CN101266956A - Protruding block structure on base board - Google Patents
Protruding block structure on base board Download PDFInfo
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- CN101266956A CN101266956A CNA2007100885448A CN200710088544A CN101266956A CN 101266956 A CN101266956 A CN 101266956A CN A2007100885448 A CNA2007100885448 A CN A2007100885448A CN 200710088544 A CN200710088544 A CN 200710088544A CN 101266956 A CN101266956 A CN 101266956A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a bump structure on a substrate, comprising at least a first electrode, at least a first bump and at least a second bump. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate, wherein the height of the second bump is higher than the height of the first bump. The elastic bump according to the invention can be used for testing quality of jointing technology.
Description
Technical field
The present invention relates to the projection cube structure on a kind of substrate, and be particularly related to a kind of projection cube structure that is used for detecting the quality of joint technology.
Background technology
Generally cover crystal glass technology (chip on glass, COG) in, the gap between glass and the wafer (gap) size often depends on operation pressure, glue material characteristic, Stress Release or the like factor.And will determine above-mentioned technological parameter the time, choosing of the gap between wafer and the glass is especially important.Judge that at present the gap length between glass and the wafer is to utilize scanning electron microscopy (SEM) to do section afterwards at joint technology (bonding process) to analyze.But this kind analytical method is very time-consuming.
In addition, (anisotropic conductive film ACF) carries out in wafer-glass bond technology, and detecting its method that engages quality is to utilize the joint situation of the conductive particle among the ACF to judge whether to engage good to utilize anisotropic conductive film.When engaging deficiency, conductive particle does not have the situation of breaking, thereby the not conducting on causing electrically easily.On the contrary,, can cause conductive particle excessively to urge, will cause the situation of not conducting because pressure is excessive if engaging force is too big.
In addition, US 5,707, and 902 exposure methods are design cusp structures on projection.After joint technology, utilize the impression that cusp caused on the projection to judge the degree of joint.But this kind method can't be effectively and is detected gap length between wafer and the glass immediately.
Moreover US 6,972, and 490 disclosed methods are to increase stop structure (stopper) on substrate, to prevent causing the joint technology failure because of over-engagement between wafer and the glass.But this kind method can't detect the gap length between glass and the wafer.
Summary of the invention
The invention provides the projection cube structure on a kind of substrate, this kind projection cube structure can be used for detecting the gap length between glass and the wafer, to judge the quality of joint technology.
The invention provides the projection cube structure on a kind of substrate, utilize this kind projection cube structure can judge the gap length between glass and the wafer and the quality of joint technology immediately.
The present invention proposes the projection cube structure on a kind of substrate, and it comprises at least one first electrode, at least one first projection and at least one second projection.First electrode is disposed on the substrate.First projection is disposed on first electrode.Second projection is disposed on the substrate, and wherein the height of second projection is higher than the height of first projection.
In one embodiment of the invention, first and second above-mentioned projection comprises metal coupling, conductive projection, macromolecular convex or the elastic projection that covered with metal layer constituted on macromolecular convex respectively.
In one embodiment of the invention, the second above-mentioned projection is made of the metal level on macromolecular convex and the macromolecular convex, and metal level can all cover, part covers or do not cover macromolecular convex.
In one embodiment of the invention, the upper surface of first and second above-mentioned projection is plane or cusp structure.
In one embodiment of the invention, the horizontal section of first and second above-mentioned projection is circle, ellipse, rectangle, polygon and combination thereof.
The present invention proposes the projection cube structure on a kind of substrate in addition, and it comprises at least one first electrode, at least one first projection and a plurality of second projection.First electrode is disposed on the substrate.First projection is disposed on first electrode.Second projection is disposed on the substrate, and wherein these second projections has two or more height.
In one embodiment of the invention, the projection cube structure on this substrate more comprises articulamentum, links together with the bottom with these second projections.
In one embodiment of the invention, above-mentioned first and second projection comprises metal coupling, conductive projection respectively or by the elastic projection that metal level constituted on macromolecular convex and the macromolecular convex.
In one embodiment of the invention, the second above-mentioned projection is made of the metal level on macromolecular convex and the macromolecular convex, and metal level can all cover, part covers or do not cover macromolecular convex.
In one embodiment of the invention, the upper surface of first and second above-mentioned projection is plane or cusp structure.
In one embodiment of the invention, the horizontal section of first and second above-mentioned projection is circle, ellipse, rectangle, polygon and combination thereof.
The present invention reintroduces the projection cube structure on a kind of substrate, and it comprises at least one electrode and at least one stepped projection.Electrode is disposed on the substrate.Stepped projection is disposed on the substrate.
In one embodiment of the invention, above-mentioned stepped projection is positioned on the electrode, or part is on electrode.
In one embodiment of the invention, the projection cube structure on this substrate more comprises projection, be positioned on the electrode, and stepped projection is positioned at the outside of electrode.
In one embodiment of the invention, above-mentioned stepped projection has the above height in two rank at least.
In one embodiment of the invention, above-mentioned stepped projection comprises metal coupling, conductive projection, macromolecular convex or the elastic projection that covered with metal layer constituted on macromolecular convex.
In one embodiment of the invention, the upper surface of above-mentioned stepped projection is plane or cusp structure.
In one embodiment of the invention, above-mentioned stepped projection comprises a plurality of layer structures that stack on substrate.
In one embodiment of the invention, the horizontal section of each above-mentioned layer structure is circle, ellipse, rectangle, polygon and combination thereof.
In one embodiment of the invention, vertical section of each above-mentioned layer structure is circle, ellipse, rectangle, polygon and combination thereof.
In one embodiment of the invention, vertical section of above-mentioned stepped projection is monolateral stepped or bilateral stepped.
In the present invention, owing to dispose at least two kinds of projections on the substrate, and the height of these at least two kinds of projections is inequality.Therefore when follow-up carry out joint technology after, the deformation degree that just can Direct observation has the projection of differing heights is judged the quality of joint technology.Another embodiment of the present invention is the stepped projection of configuration on substrate, and is same, and deformation degree that just can the stepped projection of Direct observation after carrying out joint technology is judged the quality of joint technology.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A to Fig. 1 C is the generalized section according to projection cube structure on the substrate of one embodiment of the invention and joint technology thereof.
Fig. 2 A to Fig. 2 C is the generalized section according to projection cube structure on the substrate of another embodiment of the present invention and joint technology thereof.
Fig. 3 is the generalized section that non-conductive adhesion coating is set between two substrates according to one embodiment of the invention.
Fig. 4 is the generalized section that articulamentum is set between a plurality of second projections according to one embodiment of the invention.
Fig. 5 is the generalized section that all covers on second projection, partly covers and do not cover metal level according to one embodiment of the invention.
Fig. 6 is that the upper surface at first and second projection according to one embodiment of the invention is the generalized section of cusp structure.
Fig. 7 is that second projection according to one embodiment of the invention is formed on the generalized section on the electrode.
Fig. 8 A to Fig. 8 C is the generalized section according to projection cube structure on the substrate of further embodiment of this invention and joint technology thereof.
Fig. 9 A to Fig. 9 C is the generalized section according to projection cube structure on the substrate of yet another embodiment of the invention and joint technology thereof.
Figure 10 A is the generalized section according to the bilateral stair-stepping projection of one embodiment of the invention.
Figure 10 B is the generalized section according to the monolateral stair-stepping projection of one embodiment of the invention.
Figure 11 is the schematic perspective view according to the stepped projection of one embodiment of the invention.
Figure 12 A to Figure 12 C is respectively the schematic perspective view of the layer structure of different kenels.
Description of reference numerals
100,200: substrate 102,103: electrode
104,204: protective layer 106,108a, 108b, 108c, 110: projection
112: articulamentum 114: metal level
116: cusp structure 120: non-conductive adhesion coating
202: contact 206: direction of observation
208: pattern 306,308: stepped projection
310: layer structure
Embodiment
First embodiment
Figure 1A to Fig. 1 C is according to the projection cube structure on substrate of one embodiment of the invention and the generalized section of joint technology thereof.Please refer to Figure 1A, the projection cube structure of this embodiment is to be configured on the substrate 100, and it comprises at least one electrode 102, first projection 106 and the second projection 108a, 108b, 108c.In a preferred embodiment, electrode 102 is formed on the substrate 100, and more comprises on the surface of substrate 100 and to be formed with protective layer 104, and protective layer 104 can expose electrode 102.Substrate 100 for example is silicon substrate, glass substrate, printed circuit board (PCB), bendable substrate or ceramic substrate.The material of electrode 102 for example is a metal.In addition, first projection 106 is positioned on the electrode 102, and the second projection 108a, 108b, 108c be positioned on the substrate 100, and just the second projection 108a, 108b, 108c are positioned at and do not dispose the electrode part.Therefore the second projection 108a, 108b, 108c can be formed on any position on the substrate 100, and it for example is not form circuit or element part on the substrate 100.And the first above-mentioned projection 106 and the second projection 108a, 108b, 108c can be metal coupling, conductive projection, macromolecular convex or be positioned at the elastic projection that the coated with conductive layer is constituted on the macromolecular convex.In addition, the horizontal section of first projection 106 and the second projection 108a, 108b, 108c is circle, ellipse, rectangle, polygon and combination thereof.
Particularly, the height of these second projections 108a, 108b, 108c is neither identical.For example, the height of the second projection 108a can be lower than the height that is positioned at first projection 106 on the electrode 102, the height of the second projection 108b can be positioned at electrode 102 on the height of first projection 106 identical, and the height of the second projection 108c can be higher than the height that is positioned at first projection 106 on the electrode 102.And the second projection 108a, 108b, the 108c of design differing heights are the qualities that is used for detecting joint technology after joint technology on substrate 100, and it is described in detail as follows:
Please refer to Figure 1B, another substrate 200 is set in the above-mentioned subtend that has been formed with the substrate 100 of first projection 106 and the second projection 108a, 108b, 108c.And on substrate 200, be formed with contact 202.In a preferred embodiment, contact 202 is formed on the substrate 200, and more is formed with the protective layer 202 that exposes contact 202 on substrate 200.Same, substrate 200 can be silicon substrate, glass substrate, printed circuit board (PCB), bendable substrate or ceramic substrate.For example, substrate 100 is silicon substrate (wafers), and substrate 200 is glass substrates, and then Yi Xia joint technology is the so-called crystalline substance-glass bond technology (COG) of covering.
Afterwards, please refer to Fig. 1 C, carry out joint technology, so that first projection 106 contacts with contact 202 on the substrate 200.At this moment, owing to the second projection 108a, 108b, 108c are highly different, therefore after joint technology, just can produce different deformation degree.Detailed explanation is, because the height of the second projection 108a is low than first projection 106, therefore the second projection 108a can not contact with substrate 200.In addition, because the height of the second projection 108b is identical with first projection 106, therefore the second projection 108b can just contact with substrate 200.In addition, because the height of the second projection 108c is higher than first projection 106, therefore the second projection 108c can produce deformation after engaging.Therefore, after joint technology, only need to observe, just can judge after the joint technology whether conformance with standard of the gap between the two substrates 100,200, to understand the quality of joint technology by the pattern 208 that second projection 108a, 108b, the 108c presented from the direction that arrow 206 is indicated.In the result that Fig. 1 C illustrated is that the joint technology result is good.In other words, do not contact, can know this joint technology deficiency so by inference, thereby first projection 106 does not have excellent contact with contact 202 with substrate 200 if observed result is the second projection 108b.Also contact with substrate 200 if observed result is the second projection 108a, can know this joint technology so by inference is over-engagement.
The above embodiments are to utilize three projections with differing heights to judge the quality of joint technology in the outside of electrode, but the present invention is not limited especially for the number of projection, and it can also be to utilize two, four or more a plurality of second projection with differing heights to judge the quality of joint technology.Certainly the present invention can also only utilize single projection to judge the quality of joint technology, and it is described in detail as follows:
Fig. 2 A to Fig. 2 C is according to the projection cube structure on substrate of one embodiment of the invention and the generalized section of joint technology thereof.Please refer to Fig. 2 A, the projection cube structure on this substrate is similar to Figure 1A, and difference is that second projection 110 is single projection, and the aspect ratio of second projection 110 is positioned at the height height of first projection 106 on the electrode 102.And about the material of second projection 110 and laterally section configuration and the previous described second projection 108a of Figure 1A, 108b, 108c are same or similar, so repeat no more.
Please refer to Fig. 2 B, similarly, another substrate 200 is set in the above-mentioned subtend that has been formed with the substrate 100 of first projection 106 and second projection 110.Afterwards, please refer to Fig. 1 C, carry out joint technology, so that first projection 106 contacts with contact 202 on the substrate 200.At this moment, be higher than first projection 106 owing to be positioned at the height of second projection 110 in electrode 102 outsides, therefore after joint technology, second projection 110 just can produce deformation.In other words, after joint technology, only need to observe, just can judge after the joint technology whether conformance with standard of the gap between the two substrates 100,200, to understand the quality of joint technology by the pattern 208 (deformation degree) that second projection 110 is presented from the direction that arrow 206 is indicated.
And in the above-described embodiment, more can between two substrates 100,200, form non-conductive adhesion coating (Non-Conductive Film, NCF) 120, as shown in Figure 3.Fig. 3 is that the projection with three kinds of differing heights with Fig. 1 C is the position that example illustrates non-conductive adhesion coating 120.In fact, in the embodiment of Fig. 2 C, can also dispose non-conductive adhesion coating (not shown) between the two substrates 100,200.
According to another embodiment of the present invention,, more comprise between any two at the second projection 108a, 108b, 108c so and dispose articulamentum 112, as shown in Figure 4 if dispose a plurality of second projections (for example second projection 108a, 108b, 108c) on the substrate 100.The material of articulamentum 112 for example is identical with the second projection 108a, 108b, 108c, and its effect is to prevent the second projection 108a, 108b, 108c landing.
According to another embodiment of the present invention, as shown in Figure 5, if first projection and second projection are elastic projections, first projection and second projection are made of macromolecular convex 106,108a, 108b, 108c and the metal level 114 that is positioned on macromolecular convex 106,108a, 108b, the 108c so.And this metal level 114 can all cover, part covers or do not cover second projection macromolecular convex 108a, 108b, 108c.Fig. 5 illustrated is that the macromolecular convex 108a of second projection is not covered by metal level 114, and the macromolecular convex 108b of second projection is covered by metal level 114 parts, and the macromolecular convex 108c of second projection is covered fully by metal level 114.But the invention is not restricted to this, its can also be all second projections macromolecular convex 108a, 108b, 108c all by metal level 114 cover, part covers or do not cover.
And the projection cube structure upper surface in the various embodiments described above is a planar structure, but the invention is not restricted to this.In the present invention, the upper surface of projection cube structure can also be the cusp structure.As shown in Figure 6, projection cube structure 107 is a cusp structure 116 with the upper surface of projection cube structure 109a, 109b, 109c.And the formation of this cusp structure for example is when forming projection, uses different exposures that projection and cusp structure are defined simultaneously.Therefore, upper surface is that the material of projection cube structure 107 and projection cube structure 109a, 109b, the 109c of cusp structure 116 is a macromolecular material.Similarly, in the embodiment of Fig. 2 A, the upper surface of its projection cube structure 110 also can be a cusp structure (not shown).
Second projection described in the foregoing description is disposed at and is not formed with the electrode part on the substrate, but the invention is not restricted to this, and in fact second projection can also be formed on the electrode, as shown in Figure 7.Please refer to Fig. 7,, except electrode 102 is arranged, more include electrode 103, and be to dispose first projection 106 on the electrode 102 on the substrate according to another embodiment of the present invention.Particularly, second projection 110 is disposed on the electrode 103.Fig. 7 is to be that example illustrates with the graphic of single second projection of Fig. 2 A to Fig. 2 C.Similarly, in the structure with a plurality of second projections that Figure 1A to Fig. 1 C is illustrated, the second projection 108a, 108b, 108c can also be disposed at (not shown) on the electrode.
Second embodiment
Fig. 8 A to Fig. 8 C is according to the projection cube structure on substrate of one embodiment of the invention and the generalized section of joint technology thereof.Please refer to Fig. 8 A, the projection cube structure of this embodiment is to be configured on the substrate 100, and it comprises at least one electrode 102 and at least one stepped projection 306.In a preferred embodiment, electrode 102 is formed on the substrate 100, and more comprises on the surface of substrate 100 and to be formed with protective layer 104, and protective layer 104 can expose electrode 102.In this embodiment, stepped projection 306 is positioned on the electrode 102.Similarly, stepped projection 306 can be metal coupling, conductive projection or by macromolecular convex and the elastic projection that conductive layer constituted that is positioned on the macromolecular convex.In addition, the horizontal section of stepped projection 306 is circle, ellipse, rectangle or polygon.This stepped projection 306 is disposed on the electrode 102 or part is configured on the electrode 102.In addition, this stepped projection 306 has at least more than two rank.Present embodiment graphic is that the stepped projection 306 with two rank is that example illustrates, but the present invention is not as limit.
Please refer to Fig. 8 B, another substrate 200 is set in the above-mentioned subtend that has been formed with the substrate 100 of stepped projection 306.Afterwards, please refer to Fig. 8 C, carry out joint technology, so that stepped projection 306 contacts with contact 202 on the substrate 200.At this moment, because stepped projection 306 is step structures, therefore after joint technology, if over-engagement will make stepped projection 306 produce deformation, even the hierarchic structure of stepped projection 306 is disappeared.Therefore, after joint technology, only need to observe the deformation degree of the hierarchic structure of stepped projection 306, just can judge after the joint technology whether conformance with standard of the gap between the two substrates 100,200, to understand the quality of joint technology.
The above embodiments are that stepped projection is formed on the electrode, and the present invention can also be formed on stepped projection the electrode outside, and it is described in detail as follows:
Fig. 9 A to Fig. 9 C is according to the projection cube structure on substrate of one embodiment of the invention and the generalized section of joint technology thereof.Please refer to Fig. 9 A, the projection cube structure of this embodiment is to be configured on the substrate 100, and it comprises at least one electrode 102, projection 106 and at least one stepped projection 308.In this embodiment, projection 106 is positioned on the electrode 102, and stepped projection 308 is positioned at the outside of electrode 102.The height of stepped projection 308 can be the height that is higher than, is lower than or be same as projection 106.Fig. 9 A is that the height with stepped projection 308 is that the height that is same as projection 106 is that example illustrates.In addition, the shape of the material of projection 106 and stepped projection 308 and horizontal section does not repeat them here with previous described same or similar.In addition, this stepped projection 308 has at least more than two rank.Present embodiment graphic is that the stepped projection 308 with two rank is that example illustrates, but the present invention is not as limit.
Please refer to Fig. 9 B, another substrate 200 is set in the subtend of substrate 100.Afterwards, please refer to Fig. 9 C, carry out joint technology, so that projection 106 contacts with contact 202 on the substrate 200.At this moment, because the height of stepped projection 308 is identical with the height of projection 106.Therefore after joint technology, if over-engagement will make stepped projection 308 produce deformation, even the hierarchic structure of stepped projection 308 is disappeared.On the contrary, if engage deficiency, stepped projection 308 can be contacted with substrate 200.Therefore after joint technology, only need to observe from the direction that arrow 206 is indicated, just can judge after the joint technology whether conformance with standard of the gap between the two substrates 100,200 by the pattern 208 (deformation degree) that stepped projection 308 is presented, to understand the quality of joint technology.
And vertical section of the stepped projection 308 in the foregoing description is bilateral stepped (shown in Figure 10 A).In fact, the present invention can also form monolateral stepped projection (shown in Figure 10 B) on substrate, to judge the quality of joint technology.
Figure 11 is the schematic perspective view according to the stepped projection of one embodiment of the invention, and Figure 12 A to Figure 12 C is respectively the schematic perspective view of the layer structure of different kenels.At first, please refer to Figure 11, stepped projection 308 of the present invention can also have other variation kenel except the kenel described in the previous embodiment.In detail, stepped projection 308 is made of a plurality of layer structures 310 that stack on substrate, and each layer structure 310 can be triangle layer structure (shown in Figure 12 A), circular layer structure (shown in Figure 12 B), hemisphere layer structure (shown in Figure 12 C) etc.The present invention can stack difform layer structure 310 together according to actual demand, anticipates promptly, and each layer structure 310 that the present invention does not limit in the same stepped projection 308 must be of similar shape.
In the above-described embodiments, though only enumerate the shape of triangle layer structure (shown in Figure 12 A), circular layer structure (shown in Figure 12 B), hemisphere layer structure three kinds of layer structures 310 such as (shown in Figure 12 C), it is not in order to limit the present invention.The layer structure 310 that the present invention can select to have different laterally sections and vertical section constitutes stepped projection 308.In the present embodiment, the horizontal section of layer structure 310 can be circle, ellipse, rectangle, polygon and combination thereof, and vertical section of layer structure 310 also can be circle, ellipse, rectangle, polygon and combination thereof.
Similarly, in the structure of second embodiment, can also between two substrates 100,200, form non-conductive adhesion coating (not shown).In addition, the present invention does not limit the number of the stepped projection that is formed on electrode 120 outsides.The foregoing description is to be that example explains with single, but in fact it can also be a plurality of, and if form a plurality of stepped projections on substrate 100, the total height of these stepped projections can be inequality.Similarly, if on substrate 100, form a plurality of stepped projections, between two adjacent stepped projections, also can more form the articulamentum (not shown) so, to prevent stepped projection landing.In addition, in the structure of second embodiment, projection 106 and stepped projection 308 that the stepped projection 306 that Fig. 8 A to Fig. 8 C is illustrated or Fig. 9 A to Fig. 9 C are illustrated can be by macromolecular convex or covered with metal layer is constituted on the macromolecular convex being positioned at.And this metal level can be whole coverings, part cover or the macromolecular convex of order of covering scalariform projection not.In addition, the upper surface of projection 306 in a second embodiment (or 106 and 308) can be plane or cusp structure.
In sum, in the first embodiment of the present invention, owing to dispose at least two kinds of projections on the substrate, and the height of these at least two kinds of projections is inequality.Therefore when follow-up carry out joint technology after, deformation degree that just can the Direct observation projection is judged the quality of joint technology.
Another embodiment of the present invention is the stepped projection of configuration on substrate, and is same, and deformation degree that just can the stepped projection of Direct observation after carrying out joint technology is judged the quality of joint technology.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; those of ordinary skills without departing from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is when by being as the criterion that claim defined.
Claims (21)
1. the projection cube structure on the substrate comprises:
At least one first electrode is disposed on the substrate;
At least one first projection is disposed on this first electrode; And
At least one second projection is disposed on this substrate, and wherein the height of this second projection is higher than the height of this first projection.
2. the projection cube structure on the substrate as claimed in claim 1, wherein this first and second projection comprises metal coupling, conductive projection, macromolecular convex or the elastic projection that covered with metal layer constituted on this macromolecular convex respectively.
3. the projection cube structure on the substrate as claimed in claim 1, wherein this second projection is made of the metal level on macromolecular convex and this macromolecular convex, and this metal level can all cover, part covers or do not cover this macromolecular convex.
4. the projection cube structure on the substrate as claimed in claim 1, wherein the upper surface of this first and second projection is plane or cusp structure.
5. the projection cube structure on the substrate as claimed in claim 1, wherein the horizontal section of this first and second projection is circle, ellipse, rectangle, polygon and combination thereof.
6. the projection cube structure on the substrate comprises:
At least one first electrode is disposed on the substrate;
At least one first projection is disposed on this first electrode; And
A plurality of second projections are disposed on this substrate, and wherein those second projections have two or more differing heights.
7. the projection cube structure on the substrate as claimed in claim 6 more comprises articulamentum, links together with the bottom with those second projections.
8. the projection cube structure on the substrate as claimed in claim 6, wherein this first and second projection comprises metal coupling, conductive projection, macromolecular convex or the elastic projection that covered with metal layer constituted on this macromolecular convex respectively.
9. the projection cube structure on the substrate as claimed in claim 6, wherein this second projection is made of the metal level on macromolecular convex and this macromolecular convex, and this metal level can all cover, part covers or do not cover this macromolecular convex.
10. the projection cube structure on the substrate as claimed in claim 1, wherein the upper surface of this first and second projection is plane or cusp structure.
11. the projection cube structure on the substrate as claimed in claim 1, wherein the horizontal section of this first and second projection is circle, ellipse, rectangle, polygon and combination thereof.
12. the projection cube structure on the substrate comprises:
At least one electrode is disposed on the substrate; And
At least one stepped projection is disposed on this substrate.
13. the projection cube structure on the substrate as claimed in claim 12, wherein this stepped projection is positioned on this electrode, or part is on this electrode.
14. the projection cube structure on the substrate as claimed in claim 12 more comprises projection, be positioned on this electrode, and this stepped projection is positioned at the outside of this electrode.
15. the projection cube structure on the substrate as claimed in claim 12, wherein this stepped projection has the above height in two rank at least.
16. the projection cube structure on the substrate as claimed in claim 12, wherein this stepped projection comprises metal coupling, conductive projection, macromolecular convex or the elastic projection that covered with metal layer constituted on this macromolecular convex.
17. the projection cube structure on the substrate as claimed in claim 12, wherein the upper surface of this stepped projection is plane or cusp structure.
18. the projection cube structure on the substrate as claimed in claim 12, wherein this stepped projection comprises a plurality of layer structures that stack on this substrate.
19. the projection cube structure on the substrate as claimed in claim 18, wherein respectively the horizontal section of this layer structure is circle, ellipse, rectangle, polygon and combination thereof.
20. the projection cube structure on the substrate as claimed in claim 18, wherein respectively vertical section of this layer structure is circle, ellipse, rectangle, polygon and combination thereof.
21. the projection cube structure on the substrate as claimed in claim 12, wherein this stepped projection is monolateral stepped or bilateral stepped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100885448A CN100565860C (en) | 2007-03-16 | 2007-03-16 | Projection cube structure on the substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100885448A CN100565860C (en) | 2007-03-16 | 2007-03-16 | Projection cube structure on the substrate |
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| Publication Number | Publication Date |
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| CN101266956A true CN101266956A (en) | 2008-09-17 |
| CN100565860C CN100565860C (en) | 2009-12-02 |
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| CNB2007100885448A Expired - Fee Related CN100565860C (en) | 2007-03-16 | 2007-03-16 | Projection cube structure on the substrate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794588A (en) * | 2014-01-29 | 2014-05-14 | 成都京东方光电科技有限公司 | Integrated circuit chip and display device |
| US8736083B2 (en) | 2008-12-31 | 2014-05-27 | Taiwan Tft Lcd Association | Bonding inspection structure |
| CN109887904A (en) * | 2019-04-16 | 2019-06-14 | 中国电子科技集团公司第十三研究所 | A kind of encapsulating structure and printed circuit board of millimeter wave chip |
-
2007
- 2007-03-16 CN CNB2007100885448A patent/CN100565860C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8736083B2 (en) | 2008-12-31 | 2014-05-27 | Taiwan Tft Lcd Association | Bonding inspection structure |
| CN103794588A (en) * | 2014-01-29 | 2014-05-14 | 成都京东方光电科技有限公司 | Integrated circuit chip and display device |
| CN109887904A (en) * | 2019-04-16 | 2019-06-14 | 中国电子科技集团公司第十三研究所 | A kind of encapsulating structure and printed circuit board of millimeter wave chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100565860C (en) | 2009-12-02 |
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