CN202148360U - Electroplating equipment for crystallizer copper plate - Google Patents
Electroplating equipment for crystallizer copper plate Download PDFInfo
- Publication number
- CN202148360U CN202148360U CN201120248971U CN201120248971U CN202148360U CN 202148360 U CN202148360 U CN 202148360U CN 201120248971 U CN201120248971 U CN 201120248971U CN 201120248971 U CN201120248971 U CN 201120248971U CN 202148360 U CN202148360 U CN 202148360U
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- China
- Prior art keywords
- plating tank
- plating
- electroplating
- copper plate
- auxilliary groove
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- Expired - Lifetime
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Abstract
The utility model belongs to the field of electroplating and relates to electroplating equipment for a crystallizer copper plate. The equipment comprises an electroplating trough (1), an auxiliary trough (2), a constant temperature device (3) of the electroplating trough, an automatic adding device (4) of a pH regulator, an automatic adding device (5) of a liquid-plating component, a filtering machine (6), a rectifier (7), a cathode mobile device (8) and an anode device, wherein the cathode mobile device (8) and the anode device are arranged in the electroplating trough; and the automatic control device monitors the electroplating trough (1), the constant temperature device (3) of the electroplating trough, the filtering machine (6), the automatic adding devices (4) and (5) and the rectifier (7). Through the electroplating equipment for the crystallizer copper plate, the automation and the plating layer quality of the electroplating equipment are improved, the energy source and the cost are saved, the profit is improved, the work environment is improved, and the damage to the body of the operator is reduced.
Description
Technical field
The utility model belongs to field of electroplating, relates to electroplating device, particularly is used for the electroplating device of copper plate of crystallizer.
Background technology
The existing installation that is used for the electroforming copper plate of crystallizer comprises: the utility appliance that is used for galvanized plating tank and links to each other with plating tank, like devices such as heating, cooling, conduction, filtrations; The cathode bar that is used as negative electrode connection work is arranged in the plating tank, and be provided with anode assembly.Its advantage is that electroplating device is simple, and is easy to operate, can obtain stable coating.
But, also need further improve prior art, to improve level of automation, save energy, to reduce cost, improve Working environment, guarantee to electroplate the quality of continuous casting crystallizer copper plate simultaneously.
The utility model content
For this reason; The utility model provides a kind of electroplating device that is used for copper plate of crystallizer, it is characterized in that, this equipment has an auxilliary groove 2; Should pass through two pipe connection with plating tank 1 by auxilliary groove 2; Said two pipelines are arranged on the middle part or the top of said plating tank 1 and auxilliary groove 2, and a pipeline injects plating bath from auxilliary groove 2 to plating tank 1, and another root pipeline injects plating bath from plating tank 1 to auxilliary groove 2.
Specifically, the utility model equipment of being used for copper plate of crystallizer comprises:
Plating tank 1;
The auxilliary groove 2 that is connected with plating tank 1;
The thermostat 3 of the plating tank that is connected with cooling tube with heating tube that plating tank 1 periphery is provided with;
The automatic adding set 4 of the pH regulator agent that is connected with plating tank 1;
The automatic adding set 5 of the solution composition that is connected with plating tank 1;
The filter 6 that is connected with plating tank 1;
The cathode moving device 8 and the anode assembly that in plating tank 1, are provided with;
The RF 7 that is electrically connected with cathode moving device in the plating tank 18 and anode assembly; And
The automatic control device that automatic adding set 5, filter 6 and the RF 7 of the automatic adding set 4 of the thermostat 3 of plating tank 1, plating tank, pH regulator agent, solution composition are monitored.
In the electroplating device of the utility model, extend to the bottom of plating tank 1 and auxilliary groove 2 with pipeline that plating tank 1 is connected with auxilliary groove 2.
In the electroplating device of the utility model, can also on plating tank 1 and pipeline that auxilliary groove 2 is connected, be provided for the pump that plating bath shifts.
In the electroplating device of the utility model, the pipeline that plating bath refluxes can also be set on the top of auxilliary groove 2.
Through the utility model, improved the level of automation and the quality of coating of electroplating device, practiced thrift the energy and cost, improved profit, improved Working environment, reduced harm to operator's health.
Description of drawings
Fig. 1 is the synoptic diagram that of the utility model is used to electroplate the electroplating device of continuous casting crystallizer copper plate, and label wherein is corresponding to lower device:
1: plating tank; 2: auxilliary groove; 3: the radiator valve of plating tank; The automatic adding set of 4:pH regulator; 5: the automatic adding set of solution composition; 6: filter; 7: RF; 8: cathode moving device.
Embodiment
Through the contrast accompanying drawing, the utility model is done further to explain and explanation below.
Shown in accompanying drawing 1, the electroplating device that is used for copper plate of crystallizer of the utility model comprises:
Be used for copper plate of crystallizer is carried out galvanized plating tank 1;
The auxilliary groove 2 that is connected with plating tank 1 is through carrying out the transfer of plating bath, the plating bath liquid level of adjustment plating tank 1 between auxilliary groove 2 and plating tank 1;
The thermostat 3 of plating tank is arranged on the heating tube and the cooling tube (not shown in the accompanying drawing) of plating tank 1 periphery through control, keeps the temperature of plating bath in the plating tank 1;
The automatic adding set 4 of the pH regulator agent that is connected with plating tank 1;
The automatic adding set 5 of the solution composition that is connected with plating tank 1;
The filter 6 that is connected with plating tank 1 is used for filtering the plating bath of plating tank 1;
The cathode moving device 8 and the anode assembly (not shown in the accompanying drawing) that in plating tank 1, are provided with;
The RF 7 that is electrically connected with cathode moving device in the plating tank 18 and anode assembly; And
Automatic control device (not shown in the accompanying drawing) is used for the thermostat 3 to plating tank 1, plating tank, the automatic adding set 4 of pH regulator agent, automatic adding set 5, filter 6 and the RF 7 of solution composition and monitors.
As shown in Figure 1; The equipment of the utility model is made up of plating tank 1, auxilliary groove 2, the radiator valve 3 of plating tank, the automatic adding set 4 of pH regulator agent, automatic adding set 5, filter 6, RF 7 and the automatic control device (not shown in the accompanying drawing) of solution composition and anode assembly (not shown in the accompanying drawing) and the cathode moving device 8 that in plating tank, is provided with; Wherein, Said auxilliary groove 2, filter 6; The automatic adding set 4 of pH regulator agent; The automatic adding set 5 of solution composition is connected with plating tank 1 respectively, and said automatic control device is monitored the radiator valve 3 of plating tank 1, plating tank, the automatic adding set 4 of pH regulator agent, automatic adding set 5, filter 6 and the RF 7 of solution composition automatically.
In the equipment of the utility model, come the plating tank liquid level is regulated through the transfer of carrying out plating bath between plating tank 1 and the auxilliary groove 2, on copper coin, to obtain the coating of different thickness and hardness.Said auxilliary groove 2 is connected with said plating tank 1 through two pipelines, and said two pipelines are arranged on the middle part or the top of plating tank 1 and auxilliary groove 2, can laterally arrange, and also can be provided with up and down.
PLC as automatic control device can set the radiator valve 3 of plating tank, automatic adding set 4 and 5, filter 6, RF 7 respectively; With the temperature of thermostatically controlled plating tank, regularly to plating tank 1 add quantitative medicine, regularly the plating bath to plating tank 1 filter, the timing setting electric current; Each device can also carry out manual operations respectively simultaneously, has improved production efficiency and level of automation.
General electroplating process comprises: preparation plating bath-adjustment plating bath-copper coin is carried out pre-treatment-go into groove-electroplate-go out groove-adjustment plating bath, prepare next production.
Can carry out the transfer of plating bath through the pump (not shown) between plating tank 1 and the auxilliary groove 2; Middle part between plating tank 1 and auxilliary groove 2 or top are provided with two pipelines altogether; A pipeline injects plating bath from auxilliary groove 2 to plating tank 1, another root pipeline injects plating bath from plating tank 1 to auxilliary groove 2; The conversion of this plating bath makes and in plating production process, can forward auxilliary groove 2 to by the timely as requested plating bath with plating tank 1 that so not only save energy has also reduced cost simultaneously.
Plating tank 1 mainly is to drive transmission by pump with the plating bath conversion between the two of auxilliary groove 2, wherein all extends to the lower position of groove at plating tank 1 and the pipeline in the auxilliary groove 2 always.The in good time reduction of the liquid level through regulating plating tank 1 or promote mold is electroplated can be saved the energy to a great extent.
Heating tube and the cooling tube (not shown) of the radiator valve 3 of plating tank through being arranged on plating tank 1 periphery, the temperature of plating bath in the regulation and control plating tank 1.For example, heating tube starts when the bath temperature in the plating tank 1 is lower than design temperature, and the heating plating bath is to set(ting)value; When bath temperature was higher than the temperature value of setting, cooling tube can start to guarantee plating bath constant temperature automatically.
The automatic adding set 4 of pH regulator agent links to each other with plating tank 1, in plating tank 1, to add the pH regulator agent in good time.For example, in plating tank 1, be provided with pH monitoring probe (not shown in the accompanying drawing), can measure the pH value of plating bath in real time, and measuring result is sent to PLC.PLC relatively sends instruction to the setting and the monitored results of the pH value scope of plating bath through comprehensive, and the automatic adding set 4 of pH regulator agent automatically adjusts according to instruction that PLC the sent pH value to plating bath.
The automatic adding set 5 of solution composition links to each other with plating tank 1, in plating tank 1, to add solution composition.In the automatic adding set 5 of solution composition the solution composition for preparing in advance being housed, can setting interpolation speed and interpolation time through PLC, for example every two hours added 100 seconds, can setting-up time be 120 minutes on PLC just, and the interpolation time is 100 seconds; On PLC, can also set simultaneously the concluding time of interpolation, add as after 5 hours, stopping, be 10 hours like electroplating time, just can on PLC, set stand-by time 15 hours, and automatic adding set stops to add after promptly 5 hours.
Filter 6 links to each other with plating tank 1, can filter out some impurity in the plating bath of plating tank 1 etc.Can pass through to set the runtime of filter as the PLC of automatic control device, as, every mistake turned round 2 minutes after ten minutes, just can on PLC, set filter 6 every intervals 10 minutes, turned round 2 minutes.
In the equipment of the utility model; The automatic adding set 4 of plating tank 1, auxilliary groove 2, pH regulator agent, the automatic adding set 5 of solution composition can be provided with tank level control system (not shown in the accompanying drawing), when liquid level goes wrong; When too high or too low, report to the police automatically.
In addition, auxilliary groove 2 can also be provided with the pipeline (not shown) that plating bath refluxes, and this pipeline can be arranged on the top of auxilliary groove 2, so that the plating bath in the auxilliary groove is stirred.Plating tank 1 can also be provided with the pipeline of introducing pure water, in plating tank, to inject pure water.
In addition, also can monitor, for example in plating tank 1 and auxilliary groove 2, TP is set, when temperature goes wrong, report to the police automatically the temperature of plating tank 1 and auxilliary groove 2.
As the PLC of automatic control device, can on touch-screen, be provided with current running status, parameter setting, push button, historic records of equipment various piece etc.
The utility model has improved the level of automation in the production process through the improvement to the electroplating device that is used to electroplate continuous casting crystallizer copper plate, has practiced thrift the energy, has reduced cost, has improved Working environment, has guaranteed to electroplate the quality of continuous casting crystallizer copper plate simultaneously.
Claims (5)
1. electroplating device that is used for copper plate of crystallizer; It is characterized in that; This equipment has an auxilliary groove (2), and this auxilliary groove (2) passes through two pipe connection with plating tank (1), and said two pipelines are arranged on the middle part or the top of said plating tank (1) and auxilliary groove (2); A pipeline injects plating bath from auxilliary groove (2) to plating tank (1), another root pipeline injects plating bath from plating tank (1) to auxilliary groove (2).
2. the electroplating device that is used for copper plate of crystallizer as claimed in claim 1, this equipment comprises:
Plating tank (1);
The auxilliary groove (2) that is connected with plating tank (1);
The thermostat (3) of the plating tank that is connected with cooling tube with heating tube that plating tank (1) periphery is provided with;
The automatic adding set (4) of the pH regulator agent that is connected with plating tank (1);
The automatic adding set (5) of the solution composition that is connected with plating tank (1);
The filter (6) that is connected with plating tank (1);
The cathode moving device (8) and the anode assembly that in plating tank (1), are provided with;
The RF (7) that is electrically connected with cathode moving device (8) in the plating tank (1) and anode assembly; And
The automatic control device that automatic adding set (5), filter (6) and the RF (7) of the automatic adding set (4) of the thermostat (3) of plating tank (1), plating tank, pH regulator agent, solution composition are monitored.
3. according to claim 1 or claim 2 the electroplating device that is used for copper plate of crystallizer wherein extends to the bottom of plating tank (1) and auxilliary groove (2) with the pipeline that plating tank (1) is connected with auxilliary groove (2).
4. the electroplating device that is used for copper plate of crystallizer as claimed in claim 3, wherein the pipeline that is connected with auxilliary groove (2) of plating tank (1) is provided with and is used for the pump that plating bath shifts.
5. the electroplating device that is used for copper plate of crystallizer as claimed in claim 4 wherein is provided with the pipeline that plating bath refluxes on the top of auxilliary groove (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120248971U CN202148360U (en) | 2011-07-14 | 2011-07-14 | Electroplating equipment for crystallizer copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120248971U CN202148360U (en) | 2011-07-14 | 2011-07-14 | Electroplating equipment for crystallizer copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202148360U true CN202148360U (en) | 2012-02-22 |
Family
ID=45589426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120248971U Expired - Lifetime CN202148360U (en) | 2011-07-14 | 2011-07-14 | Electroplating equipment for crystallizer copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202148360U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104703411A (en) * | 2015-04-01 | 2015-06-10 | 竞陆电子(昆山)有限公司 | Horizontal plated-through hole production line pH monitoring device |
| CN104762651A (en) * | 2015-03-03 | 2015-07-08 | 吉林安德电化科技有限公司 | Crystallizer internal surface electroplating production line and electroplating method thereof |
| CN105177646A (en) * | 2015-08-27 | 2015-12-23 | 天津佰金隆金属制品有限公司 | Device for producing cyanide-free copper plating solution |
| CN107326428A (en) * | 2017-06-06 | 2017-11-07 | 河南中南工业有限责任公司 | A kind of full-automatic diamond cobalt plating machine |
| CN108856661A (en) * | 2018-08-09 | 2018-11-23 | 辽宁科技大学 | Conticaster trench wall crystallizer copper plate producing process and the electroplating tank structure of use |
| CN110055575A (en) * | 2019-04-28 | 2019-07-26 | 湖北澳美斯汽车零部件有限公司 | A kind of safety monitoring system for electrophoretic apparatus |
| CN112011809A (en) * | 2020-08-20 | 2020-12-01 | 中南大学 | Precise electroforming integrated automatic control method and system based on modularization |
-
2011
- 2011-07-14 CN CN201120248971U patent/CN202148360U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104762651A (en) * | 2015-03-03 | 2015-07-08 | 吉林安德电化科技有限公司 | Crystallizer internal surface electroplating production line and electroplating method thereof |
| CN104703411A (en) * | 2015-04-01 | 2015-06-10 | 竞陆电子(昆山)有限公司 | Horizontal plated-through hole production line pH monitoring device |
| CN105177646A (en) * | 2015-08-27 | 2015-12-23 | 天津佰金隆金属制品有限公司 | Device for producing cyanide-free copper plating solution |
| CN107326428A (en) * | 2017-06-06 | 2017-11-07 | 河南中南工业有限责任公司 | A kind of full-automatic diamond cobalt plating machine |
| CN108856661A (en) * | 2018-08-09 | 2018-11-23 | 辽宁科技大学 | Conticaster trench wall crystallizer copper plate producing process and the electroplating tank structure of use |
| CN108856661B (en) * | 2018-08-09 | 2023-11-03 | 辽宁科技大学 | Production method of crystallizer copper plate on inner wall of groove of continuous casting machine and electroplating bath structure adopted by production method |
| CN110055575A (en) * | 2019-04-28 | 2019-07-26 | 湖北澳美斯汽车零部件有限公司 | A kind of safety monitoring system for electrophoretic apparatus |
| CN112011809A (en) * | 2020-08-20 | 2020-12-01 | 中南大学 | Precise electroforming integrated automatic control method and system based on modularization |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120222 |
|
| CX01 | Expiry of patent term |