CN101221353A - Substrate heating method - Google Patents
Substrate heating method Download PDFInfo
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- CN101221353A CN101221353A CNA2007103081975A CN200710308197A CN101221353A CN 101221353 A CN101221353 A CN 101221353A CN A2007103081975 A CNA2007103081975 A CN A2007103081975A CN 200710308197 A CN200710308197 A CN 200710308197A CN 101221353 A CN101221353 A CN 101221353A
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- substrate
- glass substrate
- conveyance
- carrying roller
- roller
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- 239000000758 substrate Substances 0.000 title claims abstract description 162
- 238000010438 heat treatment Methods 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims description 18
- 230000007723 transport mechanism Effects 0.000 claims description 16
- 239000011521 glass Substances 0.000 abstract description 78
- 238000013021 overheating Methods 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 63
- 238000003475 lamination Methods 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 22
- 239000011347 resin Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 21
- 238000009434 installation Methods 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 210000002469 basement membrane Anatomy 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- 230000008093 supporting effect Effects 0.000 description 9
- 239000012298 atmosphere Substances 0.000 description 8
- 239000000428 dust Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010276 construction Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 210000004379 membrane Anatomy 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002977 hyperthermial effect Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
- Liquid Crystal (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Abstract
The invention provides a substrate heating device comprising a first to a fifth heating furnaces and a convey device for conveying the glass substrate to the first to the fifth heating furnaces. The convey device has a plurality of convey rollers disposed in the first heating furnace. When the convey rollers is judged to exceed a setting time and stops, the convey rollers rotates or reciprocating rotates in one direction to prevent overheating for one side of the convey rollers.
Description
Technical field
The substrate that the present invention relates to attach the photonasty plate is attaching the substrate heating method that is heated to set point of temperature before handling in advance.
Background technology
For example,, be attached at substrate surface by the photonasty lamellar body (photonasty plate) that will have photosensitive material (photoresist) layer usually and constitute with substrate, P.e.c. distribution substrate, PDP panel substrate for liquid crystal panel.The photonasty lamellar body on the flexiplast supporting mass successively lamination photosensitive material layer and diaphragm are arranged.
And; employed adhering device usually in the following way in the attaching of this photonasty lamellar body; promptly; substrates such as glass substrate or resin substrates are left with predetermined distance and carry out conveyance, and the corresponding scope that is attached at the photosensitive material layer on the described substrate is peeled off diaphragm from described photonasty lamellar body.
For example in the flat 11-34280 communique of TOHKEMY in disclosed film adherence method and the device, as shown in Figure 9, it is last and extend along flat membrane conveyance face that laminated body film (photonasty lamellar body) 1a that sends from film roller 1 is wound in deflector roll 2a, 2b.On this deflector roll 2b, the rotary encoder 3 that is used to export the pulse number pulse signal corresponding with the operational throughput of laminated body film 1a is installed.
The laminated body film 1a that extends along flat membrane conveyance face is wound on the adsorption roller 4, and between described deflector roll 2b and described adsorption roller 4, is provided with hemisection cutter 5 and coverlay stripping off device 6.
Coverlay stripping off device 6 is reeled by take up roll 9 after the adhesive tape 7a that will send from adhesive tape roller 7 firmly is crimped on the coverlay between by pressure roller 8a, 8b.Like this, coverlay is peeled off from photo-sensitive resin, and is wound in together on the take up roll 9 with adhesive tape 7a.
In the downstream of adsorption roller 4, on a plurality of substrates 11, dispose laminating roll 12a, 12b overlapping and crimping laminated body film 1a by substrate conveyance device 10 conveyance at intermittence successively.Downstream at this laminating roll 12a, 12b disposes support membrane take up roll 13.The light transmission supporting film (not shown) that is attached on the substrate 11 is wound on the support membrane take up roll 13.
And just in time before laminating roll 12a, 12b carried out lamination, substrate 11 was by the temperature that is heated to regulation near the well heater 14 that is disposed at substrate conveyance device 10 in advance.Therefore, a plurality of carrying roller 10a of formation substrate conveyance device 10 are exposed to the heat from well heater 14.
Here, if lamination treatment stops, then since the rotation of carrying roller 10a stop, so being heated by the concentrated area of this carrying roller 10a with well heater 14 opposed sides (top).Therefore, have following problems: carrying roller 10a can be easy to thermal deformation owing to single face is overheated, when once more substrate 11 being carried out conveyance, produce whirling,, perhaps cause stopping etc. owing to the conveyance fault because the conveyance of described substrate 11 is crooked or shake and cause damage.
Summary of the invention
The present invention proposes in order to solve described problem, the object of the present invention is to provide a kind ofly not only can make carrying roller in heating furnace, be no more than setting-up time and stop, and can stop the substrate heating method of described carrying roller generation thermal deformation well with simple operation.
The substrate that the present invention relates to attach the photonasty plate is attaching the substrate heating method that is heated to set point of temperature before handling in advance.
This substrate heating method has: by transport mechanism a plurality of heating furnaces are arrived in substrate conveyance at intermittence or continuous conveyance, heat the operation of described substrate simultaneously; When being judged as in described heating furnace that described transport mechanism surpasses setting-up time and when stopping, making the carrying roller that constitutes described transport mechanism carry out the direction rotation or the reciprocal operation of rotation.
In the present invention, can make carrying roller carry out direction rotation or back and forth rotation, owing to surpassing setting-up time under halted state, do not heat the carrying roller in the heating furnace, so can prevent from reliably on described carrying roller, to take place because one-sided overheated and thermal deformation.Like this, can prevent that carrying roller from producing whirling, stop well, perhaps owing to stopping of causing of conveyance fault etc. because the conveyance of substrate is crooked or the damage of shaking the described substrate that causes with simple technology.
Following preferred implementation according to the reference accompanying drawing describes will more be expressly understood described purpose, feature and advantage.
Description of drawings
Fig. 1 is the summary construction diagram of the manufacturing installation of the light-sensitive layers body of the substrate heating method of suitable the 1st embodiment;
Fig. 2 is the cut-open view of the strip photonasty plate that uses in the described manufacturing installation;
Fig. 3 is the key diagram of the state on adhesive labels the is adhered to described strip photonasty plate;
Fig. 4 is the diagrammatic illustration figure of the lining heat of the described manufacturing installation of formation;
Fig. 5 is the key diagram of the 5th heating furnace of the described lining heat of formation;
Fig. 6 is for the key diagram of diaphragm when described strip photonasty plate is peeled off;
Fig. 7 is needed on the key diagram of the state on the glass substrate for photo-sensitive resin;
Fig. 8 is the summary construction diagram of manufacturing installation of the light-sensitive layers body of the 2nd embodiment of the present invention;
Fig. 9 is the summary construction diagram of the film attachment device of patent documentation 1.
Embodiment
Fig. 1 is the summary construction diagram of the manufacturing installation 20 of the light-sensitive layers body of the substrate heating method of suitable the 1st embodiment.Use in the production process of color filter at liquid crystal or organic EL, this manufacturing installation 20 carries out the operation that is transferred on the glass substrate 24 arranged side by side and hot of each photo-sensitive resin 28 (aftermentioned) of strip photonasty plate 22a, 22b.Below lamination there is the glass substrate 24 of photonasty plate 22a, 22b to be also referred to as attaching substrate 24a.Photonasty plate 22a, 22b are set at Rack respectively, and for example, photonasty plate 22a is bigger than photonasty plate 22b width.
Fig. 2 is the cut-open view of employed photonasty plate 22a, 22b in the manufacturing installation 20.This photonasty plate 22a, 22b roughly constitute by the flexible basement membrane of lamination (supporting course) 26, photo-sensitive resin (photosensitive material layer) 28 and diaphragm 30.
As shown in Figure 1, manufacturing installation 20 comprises takes in 2 (also can be more than 2) photonasty plate roller 23a, 23b that photonasty plate 22a, 22b are roller shape coiling, and the 1st and the 2nd plate delivering mechanism 32a, the 32b that described photonasty plate 22a, 22b can be sent synchronously from each photonasty plate roller 23a, 23b; On the diaphragm 30 of each photonasty plate 22a, the 22b that send, form the 1st and the 2nd organisation of working 36a, 36b as the hemisect position 34 of the boundary position that can cut off at Width; The adhesive labels 38 (with reference to Fig. 3) that makes a part have non-bonded part 38a is adhered to the 1st and the 2nd label bonding agency 40a, the 40b on each diaphragm 30.
Downstream at the 1st and the 2nd label bonding agency 40a, 40b disposes: be used for each photonasty plate 22a, 22b are altered to the 1st and the 2nd 42a of reservoir mechanism, the 42b of continuous conveyance, the 1st and the 2nd mechanism for stripping 44a, the 44b that diaphragm 30 is peeled off from each photonasty plate 22a, 22b at interval with specified length by the conveyance at intermittence; Glass substrate 24 is being heated to conveyance under the state of set point of temperature to the substrate heater 45 of sticking position, photo-sensitive resin 28 one that will expose by peeling off of described diaphragm 30 and be attached at attaching mechanism 46 on the described glass substrate 24 side by side.
Near the upstream of the sticking position in attaching mechanism 46, dispose 1st and 2nd testing agency 47a, the 47b of direct detection as half and half cutting part 34 of the boundary position of each photonasty plate 22a, 22b.
Near the downstream of the 1st and the 2nd plate delivering mechanism 32a, 32b, dispose the rear end that is used to attach the photonasty plate 22a, the 22b that roughly use and new photonasty plate 22a, the 22b that uses front end respectively attach platform 49.Downstream attaching platform 49 is provided with film terminal location detecting device 51, the departing from of the Width that produces owing to the coiling of photonasty plate roller 23a, 23b departs from control.
The the 1st and the 2nd organisation of working 36a, 36b are disposed at the roller that is used for calculating the roller footpath of accommodating each photonasty plate roller 23a, the 23b that are wound in the 1st and the 2nd plate delivering mechanism 32a, 32b to 50 downstream.The the 1st and the 2nd organisation of working 36a, 36b comprise single round sword 52 respectively, and this circle sword 52 moves and forms hemisect position 34 at the assigned position of described photonasty plate 22a, 22b along the Width of photonasty plate 22a, 22b.
As shown in Figure 2,, need tripping protection film 30 at least, in fact,, set the penetraction depth of round sword 52 in the mode that is cut into photo-sensitive resin 28 and even basement membrane 26 places in order to cut off this diaphragm 30 reliably for hemisect position 34.Circle sword 52 adopts under the state fixing there not be rotation the Width at photonasty plate 22a, 22b to move and forms the mode at hemisect position 34, perhaps adopts on described photonasty plate 22a, 22b while of rotation fricton-tightly to move and form the mode at described hemisect position 34 at described Width.
The the 1st and the 2nd organisation of working 36a, 36b also can be respectively dispose 2 in the conveyance direction (direction of arrow A) of photonasty plate 22a, 22b in the mode that only separates predetermined distance, form 2 hemisect positions 34 under the state of clamping remnant 30b simultaneously.
For between the corresponding glass substrate 24 and the remnant 30b of remaining diaphragm 30, the 1st provides the adhesive labels 38 of the released part 30ab that is connected the released part 30aa that peels off side the place ahead and peels off proceeds posterolateral with the 2nd label bonding agency 40a, 40b.As shown in Figure 2, under the state that clips remnant 30b, diaphragm 30 is the part peeled off the earlier released part 30aa as the place ahead, and with after the part peeled off as the released part 30ab at rear.
As shown in Figure 3, adhesive labels 38 is strip, for example can be formed by the resin material identical with diaphragm 30.Adhesive labels 38 not only has non-bonded part (the containing little bonding) 38a of uncoated bonding agent at central portion, and be the length direction both ends of described adhesive labels 38 in the both sides of this non-bonded part 38a, also have the 1st adhesive portion 38b on the released part 30aa that is adhered to the place ahead and be adhered to the 2nd adhesive portion 38c on the released part 30ab at rear.
As shown in Figure 1, the the 1st and the 2nd label bonding agency 40a, 40b not only have the absorption layer 54a～54g that maximum 7 adhesive labels 38 can be separated with predetermined distance and attach respectively, and, be used for keeping that photonasty plate 22a, 22b's bear platform 56 from the below but dispose in the mode of free lifting at sticking position based on the described adhesive labels 38 of described absorption layer 54a～54g.
For the velocity contrast between the continuous conveyance of described photonasty plate 22a, the 22b in the conveyance at intermittence of the photonasty plate 22a, the 22b that absorb upstream side and downstream, the 1st and the 2nd 42a of reservoir mechanism, 42b have swing dance roller 60 freely.In the 2nd 42b of reservoir mechanism, each the carrying channel length adjustment that disposes each photonasty plate 22a, 22b arrival attaching mechanism 46 that is used for sending from the 1st and the 2nd plate delivering mechanism 32a, 32b is the dance roller 61 of equal length.
The the 1st and the 2nd mechanism for stripping 44a, the 44b that is disposed at the downstream of the 1st and the 2nd 42a of reservoir mechanism, 42b has respectively and is used to interdict the tension change of sending side of photonasty plate 22a, 22b, the suction tube 62 of the tension stabilityization when making lamination.Near each sucks tube 62, not only dispose stripper roll 63, and for the diaphragm of peeling off from photonasty plate 22a, 22b by this stripper roll 63 30, except remnant 30b, remaining part is wound in respectively in the diaphragm coiling portion 64.
In the downstream of the 1st and the 2nd mechanism for stripping 44a, 44b, dispose the 1st and the 2nd tension control mechanism 66a, the 66b that can apply tension force to photonasty plate 22a, 22b.The the 1st and the 2nd tension control mechanism 66a, 66b have working cylinder 68 respectively, and under the driving action of described working cylinder 68, by the 70 swing displacements of each dance roller, the photonasty plate 22a that can slip each dance roller 70, the tension force of 22b are adjusted.
The the 1st and the 2nd 47a of testing agency, 47b have photoelectric sensor 72a, 72b such as laser sensor or light activated element; the variation that described photoelectric sensor 72a, 72b directly detect the wedge-shaped slot shape portion at hemisect position 34 or the jump that produces owing to the thickness of diaphragm 30 or produce owing to their combination, and with this detection signal as boundary position signals.Photoelectric sensor 72a, 72b are according to being provided with the opposed mode of backing roll 73a, 73b.Also can adopt replacement photoelectric sensor 72a, 72b such as image detection mechanisms such as noncontact displacement meter or ccd video camera.In addition, for ccd video camera, also can be arranged at not and the opposed position of backing roll 73a, 73b.
As shown in Figure 4, lining heat 45 has the transport mechanism 74 that is used for conveyance glass substrate 24 on the arrow C direction, and this transport mechanism 74 has corresponding the 1st heating furnace 82 described later～the 5th heating furnace 90 and is arranged in a plurality of carrying roller 76a～76e of arrow C direction.Each carrying roller 76a, 76b, 76c, 76d and 76e are respectively by rotary driving source (as motor) independently and can rotate driving independently.
Arrow C direction upstream side at transport mechanism 74 is provided with the acceptance division 78 that is used to receive glass substrate 24, on this acceptance division 78, is provided with the universal stage 80 that makes described glass substrate 24 rotations.
In the downstream of acceptance division 78, be aligned in sequence with the 1st～the 5th heating furnace 82,84,86,88 and 90.The 1st heating furnace 82 constitutes high temperature furnace, and the 2nd heating furnace 84 constitutes heating furnace, and the 3rd heating furnace 86 constitutes heating furnace, and the 4th heating furnace 88 constitutes holding furnace and detent mechanism 92, the 5 heating furnaces 90 constitute holding furnace and shut-down mechanism (not shown).
In the 1st heating furnace 82～the 5th heating furnace 90, be provided with the 1st well heater 94a～the 5th well heater 94e.In the 1st heating furnace 82, the furnace atmosphere temperature can be heated to 100 ℃～160 ℃ by the 1st well heater 94a.In the 2nd heating furnace 84, the furnace atmosphere temperature can be heated to 100 ℃～150 ℃ by the 2nd well heater 94b.
In the 3rd heating furnace 86, the furnace atmosphere temperature can be heated to 100 ℃～150 ℃ by the 3rd well heater 94c.In the 4th heating furnace 88, the furnace atmosphere temperature can be heated to 100 ℃～150 ℃ by the 4th well heater 94d, and then, in the 5th heating furnace 90, the furnace atmosphere temperature can be heated to 100 ℃～150 ℃ by the 5th well heater 94e.
In the 1st heating furnace 82～the 5th heating furnace 90, dispose being used to more than 1 respectively and detect the temperature sensor 95a～95e of furnace atmosphere temperature separately.Glass substrate 24 preferably is heated to when lamination in 90 ℃～130 ℃ scopes of surface temperature.
As shown in Figure 5, detent mechanism 92 has the working cylinder 98 that is fixed on the pallet 96, and the bar 98a that extends up from this working cylinder 98 is fixed with lifting table 100.Lifting table 100 is strip at the Width of glass substrate 24 (the arrow D direction of intersecting with the conveyance direction), is provided with supporting station 104 by guide rod 102a, 102b on described lifting table 100.
Supporting station 104 is strip on arrow D direction, and, on described supporting station 104, on arrow D direction, be arranged with a plurality of a plurality of positioning elements 106 such as for example roller that can keep glass substrate 24 by frictional resistance.
In the edges at two ends portion of lifting table 100, disposing can be at Width alignment roller (width of cloth is posted せ ロ one ラ) 108a, the 108b of arrow D direction advance and retreat by driving and reversing mechanism 110a, 110b.Driving and reversing mechanism 110a, 110b have motor 112a, 112b opposite each other, with screw axis 114a, 114b that described motor 112a, 112b are connected on screw togather nut portions 116a, 116b.Nut portions 116a, 116b fixedly are attached on movable pillar 118a, the 118b, and Width alignment roller 108a, 108b can be installed on the upper end of described movable pillar 118a, 118b with rotating freely.
In lining heat 45, can monitor the temperature of glass substrate 24 all the time, when generation is unusual, carrying roller 76a～76e quits work and gives the alarm, send abnormal information simultaneously, in the operation of back, unusual glass substrate 24 is carried out NG and discharge, be used for qualitative control or production management etc. neatly.For transport mechanism 74, also can adopt such structure, that is, dispose kickboard on the not shown air, glass substrate 24 come-up and in the conveyance of arrow C direction.
As shown in Figure 1, in the upstream of lining heat 45, be provided with the substrate stocker 120 of accommodating a plurality of glass substrate 24.Be contained in each glass substrate 24 among this substrate stocker 120 and be adsorbed on the absorption layer 124 of the hand 122a that is located at robot 122 and take out, and send among the acceptance division 78.
Attach mechanism 46 and have rubber rollers 130a, the 130b that disposes and be heated to set point of temperature up and down.On rubber rollers 130a, 130b, slip backing roll 132a, 132b, and described backing roll 132b by the pressurized operation cylinder 134a, the 134b that constitute roller clamping section 133 by being pressed in rubber rollers 130b side.
Near rubber rollers 130a, movably dispose and be used to prevent that photonasty plate 22a, 22b from contacting the contact preventing roller 136 of described rubber rollers 130a.Attaching near the upstream of mechanism 46, disposing and be used for photonasty plate 22a, 22b are preheated preheating part 137 to set point of temperature.This preheating part 137 for example has heating arrangements such as infrared ray rod well heater.
Downstream attaching mechanism 46 is provided with the automatic mechanism for stripping 146 of cooling body 144 and substrate.The automatic mechanism for stripping 146 of substrate will separate and the rectangular basement membrane 26 that attaches each glass substrate 24 is peeled off continuously every predetermined distance, comprise prestripping portion 148 and stripper roll 150 and wireline reel 152.Wireline reel 152 carries out torque control and basement membrane 26 is applied tension force when driving, on the other hand, and for example preferably by the FEEDBACK CONTROL that tension detector (not shown) carries out tension force is set on stripper roll 150.
Prestripping portion 148 has peel strip 156, and described peel strip 156 is at 24 liftables of glass substrate.And,, stop peeling off of color material layer when peeling off, thereby can access the high-quality layers pressure surface by face being heated to about 30 ℃～120 ℃ again in stripper roll 150 or its dead ahead.
In the downstream of the automatic mechanism for stripping 146 of substrate, dispose the analyzer 158 of the regional location that is used to measure the photo-sensitive resin 28 that is attached in fact on the glass substrate 24.This analyzer 158 for example comprises video cameras 160 such as CCD, described video camera 160 is set, so that the glass substrate 24 that is pasted with photo-sensitive resin 28 is made a video recording.
In the downstream of the automatic mechanism for stripping 146 of substrate, be provided with the light-sensitive layers body accumulator 190 that is used to accommodate a plurality of light-sensitive layers bodies 208.Peeled off the light-sensitive layers body 208 of basement membrane 26 and remnant 30b from attaching substrate 24a by the automatic mechanism for stripping 146 of substrate, be located at absorption layer 194 absorption on the hand 192a of robot 192 and take out, be contained in the light-sensitive layers body accumulator 190.
In manufacturing installation 20, the the 1st and the 2nd plate delivering mechanism 32a, 32b, the the 1st and the 2nd organisation of working 36a, 36b, the the 1st and the 2nd label bonding agency 40a, 40b, the the 1st and the 2nd 42a of reservoir mechanism, 42b, the the 1st and the 2nd mechanism for stripping 44a, 44b, the the 1st and the 2nd tension control mechanism 66a, 66b and the 1st and the 2nd 47a of testing agency, 47b is disposed at the top that attaches mechanism 46, but in contrast, also can be with the described the 1st and the 2nd plate delivering mechanism 32a, 32b is to the described the 1st and the 2nd 47a of testing agency, the part of 47b is disposed at the described below that attaches mechanism 46, and photonasty plate 22a, the downside that on the contrary photo-sensitive resin 28 is attached at substrate 24 up and down mutually of 22b, in addition, also described manufacturing installation 20 can be integrally formed on the straight line.
As shown in Figure 1, manufacturing installation 20 carries out integral body control by lamination control part 200, in each of each function portion of this manufacturing installation 20, for example be provided with lamination control part 202, substrate heating control section 204 and substrate and peel off control part 206 etc., these control parts link to each other by the in-process network.Lamination control part 200 links to each other with plant network, carries out the information processing that is used to produce from the production management of the indication information (condition enactment or production information) of the not shown CPU of factory and operational management etc.
Substrate heating control section 204 receives glass substrate 24 from upstream process, and based on detection signal from temperature sensor 95a～95e, this glass substrate 24 is heated to desired temperatures, and as described later, drive controlling transport mechanism 74 when the conveyance of this glass substrate 24 stops.
Main frame as operation integral body, 202 pairs of each function portions of lamination control part control, formation is based on the positional information by the hemisect position 34 of the 1st and the 2nd 47a of testing agency, 47b detected photonasty plate 22a, 22b, the control gear that can control each boundary position in the sticking position and the relative position between the glass substrate 24 and each boundary position relative position each other.
Substrate peel off 206 pairs of control parts with basement membrane 26 from peeling off by attaching the attaching substrate 24a that mechanism 46 supplies with, and then light-sensitive layers body 208 sent to the action of lower procedure control, and the information of described attaching substrate 24a and described light-sensitive layers body 208 is carried out processing controls.
Be isolated into the 1st dust free room 212a and the 2nd dust free room 212b by dividing wall 210 in the manufacturing installation 20.The part of the 1st and the 2nd plate delivering mechanism 32a, 32b to the 1 and the 2nd tension control mechanism 66a, 66b is contained among the 1st dust free room 212a, and the following mechanism of the 1st and the 2nd 47a of testing agency, 47b is contained among the 2nd dust free room 212b.The 1st dust free room 212a and the 2nd dust free room 212b are communicated with via breakthrough part 214.
Below the action of the manufacturing installation 20 of formation like this is described, carry out following explanation in the mode that is associated with substrate heating method of the present invention.
At first, photonasty plate 22a, 22b send from each photonasty plate roller 23a, the 23b that is installed on the 1st and the 2nd plate delivering mechanism 32a, the 32b.Photonasty plate 22a, 22b conveyance to the 1 and the 2nd organisation of working 36a, 36b.
In the 1st and the 2nd organisation of working 36a, 36b; circle sword 52 moves at the Width of photonasty plate 22a, 22b; begin described photonasty plate 22a, 22b are cut from diaphragm 30,, form hemisect position 34 (with reference to Fig. 2) up to incision photo-sensitive resin 28 and even basement membrane 26.And then, as shown in Figure 1,, stop after the direction conveyance in arrow A in the size of the remnant 30b of corresponding diaphragm 30 for photonasty plate 22a, 22b, under the motion effect of circle sword 52, form hemisect position 34.Thus, on photonasty plate 22a, 22b,, the place ahead released part 30aa and rear released part 30ab (with reference to Fig. 2) are set according to the mode of clamping remnant 30b.
Next, each photonasty plate 22a, 22b conveyance to the 1 and the 2nd label bonding agency 40a, 40b are located at the regulation sticking position of diaphragm 30 and bear on the platform 56.In the 1st and the 2nd label bonding agency 40a, 40b; the adhesive labels 38 of regulation sheet number be adsorbed the pad 54a～54g adsorb maintenance, each adhesive labels 38 stride diaphragm 30 remnant 30b and with the place ahead released part 30aa and rear released part 30ab one bonding (with reference to Fig. 3).
As shown in Figure 1, for the photonasty plate 22a, the 22b that are bonded with 7 adhesive labels 38, after preventing to send the tension change of side by the 1st and the 2nd 42a of reservoir mechanism, 42b, conveyance to the 1 and the 2nd mechanism for stripping 44a, 44b continuously.As shown in Figure 6, in the 1st and the 2nd mechanism for stripping 44a, 44b, 26 absorption of the basement membrane of photonasty plate 22a, 22b remain in and suck on the tube 62, and diaphragm 30 is reserved remnant 30b and peeled off from described photonasty plate 22a, 22b.This diaphragm 30 is stripped from roller 63 and is peeled off, and is wound in the diaphragm coiling portion 64 (with reference to Fig. 1).
Under the effect of the 1st and the 2nd mechanism for stripping 44a, 44b; diaphragm 30 is reserved remnant 30b and after peeling off from basement membrane 26; photonasty plate 22a, 22b carry out tension adjustment by the 1st and the 2nd tension control mechanism 66a, 66b; and then; in the 1st and the 2nd 47a of testing agency, 47b, carry out the detection at hemisect position 34 by photoelectric sensor 72a, 72b.
Each photonasty plate 22a, 22b be based on the detection information at hemisect position 34, under the turning effort of film carrying roller 90a, 90b, respectively quantitatively conveyance to attaching mechanism 46.
On the other hand, as shown in Figure 4, in lining heat 45, corresponding attach the laminating temperature in the mechanism 46 and set furnace atmosphere temperature in the 1st～the 5th heating furnace 82～90.For example, if laminating temperature is 110 ℃, then the furnace atmosphere temperature in the 1st heating furnace the 82, the 2nd heating furnace the 84, the 3rd heating furnace the 86, the 4th heating furnace 88 and the 5th heating furnace 90 is set at respectively about 150 ℃, 140 ℃, 135 ℃, 135 ℃ and 135 ℃.In addition, in glass substrate 24, coat the quality that modifying agent is connected airtight on lip-deep surface in order to keep, ceiling temperature is set at 130 ℃.
Then, the glass substrate 24 that is contained in the substrate stocker 120 is controlled by robot 122, and this glass substrate 24 is sent into acceptance division 78.In acceptance division 78, in glass substrate 24 and after the posture rotation with expectation, from described acceptance division 78 off and among conveyance to the 1 heating furnace 82 by universal stage 80.
In the 1st heating furnace 82, after glass substrate 24 heated up because of the heat effect of the 1st well heater 94a is rapid, glass substrate 24 is conveyance to the 2 heating furnaces 84 by the carrying roller 76a that constitutes transport mechanism 74.On the other hand, the new glass substrate of sending in the acceptance division 78 24 is sent in the 1st heating furnace 82.
In the 2nd heating furnace 84, after glass substrate 24 heated up by the 2nd well heater 94b, described glass substrate 24 is conveyance to the 3 heating furnaces 86 by the carrying roller 76b that constitutes transport mechanism 74.Conveyance to the 4 heating furnaces 88 carry out hyperthermic treatment and localization process by the 4th heating furnace 88 by the carrying roller 76c that constitutes transport mechanism 74 by the glass substrate 24 after 86 intensifications of the 3rd heating furnace.
Be provided with detent mechanism 92 in the 4th heating furnace 88, as shown in Figure 5, at first, shown in solid line, Width alignment roller 108a, 108b are configured on arrow D direction away from each other, and under this state, under the driving action of working cylinder 98, lifting table 100 rises.
On this lifting table 100, be provided with supporting station 104 by guide rod 102a, 102b, and, on described supporting station 104, be arranged with a plurality of positioning elements 106.Therefore, the glass substrate 24 on the carrying roller 76d is located in positioning element 106 supportings, will shift the top of described carrying roller 76d on this glass substrate 24 onto.
Then, the motor 112a, the 112b that constitute driving and reversing mechanism 110a, 110b drive, movable pillar 118a, the 118b displacement on approximating direction by screw axis 114a, 114b and nut portions 116a, 116b.Therefore, the Width alignment roller 108a, the 108b that are installed on movable pillar 118a, 118b top move on approximating direction, with the arrow D direction both ends butt that is supported on the glass substrate 24 on the positioning element 106, thereby carry out the location of this glass substrate 24.
After glass substrate 24 positioned, after the both ends of this glass substrate 24 were left slightly, lifting table 100 descended by working cylinder 98 at Width alignment roller 108a, 108b.Then, the glass substrate 24 that is supported on the positioning element 106 joins on a plurality of carrying roller 76d from this positioning element 106, and on the other hand, Width alignment roller 108a, 108b move in away from each other direction by driving and reversing mechanism 110a, 110b.In addition, carry out the Width alignment under the state that Width alignment roller 108a, 108b also can also leave slightly at the width than glass substrate 24.
Like this, when stopping to descend at glass substrate 24 contact carrying roller 76d, Width alignment roller 108a, 108b and this glass substrate 24 butts and the damage that can prevent to produce dust or glass substrate 24.
And positioning element 106 is formed by the material that can produce frictional resistance.Therefore, when positioning element 106 descends, can prevent the offset of glass substrate 24 well.
Join in the glass substrate on the carrying roller 76d 24 under the turning effort of this carrying roller 76d, be incubated processing in conveyance to the 5 heating furnaces 90, be heated under the state of set point of temperature conveyance to sticking position.This glass substrate 24 temporarily is positioned between rubber rollers 130a, the 130b corresponding to the attaching part of the photo-sensitive resin 28 of photonasty plate 22a, 22b arranged side by side.
Under this state, backing roll 132b and rubber rollers 130b are risen, thereby glass substrate 24 sandwich between rubber rollers 130a, the 130b with the regulation pressing force.And under the turning effort of rubber rollers 130a, photo-sensitive resin 28 transfer printings (lamination) arranged side by side are to this glass substrate 24.
Here, as lamination, speed is 1.0m/min～10.0m/min, and the temperature of rubber rollers 130a, 130b is 80 ℃～150 ℃, the rubber hardness of described rubber rollers 130a, 130b is 40 degree～90 degree, and the pressing force (line pressure) of this rubber rollers 130a, 130b is 50N/cm～400N/cm.
If the lamination of photonasty plate 22a, the 22b of lamination a slice amount end on glass substrate 24 by rubber rollers 130a, 130b, then the rotation of described rubber rollers 130a stops, on the other hand, lamination has the described glass substrate of described photonasty plate 22a, 22b promptly to attach substrate 24a by 142 clampings of substrate conveyance roller.
Then, rubber rollers 130b keeps out of the way in the direction of leaving rubber rollers 130a, clamp thereby remove, and the rotation of beginning substrate conveyance roller 142, attach substrate 24a quantitatively conveyance on the direction of arrow C, the position moves near the assigned position in below of rubber rollers 130a between the substrate of photonasty plate 22a, 22b.On the other hand, by substrate conveyance mechanism 45, next piece glass substrate 24 conveyance is to sticking position.
If the front end conveyance of this next piece glass substrate 24 is between rubber rollers 130a, the 130b, then described rubber rollers 130b rises, and described next piece glass substrate 24 and photonasty plate 22a, 22b are clamped by described rubber rollers 130a, 130b.Then, under the turning effort of rubber rollers 130a, 130b and substrate conveyance roller 142, begin lamination, and attach substrate 24a in the conveyance of arrow C direction.
At this moment, as shown in Figure 7, attach each end of substrate 24a and cover by remnant 30b each other.Therefore, when photo-sensitive resin 28 was transferred on the glass substrate 24, rubber rollers 130a, 130b can not polluted by described photo-sensitive resin 28.
After the attaching substrate 24a that is attached mechanism's 46 laminations cools off by cooling body 144, be transferred to prestripping portion 148.In this prestripping portion 148, peel strip 156 rises, and diaphragm 30 can be peeled off from the rear end and the front end of the glass substrate 24 of adjacency thus.Then, in the automatic mechanism for stripping 146 of substrate, under the turning effort of wireline reel 152, basement membrane 26 is reeled continuously from attaching on the substrate 24a.
The glass substrate 24 that peels off basement membrane 26 is disposed at the inspection station of corresponding analyzer 158.Check station at this, under the state of glass substrate 24 positioning and fixing, adopt video camera 160 to read the image of glass substrate 24 and photo-sensitive resin 28.Then,, calculate sticking position, and detect the attaching state by carrying out Flame Image Process.
In addition, for example photonasty plate roller 23a, 23b are being carried out exchanging operation or to being wound in basement membrane 26 on the wireline reel 152 when taking out operation etc., glass substrate 24 is stranded in the 1st heating furnace 82～the 5th heating furnace 90 that constitutes lining heat 45, and the driving of carrying roller 76a～76e stops.
And the carrying roller 76a in for example being judged to be the 1st heating furnace 82 exceeds setting-up time and when stopping, described carrying roller 76a rotation is driven.At this moment, when glass substrate 24 mountings are on carrying roller 76a, each carrying roller 76a is back and forth rotated and make described glass substrate 24 in the 1st heating furnace 82, move back and forth (with reference to Fig. 4).
Specifically, each carrying roller 76a rotates 0.5 respectively by clockwise (positive axis) and counterclockwise (contrary axle) changes～1.5 commentaries on classics, preferably rotates respectively more than 1 commentaries on classics.
On the other hand, when on carrying roller 76a, not having glass substrate 24, described carrying roller 76a one direction is rotated continuously.Therefore, the carrying roller 76a in the 1st heating furnace 82 can not be heated from the top by the 1st well heater 94a above setting-up time under the state that rotation stops.Therefore, can stop reliably owing to the one-sided overheated thermal deformation that produces of the upper side of carrying roller 76a.
Thus, also can only make carrying roller 76a carry out direction rotation or back and forth rotation, can prevent that carrying roller 76a from producing whirling with simple operation.Therefore, can access well and to stop because the conveyance of glass substrate 24 is crooked or shake the damage that causes or owing to such effects such as stopping of causing of conveyance fault.
In addition, in the 2nd heating furnace 84～the 4th heating furnace 88, also the same with described the 1st heating furnace 82, carry out direction rotation or back and forth rotation by making described carrying roller 76b～76d, thereby can prevent that described carrying roller 76b～76d from heating above setting-up time under the state that rotation stops.
And then, as shown in Figure 5, in the 5th heating furnace 90, but have the positioning element 106 of free lifting by working cylinder 98.Like this, the glass substrate 24 on the carrying roller 76e is carried out a direction and is rotated continuously after joining on this positioning element 106 by positioning element 106 risings.Like this, carrying roller 76e can not surpass setting-up time and heat under the state that stops, can obtaining the same effect with described carrying roller 76a.
Yet, because plant failure, the cleaning of rubber rollers 130a, 130b, the replacing of described rubber rollers 130a, 130b or the fault of upstream and downstream operation etc., when lamination treatment stopped than the long certain hour of described setting-up time for example more than 1 hour, the 1st well heater 94a～the 5th well heater 94e that constitutes lining heat 45 closed.Then, when lamination treatment begins once more, before the conveyance of glass substrate 24 begins, make the 1st well heater 94a～the 5th well heater 94e open-minded, and make the carrying roller 76a～76e that constitutes transport mechanism 74 temporarily carry out direction rotation or back and forth rotation, will be heated to set point of temperature respectively in the 1st heating furnace 82～the 5th heating furnace 90 simultaneously.
Therefore, when glass substrate 24 conveyances begin, can be in each carrying roller 76a～76e owing to the one-sided overheated thermal deformation that causes.Therefore, have conveyance glass substrate well 24, effectively carry out the such advantage of lamination treatment.
In addition, in the 1st embodiment,, be not limited only to this, also can adopt 1 photonasty plate roller or the photonasty plate roller more than 3 although adopt 2 photonasty plate roller 23a, 23b.In addition, in the 2nd embodiment that the following describes too.
Fig. 8 is the summary construction diagram of manufacturing installation 300 of the light-sensitive layers body of the 2nd embodiment of the present invention.Adopt identical Reference numeral for the component parts identical, and omit its detailed description with the manufacturing installation 20 of the 1st embodiment.
Manufacturing installation 300 is disposed at the downstream that attaches mechanism 46, and having can be with plate shut-off mechanism 48 between the photonasty plate 22a between each glass substrate 24, substrate that 22b cuts off integratedly.
In the manufacturing installation 300 that so constitutes, the same with described the 1st embodiment, by the attaching substrate 24a conveyance on the arrow C direction that attaches mechanism's 46 laminations.Then, if attach the position that arrives plate shut-off mechanism 48 between corresponding substrate between substrate 24a, then plate shut-off mechanism 48 is rolled up photonasty plate 22a, 22b with 2 simultaneously and is cut off integratedly to move on the arrow C direction with the same conveyance speed of described attaching substrate 24a between this substrate between this attachings substrate 24a.
After this cut off, plate shut-off mechanism 48 turned back to the position of readiness of regulation between substrate, in attaching substrate 24a, basement membrane 26 and remnant 30b was peeled off successively that (the sheet leaf is peeled off (Mei Leaf stripping
)) and produce light-sensitive layers body 208.
Claims (4)
1. substrate heating method, its substrate (24) that will attach photonasty plate (22a) are heated to set point of temperature before handling in advance attaching, and it is characterized in that having:
By transport mechanism (74) a plurality of heating furnaces (80～90) are arrived in described substrate (24) conveyance at intermittence or continuous conveyance, heat the operation of described substrate (24) simultaneously;
When being judged as in described heating furnace (82) that described transport mechanism (74) surpasses setting-up time and when stopping, making the carrying roller (76a) that constitutes described transport mechanism (74) carry out the direction rotation or the reciprocal operation of rotation.
2. substrate heating method as claimed in claim 1 is characterized in that, carries out direction when rotation at described carrying roller (76a) at least, makes described substrate (24) leave described carrying roller (76a) and keeps described substrate (24).
3. substrate heating method as claimed in claim 1 is characterized in that, described carrying roller (76a) is back and forth rotating each more than 0.5 commentaries on classics on positive and negative two directions.
4. substrate heating method as claimed in claim 1 is characterized in that having:
In described heating furnace (82), when described transport mechanism (74) stops above the certain hour of growing than described setting-up time, suspend the operation of the heat treated of described substrate (24);
When the heating of described substrate (24) begins once more, preceding at the beginning described substrate of conveyance (24), the operation that makes described carrying roller (76a) carry out direction rotation or back and forth rotate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006292786 | 2006-10-27 | ||
| JP2006292786A JP2008105354A (en) | 2006-10-27 | 2006-10-27 | Substrate heating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101221353A true CN101221353A (en) | 2008-07-16 |
Family
ID=39439113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007103081975A Pending CN101221353A (en) | 2006-10-27 | 2007-10-25 | Substrate heating method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008105354A (en) |
| KR (1) | KR20080038064A (en) |
| CN (1) | CN101221353A (en) |
| TW (1) | TW200831276A (en) |
-
2006
- 2006-10-27 JP JP2006292786A patent/JP2008105354A/en active Pending
-
2007
- 2007-10-23 TW TW096139647A patent/TW200831276A/en unknown
- 2007-10-25 CN CNA2007103081975A patent/CN101221353A/en active Pending
- 2007-10-26 KR KR1020070108560A patent/KR20080038064A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080038064A (en) | 2008-05-02 |
| JP2008105354A (en) | 2008-05-08 |
| TW200831276A (en) | 2008-08-01 |
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Open date: 20080716 |