CN106062121B - Sealing material and its solidfied material - Google Patents
Sealing material and its solidfied material Download PDFInfo
- Publication number
- CN106062121B CN106062121B CN201580011222.6A CN201580011222A CN106062121B CN 106062121 B CN106062121 B CN 106062121B CN 201580011222 A CN201580011222 A CN 201580011222A CN 106062121 B CN106062121 B CN 106062121B
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- CN
- China
- Prior art keywords
- sealing material
- functional group
- group
- organic
- anhydride
- Prior art date
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- 239000003566 sealing material Substances 0.000 title claims abstract description 259
- 239000000463 material Substances 0.000 title claims description 126
- 125000000524 functional group Chemical group 0.000 claims abstract description 103
- -1 Anhydride ester Chemical class 0.000 claims abstract description 101
- 239000000178 monomer Substances 0.000 claims abstract description 62
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 53
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 38
- 239000000203 mixture Substances 0.000 claims abstract description 25
- 150000008064 anhydrides Chemical group 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 229920000098 polyolefin Polymers 0.000 claims description 52
- 238000002834 transmittance Methods 0.000 claims description 27
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical class C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 17
- 229920002554 vinyl polymer Polymers 0.000 claims description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 14
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- 239000000565 sealant Substances 0.000 abstract description 58
- 230000035699 permeability Effects 0.000 abstract description 35
- 239000000758 substrate Substances 0.000 description 70
- 239000010410 layer Substances 0.000 description 58
- 239000011575 calcium Substances 0.000 description 44
- 150000001875 compounds Chemical class 0.000 description 42
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- 239000011347 resin Substances 0.000 description 41
- 238000007789 sealing Methods 0.000 description 37
- 238000000034 method Methods 0.000 description 31
- 239000011521 glass Substances 0.000 description 29
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 23
- 229910052799 carbon Inorganic materials 0.000 description 23
- 229920000642 polymer Polymers 0.000 description 23
- 239000000945 filler Substances 0.000 description 20
- 230000008020 evaporation Effects 0.000 description 19
- 238000001704 evaporation Methods 0.000 description 19
- 238000007711 solidification Methods 0.000 description 18
- 230000008023 solidification Effects 0.000 description 18
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 17
- 229910052791 calcium Inorganic materials 0.000 description 17
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 16
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- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 15
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- 241000283216 Phocidae Species 0.000 description 14
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- 125000000217 alkyl group Chemical group 0.000 description 11
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- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical class C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 6
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- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000004809 Teflon Substances 0.000 description 5
- 229920006362 Teflon® Polymers 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
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- 239000003999 initiator Substances 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 5
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- FWHUTKPMCKSUCV-UHFFFAOYSA-N 1,3-dioxo-3a,4,5,6,7,7a-hexahydro-2-benzofuran-5-carboxylic acid Chemical compound C1C(C(=O)O)CCC2C(=O)OC(=O)C12 FWHUTKPMCKSUCV-UHFFFAOYSA-N 0.000 description 4
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 4
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 239000012986 chain transfer agent Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
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- 238000007641 inkjet printing Methods 0.000 description 4
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- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical class C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 4
- 125000003367 polycyclic group Chemical group 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 3
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 3
- 239000004641 Diallyl-phthalate Substances 0.000 description 3
- GXBYFVGCMPJVJX-UHFFFAOYSA-N Epoxybutene Chemical compound C=CC1CO1 GXBYFVGCMPJVJX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 3
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
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- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
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- 239000003505 polymerization initiator Substances 0.000 description 3
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- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 3
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- 229960000834 vinyl ether Drugs 0.000 description 3
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- 229920005604 random copolymer Polymers 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical class OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- FXYPBSKJSOBFAC-UHFFFAOYSA-N tert-butyl $l^{1}-oxidanylformate Chemical compound CC(C)(C)OC([O])=O FXYPBSKJSOBFAC-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000005425 toluyl group Chemical group 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2003/1087—Materials or components characterised by specific uses
Abstract
The problem of the present invention, which is to provide one kind, can form that moisture permeability is low, and the sealing material of the sealant of the moderately low sealant of modulus of elasticity, thickness of thin.In order to solve above-mentioned problem, the present application provides a kind of sealing material, and it is included:Polymerizable monomer (B), it has the functional group of at least one free redical polymerization in each molecule, and molecular weight is more than 50 and less than 1000, is liquid at 23 DEG C;Anhydride ester derivs (C), it includes at least one composition five-membered ring or the anhydride group of hexatomic ring and the functional group of free redical polymerization in each molecule;And radical polymerization initiator (D), it includes at least one party of hot radical polymerization initiator and optical free radical polymerization initiator.
Description
Technical field
The present invention relates to a kind of sealing material and its solidfied material.
Background technology
Organic EL (Electro-Luminescence, electroluminescent) elements are used for always because consumption electric power is few
In display or lighting device etc..Organic EL element because of the moisture in air, oxygen due to easily deteriorating, therefore with various close
Envelope component is sealed and used.
Organic el device for example can be comprising substrate, the organic EL element being configured on the substrate and paired with substrate
Hermetic sealing substrate structure.As an example of the method for sealing the organic EL element of such structure, can enumerate:
Sealing material is coated between hermetic sealing substrate and substrate and between organic EL element and hermetic sealing substrate, and the method (face for solidifying it
Sealing Method).
Also, in order that the moisture permeability of the sealant of the solidfied material comprising sealing material reduces, it have studied and add in sealing material
Add hygroscopic fillers.Specifically, it is proposed that the sealing material (1~patent document of patent document 3) comprising calcium oxide particle;Or bag
Sealing material (patent document 4) of the particle containing porous silica etc..
In addition, as moisture agent for capturing, it is also known that organo-metallic compound, it is also proposed that comprising its hyaline membrane etc. (specially
Sharp 5~patent document of document 7).And, it is also proposed that organo-metallic compound and powdered inorganic oxide are caught as moisture
Catch agent and be added in hot-melt type member etc. (patent document 8).
On the other hand, as two functional monomers with acrylic resin and epoxy resin reaction, it is known in intramolecular
The compound (non-patent literature 1) of functional group and anhydride group comprising free redical polymerization.In addition, in the past it is also known that solidifying
Property resin manufacture composition in addition in an intramolecular there is the compound of anhydride group and acidic group (patent document 9).
Prior art literature
Patent document
Patent document 1:No. 2010/084939 publication of International Publication No.
Patent document 2:Japanese Unexamined Patent Publication 2005-122910 publications
Patent document 3:Japanese Unexamined Patent Publication 2007-184279 publications
Patent document 4:Japanese Unexamined Patent Publication 2007-284472 publications
Patent document 5:Japanese Unexamined Patent Publication 2005-298598 publications
Patent document 6:Japanese Unexamined Patent Publication 2011-026521 publications
Patent document 7:Japanese Unexamined Patent Publication 2012-006991 publications
Patent document 8:No. 2007/123039 publication of International Publication No.
Patent document 9:Japanese Unexamined Patent Application Publication 2010-523787 publications
Non-patent literature
Non-patent literature 1:A Reworkable Photothermal Dual-curing System
(Chem.Lett.2013,42,1056-1058) (can reprocess the double cure systems of photo-thermal (Chemistry Letters, 2013,42,1056-
1058))
The content of the invention
Problems to be solved by the invention
As 1~patent document of patent document 8, in order that the moisture permeability of sealant reduces, add and inhale in sealant
Moist filler, organo-metallic compound etc. are at first sight regarded as effective.However, it with the addition of hygroscopic fillers, You Jijin
When belonging to compound, the transparency of the solidfied material of sealing material is damaged sometimes, or the viscosity of sealing material uprises, moistening diffusion during coating
Property reduce etc., the application as encapsulant is restricted.In addition, according to the purposes of various equipment, sealing is sometimes required that
The filming of layer, but conventional sealing material is difficult to thinly be coated with, it is also difficult to and reply is such to be required.
In addition, being investigated the crosslink density for improving resin, the moisture permeability of sealant is reduced.But if improve resin
Crosslink density, then contraction of the sealing material in solidification become big.There are the following problems for its result:Include the solidification containing the sealing material
Substrate, the hermetic sealing substrate of the device of the sealant of thing, easily produce strain.In addition, there is a problem in that:Due to sealant
Modulus of elasticity improve, therefore sealant can not absorb from outside ess-strain, can not fully protect by sealer (such as
Organic EL element).
The present invention is in view of situation as described above forms.That is, the present invention, which provides one kind, can form that moisture permeability is low, can also tackle
The formation of thin sealant and the sealing material of the moderately low sealant of modulus of elasticity.
For solving the method for problem
That is, the first invention of the invention is on sealing material as shown below, flap seal material as obtained by it.
[1] a kind of sealing material, it is included:Polymerizable monomer (B), it has at least one free redical in each molecule
The functional group of polymerization, and molecular weight is more than 50 and less than 1000, is liquid at 23 DEG C;Anhydride ester derivs (C), it is each
At least one composition five-membered ring or the anhydride group of hexatomic ring and the functional group of free redical polymerization are included in molecule;And from
By base polymerization initiator (D), at least one party comprising hot radical polymerization initiator and optical free radical polymerization initiator.
[2] sealing material as described in [1], it is further included:Olefin polymer (A) containing polymerizable functional group,
It has the functional group of at least one free redical polymerization in each molecule, and number-average molecular weight is more than 5000 and 70000
Below.
[3] sealing material as described in [1] or [2], its viscosity determined by E types viscosimeter under 25 DEG C, 1.0rpm are
More than 5mPas and below 20000mPas.
[4] sealing material as any one of [1] to [3], wherein, the polymerizable monomer (B) and the acid anhydrides spread out
The functional group of the free redical polymerization possessed by biological (C), separately for selected from by (methyl) acryloyl group, ethene
The functional group of one or more of the group that base, pi-allyl, vinyl ether group are formed.
[5] sealing material as any one of [2] to [4], wherein, the olefin-based containing polymerizable functional group is gathered
The functional group of the free redical polymerization possessed by compound (A), for selected from by (methyl) acryloyl group, vinyl, pi-allyl,
The functional group of one or more of the group that vinyl ether group is formed.
[6] sealing material as any one of [1] to [5], wherein, the anhydride ester derivs (C) are in each molecule
In have at least one free redical polymerization functional group hexahydrophthalic anhydride derivative (C').
[7] a kind of flap seal material, it is obtained as the sealing material any one of [1] to [6] as described above.
The second invention of the present invention is the solidfied material on sealing material as shown below.
[8] a kind of solidfied material of sealing material, the sealing material are the sealing material any one of [1] to [6] as described above.
[9] a kind of solidfied material of sealing material, the sealing material are sealing material as any one of [2] to [6], its bullet
Property modulus is more than 0.1MPa and below 100MPa.
[10] a kind of solidfied material of sealing material, the sealing material are the sealing material as described in [8], and it is 400nm in wavelength
When directional light light transmittance be more than 90%.
[11] a kind of solidfied material of sealing material, the sealing material are the sealing material as described in [9], and it is 400nm in wavelength
When directional light light transmittance be more than 90%.
[12] a kind of sealing material, it is included:Olefin polymer (A) containing polymerizable functional group, it is in each molecule
In have at least one free redical polymerization functional group, and number-average molecular weight be more than 5000 and less than 70000;Hexahydro neighbour's benzene
Dicarboxylic acid anhydride derivative (C'), it has the functional group of at least one free redical polymerization in each molecule;And free radical
Polymerization initiator (D), it includes at least one party of hot radical polymerization initiator and optical free radical polymerization initiator.
Invention effect
According to the sealing material of the present invention, the solidfied material that moisture permeability is low and modulus of elasticity is moderately low can be obtained.Further, since
The viscosity of sealing material can be reduced, therefore also the solidfied material (sealant) of sealing material can be subjected to filming.
Brief description of the drawings
Figure 1A~Fig. 1 C are the schematic diagrames of the production order for the test sample for representing the solidfied material moisture permeability based on Ca methods.
Fig. 2A is the summary section for a form for representing organic el device, and Fig. 2 B are other that represent organic el device
The summary section of form.
Fig. 3 A~Fig. 3 C are the schematic diagrames of one of the manufacturing step for the organic el device for representing Fig. 2A.
Fig. 4 A are the summary sections for other forms for representing organic el device, and Fig. 4 B are by Fig. 4 A organic el device
The top view for the situation that hermetic sealing substrate removes.
Embodiment
1. on sealing material.
The sealing material of the present invention is the composition for forming the sealant of the various equipment such as organic el device.Sealing material
Composition suitably selects according to its purpose.Such as formed thickness of thin sealant when etc., be set to comprising polymerizable monomer (B),
The sealing material of anhydride ester derivs (C) and radical polymerization initiator (D).Now, sealing material can be included containing polymerization as needed
The olefin polymer (A) of property functional group.On the other hand, in the low sealant of formation modulus of elasticity etc., it is set to contain
The sealing material of the olefin polymer (A) of polymerizable functional group, anhydride ester derivs (C) and radical polymerization initiator (D).This
When, polymerizable monomer (B) can be included as needed.
In the past, in order to improve the hygroscopicity of sealant, it have studied and hygroscopic fillers etc. are added in sealing material.If however,
Sealing material includes hygroscopic fillers etc., then the transparency of the solidfied material of sealing material is damaged, or the screening characteristics step-down of sealing material and it is difficult
Fully to cover by sealer.In addition, if sealing material includes filler etc., there is a problem in that:The viscosity of sealing material uprises
And it is difficult to sealant carrying out filming.In addition, also it is difficult to only fully reduce the saturating of solidfied material by adding hygroscopic fillers
Humidity.On the other hand, in order to reduce the moisture permeability of the solidfied material of sealing material, it is investigated the crosslink density for improving resin, but
In this method, the cure shrinkage of sealing material becomes big, and the substrate being laminated with the solidfied material of sealing material produces strain sometimes.But also
There are the following problems:Because the modulus of elasticity of solidfied material improves, therefore the solidfied material can not fully absorb the stress from outside
Strain, can not adequately protect by sealer etc..
In contrast, in the solidfied material of the sealing material of the present invention, pass through the anhydride ester derivs with polymerizable functional group
(C) anhydride group catches moisture.Think herein, even the common acid anhydrides such as hexahydrophthalic anhydride, can also catch
The water that intrusion is come in, it is effective to add in sealing material.However, common acid anhydrides is not carried out with the other compositions in sealing material
Polymerisation.Therefore, easily oozed out after the solidification of sealing material, it is difficult to give full play of moisture and catch performance.If in addition, these
Compound is oozed out, then also has pollution by the worry of sealer.
In contrast, the anhydride ester derivs (C) that the sealing material of the present invention is included have the official of free redical polymerization reaction
Can group, carry out polymerisation with the olefin polymer (A) containing polymerizable functional group, polymerizable monomer (B) etc..Therefore, exist
The structure (anhydride group) from anhydride ester derivs (C) in solidfied material equably be present.That is, in the solidification of sealing material of the invention
In thing, the composition (anhydride ester derivs (C)) for catching moisture does not ooze out, and can effectively catch moisture.
In addition, in the sealing material of the present invention, spread out by the olefin polymer (A) containing polymerizable functional group with acid anhydrides
Biological (C) polymerization, is difficult to excessively improve so as to the crosslink density of solidfied material.As a result, sealing material is difficult to shrink in solidification,
Substrate being laminated with the solidfied material of sealing material etc. is difficult to produce warpage etc..In addition and then, due to solidfied material modulus of elasticity appropriateness
It is low, load from outside etc. is can absorb, therefore can adequately protect by sealer not by the shadow of the ess-strain from outside etc.
Ring.
In addition, the sealing material in the present invention is filled without the alkene polymer (A) containing polymerizable functional group or its content
When dividing few, the viscosity of sealing material.As a result, sealing material can be coated with by ink-jet method etc., the solidfied material of gained can be made (close
Sealing) thickness it is thinning.
Hereinafter, olefin polymer (A), the polymerism containing polymerizable functional group that can be included to the sealing material of the present invention
Monomer (B), anhydride ester derivs (C) and radical polymerization initiator (D) and other compositions illustrate.
1-1. contains the olefin polymer (A) of polymerizable functional group
Olefin polymer (A) containing polymerizable functional group is that in each molecule there is at least one free redical to gather
The functional group of conjunction, and number-average molecular weight is more than 5000 and less than 70000 olefin polymer.
The number-average molecular weight of olefin polymer (A) containing polymerizable functional group is more than 5000 and less than 70000, excellent
Elect 10000~40000 as.If the number-average molecular weight of the olefin polymer (A) containing polymerizable functional group is less than 70000,
Then the mobility of sealing material fully improves, and seals various components easily by sealing material.On the other hand, if containing polymerism official
The number-average molecular weight for the olefin polymer (A) that can be rolled into a ball is more than 5000, then the modulus of elasticity of the solidfied material of sealing material easily becomes
It is low.
Herein, free redical polymerization contained in the olefin polymer containing polymerizable functional group (A) each molecule
The quantity of functional group is more than 1, is appropriately configured according to modulus of elasticity of the solidfied material of desired sealing material etc..If
The quantity of the functional group of free redical polymerization contained by olefin polymer (A) containing polymerizable functional group becomes more, then seals
The modulus of elasticity of the solidfied material of material easily improves.
The functional group of free redical polymerization contained by olefin polymer (A) containing polymerizable functional group, can be with
The functional group of ethene unsaturated bond.Specially (methyl) acryloyl group, vinyl, pi-allyl, vinyl ether group etc., just react
Property etc. for viewpoint, be preferably (methyl) acryloyl group etc..Included in the olefin polymer (A) containing polymerizable functional group
During the functional group of multiple free redical polymerizations, the functional group of these free redical polymerizations can be the functional group of identical type, also may be used
For different types of functional group.
Olefin polymer (A) containing polymerizable functional group can be will " polyolefin polymer " with " with can be free
The compound that the compound of the functional group of base polymerization " combined polymerization forms, or can be by " there is the function of free redical polymerization
Group compound " will " polyolefin polymer " modification obtained by compound.The functional group of free redical polymerization can be directly with gathering
Olefin polymer combines, and can also roll into a ball via bivalence linking base and be combined with polyolefin polymer.By the official of free redical polymerization
There is no particular restriction for the species for the link group that energy group links, and can enumerate:Can have substituent carbon number be 4~12 straight chain or
Branched alkylidene;The carbon number can with substituent is 4~12 cycloalkylidene etc..In addition, linking a part for group can wrap
Include-COO- ,-O- etc..
In addition, as the substituent linked contained by group, such as can enumerate:Alkyl, hydroxyl, alkoxy, carboxyl, alkoxy
Alkoxy, aralkoxy, aryl, aryloxy group, aryloxy group alkyl epoxide, alkylthio group, alkylthioalkylthio, aromatic alkylthio, arylthio,
Arylthio alkylthio group, halogen atom etc..
As the example on olefin polymer " via the functional group of free redical polymerization for linking group and combining ",
Such as it can enumerate:Group shown in following formulas (Y2).
[changing 1]
In above-mentioned formula (Y2), R13Represent hydrogen atom or methyl.In above-mentioned formula, R14Expression carbon number is 2~12, preferably
The alkylidene for being 2~6 for carbon number.Alkylene basis representation straight-chain alkyl-sub, branched alkylidene or cycloalkylidene it is any.In addition,
In formula (Y2), q represents more than 1 and less than 23 number.One molecule of the olefin polymer (A) containing polymerizable functional group
It is interior can also to be included two or more only comprising the group shown in a kind of above-mentioned formula (Y2).
On the other hand, the polyolefin as the main framing of the olefin polymer (A) containing polymerizable functional group polymerize
Thing, can be the polymer at least one of the alkene alkene for being 2~20 selected from carbon number.The polyolefin polymer can be
A kind of homopolymer of alkene, or the random copolymer of two or more alkene, block copolymer.
Include to obtain the example for the alkene that the carbon number of polyolefin polymer is 2~20:Ethene, propylene, 1-
Butylene, 1- amylenes, 3-methyl-1-butene, 1- hexenes, 4-methyl-1-pentene, 3- Methyl-1-pentenes, 1- octenes, 1- decene, 1-
The carbon numbers such as dodecylene, tetradecene, cetene, 1- vaccenic acids, 1- eicosylenes are 2~20 straight-chain
Or branched alpha-olefin;Cyclopentene, cycloheptene, ENB, 5- methyl -2- ENBs, tetracyclododecane, 2- methyl -
The carbon numbers such as 1,4,5,8- dimethanos -1,2,3,4,4a, 5,8,8a- octahydro naphthalene are 3~20 cyclic olefin.
In addition, also include to obtain the alkene that the carbon number of polyolefin polymer is 2~20:Vinyl cyclohexyl
Alkane, diene, polyenoid etc..The example of diene or polyenoid includes:Carbon number be 4~20 and with two or more double bond ring-type or
The compound of chain.Specifically include:Butadiene, isoprene, 4- methyl-1,3-pentylenes, 1,3- pentadienes, 1,4- penta 2
Alkene, 1,5- hexadienes, 1,4- hexadienes, 1,3- hexadienes, 1,3- octadienes, 1,4- octadienes, 1,5- octadienes, 1,6- pungent two
Alkene, 1,7- octadienes, ethylidene norbornene, vinyl norbornene, bicyclopentadiene, 7- methyl isophthalic acids, 6- octadienes, 4- are sub-
Ethyl -8- methyl isophthalic acids, 7- nonadienes, 5,9- dimethyl -1,4,8- last of the ten Heavenly stems triolefins etc..
The concrete example of polyolefin polymer includes:The polyethylene such as high density polyethylene (HDPE), medium density polyethylene;Polypropylene;
Poly-1-butylene;Poly- methyl butene;Ethylene/alpha-olefin copolymer;Ethene based elastomers, propylene-based elastomers, isoprene rubber
Etc. olefin-based elastomer etc..Polyolefin polymer is preferably olefin-based elastomer, especially preferably isoprene rubber.
In addition, one with " compound with the functional group of free redical polymerization " of the reaction of said polyolefins based polymer
Individual example includes:Polymerizable monomer (B) described later, its derivative etc..This is set " to there is free redical by using known method
The compound of the functional group of polymerization " and polyolefin polymer reaction, so as to obtain the olefin-based containing polymerizable functional group
Polymer (A).
1-2. polymerizable monomers (B)
Polymerizable monomer (B) is the functional group for having in each molecule at least one free redical polymerization, and molecular weight
It is the compound of liquid at 23 DEG C for more than 50 and less than 1000.If sealing material includes polymerizable monomer (B), sealing material
The easy step-down of viscosity, and the solidfied material of sealing material crosslink density improve.In addition, polymerizable monomer (B) is set to not include
Equivalent to anhydride ester derivs described later (C) material.
The quantity of the functional group of contained free redical polymerization is more than 1 in each molecule of polymerizable monomer (B),
Preferably 1~16, more preferably 1~4, more preferably 1~3.The official of free redical polymerization contained by polymerizable monomer (B)
It can be vinyl, (methyl) acryloyl group, pi-allyl, vinyl ether group etc. that can roll into a ball, and be preferably (methyl) acryloyl group.It is polymerizeing
Property monomer (B) in when including the functional group of multiple free redical polymerizations, can be the functional group of identical type, or not of the same race
The functional group of class.
On the other hand, the molecular weight of polymerizable monomer (B) is 50~1000, preferably 50~500.If polymerizable monomer
(B) molecular weight is the scope, then easily fully adjusts the viscosity of sealing material.
The example of polymerizable monomer (B) includes:There is the list (methyl) third of (methyl) acryloyl group in an intramolecular
Olefin(e) acid system monomer and there are two (methyl) acrylic monomers of two (methyl) acryloyl groups in an intramolecular.
There is list (methyl) acrylic monomer of (methyl) acryloyl group as in an intramolecular, such as can arrange
Lift:Monomer shown in following formulas (1B).
[changing 2]
R in formula (1B)7Represent hydrogen atom or methyl.In addition, the R in formula (1B)8Represent that hydrogen atom or carbon number are 4
~18 alkyl.The alkyl that carbon number is 4~18 represents straight chained alkyl, branched alkyl or alicyclic type hydrocarbon.
The concrete example of list (methyl) acrylic monomer shown in the formula (1B) includes:(methyl) acrylic acid, (first
Base) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) 2-EHA, (methyl) lauryl acrylate,
The different stearyl ester of (methyl) acrylic acid, (methyl) isoamyl acrylate, (methyl) isodecyl acrylate, (methyl) acrylic acid are different pungent
Ester, the different myristin of (methyl) acrylic acid, (methyl) tridecyl acrylate, (methyl) cyclohexyl acrylate, acrylic acid two
Cyclopentene epoxide ethyl ester etc..These a kind of single (methyl) acrylic monomers can be only included in the sealing material of the present invention, in addition
It can include two or more.
There are two (methyl) acrylic monomers of two (methyl) acryloyl groups in an intramolecular, can be following formulas
Monomer shown in (2B).
[changing 3]
R in formula (2B)9And R10Separately represent hydrogen atom or methyl.In addition, in formula (2B), R11Represent carbon
Number is 4~12 alkyl.The alkyl that carbon number is 4~12 represents straight-chain alkyl-sub, branched alkylidene or cycloalkylidene.
The concrete example of two (methyl) acrylic monomers shown in the formula (2B) includes:1,3 butylene glycol two (methyl)
Acrylate, 1,4- butanediols two (methyl) acrylate, 1,6-HD two (methyl) acrylate, (first of neopentyl glycol two
Base) acrylate, 1,9- nonanediols two (methyl) acrylate etc..Can be only comprising these a kind of two (methyl) propylene in sealing material
Acid system monomer, it can also include two or more.
When single (methyl) acrylic monomer and two (methyl) acrylic monomers are included in sealing material, they contain
Ratio is any, if but two (methyl) acrylic monomers containing ratio become it is more, under hot and humid environment it is closely sealed reliably
Property improve.
In addition, the example of polymerizable monomer (B) also includes:An intramolecular have more than one vinyl monomer,
Monomer of one intramolecular with more than one pi-allyl, in monomer of the intramolecular with more than one vinyl ether group, one
Intramolecular has the vinyl ether compound of (methyl) acryloyl group.
The example in an intramolecular with the monomer of more than one vinyl includes:Styrene, 4-Vinyl phenol, to chlorine
Styrene, to bromstyrol, p-methylstyrene, to methoxy styrene, to t-butoxystyrene, to tert-butoxy carbonyl oxygen
The fragrant family vinyl compounds such as base styrene, 1- vinyl naphthalenes, 2- vinyl naphthalenes;1- heptene, 3,3- dimethyl -1- penta
Alkene, 4,4- dimethyl -1- amylenes, 2,4- diphenyl -4-methyl-1-pentene, 3- methyl isophthalic acids-hexene, 4- methyl isophthalic acids-hexene, 5-
Methyl isophthalic acid-hexene, 1- octenes, 2,2- dimethyl -1- hexenes, 3,4- dimethyl -1- hexenes, 4,4- dimethyl -1- hexenes, 1- nonyls
Alkene, 3,5,5- trimethyl -1- hexenes, 1- decene, 1- endecatylenes, 1- dodecylenes, 1- tridecylenes, tetradecene, 1-
15 carbenes, cetene, 1- heptadecenes, 1- vaccenic acids, the carbenes of 1- 19,1- eicosylenes, the dodecylenes of 1- bis-
Etc. fatty family vinyl compound;Vinyl acetate, monochloro acetic acid vinyl acetate, vinyl benzoate, pivalic acid vinyl acetate, fourth
Vinyl acetate, vinyl laurate, hexanedioic acid vinyl ester, vinyl methacrylate, vinyl crotonate, 2 ethyl hexanoic acid second
The generating vinyl carboxylate ester compounds such as alkene ester;The vinyl chemical combination containing nitrogen-atoms such as N- vinyl carbazoles, NVP
Thing.
The example in an intramolecular with the monomer of more than one pi-allyl includes:Diallyl phthalate, isophthalic
Diformazan diallyl phthalate, diallyl p phthalate, trimethylolpropane allyl ether, isocyanuric acid ester triallyl,
The methallyl of isocyanuric acid ester three, cyanurate triallyl etc..
The example in an intramolecular with the monomer of more than one vinyl ether group includes:Ethyl vinyl ether, isobutyl group
Vinyl ethers, butanediol divinyl ether, cyclohexyl vinyl ether, hydroxybutyl vinyl ether, hydroxyethyl vinyl ether, ring
Hexane dimethanol divinyl ether, cyclohexane dimethanol monovinyl ether, diethylene glycol divinyl ether, glycol divinyl
Base ether, triethylene glycol mono vinyl ether etc..
The example in an intramolecular with the vinyl ether compound of (methyl) acryloyl group includes:Acrylic acid 2- (2- second
Alkenyloxy group ethyoxyl) ethyl ester, methacrylic acid 2- (2- vinyloxyethoxies) ethyl ester etc..
1-3. anhydride ester derivs (C)
Anhydride ester derivs (C) are that have the functional group of at least one free redical polymerization and composition five in each molecule
The compound of the anhydride group of yuan of rings or hexatomic ring, such as can be the functional group that free redical polymerization is combined with various acid anhydrides
Compound.The quantity of the functional group of free redical polymerization contained by each molecule of anhydride ester derivs (C) is more than 1,
Preferably 1.It is described poly- in the solidification of sealing material if including the functional group of free redical polymerization in anhydride ester derivs (C)
Conjunction property monomer (B), the olefin polymer (A) containing polymerizable functional group polymerize with anhydride ester derivs (C), and suppress acid anhydrides and spread out
Biological (C's) oozes out.
The functional group of free redical polymerization contained by anhydride ester derivs (C) can be the function with ethene unsaturated bond
Group.Specially (methyl) acryloyl group, vinyl, pi-allyl, vinyl ether group etc., for the viewpoint of reactivity etc., preferably
For (methyl) acryloyl group etc..The functional group of free redical polymerization can be directly combined on the main framing comprising anhydride group,
It can be combined via group is linked.Link group can with the olefin polymer (A) containing polymerizable functional group can
The functional group of radical polymerization is identical with the link group that polyolefin polymer links.Comprising more in anhydride ester derivs (C)
Can be the functional group of identical type, or different types of functional group during the functional group of individual free redical polymerization.
Anhydride ester derivs (C) for example can be the compound shown in following formulas (1C).
[changing 4]
In the formula (1C), X represents organic group that carbon number is 2~14 (wherein, anhydride group contained carbon to each other
Number is 2 or 3), R1The functional group of free redical polymerization is represented, Y represents singly-bound or links group.In addition, n represents more than 1 and 12
Following number.
X in the formula (1C) for example can be:Fatty group;Monocyclic fatty group;Condensation polycyclic formula fatty group;
Monocyclic aromatic base;Condensation polycyclic formula aromatic series base;Ring type fatty group it is interconnected directly or by cross-linked structure and
Into non-condensation polycyclic formula fatty group;Aromatic series base interconnected non-condensation polycyclic formed directly or by cross-linked structure
Formula aromatic series base.
Above-mentioned X is more specifically the structure from various acid anhydrides, such as can be from aromatic dicarboxylic acid acid anhydride, alicyclic dicarboxyl
The group of acid anhydrides.The example of aromatic dicarboxylic acid acid anhydride includes:Phthalic anhydride, naphthalic anhydride, anthracene dicarboxylic acid anhydride etc..It is another
Aspect, the example of alicyclic dicarboxylic acid's acid anhydride include:Succinic anhydride, maleic anhydride, tetrabydrophthalic anhydride, hexahydro O-phthalic
Acid anhydrides, 5- ENB -2,3- dicarboxylic acid anhydrides, (1 α, 4 α)-norbornane -2 α, 3 alpha, alpha-dimethyl acid anhydrides etc..
In addition, X can have substituent.Substituent can be carbon number be 1~6 alkyl, carbon number be 1~6 alkoxy, benzene oxygen
Base, halogen etc..
On the other hand, the R in above-mentioned formula (1C)1Concretely (methyl) acryloyl group, vinyl, pi-allyl, ethene
Base ether.
In addition, when Y in above-mentioned formula (1C) is links group, alkylidene that it is 1~10 selected from carbon number that Y, which can be, bag
The alkenylene or the bivalence linking base group of phenylene that carbon number containing 1~3 unsaturated group is 2~10.The one of the link group
Part hydrogen can be optionally substituted by halogen.
Anhydride ester derivs shown in above-mentioned formula (1C) are preferably hexahydrophthalic anhydride derivative (C') or adjacent benzene two
Formic anhydride derivative (C "), especially preferably hexahydrophthalic anhydride derivative (C').
As the concrete example of hexahydrophthalic anhydride derivative, can enumerate:Compound shown in following formulas (2C).Should
The molecular weight of compound is preferably 296~5000.
[changing 5]
In above-mentioned formula (2C), n represents more than 1 and less than 4 numerical value.In addition, in above-mentioned formula (2C), R11Independently
Ground represents the group of the functional group comprising more than one free redical polymerization.R11Group shown in preferably following formulas (X1),
Group comprising vinyl, the group comprising pi-allyl or the group comprising vinyl ether group.
[changing 6]
In above-mentioned formula (X1), R3For hydrogen atom or methyl.In above-mentioned formula, R4Represent that carbon number is 2~12, is preferably carbon
Number is 2~6 straight-chain alkyl-sub, branched alkylidene or cycloalkylidene.In addition, in formula (X1), p represent more than 1 and 23 with
Under numerical value.
In addition, equivalent to R in above-mentioned formula (2C)11The example of " group for including vinyl " include:1,3- dioxies
For octahydro isobenzofuran -5- formic acid 3- butene-1s-base ester base, 1,3- dioxo octahydro isobenzofuran -5- formic acid 5- hexyls -
1- base esters base, 1,3- dioxo octahydro isobenzofuran -5- formic acid 7- octene-1s-base ester base.
And then in above-mentioned formula (2C), equivalent to R11The example of " group for including pi-allyl " include:1,3- dioxies
For octahydro isobenzofuran -5- allyl formates base, 1,3- dioxo octahydro isobenzofuran -5- formic acid 2- (allyloxy) second
Ester group.
In above-mentioned formula (2C), equivalent to R11The example of " group for including vinyl ether group " include:1,3- dioxies
For octahydro isobenzofuran -5- formic acid 2- (vinyl epoxide) ethoxycarbonyl, 1,3- dioxo octahydro isobenzofuran -5- formic acid 2-
(2- (vinyl epoxide) ethyoxyl) ethoxycarbonyl, 1,3- dioxos octahydro isobenzofuran -5- formic acid 4- (vinyl epoxide) fourth
Ester group.
Compound shown in above-mentioned formula (2C) can have substituent.As long as substituent does not damage effect of the invention then simultaneously
It is not particularly limited, such as can is straight-chain or branched-chain alkyl that carbon number is 1~5 etc..
The especially preferred example of anhydride ester derivs (C) is the compound shown in following formulas (3C).
[changing 7]
In above-mentioned formula (3C), R5Represent hydrogen atom or methyl.
1-4. radical polymerization initiators (D)
Radical polymerization initiator (D) is to make the above-mentioned alkene containing polymerizable functional group by heating or light irradiation
Hydrocarbon system polymer (A), anhydride ester derivs (C) or polymerizable monomer (B) carry out the compound of radical polymerization.Radical polymerization is drawn
Hair agent (D) can be optical free radical polymerization initiator, or hot radical polymerization initiator.Radical polymerization contained by sealing material
The species of initiator (D) is suitably selected according to the curing of sealing material, can only be included in sealing material any in them
One side, it can also include both sides.
There is no particular restriction for optical free radical polymerization initiator, can be known optical free radical polymerization initiator.Optical free radical
The example of polymerization initiator includes:Alkyl phenones based compound, acylphosphine oxide based compound, titanocenes based compound, oxime ester
Based compound, styrax based compound, acetophenone based compound, benzophenone based compound, thioxanthones based compound, α-acyl oxime
Ester based compound, benzoyl formiate based compound, benzil based compound, Azo, diphenyl sulfide based compound,
Organic pigment based compound, iron-phthalocyanine based compound, benzoin ether based compound, anthraquinone based compound etc..Can be only in sealing material
Comprising one kind in these optical free radical polymerization initiators, can also include two or more.
For the viewpoint of reactivity etc., optical free radical polymerization initiator is especially preferably alkyl phenones based compound, acyl
Base phosphine oxide based compound.
On the other hand, also it is not particularly limited for hot radical polymerization initiator, can is that known hot radical polymerization is drawn
Send out agent.Hot radical polymerization initiator for example can be known organic peroxide.The example bag of hot radical polymerization initiator
Include:Peroxidating 2,4 dichloro benzene formyl, the peroxidating pivalic acid tert-butyl ester, peroxidating 3,5,5- trimethyl acetyls, caprylyl peroxide,
Decanoyl peroxide, lauroyl peroxide, succinic acid peroxide, acetyl peroxide, peroxidating (the 2 ethyl hexanoic acid tert-butyl ester), peroxide
Change toluyl, benzoyl peroxide, peroxidating Malaysia tert-butyl acrylate, peroxide between (2 ethyl hexanoic acid tert-pentyl ester), peroxidating
Change bay tert-butyl acrylate, the peroxidating -3,5,5 Trimethylhexanoic acid tert-butyl ester, cyclohexanone peroxide, isopropyl peroxide carbonic acid uncle
Butyl ester, 2,5- dimethyl -2,5- two (benzoylperoxy) hexane, 2,2- bis(t-butylperoxy)s octane, peroxidating second
Tert-butyl acrylate, 2,2- bis(t-butylperoxy)s butane, peroxidized t-butyl perbenzoate, 4,4- bis(t-butylperoxy) valeric acids
N-butyl, diperoxy M-phthalic acid di tert butyl carbonate, cumyl peroxide, methyl ethyl ketone peroxide etc..In sealing material
A kind of hot radical polymerization initiator can be only included, can also be included two or more.
In addition, free radical chain transfer agent can be included in sealing material together with radical polymerization initiator.If include free radical
Chain-transferring agent, then the curability of sealing material further improve.The example of free radical chain transfer agent includes:α-methylstyrene dimerization
The disulfides such as species, the thio-alcohol containing sulfydryl, diphenyl disulfide, terminal unsaturation methacrylate n polymers
Class, cobalt complexes of porphyrin class etc..A kind of free radical chain transfer agent can be only included in sealing material, can also be included two or more.
Relative to the mass parts of total amount 100 of the compound with free-radical polymerised functional group, free radical chain transfer agent
Content is preferably the mass parts of 0.1 mass parts~10, the mass parts of more preferably 0.5 mass parts~5.
1-5. other compositions
In the range of the effect of the present invention is not damaged significantly, other resins can be included in sealing material.Other resins are for example
It can be thermosetting resin etc..The example of thermosetting resin includes:Epoxy resin, phenol resin, diallyl phthalate resin,
Carbamide resin, polyester resin etc..A kind of thermosetting resin can be only included in sealing material, can also be included two or more.
Filling material can be included in sealing material.The example of contained filling material includes in sealing material:Bead, polystyrene gather
Polymer particle, methacrylate based polymer particle, ethylene-based polymer particle, acrylic polymer particle etc..Sealing material
In be able to can also be included two or more only comprising a kind of filling material.
Modifying agent, stabilizer can be included in sealing material.The concrete example of modifying agent includes:Age resister, levelling agent, wetability
Modifying agent, surfactant, plasticizer etc..These modifying agent can be used alone a kind of or combine two or more and use.It is another
Aspect, the concrete example of stabilizer include:Ultra-violet absorber, preservative, antiseptic etc..These modifying agent, stabilizer are sealing
It is able to can also be included two or more only comprising one kind respectively in material.
Antioxidant can be included in sealing material.Antioxidant be instigate irradiated by plasma, solar radiation is and caused
Free radical inactivation material (hindered amine as light stabilizer (Hindered Amine Light Stabilizer, HALS)) or incited somebody to action
Material of peroxide breaks down etc..Antioxidant has the function of preventing that the solidfied material of sealing material from changing colour.Antioxidant can be to be obstructed
Amine, phenol antioxidant, phosphorous antioxidant etc..
The example of hindered amine includes:Double (2,2,6,6- tetramethyl piperidine -4- bases) sebacates, bis- chloro- 6- of 2,4- are tertiary pungent
Base amido-s-triazine and polycondensation product, double [1- (the 2- hydroxyls of 4,4'- hexamethylene bis (amido -2,2,6,6- tetramethyl piperidines)
Base -2- methyl propoxyl group) -2,2,6,6- tetramethyl piperidine -4- bases] sebacate.
The example of phenol antioxidant includes:Single phenols such as 2,6- di-t-butyls-paracresol, 2,2' methylene bis (4- first
Base -6- tert-butyl phenols) etc. the polymer electrolyte phenol such as bisphenols, 1,1,3- tri- (2- methyl -4- hydroxyl -5- tert-butyl-phenyls) butane
Class.
Phosphorous antioxidant preferably uses:Antioxidant selected from phosphorous acid esters and oxide-based selected from oxa- phospho hetero phenanthrene
Stainblocker.
Particularly in terms of assigning to the patience of ultraviolet, steady (Tinuvin) 123 (double (pungent oxygen of 1- preferably over day
Base -2,2,6,6- tetramethyl -4- piperidyls) sebacate), steady (Tinuvin) 765 over day (it is double (1,2,2,6,6- pentamethyls -
4- piperidyls) sebacate and 1,2,2,6,6- pentamethyl -4- piperidyl decanedioic acid methyl esters mixture), Hostavin PR25
Steady (Tinuvin) 312 or Hostavin vsu (ethane diamides N- (2- second over (4- methoxy-benzyls dimethyl malenate), day
Phenyl)-N'- (2- ethylphenyls)), (double (3- aminocarbonyl propyls) ethylenediamines -2,4- of N, N'- are double by CHIMASSORB 119FL
[N- butyl-N- (1,2,2,6,6- pentamethyl -4- piperidyls) amido] chloro- 1,3,5- triazines condensation products of -6-.
Solvent can be included as needed in the sealing material of the present invention.Solvent, which has, makes each composition be uniformly dispersed or dissolve
Function.The example of solvent includes:The aromatic solvents such as toluene, dimethylbenzene;The ketone such as acetone, methyl ethyl ketone, methyl iso-butyl ketone (MIBK)
Series solvent;Ether, butyl oxide, tetrahydrofuran, twoThe ethers such as alkane, ethylene glycol monoalkyl ether;1-METHYLPYRROLIDONE etc. is non-proton
Property polar solvent;Esters such as ethyl acetate, butyl acetate etc..
The composition of 1-6. sealing material
As described above, the composition of the sealing material of the present invention is suitably selected according to the purposes of sealing material.Such as in blowing
Black head spray sealing material and in use, the viscosity of preferably sealing material is low.It is therefore preferable that it is set to comprise at least the polymerism list
The composition of body (B), anhydride ester derivs (C) and radical polymerization initiator (D).
Now, relative to the total amount of sealing material, preferably comprising 60 mass %~96 mass % polymerizable monomer (B),
The mass % of more preferably 70 mass %~89.If the amount of polymerizable monomer (B) is more than 60 mass %, the solidfied material of sealing material
With sufficient intensity.On the other hand, if the amount of polymerizable monomer (B) is below 90 mass %, relatively sufficiently comprising acid
Acid anhydride derivative (C), the moisture permeability step-down of the solidfied material of sealing material.
In addition, relative to the total amount of sealing material, preferably comprising 3 mass %~39 mass % anhydride ester derivs (C), more
The mass % of preferably 10 mass %~29.If the amount of anhydride ester derivs is more than 3 mass %, the moisture-inhibiting of the solidfied material of sealing material
Spend abundant step-down.
Moreover, relative to the mass parts of total quality 100 of polymerizable monomer (B) and anhydride ester derivs (C), 1 is preferably comprised
The radical polymerization initiator (D) of the mass parts of mass parts~25, the mass parts of more preferably 1 mass parts~20.If radical polymerization
The amount of initiator (D) is above range, then polymerizable monomer (D), anhydride ester derivs (C) fully solidify, the solidfied material of sealing material
Modulus of elasticity easily fall within desired scope.
In addition, in the sealing material, as needed, relative to the total amount of sealing material, it can include the mass %'s of 1 mass %~10
Alkene polymer (A) containing polymerizable functional group.
On the other hand, sealing material viscosity can it is high in the case of, reduce sealing material solidfied material modulus of elasticity
In the case of, it can be set to include the alkene polymer (A) containing polymerizable functional group, anhydride ester derivs (C) and radical polymerization
The composition of initiator (D).Now, as needed, polymerizable monomer (B) can be included.
Now, relative to the total amount (quality) of sealing material, preferably comprising 30 mass %~90 mass % contain polymerization
The olefin polymer (A) of property functional group, the mass % of more preferably 30 mass %~60.If the alkene containing polymerizable functional group
The amount of based polymer (A) is more than 30 mass %, then the modulus of elasticity of the solidfied material of sealing material easily falls within desired model
In enclosing.On the other hand, it is relative to fill if the amount of the olefin polymer (A) containing polymerizable functional group is below 90 mass %
Ground is divided to include anhydride ester derivs (C), the moisture permeability step-down of the solidfied material of sealing material.
In addition, relative to the olefin polymer (A) containing polymerizable functional group, anhydride ester derivs (C) and polymerism list
Total quality of body (B), the amount of polymerizable monomer (B) be preferably below 65 mass %, the matter of more preferably 5 mass %~50
Measure %.If the amount of polymerizable monomer (B) is above range, the modulus of elasticity of sealing material can be made become relatively low.
And then relative to the total amount (quality) of sealing material, preferably comprising 3 mass %~40 mass % anhydride ester derivs
(C).If the amount of anhydride ester derivs (C) is more than 3 mass %, the abundant step-down of moisture permeability of the solidfied material of sealing material.The opposing party
Face, if the amount of the anhydride ester derivs (C) in sealing material is below 40 mass %, relatively sufficiently contain polymerism function
The olefin polymer (A) of group, the modulus of elasticity step-down of sealing material.
In addition, relative to the total amount of the compound with free-radical polymerised functional group, i.e. containing polymerizable functional group
The mass parts of total amount 100 of olefin polymer (A), anhydride ester derivs (C) and polymerizable monomer (B), the radical polymerization
Initiator (D) is preferably the mass parts of 2 mass parts~15, the mass parts of more preferably 5 mass parts~10.
The physical property of 1-7. sealing material
The viscosity determined by E types viscosimeter under 25 DEG C, 1.0rpm of the sealing material of the present invention, preferably 5mPas
~20000mPas.If the viscosity of sealing material is above range, the screening characteristics of sealing material (such as screen printability or ink-jet
Printing) improve, coating becomes easy.The viscosity of sealing material is such as the RC-500 manufactured with eastern machine industry E type viscosimeters
It is measured.
When carrying out the coating of sealing material with silk-screen printing, distributor coating, sealing material of the invention passes through E type viscosity
The viscosity that meter determines under 25 DEG C, 1.0rpm, preferably 10mPas~20000mPas, more preferably 10mPas~
5000mPa·s。
On the other hand, when carrying out the coating of sealing material by ink jet printing, sealing material of the invention passes through E type viscosity
The viscosity that meter determines under 25 DEG C, 1.0rpm, preferably 5mPas~1000mPas, more preferably 5mPas~
100mPa·s。
In addition, the moisture content of sealing material is preferably below 0.5 mass %, it is further excellent more preferably below 0.1 mass %
Elect as below 0.06 mass %.The circuit of organic EL element is configured with due to easily being deteriorated because of moisture, therefore is preferably to the greatest extent may be used
The moisture content of sealing material can be reduced.
The moisture content of sealing material can be obtained in the following manner:About 0.1g specimen sample is measured, uses karl Fischer
(Karl Fisher) moisture meter is heated to 150 DEG C, determines now caused amount of moisture (solids gasification method).
The sealing material of the present invention is preferably to be used as to form the sealing material of photosemiconductor sealant.So-called light is partly led
Body, e.g. convert the electricity into light and luminous element.Photosemiconductor specifically includes:Inorganic light-emitting diode (Light
Emitting Diode, LED) element, organic EL element etc., preferably organic EL element.Photosemiconductor is due to easily because of moisture
Deng and deteriorate, it is therefore necessary to by face seal.
In addition, according to the sealing material of the present invention, the composition (such as pigment etc.) easily deteriorated by moisture etc. can be also protected.
The moisture permeability of the solidfied material of the sealing material of the present invention is low.Therefore, if added in sealing material easily deteriorated by moisture etc. into
Point, then the composition is difficult to and contact with moisture, can suppress its deterioration.
The sealing material of the present invention can be with the state of liquid by cover sealer, and it is solidified and sealant is made.
During with the state of liquid by cover sealer, as long as such as being coated on by silk-screen printing, distributor coating, ink-jet application etc.
On the photosemiconductors such as machine EL element, and coating layer is solidified and the photosemiconductors such as organic EL element are subjected to face sealing.Separately
Outside, by the present invention sealing material be configured to it is membranaceous after, will can be sealed by the film by sealer.Be configured to it is membranaceous after, will
When being sealed by sealer, by the photosemiconductor upper laminate film shape sealing material such as organic EL element, and make its solidification, so as to have
The photosemiconductors such as machine EL element carry out face sealing.
The curing of sealing material is suitably selected according to species of radical polymerization initiator etc..For heat cure
During type sealing material, solidify sealing material by heating.As long as heating-up temperature is the temperature higher than 23 DEG C, consider by sealer
Heat resisting temperature, efficiency etc. and suitably set.
On the other hand, for light-cured type sealing material when, solidify sealing material by light irradiation.The wavelength of the light irradiated
Species according to optical free radical polymerization initiator etc. and suitably selected, such as can be ultraviolet light or visible ray etc..Irradiated
The accumulative light quantity of light be usually 100mJ/cm2~10000mJ/cm2Degree.Can further it be heated after light irradiation.
The manufacture method of 1-8. sealing material
As long as the sealing material of the present invention does not damage the effect of the present invention, can be manufactured with arbitrary method.Such as by following
Step manufactures:1) olefin polymer (A) containing polymerizable functional group, polymerizable monomer (B), anhydride ester derivs (C) are prepared
And the step of polymerization initiator (D) etc.;And 2) under non-reactive gas ambient, the step of each composition is mixed below 30 DEG C
Deng.Mixing includes:With ball mill by method that these compositions disperse, be fitted into the method being stirred into flask, entered with three rollers
The method that row is kneaded.
By the present invention sealing material be configured to membranaceous when, as long as such as by liquid airproof material be coated on peel off substrate on,
Peeled off dried coating film.As long as the methods of coating of sealing material is coated with using silk-screen printing, distributor is carried out.
Solidfied materials of the 1-9. on sealing material
The moisture permeability of the solidfied material of the sealing material of the present invention is preferably as low as possible.That is, it is determining using the following method, 60
DEG C, the Ca reaction time starteds under 90%RH, preferably more than 24 hours.The Ca reaction time starteds are longer, represent solidfied material
Moisture permeability is lower.
The moisture permeability (Ca reacts the time started) of solidfied material based on Ca methods can pass through following sequential determination.Fig. 1 is to represent
The schematic diagram of the production order of the test sample of solidfied material moisture permeability based on Ca methods.
1) making of sample
As shown in Figure 1A, prepare to be impregnated in acetone and carry out the (size of glass substrate 2 that 10 minutes ultrasonic waves clean:25mm
× 25mm, thickness:0.7mm).On the glass substrate 2, evaporator (ALS science and technology (ALS Technology) company systems are used
Make), evaporation film 4 of the thickness for 170nm calcium metal is formed under the following conditions.It is adjusted using evaporation with mask, so that
From the end of the evaporation film 4 of calcium metal, the length L untill the end of glass substrate 2 turns into 4mm.
(evaporation condition)
Vacuum during evaporation:3.0×10-5Pa
Film speed:/ second
Calcium metal raw material:High-purity chemical manufacture, particle
The glass substrate of the evaporation film with calcium metal of gained is transferred to N in the case where being not exposed in air2
In the glove box of atmosphere.Then, as shown in Figure 1B, prepare in addition the glass substrate 6 after acetone cleans (25mm ×
55mm, thickness:On 2mm), by the thickness after solidification turn into 100 μm in a manner of be added dropwise the present invention sealing material after, make its dry and
Form film 8.
Then, as shown in Figure 1 C, make the glass substrate of the film with sealing material, pasted with the glass substrate with evaporation film
Close and sandwich is made, and fixed with fixture.The thickness of the sandwich of gained can pass through the glass in the film with sealing material
Clamping thickness is 100 μm Teflon (Teflon) (registrar between substrate and the glass substrate of evaporation film with calcium metal
Mark) piece is adjusted as sept etc..From length L' of the end of the evaporation film 4 of calcium metal untill the end of film 8
It is set to 4mm.
Then, for thermohardening type sealing material when, being heated sandwich at 100 DEG C by baking oven consolidates sealing material in 30 minutes
Change and sample is made.For light-cured type sealing material when, by mercury vapor lamp to sandwich irradiate 3000mJ ultraviolet after, 80
DEG C heating makes sealing material solidify and sample is made for 30 minutes.
2) Ca reacts the measure of time started
Sample in constant temperature and humidity cabinet under 60 DEG C, 90%RH obtained by preservation.Then, the evaporation film of calcium metal is determined
End be changed into transparent from metallic luster untill time (Ca react to time started).That is, if calcium metal (metallic luster) and water are anti-
Should, then it is changed into transparent calcium hydroxide Ca (OH)2.The Ca reaction time starteds are longer, represent more to be difficult to calcium metal and water occurs
Reaction, moisture permeability are lower.
As described later, in organic el device, moisture, oxygen in air are easily from the gap of substrate and hermetic sealing substrate
Intrusion.Accordingly, with respect to the moisture permeability of the sealant in organic el device, compared with agar diffusion method, device structure of the Ca methods closer to reality
Into, and can be measured by evaluation unit, therefore can precision evaluated well.The moisture-inhibiting determined by common agar diffusion method
Degree, (aftermentioned Fig. 2A self sealss substrate 26 is towards the side of substrate 22 from the direction that the interarea of organic el device invades for primary evaluation
To) moisture permeability, in contrast, the moisture permeability determined by Ca methods, side that primary evaluation invades from the side of organic el device
To the moisture permeability in (direction of Fig. 2A described later self sealss substrate 26 with the gap of substrate 22 towards the side of organic EL element).
In this way, the direction invaded from the side of organic el device in the evaluable direction invaded as the moisture in air, oxygen of Ca methods
Moisture permeability, therefore can precision evaluate well organic el device sealant moisture permeability.
Herein, the modulus of elasticity of the solidfied material of sealing material of the invention is suitably selected according to the purposes of sealing material, composition
Select.For example, when sealing material includes olefin polymer (A) containing polymerizable functional group, preferably more than 0.1MPa
And below 100MPa, more preferably 0.1MPa~20MPa.If the modulus of elasticity of the solidfied material of sealing material is below 100MPa,
By the layer of the solidfied material comprising sealing material, protect is not influenceed by sealer by ess-strain of outside etc..The solidification of sealing material
The modulus of elasticity of thing is obtained in such a way.In cupping machine, distance installs sample as 30mm between chuck, is originating
Load is 10N, draw speed is that strain is determined under 30mm/ minutes.Also, stress, transverse axis is taken to take the stress of strain should by the longitudinal axis
The slope of the line part of varied curve, calculates modulus of elasticity.On the other hand, polymerizable functional group is contained without described in sealing material
During olefin polymer (A), modulus of elasticity can be set to 10MPa~10GPa.
The present invention sealing material solidfied material wavelength be 400nm directional light light transmittance, preferably more than 90%, more
Preferably more than 95%.If the light transmittance of the directional light of solidfied material is more than 90%, sealing material can be applied to various light half
The sealing component of conductor.The light transmittance of directional light is the light transmittance of the directional light of the solidfied material of 100 μm of sealing material, passes through purple
Outer visible spectrophotometer etc. is measured.
2. organic el device
Generally, organic el device includes:The organic EL element that is configured on substrate, the hermetic sealing substrate paired with substrate, match somebody with somebody
It is placed between substrate and hermetic sealing substrate and covers the sealant of (face sealing) organic EL element.Can be by a part for sealant or complete
Portion is set to the solidfied material of the sealing material.In addition, the solidfied material moisture permeability as described above of the sealing material of the present invention is low, therefore not
When organic EL element is completely covered, when other components be present between the solidfied material of the sealing material of the present invention and organic EL element,
Also organic EL element can be protected not influenceed by moisture.Even if moreover, in the organic el device of structure of hermetic sealing substrate is not provided with,
The solidfied material of the sealing material of the present invention also is used as the sealing material for protecting organic EL element not influenceed by moisture.By the present invention's
When the solidfied material of sealing material is used as protecting sealing material that organic EL element is not influenceed by moisture, the structure of organic el device is simultaneously unlimited
It is fixed.Organic el device can be organic el display panel or organic EL illuminating etc..
Fig. 2A is the summary section for a form for representing organic el device.This form is to be set to entire surface sealant
The example of the solidfied material of the sealing material.As shown in Figure 2 A, organic el device 20 is sequentially laminated with:Substrate 22, organic EL element
24 and hermetic sealing substrate 26.Face sealant 28 is configured between substrate 22 and hermetic sealing substrate 26, face sealant 28 covers organic EL
Around element 24.In this way, organic EL element 24 is carried out face sealing by face sealant 28.
Substrate 22 and hermetic sealing substrate 26 are usually glass substrate or resin film etc., substrate 22 and at least the one of hermetic sealing substrate 26
Side is transparent glass substrate or transparent resin film.The example of such transparent resin film includes:Poly terephthalic acid second
Aromatic polyester resins such as diester etc..
When organic EL element 24 is top emission type, organic EL element 24 from the side of substrate 22 including:Reflective pixel electricity
Pole layer 30 (including aluminium, silver etc.), organic EL layer 32, transparent counter electrode layer 34 (include ITO (Indium Tin Oxide:Oxidation
Indium tin), IZO (indium-zinc oxide) etc.).Reflective pixel electrode layer 30, organic EL layer 32 and transparent counter electrode layer 34 can pass through
Vacuum evaporation and sputter etc. and film forming.
Face sealant 28 can be set to the sealant of the solidfied material of the sealing material comprising the present invention.Include the sealing material of the present invention
Solidfied material face sealant 28 directional light light transmittance as described above, it is preferred to for more than 90%.Reason is, if directional light printing opacity
Rate is too low, then from element takes out the efficiency of light, light absorbing efficiency is easily reduced on element.The light transmittance of face sealant 28
The upper limit can for example be set to 99% or so.
As described above, the sealing material of the present invention, due to viscosity is adjusted into relatively low scope, therefore screening characteristics is good, can shape
Into the face sealant 28 of uniform thickness.In addition, the moisture permeability that the solidfied material of the sealing material of the present invention is based particularly on Ca methods is filled
Ground is divided to reduce.Therefore, comprising the present invention sealing material solidfied material face sealant 28, can particularly be captured from substrate 22 with
The gap of hermetic sealing substrate 26 is moisture, oxygen etc. in the air that the side surface direction of organic EL element enters, can suppress they with
Organic EL element 24 contacts.
In addition, from the interarea laterally inner side direction of organic el device 20, (in Fig. 2A, self sealss substrate 26 is towards substrate 22
Direction) intrusion moisture transmission, can be by the way that substrate 22 or hermetic sealing substrate 26 be set into the low material of moisture permeability to suppress.
As other forms of organic el device, the form for including such as lower member can be enumerated:1) it is configured at having on substrate
Machine EL element;2) contacted with organic EL element and cover the resin cured matter layer of (face sealing) organic EL element;3) with the tree
Fat solidified material layer contacts, and covers the passivation layer of the resin cured matter layer;4) hermetic sealing substrate (reference picture of passivation layer is covered
2B).Resin cured matter layer can be set to the solidfied material of the sealing material.
Fig. 2 B are the summary sections for other forms for representing organic el device.As shown in Figure 2 B, organic el device 20'
Face sealant 28 includes the resin cured matter layer 28-1 of the solidfied material of the sealing material comprising the present invention, covering resin solidified material layer
28-1 passivation layer 28-2 and then the second resin cured matter layer 28-3 for covering passivation layer 28-2, in addition, with Fig. 2A substantially
Form in the same manner.Other member of formation of organic el device 20' shown in Fig. 2 B and the structure of the organic el device 20 shown in Fig. 2A
It is identical into component.
Resin cured matter layer 28-1 contained by face sealant 28 is preferably to be contacted with organic EL element.Resin cured matter layer
28-1 thickness is preferably 0.1 μm~20 μm.
Passivation layer 28-2 contained by face sealant 28 is preferably the inorganic compound layer of the film forming under plasma ambient.It is so-called
The film forming under plasma ambient, for example, refer to by plasma chemical vapor deposition (Chemical Vapor Deposition,
CVD) method film forming, but be not particularly limited, it can also pass through sputtering method, vapour deposition method film forming.Passivation layer 28-2 material is preferably saturating
Bright inorganic compound, it can illustrate:Silicon nitride, silica, SiONF, SiON etc., are not particularly limited.Passivation layer 28-2 thickness
Degree is preferably 0.1 μm~5 μm.
Passivation layer 28-2 can be contacted and film forming with resin cured matter layer 28-1.Reason is to include sealing material of the invention
Even if the resin cured matter layer 28-1 of solidfied material is exposed under plasma ambient, its transparency can be also maintained.
Passivation layer 28-2 is preferably not contacted directly with organic EL element 24, and is directly contacted with resin cured matter layer 28-1
And film forming.If passivation layer 28-2 to be made directly is contacted and film forming with organic EL element 24, due to the end of organic EL element 24
For acute angle, therefore cover and reduce caused by passivation layer 28-2 sometimes.If in contrast, by being used as sealing material of the invention
After the resin cured matter layer 28-1 of solidfied material seals the face of organic EL element 24, by passivation layer on resin cured matter layer 28-1
28-2 film forming, then can make passivation layer 28-2 film formation surface become gentle, and covering improves.
The second resin cured matter layer 28-3 contained by face sealant 28 can be and resin cured matter layer 28-1 identical materials
(layer of the solidfied material of the sealing material comprising the present invention), or different materials.Such as the second resin cured matter layer 28-3
Moisture can be higher than resin cured matter layer 28-1 moisture sometimes.Reason is, the second resin cured matter layer 28-3 not with
Organic EL element directly contacts.In addition, (taken out for top emission type organic el device via the second resin cured matter layer 28-3
The luminous organic el device of organic EL element) when, the second resin cured matter layer 28-3 light transmittance must and resin cured matter
Layer 28-1 is similarly high.
Organic el device can be manufactured by arbitrary method, be may travel to lower step and manufactured:1) preparation is configured with organic
The step of substrate of EL element;2) organic EL element is covered by sealing material, sealing material is solidified and the step of face sealant is made
Suddenly;3) the step of being sealed by hermetic sealing substrate.
Fig. 3 is the schematic diagram of one of the fabrication schedule for the organic el device for representing Fig. 2A.First, preparation has been laminated organic
The substrate 22 (reference picture 3A) of EL element 24.Organic EL element 24 includes:Reflective pixel electrode layer 30, organic EL layer 32 and transparent
Counter electrode layer 34, and then can have other functional layers.Then, the liquid airproof material 28-1' of the present invention is coated on organic EL
On element 24, or flap seal material 28-1' is laminated in organic EL element 24 (reference picture 3B).Then, it is superimposed hermetic sealing substrate
26, sealing material is solidified and resin cured matter layer 28-1 is made in this condition, and gluing, sealing substrate 26 (reference picture 3C).Such as
This obtains organic el device 20.
Organic el device is as needed, can be manufactured further across the step that face sealant is exposed in plasma.
The example for the step that face sealant is exposed in plasma includes:Pass through plasma CVD method on the sealant of face
By passivating film film forming the step of, opposite sealant irradiation plasma and the step of change surface characteristic etc..By changing surface spy
Property (such as improving wetability), can improve the adaptation with other components.
As described above, a part for the containment member of organic el device can be only set to the solidfied material of the sealing material.Example
Such as, other further forms as organic el device, can enumerate the form (reference picture 4A) including such as lower member:1) configure
In the organic EL element on substrate;2) contacted with organic EL element and cover at least the one of the side of (sealing) organic EL element
The first partial resin cured matter layer;3) contacted with organic EL element and cover the upper surface of (face sealing) organic EL element
At least one of second resin cured matter layer;4) the sealing base of the first resin cured matter layer and the second resin cured matter layer is covered
Plate.First resin cured matter layer can be set to the solidfied material of the sealing material.
Fig. 4 A are the summary sections for other forms for representing organic el device;Fig. 4 B are by Fig. 4 A organic el device
The top view for the situation that 20 " hermetic sealing substrate 26 removes.As shown in Figure 4 A, organic el device 20 " has face sealant 28 and covered
Cover the stop material (dam material) 36 of its periphery;Face sealant 28 further by covering organic EL element 24 side
Second sealant 28B of the upper surface of one sealant 28A and covering organic EL element 24 is formed, in addition, with Fig. 2A substantially
Form in the same manner.Other member of formation of organic el device 20 " shown in Fig. 4 A and Fig. 4 B, with the organic el device shown in Fig. 2A
20 member of formation is identical.
Stop that there is no particular restriction for material 36, can be made up of epoxy resin etc..Such stop material 36 can be by distributor side
Formula is coated or is added dropwise and is formed.
Second sealant 28B is preferably without water imbibition filler, filler etc..Reason is, as described later, due to organic
The upper surface of EL element does not contact with water imbibition filler, filler etc., therefore can suppress the damage (scratch) of organic EL element.Separately
Outside, due also to the second sealant 28B without water imbibition filler, filler etc. easily improves total light transmittance, the transparency is excellent.
Second sealant 28B wavelength is that 400nm directional light light transmittance is preferably more than 90%.Reason is, if parallel
Light light transmittance is too low, then from element takes out the efficiency of light, light absorbing efficiency is easily reduced on element.Solidified material layer 28 it is saturating
The upper limit of light rate can for example be set to 99% or so.One of method for improving directional light light transmittance is free from filler or sets filler
For below 10 mass %.
Such face sealant 28 for example in a manner of the side for covering organic EL element, can be coated with the sealing by 1)
Material and the step of make it be solidified to form the first sealant 28A;Then, 2) in a manner of the upper surface for covering organic EL element,
The step of being coated with other sealing material and making it be solidified to form the second sealant 28B and formed.Form the close of the first sealant 28A
The coating of material is sealed, such as can be carried out by distributor mode, ink-jetting style;The coating of the second sealant 28B sealing material is formed,
It can be carried out by screen printing mode, ink-jetting style.
In the organic el device so formed, because the side of organic EL element is covered by the solidfied material of the sealing material
Lid, therefore can highly suppress the moisture in air, the transmission of oxygen.Further, since the upper surface of organic EL element by without
The solidfied material covering of other sealing material of water imbibition filler, filler etc., therefore can suppress because water imbibition filler, filler etc. draw
The damage (scratch) of the organic EL element risen, and also ensure that the transparency.That is, low moisture permeability and the transparency or scratch resistance can be taken into account
Trace.
Embodiment
Hereinafter, with reference to embodiment, the present invention will be described.The scope of the present invention is not by embodiment limited interpretation.
[embodiment 1]
Using the compound shown in as the following formula (A1) of the polyolefin polymer (A) containing polymerizable functional group
(in Kuraprene (registration mark) UC-102, the manufacture of Kuraray (Kuraray) company, number-average molecular weight 17000, a molecule
Free redical polymerization average functional group number=2) 54 mass parts;As shown in polymerizable monomer (B) following formula (B1)
Acrylic acid dicyclopentenyl epoxide ethyl ester (FA-512AS, the manufacture of chemical conversion industry company of Hitachi) 46 mass parts;As anhydride ester derivs
(C) the hexahydrophthalic anhydride derivative (C') (4-META-H, Japan's chemical conversion company system are made) 10 shown in following formula (C1)
Mass parts;As the peroxidating shown in the following formula (D1) of radical polymerization initiator -2 ethyl hexanoic acid tert-pentyl ester (Luperox
575th, Ah Ke Majifu (ARKEMA Yoshitomi) company manufactures) mixing of 5 mass parts, prepare sealing material.
[changing 8]
[changing 9]
[changing 10]
[changing 11]
[comparative example 1]
Without hexahydrophthalic anhydride derivative (C'), and be set to the ratio of components shown in table 1, in addition, with reality
Apply the identical mode of example 1 and prepare sealing material.
[comparative example 2]
Manufactured using new Japan Chemical, RIKACID MH700 (4- methylhexahydrophthalic anhydrides/hexahydro O-phthalic
The mixture of acid anhydrides (mass ratio=70/30)) hexahydrophthalic anhydride derivative (C') is replaced, and it is set to the group shown in table 1
Into than in addition, preparing sealing material in the same manner as example 1.
[evaluation]
Determine the viscosity of sealing material prepared in each embodiment and comparative example.Moreover, by the following method, measure sealing
Light transmittance, moisture permeability, the modulus of elasticity of the solidfied material of material.Show the result in table 1.
Viscosity
It is (rich to strangle the Digital Rheometer model DII-III for flying (BROOKFIELD) company and manufacturing by E types viscosimeter
ULTRA), 25 DEG C, the viscosity of sealing material under 1.0rpm are determined.
Directional light light transmittance
As background data, using ultra-violet and visible spectrophotometer (Shimadzu Seisakusho Ltd. UV-2550), alkali-free glass is determined
The directional light light transmittance of 190nm~800nm of plate wavelength region (visible ray, ultraviolet light).
With 2 alkali-free glass plate grip seal materials same as described above, Teflon piece is clamped in the end of alkali-free glass plate
(thickness is 100 μm), so as to which 100 μm will be set to by the thickness of the sealing material clamped by 2 alkali-free glass plates.By it at 100 DEG C
Heating makes its solidification for 30 minutes, obtains the solidfied material for the sealing material that thickness is 100 μm.
By ultra-violet and visible spectrophotometer (Shimadzu Seisakusho Ltd. UV-2550), measure is clamped with 2 alkali-free glass plates
The directional light light transmittance of 190nm~800nm of the solidfied material of sealing material wavelength region.Further, since Teflon piece is configured at
The end of glass plate, therefore measurement result will not be impacted.
Also, the determination of light transmittance result of the solidfied material by sealing material, subtract alkali-free glass plate as background data
Light transmittance, and calculate the directional light light transmittance of the solidfied material of sealing material.
Evaluation is carried out by the directional light light transmittance that wavelength is 400nm.
Moisture permeability (Ca methods)
1) making of sample
Prepare to be impregnated in acetone and carried out the glass substrate (size that 10 minutes ultrasonic waves clean:25mm × 25mm, thickness
Degree:0.7mm).On the glass substrate, using evaporator (manufacture of ALS scientific & technical corporation), forming thickness under the following conditions is
The evaporation film (reference picture 1A) of 170nm calcium metal.Mask is used during evaporation, from the end of the evaporation film of calcium metal to glass base
Length L untill the end of plate is set to 4mm.
(evaporation condition)
Vacuum during evaporation:3.0×10-5Pa
Film speed:/ second
Calcium metal raw material:High-purity chemical manufacture, particle
The glass substrate of the evaporation film with calcium metal of gained is transferred to N in the case where being not exposed in air2
In the glove box of atmosphere.Then, in the glass substrate (25mm × 55mm, the thickness that are cleaned through acetone prepared in addition:On 2mm),
After made sealing material is added dropwise in embodiment and comparative example in a manner of the thickness after solidification turns into 100 μm, make its dry and
Form film (reference picture 1B).
Then, by the glass substrate of the film with sealing material with calcium metal evaporation film glass substrate be bonded and
Sandwich is made, and is fixed by fixture.The thickness of the sandwich of gained passes through the glass substrate in the film with sealing material
Teflon (registration mark) piece that clamping thickness is 100 μm between the glass substrate of the evaporation film with calcium metal is as interval
Thing and be adjusted.In addition, the length L' from the end of the evaporation film of calcium metal untill the end of the film of sealing material is also set
For 4mm (reference picture 1C).
Then, being heated the sandwich 30 minutes at 100 DEG C with baking oven solidifies sealing material, and sample is made.Any
In the case of kind, the sealing material after solidification turns into membranaceous.
2) Ca reacts the measure of time started
Sample in constant temperature and humidity cabinet under 60 DEG C, 90%RH obtained by preservation.Then, the evaporation film of calcium metal is determined
End be changed into transparent from metallic luster untill time (Ca reaction the time started, unit:Hour).In Ca methods, evaluation comes from
The moisture permeability of the side surface direction of the solidfied material of membranaceous sealing material.Also, the situation for being more than 24 hours by the Ca reaction time starteds
Zero is set to, the situation less than 24 hours is set to ×.
Modulus of elasticity
Sealing material is made into its solidification for 30 minutes in 100 DEG C of heating, obtains the solidfied material that thickness is 100 μm.By the piece of gained
The solidfied material of material cuts out 10mm × 30mm as sample.On the universal tensile testing machine of Intesco companies manufacture, between chuck
Distance installs sample for 30mm, initial load be 10N, draw speed be to be tested under 30mm/ minutes.Being taken according to the longitudinal axis should
Power, transverse axis take the slope of the line part of the stress-strain diagram of strain, calculate modulus of elasticity.
[table 1]
As shown in table 1, the olefin polymer (A) containing polymerizable functional group, polymerizable monomer (B), hexahydro are being included
In the sealing material of the embodiment 1 of phthalic anhydride derivative (C') and radical polymerization initiator (D), the Ca reaction time starteds
It is very long.Because hexahydrophthalic anhydride derivative (C') has the functional group of free redical polymerization, therefore in sealing material
During solidification, with polymerizable monomer (B), the olefin polymer (A) containing polymerizable functional group etc. polymerize.As a result, due to
The structure (anhydride group) from hexahydrophthalic anhydride derivative (C') is equably included in the solidfied material of sealing material, therefore
Speculate the moisture for the solidfied material side intrusion for effectively capturing self sealss material.
In addition, in the sealing material of embodiment 1, modulus of elasticity is sufficiently low to 17MPa.This is due to hexahydrophthalic acid
Acid anhydride derivative (C') has the functional group of free redical polymerization, in the solidification of sealing material, with polymerizable monomer (B), containing poly-
Olefin polymer (A) of He Xing functional groups etc. polymerize, therefore speculates that the crosslink density of the solidfied material of sealing material does not improve excessively,
And modulus of elasticity appropriateness step-down.
In contrast, in the sealing material of comparative example 2, although including 4- methylhexahydrophthalic anhydrides, hexahydro neighbour's benzene
Dicarboxylic acid anhydride, but the Ca reaction time starteds are short.It is presumably due to 4- methylhexahydrophthalic anhydrides, hexahydrophthalic anhydride
The solidfied material of self sealss material oozes out, therefore could not fully catch moisture.
In addition, the modulus of elasticity of the solidfied material of the sealing material of comparative example 1 and comparative example 2 is more than 38MPa.Speculate containing poly-
The olefin polymer (A) of He Xing functional groups, the crosslink density of polymerizable monomer (B) improve.
[embodiment 2]
Will be as compound (FA-124AS, the Hitachi's chemical conversion company system shown in polymerizable monomer (B) following formula (B2)
Make, average functional group number=2 of number-average molecular weight 198, free redical polymerization in a molecule) 80 mass parts;As acid anhydrides
Hexahydrophthalic anhydride derivative (C') (4-META-H, Japan's chemical conversion company system shown in the formula (C1) of derivative (C)
Make) 20 mass parts;As the peroxidating shown in the formula (D1) of radical polymerization initiator -2 ethyl hexanoic acid tert-pentyl ester
(Luperox 575, the manufacture of Ah Ke Majifu companies) 5 mass parts mixing, prepares sealing material.
[changing 12]
[embodiment 3]
Peroxidating -2 ethyl hexanoic acid uncle penta is replaced using the double -2- methylbutyronitriles of 2,2'- azos shown in following formula (D2)
Ester, in addition, sealing material is prepared in the same way as in example 2.
[changing 13]
[embodiment 4]
Peroxidating -2- ethyl hexyls are replaced using the 2- hydroxy-2-methyl -1- phenyl-propan -1- ketone shown in following formula (D3)
Sour tert-pentyl ester, in addition, sealing material is prepared in the same way as in example 2.
[changing 14]
[comparative example 3]
RIKACID MH700 (the 4- methylhexahydrophthalic anhydrides/hexahydro O-phthalic manufactured using new Japan Chemical
The mixture of acid anhydrides (mass ratio=70/30)) replace hexahydrophthalic anhydride derivative (C'), in addition, with implementation
The identical mode of example 2 prepares sealing material.
[comparative example 4]
Peroxidating -2 ethyl hexanoic acid tert-pentyl ester is replaced using the double -2- methylbutyronitriles of 2,2'- azos shown in formula (D2), is removed
Beyond this, sealing material is prepared in a manner of with the identical of comparative example 3.
[comparative example 5]
Peroxidating -2 ethyl hexanoic acid uncle is replaced using the 2- hydroxy-2-methyl -1- phenyl-propan -1- ketone shown in formula (D3)
Pentyl ester, in addition, sealing material is prepared in a manner of with the identical of comparative example 3.
[comparative example 6]
By epoxy resin (cresol novolak type EPICLON (registration mark) N-680, epoxide equivalent be 200 (g/eq)-
220 (g/eq), the manufacture of DIC companies) 50 mass parts;(bisphenol-f type, YL983U0, epoxide equivalent are high-purity liquid-state epoxy resin
165 (g/eq) -175 (g/eq), Mitsubishi Chemical Ind's manufacture) 50 mass parts;Silica filler is (Admafine SO-C6, refined
All agate (ADMATECHS) company manufactures) 100 mass parts;Light cationic initiator R2074 (Luo Na-Planck (Rhone-
Poulenc) company manufactures) mixing of 3 mass parts, prepare sealing material.
[evaluation]
Directional light light transmittance
In heat cure, its solidification will be made within 30 minutes in 80 DEG C of heating with the sealing material that 2 alkali-free glass plates clamp, in purple
When outside line (Ultraviolet, UV) solidifies, 3000mJ/cm is irradiated to the sealing material clamped with 2 alkali-free glass plates2Wavelength
Make its solidification for 365nm light, obtain the solidfied material for the sealing material that thickness is 100 μm, in addition, with foregoing (embodiment 1
Deng) the assay method identical mode of directional light light transmittance be measured.
Moisture permeability (Ca methods)
Moisture permeability (Ca) is determined in a manner of with the method identical of foregoing (embodiment 1 etc.).Then by determination sample 100
DEG C carry out 30 minutes heat, evaluate moisture permeability in the same manner as described above.
[table 2]
As shown in table 2, polymerizable monomer (B), hexahydrophthalic anhydride derivative (C') and radical polymerization are being included
In the sealing material of 2~embodiment of embodiment 4 of initiator (D), the Ca reaction time starteds are very long.Due to hexahydrophthalic acid
Acid anhydride derivative (C') has the functional group of free redical polymerization, therefore in the solidification of sealing material, it is poly- with polymerizable monomer (B)
Close, and the structure (anhydride group from hexahydrophthalic anhydride derivative (C') is equably included in the solidfied material of sealing material
Group), therefore speculate the moisture for the solidfied material side intrusion for effectively capturing self sealss material.Even if in addition, it is heat-treated, Ca
It is also unchanged to react the time started.Because hexahydrophthalic anhydride derivative (C') polymerize with polymerizable monomer (B), therefore push away
Survey is not oozed out.
On the other hand, in the sealing material of 3~comparative example of comparative example 5, although comprising 4- methylhexahydrophthalic anhydrides,
Hexahydrophthalic anhydride, but the Ca reaction time starteds are short.It is presumably due to 4- methylhexahydrophthalic anhydrides, hexahydro neighbour's benzene
The solidfied material of dicarboxylic acid anhydride self sealss material oozes out, therefore could not fully catch moisture.
In addition, the Ca reaction time started length of the sealing material comprising epoxy resin of comparative example 6, i.e. moisture permeability are very
It is low, but viscosity is very high, and directional light light transmittance is low.In contrast, to confirm viscosity low for the sealing material of 2~embodiment of embodiment 4,
Also the coating for example, by ink-jet method can be carried out.In addition, directional light light transmittance also up to 98%.
The application advocates the priority based on Japanese Patent Application filed in 2 days Mays in 2014 2014-094957.This application
Content described in specification and accompanying drawing is all referenced in present specification.
[industry utilizability]
The moisture permeability of the solidfied material of the sealing material of the present invention is low, and modulus of elasticity is moderately low.Therefore, can be applied to various
The sealant of Optical devices.
Symbol description
20、20'、20”:Organic el device
22:Substrate
24:Organic EL element
26:Hermetic sealing substrate
28:Face sealant
28-1:Solidified material layer
28-2:Passivation layer
28-3:Second resin cured matter layer
28A:First sealant
28B:Second sealant
Claims (12)
1. a kind of sealing material, it is included:Polymerizable monomer B, it has at least one free redical polymerization in each molecule
Functional group, and molecular weight is more than 50 and less than 1000, is liquid at 23 DEG C;
Anhydride ester derivs C, it includes the anhydride group of at least one composition five-membered ring or hexatomic ring in each molecule and can be certainly
The functional group being polymerize by base;And
Radical polymerization initiator D, it includes at least one party of hot radical polymerization initiator and optical free radical polymerization initiator.
2. sealing material as claimed in claim 1, it is further included:Olefin polymer A containing polymerizable functional group, its
In each molecule have at least one free redical polymerization functional group, and number-average molecular weight be more than 5000 and 70000 with
Under.
3. sealing material as claimed in claim 1, its viscosity determined by E types viscosimeter under 25 DEG C, 1.0rpm are
More than 5mPas and below 20000mPas.
4. sealing material as claimed in claim 1, wherein, institute possessed by the polymerizable monomer B and the anhydride ester derivs C
The functional group of free redical polymerization is stated, separately for selected from by (methyl) acryloyl group, vinyl, pi-allyl, vinyl
The functional group of one or more of the group that ether is formed.
5. sealing material as claimed in claim 2, wherein, the olefin polymer A containing polymerizable functional group is had
The free redical polymerization functional group, for selected from by (methyl) acryloyl group, vinyl, pi-allyl, vinyl ether group institute
The functional group of one or more of the group of composition.
6. sealing material as claimed in claim 2, wherein, the anhydride ester derivs C is with least one in each molecule
The hexahydrophthalic anhydride derivative C' of the functional group of free redical polymerization.
7. a kind of flap seal material, it is obtained as the sealing material described in claim 1.
8. a kind of solidfied material of sealing material, the sealing material is the sealing material described in claim 1.
9. a kind of solidfied material of sealing material, the sealing material is the sealing material described in claim 2, and its modulus of elasticity is 0.1MPa
Above and below 100MPa.
10. a kind of solidfied material of sealing material, the sealing material is the sealing material described in claim 8, and it is when wavelength is 400nm
Directional light light transmittance be more than 90%.
11. a kind of solidfied material of sealing material, the sealing material is the sealing material described in claim 9, and it is when wavelength is 400nm
Directional light light transmittance be more than 90%.
12. a kind of sealing material, it is included:
Olefin polymer A containing polymerizable functional group, it has at least one free redical polymerization in each molecule
Functional group, and number-average molecular weight is more than 5000 and less than 70000;
Hexahydrophthalic anhydride derivative C', it has the functional group of at least one free redical polymerization in each molecule;
And
Radical polymerization initiator D, it includes at least one party of hot radical polymerization initiator and optical free radical polymerization initiator.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014094957 | 2014-05-02 | ||
JP2014-094957 | 2014-05-02 | ||
PCT/JP2015/002259 WO2015166657A1 (en) | 2014-05-02 | 2015-04-27 | Sealing material and cured product thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106062121A CN106062121A (en) | 2016-10-26 |
CN106062121B true CN106062121B (en) | 2018-03-13 |
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Application Number | Title | Priority Date | Filing Date |
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CN201580011222.6A Active CN106062121B (en) | 2014-05-02 | 2015-04-27 | Sealing material and its solidfied material |
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JP (1) | JP5872129B1 (en) |
KR (1) | KR101864976B1 (en) |
CN (1) | CN106062121B (en) |
TW (1) | TWI651358B (en) |
WO (1) | WO2015166657A1 (en) |
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CN113214604A (en) * | 2016-10-19 | 2021-08-06 | 积水化学工业株式会社 | Sealing agent for organic EL display element and method for producing sealing agent for organic EL display element |
JP7040968B2 (en) * | 2018-03-19 | 2022-03-23 | 日東電工株式会社 | Adhesive sheet and magnetic disk device |
JPWO2019220896A1 (en) * | 2018-05-18 | 2021-07-01 | 日本ゼオン株式会社 | Method for manufacturing resin solution for printing and device structure |
CN114031707B (en) * | 2020-07-20 | 2023-08-15 | 中国石油化工股份有限公司 | Cured material composition and application thereof, cured resin and preparation method and application thereof |
KR20230095934A (en) * | 2021-03-31 | 2023-06-29 | 덴카 주식회사 | Composition, cured body and organic EL display device |
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CN1753947A (en) * | 2003-02-28 | 2006-03-29 | 株式会社可乐丽 | Curable composition |
CN101278028A (en) * | 2005-10-03 | 2008-10-01 | 三井化学株式会社 | Sealing material for flat panel display |
CN102165017A (en) * | 2008-09-29 | 2011-08-24 | 三井化学株式会社 | Sealant, sealing member and organic EL device |
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JPWO2015166657A1 (en) | 2017-04-20 |
WO2015166657A1 (en) | 2015-11-05 |
KR101864976B1 (en) | 2018-06-05 |
TW201546160A (en) | 2015-12-16 |
KR20160111434A (en) | 2016-09-26 |
JP5872129B1 (en) | 2016-03-01 |
TWI651358B (en) | 2019-02-21 |
CN106062121A (en) | 2016-10-26 |
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