CN101275255A - Maintenance method for alkaline non-cyanide plating copper - Google Patents
Maintenance method for alkaline non-cyanide plating copper Download PDFInfo
- Publication number
- CN101275255A CN101275255A CNA2007100327367A CN200710032736A CN101275255A CN 101275255 A CN101275255 A CN 101275255A CN A2007100327367 A CNA2007100327367 A CN A2007100327367A CN 200710032736 A CN200710032736 A CN 200710032736A CN 101275255 A CN101275255 A CN 101275255A
- Authority
- CN
- China
- Prior art keywords
- copper
- acid
- plating
- cyanide
- alkaline non
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a maintaining method for an alkalescent non-cyanide cuprodine. The method uses indissoluble anode, cathode in the alkalescent non-cyanide cuprodine liquor as the galvanized workpiece, adds cupric salt, complexing agents and additives and adjusts the pH value of the galvanizing liquor to control the current dense range between 0.1-7A/dm<SUP>2</SUP>; the galvanizing time is between 1min to 72h; then the galvanizing liquor is filtered; the galvanizing liquor is processed air bend or moves the workpiece while galvanizing. The invention uses the indissoluble anode comprising stainless steel, DSA coating, titanium, platinum, graphite which is simple to use, innoxious, harmless; the invention has a low production cost and even, smooth and shining fine galvanizing layer by using the indissoluble anode. The technique maintaining method of the invention has a simple operation, great stability of galvanizing liquor and convenient maintenance for the galvanizing liquor.
Description
Technical field
The invention belongs to electrochemical surface scientific and engineering field, particularly a kind of maintenance method for alkaline non-cyanide plating copper.
Background technology
Cyanide copper plating is electroplated the bottoming copper-plating technique as iron and steel, zinc alloy etc. for a long time, but prussiate toxicity is big, operative employee's human and environment is caused serious threat, cause cyanide copper plating and cleaner production to be runed counter to, so cyanogenless electroplating technology is the direction of Future Development.Cyanide-free alkaline copper plating is the product of national cleaner production demand for development, eliminate the harm of cyanide electroplating to a great extent to operator and environment, many researchers have been paid many painstaking effort in the exploration and the popularization of cyanogenless electroplating technology, made significant headway, but cyanide-free alkaline copper plating also has very big obstacle so far in large-scale production and application, its distinct issues are exactly problems such as binding force of cladding material, coating outward appearance, anode and wastewater treatment.
Alkaline non-cyanide copper facing at present generally uses the electrolytic copper of calendering or anaerobic electrolytic copper as anode, and in electroplating process, the anode dissolution by copper comes the supplementation with copper ion usually.The soluble copper anode is at dissolution process and form the compound microparticle of univalent copper ion, insoluble Red copper oxide and cupric oxide and copper and nitrogen, phosphorus when stopping to electroplate in solution easily, in a single day above-mentioned substance enters in the plating bath, will produce plating bath and poison, make coating produce numb sand, influence binding force of cladding material and outward appearance, plating bath uses that for a long time the after-current density range reduces etc.
Summary of the invention
In order to solve above-mentioned the deficiencies in the prior art part, the object of the present invention is to provide a kind of maintenance method for alkaline non-cyanide plating copper.This method adopts insoluble anode overcoming soluble anode to plating bath " poisoning " and eliminate coating fiber crops sand, and provides and adopt insoluble anode to electroplate a kind of maintaining method to plating bath.The present invention is intended to solve anode problem and plating solution maintenance method, adopts insoluble anode then to need to remedy by additional mantoquita the consumption of cupric ion in the electroplating process.
Purpose of the present invention realizes by following technical proposals: a kind of maintenance method for alkaline non-cyanide plating copper, comprise the steps: in alkaline non-cyanide copper facing plating bath, adopt insoluble anode as anode, workpiece to be plated is as negative electrode, use the murder by poisoning of insoluble anode to eliminate to solution, the concentration of adjusting bivalent cupric ion in the alkaline non-cyanide copper facing plating bath is 8～25g/L, adjust the pH value 8.2～11 of plating bath, electroplate then, replenish mantoquita in electroplating process, the concentration that makes bivalent cupric ion in the alkaline non-cyanide copper facing plating bath is to starting point concentration; Add complexing agent, the volumetric molar concentration ratio that makes complexing agent and bivalent cupric ion is 2～4; When coating requires brightly more when careful, add additive, the addition of additive is 0.001～1g/L, replenishes the consumption or the carry-over loss of electroplating process, adjusts the pH value 8.2～11 of plating bath simultaneously, the control current density range is at 0.1～7A/dm
2, electroplating time is at 1min～72h; When electroplating to plating bath in addition pneumatic blending or swap cathode workpiece to be plated, to improve the current density upper limit.The crystallization of gained coating is careful, improves its luminance brightness, and adopts filter to filter to plating bath, to remove the particulate in the plating bath, avoids coating numb sand and burr to occur, adopts to stir and can improve current density range.
In order to realize the present invention better, described alkaline non-cyanide copper facing plating bath comprises pyrophosphate copper plating system, copper plating with ethylene glycol as complexing agent system, trolamine copper facing system, biuret copper facing system, citrate copper-plating system, HEDP (1-Hydroxy Ethylidene-1,1-Diphosphonic Acid) salt copper facing system, tartrate copper facing system or ATMP (Amino Trimethylene Phosphonic Acid) salt copper facing system.
Described insoluble anode comprises stainless steel, DSA (dimensionally stable anode Dimensionally StableAnodes or catalyst coatings titanium anode) coating, titanium, platinum or graphite, under alkaline system, use, dissolving and passivation can not take place, can prevent the appearance and the stable plating bath of numb sand, guarantee that current density range does not reduce.
Tabular, netted, bar-shaped, wire, circular-arc or rectangular-shaped that insoluble anode shape of the present invention comprises.
The magnesium alloy that described negative electrode is the workpiece to be plated aluminium alloy that comprises cast iron, steel, zinc alloy, copper alloy, handle through secondary soaking zinc, handle through chemical nickel plating or through metallized following material comprises plastics, plastic cement, rubber, timber, stone material, pottery, glass or flowers.
Described mantoquita comprises that the carboxylic acid of cupric nitrate, cupric chloride, copper sulfate, cupric pyrophosphate, copper hydroxide, ventilation breather and copper and sulfoacid compound comprise one or more in cupric tartrate, Cuprocitrol, sulphosalicylic acid copper or the copper methanesulfonate, when bivalent cupric ion concentration is lower than given range, above-mentioned substance is a kind of or more than one are water-soluble, use filter that plating bath is filtered, add mantoquita in the mouth adding of filter.
Described complexing agent comprises tartrate, tartrate sylvite, sodiotartrate, the tartrate ammonium salt, citric acid, citric acid sylvite, sodium citrate salt, the citric acid ammonium salt, sulphosalicylic acid, sulphosalicylic acid sylvite, the sulphosalicylic acid sodium salt, the sulphosalicylic acid ammonium salt, methylsulphonic acid, methylsulphonic acid sylvite, the methylsulphonic acid sodium salt, the methylsulphonic acid ammonium salt, tetra-sodium, tetra-sodium sylvite, the tetra-sodium sodium salt, the tetra-sodium ammonium salt, Amino Trimethylene Phosphonic Acid (ATMP), Amino Trimethylene Phosphonic Acid sylvite, the Amino Trimethylene Phosphonic Acid sodium salt, the Amino Trimethylene Phosphonic Acid ammonium salt, 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid (HEDP), 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid sylvite, the 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid sodium salt, the 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid ammonium salt, EDTMP (ethylene diamine tetra methylene phosphonic acid), ethylene diamine tetra methylene phosphonic acid sylvite, in ethylene diamine tetra methylene phosphonic acid sodium salt or the ethylene diamine tetra methylene phosphonic acid ammonium salt one or more.
The described pH value adjustment material that adopts is one or more in sodium hydroxide, potassium hydroxide, ammoniacal liquor, copper hydroxide, ventilation breather, nitric acid, sulfuric acid, hydrochloric acid, phosphoric acid, tartrate, citric acid, sulphosalicylic acid or the methylsulphonic acid.
Described additive comprises and a kind of in hydrogen peroxide, Potassium Persulphate, Sodium Persulfate, ammonium persulphate, potassium permanganate, clorox, ceric sulfate, tin anhydride, antimonypotassium tartrate, phenol, thiocarbamide, dimercapto thiazole, thiazoline, oxine, dimethyl sulfoxide (DMSO), α-Lian pyrimidine, imidazoles or the pyridine or more than one adds additive to improve quality of coating.
The air pressure of described pneumatic blending is in 0.3～1MPa scope, and the translational speed of described swap cathode workpiece to be plated is per minute 5～15 times.
The present invention is applied to pre-copper facing, thickening copper facing and anti-carburizing copper facing, is applicable to rack plating and barrel plating.
Maintaining method of the present invention comprise to the plating bath mantoquita add, complexing agent is added, the pH value is adjusted, current density range, electroplating time.
The present invention uses did not a kind ofly lose efficacy and long-life insoluble anode and maintaining method in alkaline non-cyanide copper facing process, use stainless steel, DSA coating, titanium or platinum as anode, by adding mantoquita to keep copper ion concentration unanimity in the plating bath, with alkali or sour, make the coating crystallization careful, bright by adjusting electric current and filtering plating bath to adjust the pH value of plating bath.
The present invention solves alkaline non-cyanide copper facing in process of production because of using the soluble copper anode to produce numb sand and producing the problem that the after-current density range reduces for a long time, it is easy to maintenance that bath stability is reached lastingly, and stride forward to suitability for industrialized production, be a kind of technology that meets cleaner production.
The present invention compared with prior art has the following advantages and beneficial effect:
1, plating bath is nontoxic, and nonhazardous gas is overflowed;
2, anode is made simply, and process maintenance is convenient;
3, coating and steel substrate bonding force are good, copper plate and directly plating thick copper layer in advance;
4, dispersive ability and covering power are good.
Embodiment
The present invention is described in further detail below in conjunction with embodiment, but embodiments of the present invention are not limited thereto.
Embodiment 1
A kind of maintenance method for alkaline non-cyanide plating copper, comprise the steps: in citrate system alkaline non-cyanide copper facing plating bath, content of copper ion is 8g/L, the pH value of adjusting plating bath with citric acid or sodium hydroxide is 8.5, adopt stainless steel as insoluble anode, cleek is electroplated as the negative electrode workpiece to be plated; In electroplating process, swap cathode per minute 5 times is with 1A/dm
2Current density electroplate 2min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand, cleek is bent to fracture, incision position is blistering not, electroplate 100 ampere-hours after, the supplementation with copper ion is to initial concentration, adjust the pH value to 8.5 of plating bath with citric acid or sodium hydroxide, and to the filtration of plating bath employing filter, can continue to electroplate, quality of coating does not descend.
Embodiment 2
In tartrate system alkaline non-cyanide copper facing plating bath, content of copper ion is 8g/L, and the pH value of adjusting plating bath with tartrate, sulfuric acid or sodium hydroxide is 9, adopts stainless steel as insoluble anode, and cleek is electroplated as the negative electrode workpiece to be plated; In electroplating process, pressure is the pneumatic blending of 0.3MPa, with 1A/dm
2Current density electroplate 10min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand, cleek is bent to fracture, incision position is blistering not, electroplate 10 ampere-hour electric weight after, additional cupric tartrate makes cupric ion to initial concentration, and adjust the pH value to 9 of plating bath with tartrate, sulfuric acid or sodium hydroxide, and to the filtration of plating bath employing filter, can continue to electroplate, quality of coating does not descend.
Embodiment 3
In pyrophosphate salt system alkaline non-cyanide copper facing plating bath, content of copper ion is 25g/L, and the pH value of adjusting plating bath with phosphoric acid, sulfuric acid or sodium hydroxide, ammoniacal liquor is 8.2, adopts stainless steel as insoluble anode, aluminium alloy behind the nickel preplating is electroplated as the negative electrode workpiece to be plated; In electroplating process, swap cathode per minute 15 times, the tin anhydride additive of adding 0.02g/L is with 1A/dm
2Current density electroplate 5min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening, there is not numb sand, cleek is bent to fracture, and incision position is blistering not, electroplate 100 ampere-hour electric weight after, additional cupric pyrophosphate makes cupric ion to initial concentration, replenish the additive tin anhydride of 0.001g/L, and with the pH value to 8.2 of adjusting plating bath with phosphoric acid, sulfuric acid or sodium hydroxide, and to the filtration of plating bath employing filter, can continue to electroplate, quality of coating does not descend.
Embodiment 4
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9g/L, and the pH value of adjusting plating bath with phosphoric acid, sulfuric acid or potassium hydroxide is 9.2, adopts the DSA coating as insoluble anode, and iron plate is electroplated as the negative electrode workpiece to be plated; In electroplating process, add the potassium permanganate additive of 0.005g/L, swap cathode per minute 10 times is with 0.1A/dm
2Current density electroplate 5min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand, test piece is bent to fracture, incision position is blistering not.
Embodiment 5
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 15g/L, and the pH value of adjusting plating bath with methylsulphonic acid, sulfuric acid or potassium hydroxide is 10, adopts stainless steel as insoluble anode, and cleek is electroplated as the negative electrode workpiece to be plated; In electroplating process, add α-Lian pyrimidine additive of 0.02g/L, pressure is the pneumatic blending of 0.5MPa, adopting flow simultaneously is the filter filtration copper plating solution of 2 tphs, with 7A/dm
2Current density electroplate 1min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand, cleek is bent to fracture, incision position is blistering not.
Embodiment 6
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9.5g/L, and the pH value of adjusting plating bath with phosphoric acid, sulfuric acid or potassium hydroxide is 9.5, adopts stainless steel as insoluble anode, and iron plate is electroplated as the negative electrode workpiece to be plated; In electroplating process, pressure is the pneumatic blending of 1MPa, with 1.5A/dm
2Current density electroplate 60min thickening copper facing, the gained thickness of coating reaches 40 microns, supplementation with copper ion to initial content can continue to electroplate.
Embodiment 7
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9.5g/L, and the pH value of adjusting plating bath with citric acid, sulfuric acid or potassium hydroxide is 9.5, adopts stainless steel as insoluble anode, and iron plate is electroplated as the negative electrode workpiece to be plated; In electroplating process, pressure is the pneumatic blending of 0.65MPa, with 0.5A/dm
2Current density electroplate the anti-carburizing copper facing of 72h, gained coating can reach anti-carburizing requirement, supplementation with copper ion to initial content can continue to electroplate.
Embodiment 8
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9.5g/L, and the pH value of adjusting plating bath with HEDP, sulfuric acid or potassium hydroxide is 9.5, adopts stainless steel as insoluble anode, aluminium alloy behind the secondary soaking zinc is electroplated as the negative electrode workpiece to be plated; Pressure is the pneumatic blending of 0.65MPa, with 1A/dm
2Current density electroplate 2min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand.
Embodiment 9
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9.5g/L, and the pH value of adjusting plating bath with phosphoric acid, sulfuric acid or potassium hydroxide is 9.5, adopts stainless steel as insoluble anode, magnesium alloy behind the chemical nickel plating is electroplated as the negative electrode workpiece to be plated; In electroplating process, pressure is the pneumatic blending of 0.65MPa, with 1A/dm
2Current density electroplate 2min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand.
Embodiment 10
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9.5g/L, and the pH value of adjusting plating bath with tartrate, ATMP or potassium hydroxide is 9.5, adopts stainless steel as insoluble anode, and iron plate is electroplated as the negative electrode workpiece to be plated; In electroplating process, pressure is the pneumatic blending of 0.65MPa, and adopting flow simultaneously is the filter filtration copper plating solution of 2 tphs, with 1A/dm
2Current density electrolysis 100AH after, middle constantly hydrogen make-up cupric oxide solution is kept the constant 8～9.5g/L of cupric ion, replenish two kinds of complexing agent Seignette salt 6g/L and ATMP 2g/L (the volumetric molar concentration ratio that makes complexing agent and bivalent cupric ion is 2～4), adjust the pH value between 9.3～9.8 with sodium hydroxide solution, and then with 1A/dm
2Current density electroplate 2min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand, test piece is bent to fracture, incision position is blistering not.
Embodiment 11
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9g/L, and the pH value of adjusting plating bath with phosphoric acid, sulfuric acid or potassium hydroxide is 9.5, adopts the DSA coating as insoluble anode, and zinc alloy is electroplated as the negative electrode workpiece to be plated; In electroplating process, pressure is the pneumatic blending of 0.75MPa, with 1A/dm
2Current density electroplate 3min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand.
Embodiment 12
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9g/L, the pH value of adjusting plating bath with phosphoric acid, sulfuric acid or potassium hydroxide is 9.5, adopt the DSA coating as insoluble anode, iron plate is as the negative electrode workpiece to be plated, in electroplating process, add hydrogen peroxide (mass percent the is 30%) additive of 0.5ml/L, pressure is that the pneumatic blending of 0.5MPa is with 1A/dm
2Current density electrolysis 100 ampere-hour electric weight after, middle constantly additional ventilation breather and two kinds of mantoquitas of copper sulfate are kept the constant 8～9.5g/L of cupric ion, replenish the HEDP complexing agent of 5g/L, perhaps replenish the HEDP of 3g/L and the ATMP complexing agent of 3g/L, the volumetric molar concentration ratio that makes complexing agent and bivalent cupric ion is 2～4, adjust the pH value between 9.3～9.8 with potassium hydroxide solution, and then with 1A/dm
2Current density electroplate 3min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand, test piece is bent to fracture, incision position is blistering not.
Embodiment 13
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9g/L, and the pH value of adjusting plating bath with HEDP and sulfuric acid (perhaps potassium hydroxide) is 9.5, adopts titanium as insoluble anode, and copper sheet is electroplated as the negative electrode workpiece to be plated; In electroplating process, add the Potassium Persulphate additive of 1.0g/L, pressure is the pneumatic blending of 0.65MPa, with 0.2A/dm
2Current density electroplate 5min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand, test piece is bent to fracture, incision position is blistering not.
Embodiment 14
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9g/L, and the pH value of adjusting plating bath with phosphoric acid, sulfuric acid or potassium hydroxide is 9.5, adopts graphite as insoluble anode, and copper sheet is electroplated as the negative electrode workpiece to be plated; In electroplating process, add the thiourea additives of 0.01g/L, pressure is that the pneumatic blending of 0.65MPa is with 0.2A/dm
2Current density electroplate 5min, plate acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand, test piece is bent to fracture, incision position is blistering not.
Embodiment 15
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 9g/L, and the pH value of adjusting plating bath with sulfuric acid or potassium hydroxide is 9.5, adopts stainless steel as insoluble anode, and casting iron lock is as the negative electrode workpiece to be plated, with 1.5A/dm
2Current density electroplate 5min, the degree of depth is through hole and the equal plated with copper layer of blind hole of 50mm, proves that degree of depth ability is good, plates acid copper-plating, bright nickel plating, trivalent chromium chrome plating or sexavalent chrome chromium plating again, surface-brightening does not have numb sand.
Embodiment 16
In HEDP system alkaline non-cyanide copper facing plating bath, content of copper ion is 8.5g/L, and the pH value of adjusting plating bath with sulfuric acid or potassium hydroxide is 9.3, adopt stainless steel as insoluble anode, screw, nut are put into drum as the negative electrode workpiece to be plated with workpiece to be plated, electroplate; In electroplating process, adopting flow is the filter filtration copper facing plating bath of 2 tphs, with 0.8A/dm
2Current density barrel plating 60min, barrel plating bright nickel plating again, surface-brightening does not have numb sand, bonding force is good.
The foregoing description is a preferred implementation of the present invention; but embodiments of the present invention are not restricted to the described embodiments; other any do not deviate from change, the modification done under spirit of the present invention and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (10)
1, a kind of maintenance method for alkaline non-cyanide plating copper, it is characterized in that comprising the steps: in alkaline non-cyanide copper facing plating bath, adopt insoluble anode as anode, workpiece to be plated is as negative electrode, the concentration of adjusting bivalent cupric ion in the alkaline non-cyanide copper facing plating bath is 8～25g/L, adjusts the pH value 8.2～11 of plating bath, electroplates then, replenish mantoquita in electroplating process, the concentration that makes bivalent cupric ion in the alkaline non-cyanide copper facing plating bath is to starting point concentration; Add complexing agent, the volumetric molar concentration ratio that makes complexing agent and bivalent cupric ion is 2～4; When coating requires brightly when careful, add additive, the addition of additive is 0.001～1g/L, adjusts the pH value 8.2～11 of plating bath simultaneously, the control current density range is at 0.1～7A/dm
2, electroplating time is at 1min～72h; And when electroplating to plating bath in addition pneumatic blending or swap cathode workpiece to be plated, to improve the current density upper limit.
2, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: described alkaline non-cyanide copper facing plating bath comprises pyrophosphate copper plating system, copper plating with ethylene glycol as complexing agent system, trolamine copper facing system, biuret copper facing system, citrate copper-plating system, 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid salt copper facing system, tartrate copper facing system or Amino Trimethylene Phosphonic Acid salt copper facing system.
3, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: described insoluble anode comprises stainless steel, DSA coating, titanium, platinum or graphite.
4, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: described insoluble anode shape comprises tabular, netted, bar-shaped, wire, circular-arc or rectangular-shaped.
5, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: the aluminium alloy that described workpiece to be plated comprises cast iron, steel, zinc alloy, copper alloy, handle through secondary soaking zinc, the magnesium alloy of handling through chemical nickel plating or through metallized material; Described material comprises plastics, plastic cement, rubber, timber, stone material, pottery, glass or flowers.
6, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: described mantoquita comprises one or more in cupric nitrate, cupric chloride, copper sulfate, cupric pyrophosphate, copper hydroxide, ventilation breather, cupric tartrate, Cuprocitrol, sulphosalicylic acid copper or the copper methanesulfonate.
7, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: described complexing agent comprises tartrate, tartrate sylvite, sodiotartrate, the tartrate ammonium salt, citric acid, citric acid sylvite, sodium citrate salt, the citric acid ammonium salt, sulphosalicylic acid, sulphosalicylic acid sylvite, the sulphosalicylic acid sodium salt, the sulphosalicylic acid ammonium salt, methylsulphonic acid, methylsulphonic acid sylvite, the methylsulphonic acid sodium salt, the methylsulphonic acid ammonium salt, tetra-sodium, tetra-sodium sylvite, the tetra-sodium sodium salt, the tetra-sodium ammonium salt, Amino Trimethylene Phosphonic Acid, Amino Trimethylene Phosphonic Acid sylvite, the Amino Trimethylene Phosphonic Acid sodium salt, the Amino Trimethylene Phosphonic Acid ammonium salt, 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid, 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid sylvite, the 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid sodium salt, the 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid ammonium salt, ethylene diamine tetra methylene phosphonic acid, ethylene diamine tetra methylene phosphonic acid sylvite, in ethylene diamine tetra methylene phosphonic acid sodium salt or the ethylene diamine tetra methylene phosphonic acid ammonium salt one or more.
8, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: the described pH value adjustment material that adopts is one or more in sodium hydroxide, potassium hydroxide, ammoniacal liquor, copper hydroxide, ventilation breather, nitric acid, sulfuric acid, hydrochloric acid, phosphoric acid, tartrate, citric acid, sulphosalicylic acid or the methylsulphonic acid.
9, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: described additive comprises a kind of in hydrogen peroxide, Potassium Persulphate, Sodium Persulfate, ammonium persulphate, potassium permanganate, clorox, ceric sulfate, tin anhydride, antimonypotassium tartrate, phenol, thiocarbamide, dimercapto thiazole, thiazoline, oxine, dimethyl sulfoxide (DMSO), α-Lian pyrimidine, imidazoles or the pyridine or more than one.
10, a kind of maintenance method for alkaline non-cyanide plating copper according to claim 1 is characterized in that: the air pressure of described pneumatic blending is in 0.3～1MPa scope, and the translational speed of described swap cathode workpiece to be plated is per minute 5～15 times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100327367A CN101275255A (en) | 2007-12-20 | 2007-12-20 | Maintenance method for alkaline non-cyanide plating copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100327367A CN101275255A (en) | 2007-12-20 | 2007-12-20 | Maintenance method for alkaline non-cyanide plating copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101275255A true CN101275255A (en) | 2008-10-01 |
Family
ID=39995097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100327367A Pending CN101275255A (en) | 2007-12-20 | 2007-12-20 | Maintenance method for alkaline non-cyanide plating copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101275255A (en) |
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102021617A (en) * | 2010-12-10 | 2011-04-20 | 广州晋惠化工科技有限公司 | Cyanide-free electroplating bath for copper plating of iron and steel parts |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
| CN102080241A (en) * | 2011-02-17 | 2011-06-01 | 杭州海尚科技有限公司 | Low-concentration weakly alkaline cyanide-free copper plating and bath solution preparing method |
| CN102212865A (en) * | 2011-06-10 | 2011-10-12 | 江西昌河航空工业有限公司 | Non-cyanide plating cadmium-titanium bath solution processing method |
| CN101665962B (en) * | 2009-09-04 | 2012-06-27 | 厦门大学 | Alkaline non-cyanide plating solution for copper-plating used on iron and steel base and preparation method thereof |
| CN102586803A (en) * | 2012-03-27 | 2012-07-18 | 广西靖西县一洲锰业有限公司 | Method for preparing low-lead electrolytic manganese metal |
| CN103484903A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Copper plating process for iron-based hardware |
| CN103628122A (en) * | 2012-08-22 | 2014-03-12 | 昆山雅鑫化工有限公司 | Coppered wire stripping and hanging process |
| CN103668357A (en) * | 2013-12-19 | 2014-03-26 | 株洲永盛电池材料有限公司 | Alkaline cyanide-free high-speed copper plating solution |
| CN103898504A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Surface chemical nickel plating technique of magnesium alloy for notebook computer cases |
| CN104499018A (en) * | 2014-11-28 | 2015-04-08 | 广东致卓精密金属科技有限公司 | Alkaline non-cyanide pre-plated copper plating solution and process |
| CN105154929A (en) * | 2015-09-24 | 2015-12-16 | 钱宏彬 | Non-cyanide alkaline copper plating agent and using method thereof |
| CN105177684A (en) * | 2015-07-17 | 2015-12-23 | 武汉吉和昌化工科技股份有限公司 | Insoluble anode for cyanide-free alkaline copper plating and electroplating process of insoluble anode |
| CN105177646A (en) * | 2015-08-27 | 2015-12-23 | 天津佰金隆金属制品有限公司 | Device for producing cyanide-free copper plating solution |
| CN105297121A (en) * | 2015-10-21 | 2016-02-03 | 胜宏科技（惠州）股份有限公司 | Electrocoppering bath titanium basket maintenance method |
| CN105463545A (en) * | 2016-01-05 | 2016-04-06 | 张颖 | Double-bottoming electroplating joint plating solution for nickel-magnesium alloy plated hubs |
| CN105506687A (en) * | 2016-02-19 | 2016-04-20 | 苏州市华婷特种电镀有限公司 | Electroplating solution for obtaining coating of black nickel |
| CN105506623A (en) * | 2015-12-16 | 2016-04-20 | 张颖 | Surface plating method for die-casting zinc alloy component |
| CN105525315A (en) * | 2016-01-18 | 2016-04-27 | 苏州市华婷特种电镀有限公司 | Electroplating solution for obtaining ancient bronze plating |
| CN105543908A (en) * | 2016-02-29 | 2016-05-04 | 广州鸿葳科技股份有限公司 | Solution and method for cyanide-free alkaline bright barrel copper plating |
| CN107190288A (en) * | 2017-06-19 | 2017-09-22 | 沈阳飞机工业（集团）有限公司 | A kind of preparation method of HEDP copper facing imporosity thin layer |
| CN107829116A (en) * | 2017-12-14 | 2018-03-23 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating electroplate liquid |
| CN108034970A (en) * | 2017-12-15 | 2018-05-15 | 宏正（福建）化学品有限公司 | A kind of citric acid-tartrate preplating copper electrolyte and its application process |
| CN108193241A (en) * | 2017-12-18 | 2018-06-22 | 厦门金越电器有限公司 | A kind of tin plating method of copper or copper alloy parts |
| CN109161941A (en) * | 2018-08-09 | 2019-01-08 | 浙江工业大学 | A kind of Sintered NdFeB magnet copper composite graphite alkene coating bottoming is to improve corrosion proof method and product |
| CN109628962A (en) * | 2019-01-21 | 2019-04-16 | 南京市产品质量监督检验院 | A kind of preparation method of no cyanogen 18k gold ornaments |
| CN109786800A (en) * | 2019-02-18 | 2019-05-21 | 重庆大学 | Using the hot recycling ammonia battery and preparation method of the Ni-based copper-plating electrode of foam |
| CN110062820A (en) * | 2016-12-16 | 2019-07-26 | 柯尼卡美能达株式会社 | The forming method and plating plating solution of transparent conductive film |
| CN110168146A (en) * | 2016-12-29 | 2019-08-23 | 阿文尼公司 | Copper electrodeposition solutions and method for high aspect-ratio pattern |
| CN110284162A (en) * | 2019-07-22 | 2019-09-27 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating solution for photovoltaic confluence welding strip and preparation method thereof |
| CN110760905A (en) * | 2019-11-28 | 2020-02-07 | 汕头市铠嘉模具有限公司 | Application of alkaline cyanide-free copper plating process in gravure industry |
| CN110904473A (en) * | 2019-12-04 | 2020-03-24 | 中山美力特环保科技有限公司 | 5G antenna environment-friendly copper plating process |
| CN111005011A (en) * | 2014-10-27 | 2020-04-14 | 表面技术公司 | Plating bath solution |
| CN112941513A (en) * | 2021-01-29 | 2021-06-11 | 广西隆林利通线缆科技有限公司 | Production method of cyanide-free electroplating copper-clad aluminum wire |
| CN113755937A (en) * | 2021-09-09 | 2021-12-07 | 中国航发南方工业有限公司 | Maintenance method of electroplating platinum bath solution |
| CN114150257A (en) * | 2021-12-17 | 2022-03-08 | 江西洪都航空工业集团有限责任公司 | Vacuum heat treatment anti-carburizing method |
| CN114318434A (en) * | 2021-12-10 | 2022-04-12 | 胜宏科技（惠州）股份有限公司 | Copper electroplating solution and preparation method thereof |
| CN117758104A (en) * | 2023-12-28 | 2024-03-26 | 余姚市爱迪升电镀科技有限公司 | Copper-molybdenum alloy wire for electronic device, manganese plating process and manganese plating solution thereof |
-
2007
- 2007-12-20 CN CNA2007100327367A patent/CN101275255A/en active Pending
Cited By (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665962B (en) * | 2009-09-04 | 2012-06-27 | 厦门大学 | Alkaline non-cyanide plating solution for copper-plating used on iron and steel base and preparation method thereof |
| CN102021617B (en) * | 2010-12-10 | 2012-07-18 | 广州晋惠化工科技有限公司 | Cyanide-free electroplating bath for copper plating of iron and steel parts |
| CN102021617A (en) * | 2010-12-10 | 2011-04-20 | 广州晋惠化工科技有限公司 | Cyanide-free electroplating bath for copper plating of iron and steel parts |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
| CN102080241A (en) * | 2011-02-17 | 2011-06-01 | 杭州海尚科技有限公司 | Low-concentration weakly alkaline cyanide-free copper plating and bath solution preparing method |
| CN102212865A (en) * | 2011-06-10 | 2011-10-12 | 江西昌河航空工业有限公司 | Non-cyanide plating cadmium-titanium bath solution processing method |
| CN102212865B (en) * | 2011-06-10 | 2013-02-13 | 江西昌河航空工业有限公司 | Non-cyanide plating cadmium-titanium bath solution processing method |
| CN102586803A (en) * | 2012-03-27 | 2012-07-18 | 广西靖西县一洲锰业有限公司 | Method for preparing low-lead electrolytic manganese metal |
| CN103628122A (en) * | 2012-08-22 | 2014-03-12 | 昆山雅鑫化工有限公司 | Coppered wire stripping and hanging process |
| CN103898504A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Surface chemical nickel plating technique of magnesium alloy for notebook computer cases |
| CN103484903A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Copper plating process for iron-based hardware |
| CN103668357A (en) * | 2013-12-19 | 2014-03-26 | 株洲永盛电池材料有限公司 | Alkaline cyanide-free high-speed copper plating solution |
| CN103668357B (en) * | 2013-12-19 | 2016-08-17 | 湖南永盛新材料股份有限公司 | A kind of alkaline non-cyanide high-speed plating copper electrolyte |
| CN111005011A (en) * | 2014-10-27 | 2020-04-14 | 表面技术公司 | Plating bath solution |
| CN111005011B (en) * | 2014-10-27 | 2022-04-01 | 表面技术公司 | Plating bath solution |
| CN104499018A (en) * | 2014-11-28 | 2015-04-08 | 广东致卓精密金属科技有限公司 | Alkaline non-cyanide pre-plated copper plating solution and process |
| CN105177684A (en) * | 2015-07-17 | 2015-12-23 | 武汉吉和昌化工科技股份有限公司 | Insoluble anode for cyanide-free alkaline copper plating and electroplating process of insoluble anode |
| CN105177646A (en) * | 2015-08-27 | 2015-12-23 | 天津佰金隆金属制品有限公司 | Device for producing cyanide-free copper plating solution |
| CN105154929A (en) * | 2015-09-24 | 2015-12-16 | 钱宏彬 | Non-cyanide alkaline copper plating agent and using method thereof |
| CN105297121A (en) * | 2015-10-21 | 2016-02-03 | 胜宏科技（惠州）股份有限公司 | Electrocoppering bath titanium basket maintenance method |
| CN105506623A (en) * | 2015-12-16 | 2016-04-20 | 张颖 | Surface plating method for die-casting zinc alloy component |
| CN105463545A (en) * | 2016-01-05 | 2016-04-06 | 张颖 | Double-bottoming electroplating joint plating solution for nickel-magnesium alloy plated hubs |
| CN105525315A (en) * | 2016-01-18 | 2016-04-27 | 苏州市华婷特种电镀有限公司 | Electroplating solution for obtaining ancient bronze plating |
| CN105506687A (en) * | 2016-02-19 | 2016-04-20 | 苏州市华婷特种电镀有限公司 | Electroplating solution for obtaining coating of black nickel |
| CN105543908A (en) * | 2016-02-29 | 2016-05-04 | 广州鸿葳科技股份有限公司 | Solution and method for cyanide-free alkaline bright barrel copper plating |
| CN105543908B (en) * | 2016-02-29 | 2018-04-13 | 广州鸿葳科技股份有限公司 | A kind of non-cyanide alkali is bright to roll copper-plated solution and method |
| CN110062820B (en) * | 2016-12-16 | 2021-07-20 | 柯尼卡美能达株式会社 | Method for forming transparent conductive film and plating solution for electroplating |
| CN110062820A (en) * | 2016-12-16 | 2019-07-26 | 柯尼卡美能达株式会社 | The forming method and plating plating solution of transparent conductive film |
| CN110168146B (en) * | 2016-12-29 | 2024-01-09 | 阿文尼公司 | Copper electrodeposition solution and method for high aspect ratio patterns |
| CN110168146A (en) * | 2016-12-29 | 2019-08-23 | 阿文尼公司 | Copper electrodeposition solutions and method for high aspect-ratio pattern |
| CN107190288A (en) * | 2017-06-19 | 2017-09-22 | 沈阳飞机工业（集团）有限公司 | A kind of preparation method of HEDP copper facing imporosity thin layer |
| CN107829116A (en) * | 2017-12-14 | 2018-03-23 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating electroplate liquid |
| CN107829116B (en) * | 2017-12-14 | 2019-08-09 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating electroplate liquid |
| CN108034970A (en) * | 2017-12-15 | 2018-05-15 | 宏正（福建）化学品有限公司 | A kind of citric acid-tartrate preplating copper electrolyte and its application process |
| CN108193241B (en) * | 2017-12-18 | 2019-08-23 | 厦门金越电器有限公司 | A kind of tin plating method of copper or copper alloy parts |
| CN108193241A (en) * | 2017-12-18 | 2018-06-22 | 厦门金越电器有限公司 | A kind of tin plating method of copper or copper alloy parts |
| CN109161941A (en) * | 2018-08-09 | 2019-01-08 | 浙江工业大学 | A kind of Sintered NdFeB magnet copper composite graphite alkene coating bottoming is to improve corrosion proof method and product |
| CN109628962A (en) * | 2019-01-21 | 2019-04-16 | 南京市产品质量监督检验院 | A kind of preparation method of no cyanogen 18k gold ornaments |
| CN109786800A (en) * | 2019-02-18 | 2019-05-21 | 重庆大学 | Using the hot recycling ammonia battery and preparation method of the Ni-based copper-plating electrode of foam |
| CN109786800B (en) * | 2019-02-18 | 2020-12-29 | 重庆大学 | Thermal regeneration ammonia battery adopting foam nickel-based copper-plated electrode and preparation method |
| CN110284162A (en) * | 2019-07-22 | 2019-09-27 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating solution for photovoltaic confluence welding strip and preparation method thereof |
| CN110760905A (en) * | 2019-11-28 | 2020-02-07 | 汕头市铠嘉模具有限公司 | Application of alkaline cyanide-free copper plating process in gravure industry |
| CN110904473A (en) * | 2019-12-04 | 2020-03-24 | 中山美力特环保科技有限公司 | 5G antenna environment-friendly copper plating process |
| CN112941513A (en) * | 2021-01-29 | 2021-06-11 | 广西隆林利通线缆科技有限公司 | Production method of cyanide-free electroplating copper-clad aluminum wire |
| CN113755937A (en) * | 2021-09-09 | 2021-12-07 | 中国航发南方工业有限公司 | Maintenance method of electroplating platinum bath solution |
| CN114318434A (en) * | 2021-12-10 | 2022-04-12 | 胜宏科技（惠州）股份有限公司 | Copper electroplating solution and preparation method thereof |
| CN114318434B (en) * | 2021-12-10 | 2023-08-08 | 胜宏科技（惠州）股份有限公司 | Electrolytic copper plating solution and preparation method thereof |
| CN114150257A (en) * | 2021-12-17 | 2022-03-08 | 江西洪都航空工业集团有限责任公司 | Vacuum heat treatment anti-carburizing method |
| CN117758104A (en) * | 2023-12-28 | 2024-03-26 | 余姚市爱迪升电镀科技有限公司 | Copper-molybdenum alloy wire for electronic device, manganese plating process and manganese plating solution thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101275255A (en) | Maintenance method for alkaline non-cyanide plating copper | |
| CN1170963C (en) | Cyanide-free monovalent copper eletroplating solutions | |
| CN111364074B (en) | Preparation method of composite coordination low-concentration monovalent gold cyanide-free gold-plating electroplating solution | |
| KR101063851B1 (en) | Method for electrolessly depositing metals | |
| JPH02107794A (en) | Electroplating bath for platinium or a platinium alloy and its electroplating method | |
| CN101012569A (en) | Method for direct copper non-cyanide plating of zinc alloy casting die | |
| WO2016098789A1 (en) | Cyanogen-free gold electroplating liquid and gold electroplating method | |
| CN103806053A (en) | Dual-pulse gold plating process | |
| JP2013091833A (en) | Reducing electroless silver plating solution and reducing electroless silver plating method | |
| CN102677116A (en) | Method for dipulse preplating non-cyanide alkaline copper on ferro matrix | |
| EP1930478B1 (en) | Electrolyte composition and method for the deposition of quaternary copper alloys | |
| CN103806032A (en) | Cyanide-free one-step rapid copper plating process for steel wire surface | |
| CN102021617B (en) | Cyanide-free electroplating bath for copper plating of iron and steel parts | |
| US3637474A (en) | Electrodeposition of palladium | |
| JPH0146597B2 (en) | ||
| CN101781782B (en) | Cyanide-free high-speed silver plating electroplating solution | |
| JPH0270084A (en) | Gold plating bath and gold plating method | |
| CN100362141C (en) | Propanetriol non-cyanide bright copper plating liquid | |
| CN108823555B (en) | Reduced chemical gold plating solution and preparation method, use method and application thereof | |
| CN112962128B (en) | Coarsening process method of high-peeling-resistance copper foil | |
| CN111876797B (en) | High-corrosion-resistance neutral nickel plating solution and neutral nickel priming process | |
| JPH01219187A (en) | Copper electroplating solution | |
| CN102206840B (en) | Alkaline chloride copper-plating treatment agent and preparation method thereof | |
| JP2014065943A (en) | Reduction type electroless tin plating bath | |
| CN105543917A (en) | Double-bottoming electroplating method for nickel-plating magnesium alloy hub |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20081001 |