CN105177684A - Insoluble anode for cyanide-free alkaline copper plating and electroplating process of insoluble anode - Google Patents
Insoluble anode for cyanide-free alkaline copper plating and electroplating process of insoluble anode Download PDFInfo
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- CN105177684A CN105177684A CN201510423690.6A CN201510423690A CN105177684A CN 105177684 A CN105177684 A CN 105177684A CN 201510423690 A CN201510423690 A CN 201510423690A CN 105177684 A CN105177684 A CN 105177684A
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- stainless steel
- insoluble anode
- anode
- copper plating
- cyanide
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Abstract
The invention discloses an insoluble anode for cyanide-free alkaline copper plating and an electroplating process of the insoluble anode. The insoluble anode is made of stainless steel which is specifically made of one or more of Cr17Mo2Ti stainless steel, Cr25Mo3Ti stainless steel or Cr1Ni18Ti stainless steel. The insoluble anode is in a plate shape or a net shape or a cylindrical shape or a rectangular shape. The insoluble anode is made of the stainless steel and contains Cr, Ni, Ti and other elements which are insoluble in alkaline copper plating liquid, so that it is guaranteed that no harmful metal impurity exists in the copper plating liquid, and the purity, electricity conductance, heat conductance and welding performance of a copper plating layer are further guaranteed.
Description
Technical field
The present invention relates to electroplating technology field, be specifically related to a kind of insoluble anode and electroplating technology thereof of cyanide-free alkaline copper plating.
Background technology
Electroplating especially in basic plating field, copper facing is with a long history, and it occupies 25 ~ 30% in plating.The difference of electroplating solution is pressed in electro-coppering, can be divided into alkaline copper plating and the large class of acid copper-plating two.At implementation process middle-jiao yang, function of the spleen and stomach very tough cathode plate, or the smelting phosphorus copper plate of phosphorous 0.003 ~ 0.01%.Copper-plated principle be by copper anode in electroplating process because electrochemistry or chemistry (mainly electrochemistry) constantly dissolve, there is provided in plating solution, supplement the cupric ion that negative electrode consumes due to galvanic deposit, thus ensure that the normal operation of plating.
In existing copper facing technology, there is following significantly defect: (1) is electrolytic copper plate due to copper anode or smelts copper coin, contain in making processes, be mingled with a large amount of foreign metals and some insoluble materials, therefore can constantly produce the fault that have side effect in Electroplating Production; (2) in electroplating process, during anode dissolution, metallic impurity can be served to solution band, as Zn
2+, Fe
2+, Pd
2+, Cd
2+deng, also can with Cu
2+be electrolysed by the cathode out together, seriously compromise the performance of plating solution and the quality of copper plate; (3) copper coin anode may be too fast owing to dissolving, and causes Cu in plating solution
2+concentration rise too fast and make coating coarse; (4) copper coin anode may be high because of foreign matter content, causes electrochemical dissolution speed too slow, in plating solution, provide Cu
2+deficiency, causes anode passivation, blackout, and makes Cu in electroplating process
2+concentration overbalance, greatly have impact on the quality of plating, causes trouble and inconvenience greatly to the maintenance of plating solution.
Summary of the invention
For overcoming the deficiencies in the prior art, object of the present invention is exactly insoluble anode and the electroplating technology thereof that will provide a kind of cyanide-free alkaline copper plating.This insoluble anode adopts stainless steel to make, containing elements such as Cr, Ni, Ti, they do not dissolve in alkaline copper plating bath, thus ensure that copper plating bath not containing harmful metallic impurity, further ensure that the pure property of copper plate, electroconductibility, thermal conductivity and welding property.
For realizing this object, the insoluble anode of a kind of cyanide-free alkaline copper plating provided by the present invention and electroplating technology thereof, described insoluble anode adopts stainless steel to make.
Further, any one or a few in described insoluble anode employing Cr17Mo2Ti stainless steel, Cr25Mo3Ti stainless steel or Cr1Ni18Ti stainless steel is made.
Further, the shape of described insoluble anode comprises tabular, netted, cylindric or rectangular-shaped.
Electroplating technique of the present invention, its electroplate liquid formulation is as follows:
Electroplating temperature is 30 ~ 50 DEG C, and cathode current density is 0.5 ~ 1.0A/dm
2, bath pH values is 8.2 ~ 8.8, and anode is Cr
17mo
2ti stainless steel plate or net or Cr
25mo
3ti stainless steel plate or net or Cr
1ni
18ti stainless steel plate or net.
Electroplating technique of the present invention, its electroplate liquid formulation is as follows:
Electroplating temperature is 30 ~ 50 DEG C, and cathode current density is 1.0 ~ 3.0A/dm
2, bath pH values is 9 ~ 10, and anode is Cr
17mo
2ti stainless steel plate or net or Cr
25mo
3ti stainless steel plate or net or Cr
1ni
18ti stainless steel plate or net.
In technique scheme, described cupric salt is CuCO
3or CuSO
45H
2o.
Electroplating technique of the present invention, its electroplate liquid formulation is as follows:
Electroplating temperature is 45 ~ 55 DEG C, and cathode current density is 0.2 ~ 4.0A/dm
2, bath pH values is 8 ~ 10, and anode is Cr
17mo
2ti stainless steel plate or net or Cr
25mo
3ti stainless steel plate or net or Cr
1ni
18ti stainless steel plate or net.
Advantage of the present invention:
(1) insoluble anode of the present invention adopts stainless steel to make, containing elements such as Cr, Ni, Ti, they do not dissolve in alkaline copper plating bath, thus ensure that copper plating bath not containing harmful metallic impurity, further ensure that the pure property of copper plate, electroconductibility, thermal conductivity and welding property;
(2) the present invention is as the anode of alkaline copper plating, and groove positive pressure is normal, and power consumption is less, and there will not be anode passivation, blackout phenomenon, also can not cause producing Cu in plating solution
+powder causes copper plate surface to occur burr phenomena;
(4) the present invention adopts stainless steel as copper-plated anode, and plating solution maintenance is simple and convenient, only needs analytical test to go out Cu in solution
2+density loss after real data, supplement mantoquita;
(5) the present invention adopt stainless steel to make the coating bath body of cyanide-free alkaline copper plating is double does anode, the dispersive ability of copper plating solution, depth capability can be made to promote 15 ~ 20%;
(6)) the present invention adopts stainless steel as copper-plated anode, cheap, can save the production cost of enterprise.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail:
Embodiment 1:
Electroplate liquid formulation is as follows:
Electroplating temperature is 30 DEG C, and cathode current density is 0.5A/dm
2, bath pH values is 8.2, and anode is Cr
17mo
2ti stainless steel plate.
In the electroplating process of the present embodiment, groove positive pressure is normal, does not occur anode passivation, blackout phenomenon, does not produce Cu in plating solution
+powder, there is not burr phenomena in copper plate surface, and copper plate surface-brightening, its pure property, electroconductibility, thermal conductivity and welding property are all good.
Embodiment 2:
Electroplate liquid formulation is as follows:
Electroplating temperature is 50 DEG C, and cathode current density is 1.0A/dm
2, bath pH values is 8.8, and anode is Cr
17mo
2ti stainless (steel) wire.
In the electroplating process of the present embodiment, groove positive pressure is normal, does not occur anode passivation, blackout phenomenon, does not produce Cu in plating solution
+powder, there is not burr phenomena in copper plate surface, and copper plate surface-brightening, its pure property, electroconductibility, thermal conductivity and welding property are all good.
Embodiment 3:
Electroplate liquid formulation is as follows:
Electroplating temperature is 50 DEG C, and cathode current density is 3.0A/dm
2, bath pH values is 10, and anode is Cr
25mo
3ti stainless (steel) wire.
In the electroplating process of the present embodiment, groove positive pressure is normal, does not occur anode passivation, blackout phenomenon, does not produce Cu in plating solution
+powder, there is not burr phenomena in copper plate surface, and copper plate surface-brightening, its pure property, electroconductibility, thermal conductivity and welding property are all good.
Embodiment 4:
Electroplate liquid formulation is as follows:
Electroplating temperature is 30 DEG C, and cathode current density is 1.0A/dm
2, bath pH values is 9, and anode is Cr
25mo
3ti stainless steel plate.
In the electroplating process of the present embodiment, groove positive pressure is normal, does not occur anode passivation, blackout phenomenon, does not produce Cu in plating solution
+powder, there is not burr phenomena in copper plate surface, and copper plate surface-brightening, its pure property, electroconductibility, thermal conductivity and welding property are all good.
Embodiment 5:
Electroplate liquid formulation is as follows:
Electroplating temperature is 55 DEG C, and cathode current density is 4.0A/dm
2, bath pH values is 10, and anode is Cr
1ni
18ti stainless steel plate.
In the electroplating process of the present embodiment, groove positive pressure is normal, does not occur anode passivation, blackout phenomenon, does not produce Cu in plating solution
+powder, there is not burr phenomena in copper plate surface, and copper plate surface-brightening, its pure property, electroconductibility, thermal conductivity and welding property are all good.
Embodiment 6:
Electroplate liquid formulation is as follows:
Electroplating temperature is 45 DEG C, and cathode current density is 0.2A/dm
2, bath pH values is 8, and anode is Cr
1ni
18ti stainless (steel) wire.
In the electroplating process of the present embodiment, groove positive pressure is normal, does not occur anode passivation, blackout phenomenon, does not produce Cu in plating solution
+powder, there is not burr phenomena in copper plate surface, and copper plate surface-brightening, its pure property, electroconductibility, thermal conductivity and welding property are all good.
The content that this specification sheets is not described in detail belongs to the known prior art of professional and technical personnel in the field.
Claims (7)
1. an insoluble anode for cyanide-free alkaline copper plating, is characterized in that, described insoluble anode adopts stainless steel to make.
2. the insoluble anode of a kind of cyanide-free alkaline copper plating according to claim 1, is characterized in that, any one or a few in described insoluble anode employing Cr17Mo2Ti stainless steel, Cr25Mo3Ti stainless steel or Cr1Ni18Ti stainless steel is made.
3. the insoluble anode of a kind of cyanide-free alkaline copper plating according to claim 1, is characterized in that, the shape of described insoluble anode comprises tabular, netted, cylindric or rectangular-shaped.
4. utilize the insoluble anode of the cyanide-free alkaline copper plating described in claim 1 ~ 3 any one to carry out an electroplating technique, it is characterized in that, its electroplate liquid formulation is as follows:
Electroplating temperature is 30 ~ 50 DEG C, and cathode current density is 0.5 ~ 1.0A/dm
2, bath pH values is 8.2 ~ 8.8, and anode is Cr
17mo
2ti stainless steel plate or net or Cr
25mo
3ti stainless steel plate or net or Cr
1ni
18ti stainless steel plate or net.
5. utilize the insoluble anode of the cyanide-free alkaline copper plating described in claim 1 ~ 3 any one to carry out an electroplating technique, it is characterized in that, its electroplate liquid formulation is as follows:
Electroplating temperature is 30 ~ 50 DEG C, and cathode current density is 1.0 ~ 3.0A/dm
2, bath pH values is 9 ~ 10, and anode is Cr
17mo
2ti stainless steel plate or net or Cr
25mo
3ti stainless steel plate or net or Cr
1ni
18ti stainless steel plate or net.
6. a kind of insoluble anode of cyanide-free alkaline copper plating that utilizes according to claim 5 carries out electroplating technique, and it is characterized in that, described cupric salt is CuCO
3or CuSO
45H
2o.
7. utilize the insoluble anode of the cyanide-free alkaline copper plating described in claim 1 ~ 3 any one to carry out an electroplating technique, it is characterized in that, its electroplate liquid formulation is as follows:
Electroplating temperature is 45 ~ 55 DEG C, and cathode current density is 0.2 ~ 4.0A/dm
2, bath pH values is 8 ~ 10, and anode is Cr
17mo
2ti stainless steel plate or net or Cr
25mo
3ti stainless steel plate or net or Cr
1ni
18ti stainless steel plate or net.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510423690.6A CN105177684A (en) | 2015-07-17 | 2015-07-17 | Insoluble anode for cyanide-free alkaline copper plating and electroplating process of insoluble anode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510423690.6A CN105177684A (en) | 2015-07-17 | 2015-07-17 | Insoluble anode for cyanide-free alkaline copper plating and electroplating process of insoluble anode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105177684A true CN105177684A (en) | 2015-12-23 |
Family
ID=54900089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510423690.6A Pending CN105177684A (en) | 2015-07-17 | 2015-07-17 | Insoluble anode for cyanide-free alkaline copper plating and electroplating process of insoluble anode |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933051A (en) * | 1989-07-24 | 1990-06-12 | Omi International Corporation | Cyanide-free copper plating process |
| CN101275255A (en) * | 2007-12-20 | 2008-10-01 | 广州市二轻工业科学技术研究所 | Maintenance method for alkaline non-cyanide plating copper |
| CN102995077A (en) * | 2012-12-28 | 2013-03-27 | 武汉吉和昌化工科技有限公司 | Cyanide-free alkaline bright copper plating solution and preparation method and electroplating process thereof |
| CN103388164A (en) * | 2013-08-09 | 2013-11-13 | 湖北德美科技有限公司 | Non-cyanide alkaline copper electroplating process and formula |
-
2015
- 2015-07-17 CN CN201510423690.6A patent/CN105177684A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933051A (en) * | 1989-07-24 | 1990-06-12 | Omi International Corporation | Cyanide-free copper plating process |
| CN101275255A (en) * | 2007-12-20 | 2008-10-01 | 广州市二轻工业科学技术研究所 | Maintenance method for alkaline non-cyanide plating copper |
| CN102995077A (en) * | 2012-12-28 | 2013-03-27 | 武汉吉和昌化工科技有限公司 | Cyanide-free alkaline bright copper plating solution and preparation method and electroplating process thereof |
| CN103388164A (en) * | 2013-08-09 | 2013-11-13 | 湖北德美科技有限公司 | Non-cyanide alkaline copper electroplating process and formula |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚 等: "《电镀手册》", 31 January 2007, 国防工业出版社 * |
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Application publication date: 20151223 |
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