CN101257074A - Novel LED and LCD back light source using the same - Google Patents
Novel LED and LCD back light source using the same Download PDFInfo
- Publication number
- CN101257074A CN101257074A CNA2007103077274A CN200710307727A CN101257074A CN 101257074 A CN101257074 A CN 101257074A CN A2007103077274 A CNA2007103077274 A CN A2007103077274A CN 200710307727 A CN200710307727 A CN 200710307727A CN 101257074 A CN101257074 A CN 101257074A
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- Prior art keywords
- led
- metallic plate
- light
- luminescence chip
- heat sink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
Abstract
The invention relates to a new type LED and a LED backlight using the same. Therein, the new type LED includes a luminescence chip and a heat sink, which has characteristic in that the heat sink is a heat-conductive electric-conductive body, the heat sink electrical connects with anode or cathode of the luminescence chip for being the LED exterior electrode; the LCD backlight has characteristic in that includes a metal plate (1), an isolation layer (2) covers the metal plate (1) upper surface, at least two luminescence chips are installed on the isolation layer (2), therein, each luminescence anode electrical connects with the metal plate (1) upper surface by a conduction solder through the isolation layer (2). The new type LED and the LCD backlight can send out heat generated by LED in working in time, increase light-intensity and light-effect, and enhance light utilization, obtain fully diffusing. Therefore, light distribution with higher evenness can be obtained.
Description
Technical field
The present invention relates to a kind of New LED and use the LCD backlight of this LED.
Background technology
Along with the continuous development of LED technology, the luminous efficiency of LED emitting semiconductor and luminous intensity had had significantly raising in recent years, and the particularly development of white light LEDs technology makes led light source be applied to the general lighting field and LCD application backlight becomes possibility.
But have several problems to need to solve: the heat dissipation problem when being great power LED work, another is LED uses time output and module backlight as the LCD backlight a cost problem.What large power white light LED was at present most effective can realize the luminous efficiency that 100lm/W is above, but this is to realize under less input current, increase input current, can improve luminous intensity, but simultaneously luminous efficiency descends thereupon also, this be since LED when luminous electric current pass through PN junction, cause the PN junction heating of led chip, this part heat can not in time exhale, and junction temperature raises, thereby causes luminous efficiency to descend.The luminous intensity that the LCD backlight requires is bigger, and is also than under the condition with higher, low-cost in order to swell as far as possible at present led chip cost, need improve the luminous efficiency of single led chip as far as possible, improve light output simultaneously, simplify the structure of module backlight, reduce amount of parts.
The utility model content
One of purpose of the present invention provides a kind of New LED, and the heat that can be timely and effectively produces during with work distributes, thereby it is too many to avoid the junction temperature of LED to raise, and LED can be operated under the bigger electric current stability and high efficiency, has improved light intensity and light efficiency;
Two of purpose of the present invention provides a kind of LCD backlight that uses this LED, light is reduced because of the light decay that boundary reflection causes, the utilance of light improves, and the diffusion of process is more abundant before the light ejaculation, distributes so can obtain the higher light of the uniformity.
For achieving the above object, the technical solution used in the present invention is:
A kind of New LED comprises luminescence chip and heat sink, and its special feature is, described heat sink be the heat-conductivity conducting body, thereby this heat sink outer electrode that is electrically connected with the male or female of luminescence chip as LED.
Wherein heat sinkly be electrically connected with the anode of luminescence chip.
Further, wherein heat sink is metallic plate.
Wherein the anode of luminescence chip is electrically connected with the metallic plate upper surface by conductive solder, and all the other positions of metallic plate upper surface are coated with insulating barrier.
A kind of LCD backlight, its special feature is, comprises metallic plate, is coated with insulating barrier at the upper surface of metallic plate, at least two luminescence chips are installed on insulating barrier, and wherein the anode of every luminescence chip all is electrically connected with the metallic plate upper surface by the conductive solder that penetrates insulating barrier; Also comprise the diffusion sheet that is coated with phosphor powder layer, this diffusion sheet is parallel with the aforementioned metal plate, thereby both peripheral hermetic seals form airtight cuboid, is provided with the maintenance insulated column of distance between the two between diffusion sheet and metallic plate; Be filled with dry nitrogen or inert gas in the closed cavity between metallic plate and diffusion sheet.
Wherein inert gas is helium or neon.
Further, wherein luminescence chip evenly distributes on insulating barrier.
The present invention proposes a kind of New LED, it specifically is the surface that the LED luminescence chip closely is mounted on metallic plate, heat conductivility good metal plate had both played the effect as electrode, the heat that produces in the time of can timely and effectively LED being worked again distributes, it is too many that thereby the junction temperature of avoiding LED raises, LED can be operated under the bigger electric current stability and high efficiency, improve light intensity and light efficiency.
And a kind of LCD backlight that uses this LED, original use LED is as the LCD backlight of light source, all be to use the LED particle that encapsulated, be arranged on the circuit board, the light that LED sends is earlier through passing through strong bright film again after the diffusion sheet scattering, could arrive spectators' eyes through the LCD display floater at last, light need reflect through the bed boundary, causes the effective rate of utilization that penetrates light very low.The present invention is by improving the LCD back light module unit structure, arrive the diffusion sheet that is coated with phosphor powder layer again after the blue light process scattering earlier that blue-light LED chip is emitted, blue-light excited fluorescent material sends gold-tinted, and both form white lights through mixing the back, arrives spectators' eyes after inciding the LCD panel.Owing to reduced the interface in the light path, make light reflect the light decay that causes and reduce that the utilance of light improves, and the diffusion of process is more abundant before the light ejaculation because of the boundary, distribute so obtain the higher light of the uniformity.
Description of drawings
Accompanying drawing 1 is the structural representation of LED among the present invention;
Accompanying drawing 2 is structural representations of LCD backlight among the present invention.
Among Fig. 1,1 is metallic plate, and 2 is insulating barrier, and 3 is electrode, and 4 is conductive solder, and 5 is P type doped region, and 6 is N type doped region, and 7 is the gallium nitride substrate, 8 blue lights for output.
Among Fig. 2,1 is metallic plate, and 2 is insulating barrier, and 8 is blue light, and 9 is the LED blue chip, and 10 is insulated column, and 11 are the sealing-in frame, and 12 is diffusion sheet, and 13 is phosphor powder layer, and 14 is white light.
Embodiment
The present invention is further detailed explanation below in conjunction with accompanying drawing:
New LED of the present invention comprises luminescence chip and heat sink, wherein heat sink is the heat-conductivity conducting body, the concrete metallic plate 1 that adopts, be electrically connected a outer electrode thereby this is heat sink with the male or female of luminescence chip as LED, wherein be electrically connected more commonly used with anode, the anode of luminescence chip is electrically connected with metallic plate 1 upper surface by conductive solder 4, and all the other positions of metallic plate 1 upper surface are coated with insulating barrier 2.
As shown in Figure 1, specifically be that the P type doped region 5 on the gallium nitride substrate 7 is electrically connected with metallic plate 1 upper surface by conductive solder 4, and N type doped region 6 is connected with electrode 3 and draw this LED blue light-emitting 8.
As shown in Figure 2, LCD backlight of the present invention, comprise metallic plate 1, upper surface at metallic plate 1 is coated with insulating barrier 2, at least two luminescence chips are installed on insulating barrier 2, concrete quantity can be decided according to the size of whole LCD backlight with to the needs of light intensity, and a plurality of luminescence chips are suitable on insulating barrier 2 evenly to distribute, and wherein the anode of every luminescence chip all is electrically connected with metallic plate 1 upper surface by the conductive solder 4 that penetrates insulating barrier 2; Also comprise the diffusion sheet 12 that is coated with phosphor powder layer 13, this diffusion sheet 12 is parallel with aforementioned metal plate 1, thereby both peripheral hermetic seals form airtight cuboid, is provided with the maintenance insulated column 10 of distance between the two between diffusion sheet 12 and metallic plate 1; Be filled with dry nitrogen or inert gas in the closed cavity between metallic plate 1 and diffusion sheet 12, wherein inert gas is helium or neon.
As shown in Figure 2, specifically adopt LED blue chip 9, diffusion sheet 12 is peripheral by 11 hermetic seals of sealing-in frame with aforementioned metal plate 1, and the LCD backlight finally sends white light 14.
The invention provides a kind of New LED, it is the surface that luminescence chip (being led chip or LED luminescence chip) closely is mounted on metallic plate 1, the effect that heat conductivility good metal plate 1 had both played as electrode, the heat that produces in the time of can timely and effectively LED being worked again distributes, it is too many that thereby the junction temperature of avoiding LED raises, LED can be operated under the bigger electric current stability and high efficiency, improve light intensity and light efficiency.
Original use LED is as the LCD backlight of light source, all be to use the LED particle that encapsulated, be arranged on the circuit board, the light that luminescence chip sends is earlier through passing through strong bright film again after diffusion sheet 12 scatterings, could arrive user's eyes at last through the LCD display floater, light need pass through the multilayer boundary reflection, causes the effective rate of utilization that penetrates light very low.LCD backlight of the present invention is by improving existing LCD back light module unit structure, arrive the diffusion sheet 12 that is coated with phosphor powder layer 13 again after the blue light process scattering earlier that LED blue chip 9 is emitted, blue-light excited fluorescent material sends gold-tinted, both form white lights through mixing the back, incide the eyes that arrive the user behind the LCD panel.
Owing to reduced the interface in the light path, make light reduce because of the light decay that boundary reflection causes, the utilance of light improves, and the diffusion of process is more abundant before the light ejaculation, distributes so obtain the higher light of the uniformity.
Claims (7)
1. a New LED comprises luminescence chip and heat sink, it is characterized in that: described heat sink be the heat-conductivity conducting body, thereby this heat sink outer electrode that is electrically connected with the male or female of luminescence chip as LED.
2. New LED as claimed in claim 1 is characterized in that: wherein heat sinkly be electrically connected with the anode of luminescence chip.
3. New LED as claimed in claim 1 is characterized in that: wherein heat sink is metallic plate (1).
4. New LED as claimed in claim 3 is characterized in that: wherein the anode of luminescence chip is electrically connected with metallic plate (1) upper surface by conductive solder (4), and all the other positions of metallic plate (1) upper surface are coated with insulating barrier (2).
5. LCD backlight, it is characterized in that: comprise metallic plate (1), upper surface at metallic plate (1) is coated with insulating barrier (2), on insulating barrier (2) at least two luminescence chips are installed, wherein the anode of every luminescence chip all is electrically connected with metallic plate (1) upper surface by the conductive solder (4) that penetrates insulating barrier (2);
Also comprise the diffusion sheet (12) that is coated with phosphor powder layer (13), this diffusion sheet (12) is parallel with aforementioned metal plate (1), thereby both form airtight cuboid at peripheral hermetic seal, are provided with the maintenance insulated column of distance (10) between the two between diffusion sheet (12) and metallic plate (1);
Be filled with dry nitrogen or inert gas in the closed cavity between metallic plate (1) and diffusion sheet (12).
6. LCD backlight as claimed in claim 5 is characterized in that: wherein inert gas is helium or neon.
7. as claim 5 or 6 described LCD backlights, it is characterized in that: wherein luminescence chip is gone up evenly at insulating barrier (2) and is distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007103077274A CN100552998C (en) | 2007-12-26 | 2007-12-26 | A kind of LCD backlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007103077274A CN100552998C (en) | 2007-12-26 | 2007-12-26 | A kind of LCD backlight |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101257074A true CN101257074A (en) | 2008-09-03 |
| CN100552998C CN100552998C (en) | 2009-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007103077274A Expired - Fee Related CN100552998C (en) | 2007-12-26 | 2007-12-26 | A kind of LCD backlight |
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| CN (1) | CN100552998C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121630A (en) * | 2010-12-30 | 2011-07-13 | 创维液晶器件(深圳)有限公司 | Directly-lit LED backlight module and liquid crystal display |
| CN102187456A (en) * | 2009-02-09 | 2011-09-14 | 株式会社安川电机 | Semiconductor device cooling structure and power converter provided with the cooling structure |
| CN102537822A (en) * | 2010-10-05 | 2012-07-04 | 通用汽车环球科技运作有限责任公司 | Motor vehicle headlamp |
| CN106352288A (en) * | 2015-07-17 | 2017-01-25 | 古德里奇照明系统有限责任公司 | Aircraft LED Light Unit |
| CN110297356A (en) * | 2019-06-25 | 2019-10-01 | 厦门天马微电子有限公司 | A kind of lamp plate, backlight module and curved-surface display device |
| CN114063350A (en) * | 2021-10-28 | 2022-02-18 | 联想(北京)有限公司 | Light source module, display module and light source module preparation method |
-
2007
- 2007-12-26 CN CNB2007103077274A patent/CN100552998C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102187456A (en) * | 2009-02-09 | 2011-09-14 | 株式会社安川电机 | Semiconductor device cooling structure and power converter provided with the cooling structure |
| CN102537822A (en) * | 2010-10-05 | 2012-07-04 | 通用汽车环球科技运作有限责任公司 | Motor vehicle headlamp |
| CN102121630A (en) * | 2010-12-30 | 2011-07-13 | 创维液晶器件(深圳)有限公司 | Directly-lit LED backlight module and liquid crystal display |
| CN106352288A (en) * | 2015-07-17 | 2017-01-25 | 古德里奇照明系统有限责任公司 | Aircraft LED Light Unit |
| CN110297356A (en) * | 2019-06-25 | 2019-10-01 | 厦门天马微电子有限公司 | A kind of lamp plate, backlight module and curved-surface display device |
| CN114063350A (en) * | 2021-10-28 | 2022-02-18 | 联想(北京)有限公司 | Light source module, display module and light source module preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100552998C (en) | 2009-10-21 |
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Granted publication date: 20091021 Termination date: 20141226 |
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