CN105177646A - Device for producing cyanide-free copper plating solution - Google Patents
Device for producing cyanide-free copper plating solution Download PDFInfo
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- CN105177646A CN105177646A CN201510537468.9A CN201510537468A CN105177646A CN 105177646 A CN105177646 A CN 105177646A CN 201510537468 A CN201510537468 A CN 201510537468A CN 105177646 A CN105177646 A CN 105177646A
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- cyanide
- free copper
- copper electroplating
- production
- electroplating solution
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Abstract
The invention provides a device for producing cyanide-free copper plating solution and belongs to the field of cyanide-free copper plating technology. The device comprises a premixing device, a filter unit, a pH value regulation device and an electroplating tank sequentially arranged, wherein a feeding hole is formed in the premixing device and is connected with a plurality of delivery pumps; a plurality of layers of filter screens are arranged in the filter unit; an acid inlet and alkali inlet are formed in the pH value regulation device; the acid inlet is connected with an acid amount regulator; the alkali inlet is connected with an alkali amount regulator; a sample collector is arranged on the electroplating tank and is connected with a controller; the controller is connected with the delivery pumps, the acid amount regulator and the alkali amount regulator; the bottom of the electroplating tank is further connected with a recycling tank; a pH value display screen is arranged on the pH value regulation device. The device is simple in structure, convenient to operate, high in degree of automation, production efficiency, and safety to operation staff.
Description
Technical field
The present invention relates to cyanide-free copper electroplating technical field, specifically a kind of device for the production of cyanide-free copper electroplating solution.
Background technology
Copper facing is that steel pipe carries out one of surface-treated main technique, and the consumption in Steel Wire Products Industry is only second to zinc-plated and occupies second, but its application target and institute's tool function more more extensive and important than zinc-plated.It is except equally having except protection against corrosion and decoration functions with zinc-plated, the performance being sometimes antiseep in order to improve steel pipe and gaining in strength.Along with science and technology and the developing rapidly of modern industry, steel copper facing technology also obtain in recent years and develops rapidly.Cyanide-free copper electroplating solution is all used in existing copper-plating technique, but cyanide-free copper electroplating solution does not have special device to produce at present, all the methods by manually preparing cyanide-free copper electroplating solution, operator directly can touch the various chemical compositions of cyanide-free copper electroplating solution, have certain toxicity and corrodibility; Moreover inaccurate for the assurance of each component and potential of hydrogen, even can cause the waste of raw material.Therefore prepare cyanide-free copper electroplating solution out like this, composition out of true, and artificial confecting efficiency is low, poor stability, cost is high.
Summary of the invention
The problem to be solved in the present invention is: overcome the deficiencies in the prior art, and provide a kind of structure simple, easy to operate, level of automation is high, and production efficiency is high, the device for the production of cyanide-free copper electroplating solution high to operator safety.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of device for the production of cyanide-free copper electroplating solution, comprise the Preblend device set gradually, filtration unit, pH value regulator and plating tank, described Preblend device is provided with an opening for feed, described opening for feed connects several dehvery pumps, some metafiltration nets are provided with in described filtration unit, described pH value regulator is provided with sour entrance and alkali entrance, described sour entrance connects acid amount setter, described alkali entrance connects alkali number setter, described plating tank is provided with a sample collector, described sample collector connects a controller, described controller connects dehvery pump, acid amount setter and alkali number setter.
Further, the aperture of described filter screen is 0.25-0.45 μm.
Further, described filter screen is four layers, five layers or six layers.
Further, the bottom of described plating tank also connects an accumulator tank.
Further, described Preblend bottom of device is provided with a magnetic stirrer.
Further, described pH value regulator is provided with potential of hydrogen display screen.
Further, described controller is a PLC.
The advantage that the present invention has and positively effect are:
Structure of the present invention is simple, easy to operate, adopts controller with dehvery pump, setter is measured in acid and alkali number setter is connected, realize each component and potential of hydrogen regulates automatically, level of automation is high, and production efficiency is high, directly prepare by hand without the need to operator, high to operator safety.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention for the production of the device of cyanide-free copper electroplating solution.
In figure: 1, Preblend device; 2, filtration unit; 3, pH value regulator; 4, plating tank; 5, opening for feed; 6, dehvery pump; 7, filter screen; 8, sour entrance; 9, alkali entrance; 10, acid amount setter; 11, alkali number setter; 12, sample collector; 13, PLC; 14, accumulator tank; 15, magnetic stirrer; 16, potential of hydrogen display screen.
Embodiment
As shown in Figure 1, a kind of device for the production of cyanide-free copper electroplating solution, comprise the Preblend device 1 set gradually, filtration unit 2, pH value regulator 3 and plating tank 4, the bottom of plating tank 4 also connects an accumulator tank 14, Preblend device 1 is provided with an opening for feed 5, opening for feed 5 connects four dehvery pumps 6, a magnetic stirrer 15 is provided with bottom Preblend device 1, five metafiltration nets 7 are provided with in filtration unit 2, the aperture of filter screen 7 is 0.35 μm, pH value regulator 3 is provided with sour entrance 8 and alkali entrance 9, acid entrance 8 connects acid amount setter 10, alkali entrance 9 connects alkali number setter 11, pH value regulator 3 is provided with potential of hydrogen display screen 16, plating tank 4 is provided with a sample collector 12, sample collector 12 connects a PLC13, PLC13 connects dehvery pump, acid amount setter and alkali number setter.
The working process of this example: each component of composition cyanide-free copper electroplating solution is inputted in Preblend device 1 by dehvery pump 6, be stirred to evenly through magnetic stirrer 15, five layers of filtering net 7 more after filtration in device 2 filter, filter out the impurity in solution, enter in pH value regulator 3 again, potential of hydrogen display screen 16 demonstrates the pH of solution, by the pH of acid amount setter 10 and alkali number setter 11 regulator solution, last solution enters in plating tank 4, each component and the potential of hydrogen of the sample collector 12 pairs of solution on plating tank 4 detect, and detected result is transferred to PLC13, PLC13 analyzes detected result, if a certain component concentration in solution is higher, PLC13 will regulate the unlatching of dehvery pump 6, and then regulate the content of this component, if solution meta-acid, open alkali number setter 11, if solution meta-alkali, open acid amount setter 10, and then the potential of hydrogen of regulator solution.
Above embodiments of the invention have been described in detail, but described content being only preferred embodiments of the present invention, can not being considered to for limiting practical range of the present invention.All equalizations done according to the present patent application scope change and improve, and all should still belong within patent covering scope of the present invention.
Claims (7)
1. the device for the production of cyanide-free copper electroplating solution, it is characterized in that: comprise the Preblend device set gradually, filtration unit, pH value regulator and plating tank, described Preblend device is provided with an opening for feed, described opening for feed connects several dehvery pumps, some metafiltration nets are provided with in described filtration unit, described pH value regulator is provided with sour entrance and alkali entrance, described sour entrance connects acid amount setter, described alkali entrance connects alkali number setter, described plating tank is provided with a sample collector, described sample collector connects a controller, described controller connects dehvery pump, acid amount setter and alkali number setter.
2. a kind of device for the production of cyanide-free copper electroplating solution according to claim 1, is characterized in that: the aperture of described filter screen is 0.25-0.45 μm.
3. a kind of device for the production of cyanide-free copper electroplating solution according to claim 1 and 2, is characterized in that: described filter screen is four layers, five layers or six layers.
4. a kind of device for the production of cyanide-free copper electroplating solution according to claim 1, is characterized in that: the bottom of described plating tank also connects an accumulator tank.
5. a kind of device for the production of cyanide-free copper electroplating solution according to claim 1, is characterized in that: described Preblend bottom of device is provided with a magnetic stirrer.
6. a kind of device for the production of cyanide-free copper electroplating solution according to claim 1, is characterized in that: described pH value regulator is provided with potential of hydrogen display screen.
7. a kind of device for the production of cyanide-free copper electroplating solution according to claim 1, is characterized in that: described controller is a PLC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510537468.9A CN105177646B (en) | 2015-08-27 | 2015-08-27 | A kind of device for being used to produce cyanide-free copper electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510537468.9A CN105177646B (en) | 2015-08-27 | 2015-08-27 | A kind of device for being used to produce cyanide-free copper electroplating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105177646A true CN105177646A (en) | 2015-12-23 |
| CN105177646B CN105177646B (en) | 2017-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510537468.9A Active CN105177646B (en) | 2015-08-27 | 2015-08-27 | A kind of device for being used to produce cyanide-free copper electroplating solution |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1066257A (en) * | 1992-06-10 | 1992-11-18 | 国营江南机器厂 | Purification treatment method for copper and zinc complex ion wastewater and waste residues |
| CN1286318A (en) * | 2000-08-17 | 2001-03-07 | 华南理工大学 | Process and equipment for regenerating chemically nickel-plating liquid |
| JP2001172789A (en) * | 1999-12-14 | 2001-06-26 | Chuo Seisakusho Ltd | Method for electrolyzing metal containing chromium |
| CN201106070Y (en) * | 2007-10-25 | 2008-08-27 | 上海派升环保科技有限公司 | Device for reusing electroplating wastewater by using integrated membrane |
| CN101275255A (en) * | 2007-12-20 | 2008-10-01 | 广州市二轻工业科学技术研究所 | Maintenance method for alkaline non-cyanide plating copper |
| CN202148360U (en) * | 2011-07-14 | 2012-02-22 | 长春京诚机器设备有限公司 | Electroplating equipment for crystallizer copper plate |
| CN103422140A (en) * | 2012-05-15 | 2013-12-04 | 株式会社荏原制作所 | Plating apparatus and plating solution management method |
| CN205046220U (en) * | 2015-08-27 | 2016-02-24 | 天津佰金隆金属制品有限公司 | Non -cyanide plating copper solution apparatus for producing |
-
2015
- 2015-08-27 CN CN201510537468.9A patent/CN105177646B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1066257A (en) * | 1992-06-10 | 1992-11-18 | 国营江南机器厂 | Purification treatment method for copper and zinc complex ion wastewater and waste residues |
| JP2001172789A (en) * | 1999-12-14 | 2001-06-26 | Chuo Seisakusho Ltd | Method for electrolyzing metal containing chromium |
| CN1286318A (en) * | 2000-08-17 | 2001-03-07 | 华南理工大学 | Process and equipment for regenerating chemically nickel-plating liquid |
| CN201106070Y (en) * | 2007-10-25 | 2008-08-27 | 上海派升环保科技有限公司 | Device for reusing electroplating wastewater by using integrated membrane |
| CN101275255A (en) * | 2007-12-20 | 2008-10-01 | 广州市二轻工业科学技术研究所 | Maintenance method for alkaline non-cyanide plating copper |
| CN202148360U (en) * | 2011-07-14 | 2012-02-22 | 长春京诚机器设备有限公司 | Electroplating equipment for crystallizer copper plate |
| CN103422140A (en) * | 2012-05-15 | 2013-12-04 | 株式会社荏原制作所 | Plating apparatus and plating solution management method |
| CN205046220U (en) * | 2015-08-27 | 2016-02-24 | 天津佰金隆金属制品有限公司 | Non -cyanide plating copper solution apparatus for producing |
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| CN105177646B (en) | 2017-12-08 |
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Effective date of registration: 20170725 Address after: 510640 Guangdong City, Tianhe District Province, No. five, road, public education building, unit 371-1, unit 2401 Applicant after: Guangdong Gaohang Intellectual Property Operation Co., Ltd. Address before: 300400 Tianjin city xiditou town Beichen District Xin Hou Village Applicant before: TIANJIN BAIJINLONG METAL PRODUCTS CO., LTD. |
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Effective date of registration: 20171107 Address after: 225400, Jiangsu, Taizhou province Taixing City hi tech Industrial Park on the west side of Dai Wang Road Applicant after: Jiangsu wisdom Venture Investment Co., Ltd. Address before: 510640 Guangdong City, Tianhe District Province, No. five, road, public education building, unit 371-1, unit 2401 Applicant before: Guangdong Gaohang Intellectual Property Operation Co., Ltd. |
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