CN101278028A - Sealing material for flat panel display - Google Patents
Sealing material for flat panel display Download PDFInfo
- Publication number
- CN101278028A CN101278028A CNA2006800365502A CN200680036550A CN101278028A CN 101278028 A CN101278028 A CN 101278028A CN A2006800365502 A CNA2006800365502 A CN A2006800365502A CN 200680036550 A CN200680036550 A CN 200680036550A CN 101278028 A CN101278028 A CN 101278028A
- Authority
- CN
- China
- Prior art keywords
- sealing material
- compound
- flat panel
- panel display
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000003566 sealing material Substances 0.000 title claims abstract description 65
- 150000001875 compounds Chemical class 0.000 claims abstract description 52
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 15
- 150000003512 tertiary amines Chemical class 0.000 claims abstract description 13
- 150000008064 anhydrides Chemical class 0.000 claims description 28
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 230000002285 radioactive effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 16
- 239000010954 inorganic particle Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 16
- 239000003513 alkali Substances 0.000 claims description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 abstract description 8
- 230000006866 deterioration Effects 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 6
- 150000007513 acids Chemical class 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 66
- 239000000126 substance Substances 0.000 description 31
- 238000001723 curing Methods 0.000 description 20
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- -1 ethylidene, propylidene, butylidene Chemical group 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 239000002585 base Substances 0.000 description 12
- 125000004432 carbon atom Chemical group C* 0.000 description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 12
- 238000005401 electroluminescence Methods 0.000 description 10
- 239000005357 flat glass Substances 0.000 description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 10
- 229920002554 vinyl polymer Polymers 0.000 description 10
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 229910052731 fluorine Inorganic materials 0.000 description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 125000001118 alkylidene group Chemical group 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 4
- 239000012467 final product Substances 0.000 description 4
- 125000001153 fluoro group Chemical group F* 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000003556 assay Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000013035 low temperature curing Methods 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 235000012222 talc Nutrition 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 125000004417 unsaturated alkyl group Chemical group 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 125000002541 furyl group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000005009 perfluoropropyl group Chemical group FC(C(C(F)(F)F)(F)F)(F)* 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000001544 thienyl group Chemical group 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- YSHRTXBTHVBWTL-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)butoxy]ethanol Chemical compound OCCOCC(CC)OCC1CO1 YSHRTXBTHVBWTL-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- IEMNEAVSEGLTHB-UHFFFAOYSA-N 2-[[4-[1,1,1,3,3,3-hexafluoro-2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C(F)(F)F)(C(F)(F)F)C(C=C1)=CC=C1OCC1CO1 IEMNEAVSEGLTHB-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- RMDKEBZUCHXUER-UHFFFAOYSA-N 4-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C=CC1(C)C2 RMDKEBZUCHXUER-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000005251 capillar electrophoresis Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000000254 damaging effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000005816 glass manufacturing process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012775 heat-sealing material Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 235000012204 lemonade/lime carbonate Nutrition 0.000 description 1
- 238000004895 liquid chromatography mass spectrometry Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000006198 methoxylation reaction Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
- C09K2200/0647—Polyepoxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
- C09K2323/055—Epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
- H01J2209/26—Sealing parts of the vessel to provide a vacuum enclosure
- H01J2209/264—Materials for sealing vessels, e.g. frit glass compounds, resins or structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Abstract
Disclosed is a sealing material for flat panel displays which is characterized by containing 0.01-40 parts by weight of a compound (B) which generates a base when irradiated with radiation per 100 parts by weight of a compound (A) which has at least one epoxy group in a molecule. The compound (B) which generates a base when irradiated with radiation is preferably a compound which generates a tertiary amine when irradiated with radiation. The sealing material is good in curability at low temperatures, while having a long pot life at room temperature. In addition, this sealing material does not cause deterioration of display members due to ionic components or acids.
Description
Technical field
The present invention relates to a kind of in low-temperature curing, long in the working life of room temperature, and can not make the sealing material for flat panel display of parts deterioration because of ion component or acid.
Background technology
In recent years, developing and making the flat-panel monitor that utilizes various display elements at electronics, electric field.These indicating meter great majority are to have sealed display element in the unit of glass or plastics etc.Can enumerate liquid crystal (LC) indicating meter, electroluminescence (EL) indicating meter etc. as its representative.Be generally used for the sealing material of flat-panel monitor, use be the temperature-curable below the heat resisting temperature of used unit the heat curing-type sealing material or can be at the solid type sealing material of the light of self-vulcanizing.Usually the solidification value of heat curing-type sealing material that is used as the sealing material of liquid-crystal display is about 120～150 ℃.
On the other hand, for example with regard to the sealing material of OLED display, because the thermotolerance of organic EL etc. is 80～120 ℃, so need more make its curing under the low temperature.But, being designed to sealing material in low-temperature curing, will shorten its working life in room temperature, so cause operation decline.
Therefore, need use by the UV cationic curing and come the such sealing material of cured epoxy resin (patent documentation 2) in the situation of low-temperature curing.
Patent documentation 1: TOHKEMY 2004-27001 communique
Patent documentation 2: TOHKEMY 2002-201264 communique
Summary of the invention
The technical problem that invention will solve
But the parts that contact with sealing material can can't use the sealing material of UV cationic curing type as mentioned above because of ion component or the sour flat-panel monitor that this structure of deterioration takes place.
Like this, long for good in the working life of room temperature in cryogenic solidified nature, and can be because of ion component or the sour also just raising of requirement that makes the sealing material of parts deterioration.
Thereby, the purpose of this invention is to provide a kind of good, long in the working life of room temperature, and can not make the sealing material for flat panel display of parts deterioration because of ion component or acid in cryogenic solidified nature.
The technical scheme of dealing with problems
The result that the inventor etc. further investigate in order to address the above problem, found a kind of sealing material for flat panel display, it is characterized in that, at least contain the compound of an epoxy group(ing) with respect to (A) of 100 weight parts at intramolecularly, (B) that contain 0.01～40 weight part produces compound of alkali by radioactive rays.(here, radioactive rays are meant hertzian wave and particle beam such as ultraviolet ray, visible light, preferably refer to ultraviolet ray, visible light, especially preferably refer to ultraviolet ray.)
In addition, the compound that (B) produces alkali by radioactive rays is preferably the compound that produces tertiary amine by radioactive rays.
And then, with respect to 1 normal described (A) composition, also can contain 0.8～1.2 normal (C) anhydride curing agent.
And then the sealing material also can contain (D) silane coupling agent, (E) inorganic particles filler.Also promptly, also can further contain (D) silane coupling agent of 0～30 weight part with respect to described (A) composition of 100 weight parts.In addition, also can further contain (E) inorganic particles filler of 0～1000 weight part with respect to described (A) composition of 100 weight parts.
In addition, the present invention also provides the sealing method that uses described sealing material, and the flat-panel monitor that uses the sealing material to obtain.Also promptly, the sealing method of the flat-panel monitor that the present invention relates to is characterised in that, uses described sealing material for flat panel display to come the seal plate indicating meter.In addition, the flat-panel monitor that the present invention relates to is characterised in that, uses above-mentioned sealing method to obtain.Here, flat-panel monitor is meant liquid crystal (LC) indicating meter, electroluminescence (EL) indicating meter, plasma display etc.
The beneficial effect of the invention
Can obtain in cryogenic solidified nature good, long in the working life of room temperature, and can not make the sealing material for flat panel display of parts deterioration because of ion component or acid by the present invention.
Embodiment
Below, describe the present invention in detail.
The sealing material for flat panel display that the present invention relates to contains (A) and contains the compound of an epoxy group(ing) and the compound that (B) produces alkali by radioactive rays at least at intramolecularly.And then, preferably contain (C) anhydride curing agent.And then the sealing material for flat panel display that the present invention relates to also contains (D) silane coupling agent and/or (E) inorganic particles filler preferably when containing (A)～(C) composition.
The compound of an epoxy group(ing) [(A) contain at least] at intramolecularly
At least contain the compound of an epoxy group(ing) as (A) that use in the present invention at intramolecularly, use and in a molecule, contain a compound at least as the epoxy group(ing) of functional group.Here, in this manual, (A) also is called (A) composition at the compound that intramolecularly contains an epoxy group(ing) at least.
Concrete example as (A) composition can be enumerated following material.Can enumerate simple function epoxy compoundss such as phenyl glycidyl ether, 2-ethylhexyl glycidyl ether, ethyl Diethylene Glycol glycidyl ether, Dicyclopentadiene (DCPD) glycidyl ether, 2-hydroxyethyl glycidyl ether; Quinhydrones diglycidylether, resorcinol diglycidyl ether, ethylene glycol diglycidylether, polyethyleneglycol diglycidylether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, cylohexanediol diglycidyl ether, cyclohexanedimethanodiglycidyl diglycidyl ether, Dicyclopentadiene (DCPD) glycol diglycidylether, 1, difunctionality epoxy compoundss such as 6-naphthalene glycol diglycidylether, bisphenol A diglycidyl ether, Bisphenol F diglycidylether, hydrogenation bisphenol A diglycidyl ether, hydrogenation Bisphenol F diglycidylether; Multi-functional epoxy compounds such as trihydroxymethylpropanyltri diglycidyl ether, tetramethylolmethane four glycidyl ethers, phenol phenolic varnish type epoxide, cresols phenolic varnish type epoxide, epoxidized polybutadiene.
In addition, should can also use the compound that contains an ester ring type epoxy group(ing) at intramolecularly at least in (A) composition.Specifically can enumerate the compound shown in following formula [1], [2], [3], [4] etc.
[Chemical formula 1]
In formula [1], R
1Alkylidene group for a wire such as Sauerstoffatom, sulphur atom, methylene radical, ethylidene, propylidene, butylidene or a catenate carbonatoms 1～20; Poly-(alkylidene group oxygen) base of a wire such as poly-(ethylidene oxygen) base, poly-(propylidene oxygen) base or a catenate carbonatoms 1～120; A wire or a catenate unsaturated alkyl such as propenylidene, methyl propenylidene, crotonylidene; Carbonyl, contain the alkylidene group of carbonyl, in molecular chain, contain the alkylidene group of formamyl.
[Chemical formula 2]
[chemical formula 3]
In formula [3], R
1Alkyl for carbonatomss 1～6 such as hydrogen atom, fluorine atom, methyl, ethyl, propyl group, butyl, amyl group, hexyls; The fluoroalkyl of carbonatomss 1～6 such as trifluoromethyl, perfluoro-methyl, perfluor ethyl, perfluoro propyl; The aryl of carbonatoms such as phenyl, naphthyl 6～18; Furyl or thienyl.R
1Can be identical or different mutually.
[chemical formula 4]
In formula [4], R
1Alkyl for carbonatomss 1～6 such as hydrogen atom, fluorine atom, methyl, ethyl, propyl group, butyl, amyl group, hexyls; The fluoroalkyl of carbonatomss 1～6 such as trifluoromethyl, perfluoro-methyl, perfluor ethyl, perfluoro propyl; The aryl of carbonatoms such as phenyl, naphthyl 6～18; Furyl or thienyl.R
1Can be identical or different mutually.R
2Alkylidene group for a wire such as Sauerstoffatom, sulphur atom, methylene radical, ethylidene, propylidene, butylidene or a catenate carbonatoms 1～20; Poly-(alkylidene group oxygen) base of a wire such as poly-(ethylidene oxygen) base, poly-(propylidene oxygen) base or a catenate carbonatoms 1～120; A wire or a catenate unsaturated alkyl such as propenylidene, methyl propenylidene, crotonylidene; Carbonyl, contain the alkylidene group of carbonyl, in molecular chain, contain the alkylidene group of formamyl.
In addition, also can use part or all compound that replaces with fluorine with the hydrogen atom of the C-H of these above-mentioned formulas [2]～[4] compound.More specifically say the compound that to enumerate compound (bisphenol AF diglycidylether) that 6 hydrogen of the methyl in the dihydroxyphenyl propane glycidyl ether are replaced with fluorine, 6 hydrogen of the methyl of dihydroxyphenyl propane is replaced with fluorine and the reactant of epoxy compounds etc.
(A) composition can be used alone or be used in combination two or more.
The compound of alkali [(B) produce] by radioactive rays
(B) of Shi Yonging produces alkali by the compound of radioactive rays generation alkali by radioactive rays in the present invention, thereby can be used for solidifying (A) composition.Here, in this manual, (B) also is called (B) composition by the compound that radioactive rays produce alkali.In the sealing material for flat panel display of the present invention, owing to use (B) composition, so behind irradiation ultraviolet radiation etc., can fully solidify with low temperature.In addition, use should (B) composition sealing material for flat panel display of the present invention because the curing of sealing material is suppressed before irradiation ultraviolet radiation etc., so can obtain long pot life in room temperature.And then, according to sealing material for flat panel display of the present invention, different with the sealing material of the type that is cured by the UV cationic curing, owing to can not produce acid, so when sealing, can not make the parts deterioration because of ion component or acid because of the irradiation of ultraviolet ray etc.
As (B) composition,, but be preferably before the irradiation radioactive rays not compound with the Resins, epoxy reaction so long as the compound that produces alkali by radioactive rays then is not particularly limited.Specifically, be considered to be fit to be by radioactive rays produce the quaternary ammonium salt etc. of tertiary amine or before the irradiation radioactive rays because steric hindrance and the reactivity of tertiary amine is suppressed at lower level, but steric hindrance disappears and compound that reactive behavior improves etc. behind the irradiation radioactive rays.More preferably produce the quaternary ammonium salt of tertiary amine.Can enumerate the compound shown in following formula [5]～[7] etc. more specifically.
[chemical formula 5]
[chemical formula 6]
[chemical formula 7]
These compounds can pass through Journal of Photopolymer Science and Technology, Vol.17, and the method for putting down in writing among No.1 (2004) 15-18 is synthetic, obtains.
In addition, can enumerate the compound shown in following formula [8], [9] etc.
[chemical formula 8]
[chemical formula 9]
These compounds can pass through Journal of Polymer Science:Part A:Polymer Chemistry, and the method for record is synthetic among the Vol.39,1329-1341 (2001), obtain.
In addition, can enumerate the compound shown in following formula [10]～[15] etc.
[Chemical formula 1 0]
[Chemical formula 1 1]
[Chemical formula 1 2]
[Chemical formula 1 3]
[Chemical formula 1 4]
[Chemical formula 1 5]
In addition, can enumerate the compound shown in following formula [16]～[21] etc.
[Chemical formula 1 6]
[Chemical formula 1 7]
[Chemical formula 1 8]
[Chemical formula 1 9]
[Chemical formula 2 0]
[Chemical formula 2 1]
These compounds can pass through Journal of Polymer Science:Part A:Polymer Chemistry, and the method for record is synthetic among the Vol.39,1329-1341 (2001), obtain.
(B) composition can be used alone or be used in combination two or more.
About these (B) compositions that use in the resin combination of the present invention (sealing material for flat panel display), can from resin combination, separate (B) composition with pillar etc., after the solution to (B) composition carries out the UV pre-irradiation, adopt LC-MS or capillary electrophoresis or other amine analysis methods of often using, analyze whether produced tertiary amine.
Proportional about containing of these (B) compositions in the resin combination of the present invention (sealing material for flat panel display), be consider to produce behind the tertiary amine with the reactivity of Resins, epoxy etc. to decide, but consider from the angle of solidified nature, working life, suitable described (A) composition with respect to 100 weight parts contains 0.01～40 weight part usually, is preferably 1～40 weight part.
[(C) anhydride curing agent]
Among the present invention, can use (A) to contain the compound of an epoxy group(ing) and (C) anhydride curing agent at least, form epoxy-anhydride-cured system at intramolecularly.Here, in this manual, (C) anhydride curing agent also is called (C) composition.At this moment, (B) composition is after by radioactive rays generation tertiary amine, plays the effect of curing catalyst.In addition, in the present invention,, can guarantee the postradiation operation of UV, so be preferred when at (A) composition with (B) when being used in combination (C) composition in the composition.
Be used for (C) of the present invention anhydride curing agent, suitable use can be at the i.e. material of 80～120 ℃ or its following temperature-curable of the heat resisting temperature of organic EL.More preferably using can be below 120 ℃, and then preferably can be 80 ℃ of following solidified material.As concrete example, acid anhydrides such as suitable use anhydride phthalic acid, tetrahydrochysene anhydride phthalic acid, six hydrogen anhydride phthalic acids, methyl tetrahydrochysene anhydride phthalic acid, methyl six hydrogen anhydride phthalic acids, methyl norbornene dioic anhydride are solidifying agent.
In addition, in this (C) composition, also can use the polymkeric substance that contains an acid anhydrides at intramolecularly at least.Method for introduce anhydride group in polymkeric substance is not particularly limited in the present invention, for example can enumerate the method as polymkeric substance such as vinyl monomer that polymerization has anhydride group.As the example of vinyl monomer with anhydride group etc., can enumerate itaconic anhydride, maleic anhydride, 4-methacrylic acid ethyl trimellitic acid 1,2-anhydride ester etc. and in molecule, have compound of anhydride group and vinyl etc.In addition, also can be to have the vinyl monomer etc. of anhydride group and the multipolymer of other vinyl monomers etc.As the example of other vinyl monomers, can enumerate (methyl) esters of acrylic acid.The material of non-functionality alkyl ester that preferably has straight chain shape such as methyl, ethyl, sec.-propyl, normal-butyl, isobutyl-, the tertiary butyl, 2-ethylhexyl, cyclohexyl, benzyl, isobornyl, lauryl, myristyl or branched structure is as ester group that should (methyl) acrylate.In addition, can also with vinylbenzene, alpha-methyl styrene, vinyl acetate etc. can with the material of vinyl monomer class copolymerization with anhydride group, the monomer that contains the polymkeric substance of anhydride group as formation uses.
Use organo-peroxide or azo-compound as radical polymerization initiator, the vinyl monomer of enumerating more than the radical polymerization in organic solvent with anhydride group and other vinyl monomers etc. just can obtain containing the polymkeric substance of anhydride group.Directly use also can, use after can also from the resin solution that contains this polymkeric substance, removing the organic solvent composition.In addition, as the additive method of the polymkeric substance that obtains containing anhydride group, can enumerate main chain to the polymkeric substance that does not have anhydride group, side chain or terminal chemically modified forms the method for epoxy group(ing), material that uses such as polymerization starter or chain-transfer agent are had an anhydride group comes polymer, polymer the method etc. of carrying out.
Weight-average molecular weight (polystyrene conversion) for the polymkeric substance that contains anhydride group that uses in the present invention is not particularly limited, so long as get final product with the material that other compositions of sealing material mix with the organic EL of formation of the present invention, but preferable weight-average molecular weight (polystyrene conversion) is 500～50,000.
(C) composition can be used alone or be used in combination two or more.Containing about the proportional stoichiometry that is preferably described (A) composition of in the resin combination of the present invention these (C) curing agent component,, be generally 0～1000 weight part with respect to (A) composition 1 equivalent (A) 100 weight parts.In addition, containing of (C) anhydride curing agent composition in the resin combination of the present invention proportionally preferably used about the stoichiometry of described (A) composition, be generally 0.7～1.5 equivalent with respect to 1 normal (A) composition, be preferably 0.8～1.2 equivalent, more preferably 0.8～1.0 equivalent.87258725
[(D) coupling agent]
Organic EL of the present invention is with in the sealing material for flat panel display such as sealing material, in order to improve the interface adaptation with base material, can also add (D) coupling agent.In this manual (D) coupling agent also is called (D) composition.Can use the compound shown in for example following formula [22], [23] as coupling agent.
(R
2O)
3-Si-R
3R
4 [22]
(R
2O)
3-Ti-R
3R
4 [23]
In formula [22], [23], R
2Be alkylidene groups such as methyl, ethyl, propyl group.R
3Alkylidene group for a wire such as methylene radical, ethylidene, propylidene, butylidene or a catenate carbonatoms 1～20; Poly-(alkylidene group oxygen) base of a wire such as poly-(ethylidene oxygen) base, poly-(propylidene oxygen) base or a catenate carbonatoms 1～120; A wire or a catenate unsaturated alkyl such as propenylidene, methyl propenylidene, crotonylidene; Carbonyl, contain the alkylidene group of carbonyl, in molecular chain, contain alkylidene group, the phenyl of formamyl.R
4Be alkylidene group, glycidyl ether, primary amine, thiol group, vinyl, isocyanate group such as methyl, ethyl, propyl group.In addition, can use part or all material that replaces with fluorine with the hydrogen atom of the C-H of these coupling agents.The preferred material that uses the hydrogen with methylene radical and/or methyl to replace with fluorine.
(D) composition can be used alone or be used in combination two or more.
(D) coupling agent composition in the resin combination of the present invention to contain proportional be that described (A) composition with respect to 100 weight parts is generally 0～30 weight part, is preferably 0.5～30 weight part, more preferably 0.5～20 weight part.
[(E) inorganic particles filler]
Organic EL of the present invention can add (E) inorganic particles filler with in the sealing material for flat panel display such as sealing material.In this manual (E) inorganic particles filler also is called (E) composition.The inorganic particles filler is that the median size of primary particle is the mineral filler of 0.005～10 μ m.Specifically, can enumerate silica, talcum, aluminum oxide, mica, lime carbonate etc.The inorganic particles filler is that be untreated in the surface and surface-treated can use.Can enumerate for example methoxylation, trimethyl silylization, octyl group silylanizing or carry out surface-treated inorganic particles filler etc. as surface-treated inorganic particles filler with silicone oil.These compositions can be used alone or be used in combination two or more.
(E) inorganic particles filler composition in the resin combination of the present invention contain proportional need the adjusting according to the desired transparency of sealing material and viscosity, when described (A) composition with respect to 100 weight parts is generally 0～1000 weight part, be preferably 1～600 weight part, more preferably during 5～300 weight parts, can obtain anti-water vapour permeability, bonding force, give effects such as shake-change property.
[other additives]
In the resin combination of the present invention, can contain other compositions such as other resinous principles, weighting agent, properties-correcting agent, stablizer in the scope of not damaging effect of the present invention.
＜other resinous principles 〉
As other resinous principles, for example can enumerating, polymeric amide, polyamidoimide, urethane, polyhutadiene, sovprene, polyethers, polyester, styrene-butadiene-styrene block copolymer, petroleum resin, xylene resin, ketone resin, celluosic resin, fluorine are that oligopolymer, silicon are that oligopolymer, polythioether are oligopolymer etc.These can be used alone or make up multiple use.
＜weighting agent 〉
As weighting agent, can enumerate for example granulated glass sphere, styrenic particle, methacrylate ester polymer particle, ethylene-based polymer particle, acrylic polymer particle etc.These can be used alone or make up multiple use.
＜properties-correcting agent 〉
For example polymerization be can enumerate as properties-correcting agent and auxiliary agent, age resister, flow agent, wettability modifying agent, tensio-active agent, softening agent etc. caused.These can be used alone or make up multiple use.
＜stablizer 〉
Can enumerate for example UV light absorber, sanitas, antiseptic-germicide etc. as stablizer.These can be used alone or make up multiple use.
[modulation of sealing material for flat panel display]
The organic EL that is suitable for whole face seal of the present invention can be by using each composition with sealing material for flat panel display such as sealing materials with aforementioned proportion, uniform mixing is modulated.Viscosity can assign to regulate by the proportioning of resin or by adding other one-tenth.Consider that from the angle of the operation that is suitable for whole face seal its viscosity is preferably in the scope of 100～10000mPas, more preferably the scope of 500～6000mPas.Here, viscosity is to measure with E type viscometer (RC-500 that eastern machine industry is made) at 25 ℃.
When mixing described each raw material and obtaining sealing material, under the situation of the sealing material that uses in top light emitting (top emission) mode, require high transparent in the visible region.In order to make sealing material transparent, each material choice is used does not have painted material to get final product.In addition, use the situation of inorganic particles filler, by making organic composition blendings such as specific refractory power and Resins, epoxy, perhaps the particle diameter with the inorganic particles filler fully is decreased to less than visible wavelength, to eliminate scattering of light, guarantees that the transparency gets final product.
[sealing method]
The sealing method of the flat-panel monitor that the present invention relates to is characterised in that and uses above-mentioned sealing material for flat panel display to come the seal plate indicating meter.
Be coated with the method for sealing material for flat panel display of the present invention to display substrate, then coating process be not particularly limited so long as can be coated with sealing material equably.For example implement to get final product by the known method such as method of silk screen printing or the coating of use decollator.In addition, also can be so that resin system film or the good plate-shaped member of moisture resistancees such as sheet glass, metal sheet are used as sealing plate, the form of packing matcrial is used between display base plate and sealing plate.
Behind the coating sealing material, specifically by producing the light source of ultraviolet ray or visible light, sealing agent is shone radioactive rays specifically ultraviolet ray or visible light by radiation generator, the quaternary ammonium salt that contains from sealing agent produces tertiary amine.The condition of irradiation radioactive rays can be according to the quaternary ammonium salt that contains in the influence of used display substrate or the sealing agent is suitably selected the sensitivity of radioactive rays.For example, use metal halide lamp, irradiation 50mW/cm as light source
2UV intensity, 1000mJ/cm
2The UV energy.Then, heat sealing material is solidified.Condition of cure was cured for for example preserving in 100 ℃ thermostatic bath in 1 hour.
The flat-panel monitor that the present invention relates to is characterised in that with above-mentioned sealing method and obtains.
[embodiment]
The following describes embodiments of the invention, but the present invention is not limited to these embodiment.
＜assay method 〉
Sealing material for flat panel display and cured article thereof for gained carry out following evaluation.
(viscosity)
25 ℃ of viscosity with E type viscometer (RC-500 that eastern machine industry is made) assay plate indicating meter usefulness sealing material.
(viscosity stability)
Sealing material for flat panel display, is measured with E type viscometer (RC-500 that eastern machine industry is made) at 25 ℃ after 24 hours 25 ℃ of placements.
Zero: viscosity changes less than 1.1 times, △: viscosity change more than 1.1 times and less than 1.5 times, *: viscosity changes more than 1.5 times.
(solidified nature)
Solidified nature be on sheet glass with 100 μ m thickness spread plate indicating meter sealing materials, carry out 50mW/cm with metal halide lamp
2-1000mJ/cm
2UV irradiation after, refer to touch evaluation and in 80 ℃ thermostatic bath, preserve solid state after 1 hour.
Zero: curing, △: part curing, *: uncured.
(film vapor transfer rate)
Based on JIS Z0208, the assay plate indicating meter vapor transfer rate of the cured article film (thickness 100 μ m) of sealing material under 40 ℃ of 90%RH conditions.
(bonding strength)
Bonding strength is to clamp resin combination (sealing material for flat panel display) (thickness 20 μ m) after 1 sheet glass is made up sheet glass, and being heating and curing makes it bonding.Also promptly the central authorities on the sheet glass of the JISR3202 of thick 5mm, long 25mm, wide 45mm regulation are coated with a small amount of sealing agent, carry out 50mW/cm with metal halide lamp
2-1000mJ/cm
2UV irradiation.Then, re-use a same sheet glass, sheet glass is pasted each other becomes cruciform.With slit agent etc. the thickness of sealing agent being regulated becomes 20 μ m.Test piece after pasting preserved in 80 ℃ thermostatic bath made its curing in 1 hour.Measure the planar stretch bonding strength of the bonding test piece of two sheet glass making of this usefulness with draw speed 2mm/min.Bonding strength when peeling off these two base materials with draw speed 2mm/min mensuration.
(operation)
Operation is to estimate the time that needs during with adhesive substrate.Specifically, with 0.2cm
3Sealing material drop onto on the sheet glass, extend to the time of the round shape of diameter 40mm when measuring the sheet glass place 40mm * 45mm * 1mm thereon.
Zero: less than 30 seconds, △: more than 30 seconds～less than 60 seconds, *: more than 60 seconds.
＜starting material 〉
(A) contain the compound ((A) composition) of an epoxy group(ing) at least at intramolecularly
Bisphenol F diglycidylether (trade(brand)name: EXA-830LVP, big Japanese ink Industrial Co., Ltd makes)
Phenol phenolic varnish epoxide (trade(brand)name: YDPN638, Toto Kasei KK makes)
3,4-oxirane ring hexenyl methyl-3 ', 4 '-oxirane ring hexene carboxylicesters (trade(brand)name: セ ロ キ サ イ De 2021P, Daicel (Daicel) chemical industry Co., Ltd. makes)
(B) produce the quaternary ammonium salt ((B) composition) of tertiary amine by radioactive rays
1-phenacyl-(1-azonia-4-azabicyclo [2,2,2]-octane) selenium cyanate (compound shown in the above-mentioned formula [7])
1-methyl isophthalic acid-phenacyl-(1-azonia hexanaphthene) bromide (compound shown in the above-mentioned formula [9])
N, N, N-tributyl-N-acetyl naphthalenone ammonium-triphenylbut ylboronic acid salt (compound shown in the above-mentioned formula [17])
N, N, N-tributyl-N-acetyl cumarone ammonium-triphenylbut ylboronic acid salt (compound shown in the above-mentioned formula [19])
(B ') tertiary amine compound ((B ') composition)
2,4,6-three dimethylaminomethyl phenol (trade(brand)name: ア ミ キ ユ ア 3010, japan epoxy resin Co., Ltd. make)
Tributylamine (making) with the pure medicine of light Co., Ltd.
(C) anhydride curing agent ((C) composition)
Tetrahydrochysene methyl anhydride phthalic acid (trade(brand)name: Epicure YH300, japan epoxy resin Co., Ltd. makes)
(D) silane coupling agent ((D) composition)
γ-glycidoxypropyltrime,hoxysilane (trade(brand)name: SH6040, eastern beautiful DOW CORNING organosilicon Co., Ltd. makes)
(E) inorganic particles filler ((E) composition)
Talcum particulate (trade(brand)name: SG-2000, Japanese talcum Co., Ltd. makes)
[embodiment 1]
According to the prescription of table shown in the 1-1, mix (A) contain an epoxy group(ing) at least at intramolecularly compound, (B) and produce the compound of tertiary amine by radioactive rays, obtain liquid composition (sealing material for flat panel display).Use the composition of gained to estimate each rerum natura.
[embodiment 2]
According to the prescription of table shown in the 1-1, mix (A) contain an epoxy group(ing) at least at intramolecularly compound, (B) and produce compound, (C) anhydride curing agent of tertiary amine by radioactive rays, obtain liquid composition (sealing material for flat panel display).Use the composition of gained to estimate each rerum natura.
[embodiment 3～16, comparative example 1～4]
The composition of showing 1-1～table 1-3 is used in operation similarly to Example 2.Also promptly, except using the composition shown in table 1-1～table 1-3 ((A) composition～(E) composition), other are operated similarly to Example 2, obtain liquid composition (sealing material for flat panel display).
Table 1-1
Continued on next page
Table 1-1 brought forward
| (E) inorganic particles filler talcum particulate | - | - | - | - | 30 | 30 | 30 | 30 |
| Viscosity (mPas) | 5840 | 1850 | 1650 | 1600 | 2800 | 2910 | 3140 | 2950 |
| Solidified nature | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
| Viscosity stability | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
| Vapor transfer rate (g/m 2·24hr：40℃90％RH) | 21 | 19 | 17 | 18 | 14 | 14 | 16 | 14 |
| Bonding force (MPa: glass/glass) | 19 | 16 | 15 | 19 | 21 | 23 | 25 | 23 |
| Operation | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
Table 1-2
Table 1-3
Here, in table 1-1～table 1-3, the numerical value unit of each composition is a weight part.Wherein, in the hurdle of (C) composition, the numeric representation in the bracket is with respect to the amount (equivalent) of (C) composition of 1 equivalent (A) composition.
Claims (7)
1. a sealing material for flat panel display is characterized in that, contains the compound of an epoxy group(ing) with respect to (A) of 100 weight parts at least at intramolecularly, and (B) that contain 0.01～40 weight part produces compound of alkali by radioactive rays.
2. sealing material for flat panel display according to claim 1 is characterized in that, (B) compound by radioactive rays generation alkali is the compound that produces tertiary amine by radioactive rays.
3. sealing material for flat panel display according to claim 1 is characterized in that, contains the compound of an epoxy group(ing) with respect to 1 normal (A) at least at intramolecularly, further contains 0.8～1.2 normal (C) anhydride curing agent.
4. sealing material for flat panel display according to claim 1 is characterized in that, with respect to the claim 1 of 100 weight parts described (A), further contains (D) silane coupling agent of 0～30 weight part.
5. sealing material for flat panel display according to claim 1 is characterized in that, with respect to the claim 1 of 100 weight parts described (A), further contains (E) inorganic particles filler of 0～1000 weight part.
6. the sealing method of a flat-panel monitor is characterized in that, uses each the described sealing material for flat panel display in the claim 1～5 to come the seal plate indicating meter.
7. a flat-panel monitor is characterized in that, uses the described sealing method of claim 6 to obtain.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP289855/2005 | 2005-10-03 | ||
| JP2005289855 | 2005-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101278028A true CN101278028A (en) | 2008-10-01 |
Family
ID=37906250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800365502A Pending CN101278028A (en) | 2005-10-03 | 2006-10-02 | Sealing material for flat panel display |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7914641B2 (en) |
| EP (1) | EP1947157A1 (en) |
| JP (1) | JP4786663B2 (en) |
| KR (1) | KR101012971B1 (en) |
| CN (1) | CN101278028A (en) |
| TW (1) | TW200720796A (en) |
| WO (1) | WO2007040209A1 (en) |
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| CN104105733A (en) * | 2012-02-10 | 2014-10-15 | 三井化学株式会社 | Surface sealing agent for organic EL element, organic EL device using same, and manufacturing method for same |
| CN106062121A (en) * | 2014-05-02 | 2016-10-26 | 三井化学株式会社 | Sealing material and cured product thereof |
| CN110518145A (en) * | 2019-08-28 | 2019-11-29 | 云谷（固安）科技有限公司 | Thin-film packing structure and preparation method thereof, display panel |
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| TW436491B (en) * | 1997-08-22 | 2001-05-28 | Ciba Sc Holding Ag | Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions |
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| WO2001012745A1 (en) * | 1999-08-12 | 2001-02-22 | Mitsui Chemicals, Inc. | Photocurable resin composition for sealing material and method of sealing |
| CN1125488C (en) | 2000-08-25 | 2003-10-22 | 中国科学院化学研究所 | Liquid epoxy composite for packaging semiconductor and its application |
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| JP2003096184A (en) * | 2001-07-17 | 2003-04-03 | Mitsui Chemicals Inc | Photocurable resin composition |
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2006
- 2006-10-02 CN CNA2006800365502A patent/CN101278028A/en active Pending
- 2006-10-02 JP JP2007538760A patent/JP4786663B2/en not_active Expired - Fee Related
- 2006-10-02 EP EP06811081A patent/EP1947157A1/en not_active Withdrawn
- 2006-10-02 WO PCT/JP2006/319733 patent/WO2007040209A1/en active Application Filing
- 2006-10-02 US US12/089,152 patent/US7914641B2/en not_active Expired - Fee Related
- 2006-10-02 KR KR1020087010483A patent/KR101012971B1/en not_active IP Right Cessation
- 2006-10-03 TW TW095136690A patent/TW200720796A/en not_active IP Right Cessation
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| CN102210192A (en) * | 2008-11-28 | 2011-10-05 | 三井化学株式会社 | Organic el element surface sealant, method for producing display, and display |
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Also Published As
| Publication number | Publication date |
|---|---|
| US7914641B2 (en) | 2011-03-29 |
| JP4786663B2 (en) | 2011-10-05 |
| KR20080059274A (en) | 2008-06-26 |
| KR101012971B1 (en) | 2011-02-10 |
| JPWO2007040209A1 (en) | 2009-04-16 |
| US20100152315A1 (en) | 2010-06-17 |
| TWI355545B (en) | 2012-01-01 |
| WO2007040209A1 (en) | 2007-04-12 |
| TW200720796A (en) | 2007-06-01 |
| EP1947157A1 (en) | 2008-07-23 |
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