of film adsorption plant, it is characterised in that include：
One support base, with an adsorption plane；
One first passage, through the support base, the first passage has one first opening with one second opening, and the first passage
First opening be located at the adsorption plane；
One second channel, through the support base, the second channel has one first opening with one second opening, and the second channel
First opening be located at the adsorption plane；And
One pump, is communicated in the second opening of the second channel；
Wherein when a film is positioned over the adsorption plane and covers the first opening of the first passage and the first of the second channel opens
During mouth, the adsorption plane connects the first opening of the first passage and the first opening of the second channel with the gap of the film, should
Pumping gas is flowed into from the second opening of the first passage and sequentially passes through the first opening of the first passage, is somebody's turn to do to drive an air-flow
Adsorption plane and the gap of the film and the first opening of the second channel, to adsorb the film.
2. film adsorption plant as claimed in claim 1, it is characterised in that also include：
One third channel, through the support base, the third channel has one first opening with one second opening, and the third channel
First opening be located at the adsorption plane；And
One fourth lane, through the support base, the fourth lane has one first opening with one second opening, the wherein four-way
First opening in road is located at the adsorption plane.
3. film adsorption plant as claimed in claim 2, it is characterised in that also include：
One first valve, with an air inlet, is communicated in the second opening of the third channel and the second opening of the fourth lane,
And a gas outlet, it is communicated in the pump；And
One second valve, with an air inlet, is communicated in the second opening of the second channel, and a gas outlet, is communicated in this
Pump；
Wherein first opened when the film is positioned over the adsorption plane and covers the first opening of the first passage, the second channel
Mouthful, the third channel first opening and the fourth lane first opening when, the pumping gas, first valve first open with
The vacuum suction film, is then turned on second valve, the air-flow is flowed into and through the suction from the second opening of the first passage
Attached face and the gap of the film, to adsorb the film.
4. film adsorption plant as claimed in claim 1, it is characterised in that also include：
One flow controller, is installed on the second opening of the first passage, is used to control the flow of the air-flow.
5. film adsorption plant as claimed in claim 1, it is characterised in that also include：
One temperature controller, is installed on the second opening of the first passage, is used to control the temperature of the air-flow.
6. a kind of film adsorption plant, it is characterised in that include：
One support base, with an adsorption plane；
One carrier film, is arranged on the adsorption plane；
One first passage, through the support base, the first passage has one first opening with one second opening, and the first passage
First opening be located at the adsorption plane；
One second channel, through the support base, the second channel have one first opening with one second opening, wherein this second lead to
First opening in road is located at the adsorption plane；And
One pump, is communicated in second opening and the second of the second channel the opening of the first passage, be used to drive make a fluid from
Second opening of the first passage flows into, and by the adsorption plane and the gap of the carrier film, is opened by the second of the second channel
Mouth returns to the pump.
7. film adsorption plant as claimed in claim 6, it is characterised in that also include：
One flow controller, is communicated in the second opening and the pump of the first passage, is used to control the flow of the fluid.
8. film adsorption plant as claimed in claim 6, it is characterised in that also include：
One temperature controller, is communicated in the second opening and the pump of the first passage, is used to control the temperature of the fluid.
9. film adsorption plant as claimed in claim 6, it is characterised in that when a film is positioned over the carrier film, the pump drives
The fluid circulation is moved, makes to form vacuum between the carrier film and the film, to adsorb the film.
10. film adsorption plant as claimed in claim 6, it is characterised in that the fluid is gas or liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310364415.2A CN104425326B (en) | 2013-08-20 | 2013-08-20 | Film adsorption plant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310364415.2A CN104425326B (en) | 2013-08-20 | 2013-08-20 | Film adsorption plant |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104425326A CN104425326A (en) | 2015-03-18 |
| CN104425326B true CN104425326B (en) | 2017-06-09 |
Family
ID=52973977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310364415.2A Active CN104425326B (en) | 2013-08-20 | 2013-08-20 | Film adsorption plant |
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| Country | Link |
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| CN (1) | CN104425326B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111653501A (en) * | 2019-03-04 | 2020-09-11 | 镭射谷科技股份有限公司 | Semiconductor package manufacturing apparatus, laser processing method, and leveling method for processing carrier board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5707051A (en) * | 1993-08-13 | 1998-01-13 | Kabushiki Kaisha Toshiba | Wafer stage apparatus for attracting and holding semiconductor wafer |
| CN101295657A (en) * | 2007-04-23 | 2008-10-29 | 株式会社新川 | Method for fixing bent circuit board of die bonder and die bonder apparatus |
| CN102543814A (en) * | 2010-12-02 | 2012-07-04 | 富士电机株式会社 | Chucking device and chucking method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263316A (en) * | 1994-03-25 | 1995-10-13 | Toshiba Corp | X-ray aligner |
-
2013
- 2013-08-20 CN CN201310364415.2A patent/CN104425326B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5707051A (en) * | 1993-08-13 | 1998-01-13 | Kabushiki Kaisha Toshiba | Wafer stage apparatus for attracting and holding semiconductor wafer |
| CN101295657A (en) * | 2007-04-23 | 2008-10-29 | 株式会社新川 | Method for fixing bent circuit board of die bonder and die bonder apparatus |
| CN102543814A (en) * | 2010-12-02 | 2012-07-04 | 富士电机株式会社 | Chucking device and chucking method |
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| Publication number | Publication date |
|---|---|
| CN104425326A (en) | 2015-03-18 |
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