CN101257036A - 有机el显示装置 - Google Patents

有机el显示装置 Download PDF

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Publication number
CN101257036A
CN101257036A CNA200810009694XA CN200810009694A CN101257036A CN 101257036 A CN101257036 A CN 101257036A CN A200810009694X A CNA200810009694X A CN A200810009694XA CN 200810009694 A CN200810009694 A CN 200810009694A CN 101257036 A CN101257036 A CN 101257036A
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CN
China
Prior art keywords
mentioned
organic
distance piece
substrate
sealing substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200810009694XA
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English (en)
Chinese (zh)
Inventor
东人士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Hitachi Displays Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Displays Ltd filed Critical Hitachi Displays Ltd
Publication of CN101257036A publication Critical patent/CN101257036A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CNA200810009694XA 2007-02-28 2008-02-20 有机el显示装置 Pending CN101257036A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007049651A JP2008218004A (ja) 2007-02-28 2007-02-28 有機ｅｌ表示装置
JP2007049651 2007-02-28

Publications (1)

Publication Number Publication Date
CN101257036A true CN101257036A (zh) 2008-09-03

Family

ID=39715088

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200810009694XA Pending CN101257036A (zh) 2007-02-28 2008-02-20 有机el显示装置

Country Status (3)

Country Link
US (1) US20080203909A1 (ja)
JP (1) JP2008218004A (ja)
CN (1) CN101257036A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102040795A (zh) * 2009-10-15 2011-05-04 住友化学株式会社 树脂组合物
CN103681482A (zh) * 2012-09-21 2014-03-26 上海天马微电子有限公司 Oled显示器件及其封装方法
CN104412706A (zh) * 2012-06-15 2015-03-11 须贺唯知 电子元件的封装方法以及基板接合体
CN102171746B (zh) * 2008-10-02 2015-05-20 夏普株式会社 显示装置用基板、显示装置用基板的制造方法、显示装置、液晶显示装置、液晶显示装置的制造方法和有机电致发光显示装置
CN106997885A (zh) * 2016-01-22 2017-08-01 豪威科技股份有限公司 开沟槽结合坝装置及其制造方法
CN109326737A (zh) * 2018-09-20 2019-02-12 京东方科技集团股份有限公司 显示基板及其制作方法、和显示装置
CN111192529A (zh) * 2019-05-17 2020-05-22 友达光电股份有限公司 显示面板及其制造方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7042024B2 (en) * 2001-11-09 2006-05-09 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
JP2007335365A (ja) * 2006-06-19 2007-12-27 Hitachi Displays Ltd 有機ｅｌ表示装置
JP4952318B2 (ja) * 2007-03-19 2012-06-13 セイコーエプソン株式会社 エレクトロルミネッセンス装置の製造方法
JP2009259732A (ja) * 2008-04-21 2009-11-05 Seiko Epson Corp 有機エレクトロルミネッセンス装置
GB2467547B (en) * 2009-02-04 2011-09-14 Cambridge Display Tech Ltd Organic optoelectronic devices and methods of making the same
JP5515522B2 (ja) * 2009-08-31 2014-06-11 大日本印刷株式会社 有機エレクトロルミネッセンス表示装置用カラーフィルタおよび有機エレクトロルミネッセンス表示装置
JP5650388B2 (ja) 2009-10-05 2015-01-07 三菱電機株式会社 有機ｅｌパネル、パネル接合型発光装置、有機ｅｌパネルの製造方法
JP5853350B2 (ja) * 2010-03-08 2016-02-09 住友化学株式会社 電気装置
EP2586077B1 (en) 2010-06-22 2016-12-14 Koninklijke Philips N.V. Organic electroluminescence device with separating foil
KR102071330B1 (ko) * 2012-12-27 2020-01-30 엘지디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
WO2016028437A1 (en) * 2014-08-20 2016-02-25 Pixtronix, Inc. Display apparatus incorporating edge seals for reducing moisture ingress
KR102352741B1 (ko) * 2015-01-14 2022-01-18 삼성디스플레이 주식회사 표시 장치
CN108428804A (zh) * 2018-04-19 2018-08-21 武汉华星光电技术有限公司 Oled显示面板及其封装方法
CN108550710B (zh) * 2018-06-26 2024-02-27 江苏集萃有机光电技术研究所有限公司 Oled发光组件及发光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003228302A (ja) * 2002-02-04 2003-08-15 Toshiba Electronic Engineering Corp 表示装置及びその製造方法
US7764012B2 (en) * 2004-04-16 2010-07-27 Semiconductor Energy Laboratory Co., Ltd Light emitting device comprising reduced frame portion, manufacturing method with improve productivity thereof, and electronic apparatus
JP2005340020A (ja) * 2004-05-27 2005-12-08 Hitachi Displays Ltd 有機エレクトロルミネッセンス表示装置およびその製造方法
JP2007242591A (ja) * 2006-03-08 2007-09-20 Samsung Sdi Co Ltd 有機電界発光表示装置及びその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102171746B (zh) * 2008-10-02 2015-05-20 夏普株式会社 显示装置用基板、显示装置用基板的制造方法、显示装置、液晶显示装置、液晶显示装置的制造方法和有机电致发光显示装置
CN102040795A (zh) * 2009-10-15 2011-05-04 住友化学株式会社 树脂组合物
CN104412706A (zh) * 2012-06-15 2015-03-11 须贺唯知 电子元件的封装方法以及基板接合体
CN104412706B (zh) * 2012-06-15 2017-05-31 须贺唯知 电子元件的封装方法以及基板接合体
CN103681482A (zh) * 2012-09-21 2014-03-26 上海天马微电子有限公司 Oled显示器件及其封装方法
CN106997885A (zh) * 2016-01-22 2017-08-01 豪威科技股份有限公司 开沟槽结合坝装置及其制造方法
CN109326737A (zh) * 2018-09-20 2019-02-12 京东方科技集团股份有限公司 显示基板及其制作方法、和显示装置
CN111192529A (zh) * 2019-05-17 2020-05-22 友达光电股份有限公司 显示面板及其制造方法

Also Published As

Publication number Publication date
US20080203909A1 (en) 2008-08-28
JP2008218004A (ja) 2008-09-18

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Open date: 20080903