CN101205444A - 胶粘剂膜组合物、相关的切割晶片粘结膜以及晶片封装件 - Google Patents
胶粘剂膜组合物、相关的切割晶片粘结膜以及晶片封装件 Download PDFInfo
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- CN101205444A CN101205444A CNA2007101990795A CN200710199079A CN101205444A CN 101205444 A CN101205444 A CN 101205444A CN A2007101990795 A CNA2007101990795 A CN A2007101990795A CN 200710199079 A CN200710199079 A CN 200710199079A CN 101205444 A CN101205444 A CN 101205444A
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Abstract
本发明涉及一种胶粘剂膜组合物、相关的切割晶片粘结膜以及晶片封装件。该胶粘剂膜组合物包含聚酯类热塑性树脂,含至少一个羟基、羧基或环氧基的高弹体树脂,环氧树脂,酚固化剂,潜在催化固化剂或固化催化剂中的一种或多种,硅烷偶联剂,以及填料。
Description
技术领域
本发明涉及胶粘剂膜组合物,尤其涉及用于形成在晶片(die)装配和封装中使用的胶粘剂膜的胶粘剂膜组合物。
背景技术
在晶片装配和封装(例如半导体装配和封装)中使用的胶粘剂膜受到日益增长的关注。举例来说,胶粘剂膜可作为切割膜(dicingfilm)的一部分使用,该切割膜在半导体芯片制造过程的切割操作中用于固定半导体晶圆。使用半导体装配用胶粘剂膜的典型方法可包括:将切割膜层压至半导体晶圆上,然后在切割工序中对半导体晶圆进行切割。切割工序是一个将半导体晶圆切割为单独的半导体晶片即芯片的工序。在切割工序之后,相继进行扩展工序、拾取工序和贴晶片工序。
胶粘剂膜对于半导体制造的应用还可通过将胶粘剂膜作为切割晶片粘结膜的一部分使用来进行扩充,该切割晶片粘结膜是同时用于切割和晶片粘结(即贴晶片)的一种集成膜。但是,在该方法中,拾取工序需要将与胶粘剂层层压在一起的晶片完全拾起,例如从压敏胶粘剂(PSA)层上移除。因此,为了将晶片与PSA层分开,胶粘剂层与晶片间的粘附力水平需要很高。此外,胶粘剂膜作为切割晶片粘结膜使用还需要胶粘剂膜更高的可靠性,例如提高的拉伸强度。另外,胶粘剂膜与晶圆和/或晶片之间界面的品质很重要。举例来说,如果在胶粘剂膜与晶圆和/或晶片之间的界面上形成空隙,所得到的封装晶片的可靠性就会降低。同样,在胶粘剂膜与下层衬底(如印制电路板(PCB))或另一晶片或晶圆之间的界面上形成的空隙也会削弱可靠性。
发明内容
因此,本发明致力于一种胶粘剂膜组合物、相关的切割晶片粘结膜以及晶片封装件,它们基本解决了由于相关领域的局限性和缺点而造成的一种或多种问题。
因此,本发明的一个特征在于提供一种可用于形成胶粘剂膜的胶粘剂膜组合物,该组合物在室温下为固态,并且在粘结晶片时的温度下显示出流动性。
因此,本发明的另一个特征在于提供一种包含该胶粘剂膜的晶片封装件。
本发明的至少一个上述特征以及其他特征和优点可通过提供一种胶粘剂膜组合物来实现,该胶粘剂膜组合物包含聚酯类热塑性树脂,含至少一个羟基、羧基或环氧基的高弹体树脂,环氧树脂,酚固化剂,潜在催化固化剂或固化催化剂中的至少一种,硅烷偶联剂,以及填料。聚酯类热塑性树脂可以是由如下式1表示的均聚物或共聚物:
R1和R2可各自独立地包括具有至少一个碳的碳链,R1和R2可各自独立地被取代或未被取代,并且n在1至约300的范围内。R1可为草酸基、琥珀酰基、对苯二甲酸基、间苯二甲酸基、萘基、二苯基、二苯氧亚乙基、二苯砜基、烷基、苯甲酰基、环烷基或苯基,R2可为烷基、萘基、氢醌基、苯基(benzene group)或苯基(phenyl group),并且R1和R2可各自独立地被取代或未被取代。聚酯类热塑性树脂的软化点可为约0℃~约200℃,重均分子量可为约200~约1,000,000。聚酯类热塑性树脂的软化点可为约30℃~约140℃。
高弹体树脂的重均分子量可为约500~约5,000,000。环氧树脂可包括双酚类环氧树脂、苯酚酚醛清漆类环氧树脂、邻甲酚酚醛清漆类环氧树脂、多官能环氧树脂、胺类环氧树脂、含杂环的环氧树脂、具有取代基的环氧树脂、萘酚类环氧树脂或它们的衍生物中的一种或多种。酚固化剂可包括苯酚酚醛类清漆树脂、聚酚醚(xyloc)类树脂、双酚A类酚醛清漆树脂或甲酚类酚醛清漆树脂中的一种或多种。该组合物可包含潜在催化固化剂,该潜在催化固化剂可包括联苯类酚固化剂或聚酚醚(xylok)类酚固化剂,以及由式2或式3表示的催化剂:
该组合物可包含固化催化剂,该固化催化剂可包括三聚氰胺类固化催化剂、咪唑类固化催化剂或酚类固化催化剂中的一种或多种。硅烷偶联剂可包括含环氧基硅烷或含巯基硅烷中的一种或多种。填料的粒径可为约5nm~约10μm。
基于胶粘剂膜组合物(不计任何溶剂)的总量,聚酯类热塑性树脂的含有量可为约1~约50重量份,高弹体树脂的含有量可为约5~约75重量份,环氧树脂的含有量可为约3~约20重量份,酚固化剂的含有量可为约3~约40重量份,潜在催化固化剂的含有量可为约3~约20重量份,硅烷偶联剂的含有量可为约0.01~约10重量份,并且填料的含有量可为约0.1~约60重量份。基于胶粘剂膜组合物(不计任何溶剂)的总量,聚酯类热塑性树脂的含有量可为约1~约50重量份,高弹体树脂的含有量可为约5~约75重量份,环氧树脂的含有量可为约3~约20重量份,酚固化剂的含有量可为约3~约40重量份,固化催化剂的含有量可为约0.01~约5重量份,硅烷偶联剂的含有量可为约0.01~约10重量份,并且填料的含有量可为约0.1~约60重量份。
该组合物还可包含约5~约85重量份的有机溶剂。该组合物还可包含约0.01~约5重量份的离子俘获剂,其中该离子俘获剂包括三嗪硫醇化合物、锆类化合物、锑铋类化合物或镁铝类化合物中的一种或多种。
本发明的至少一个上述特征以及其他特征和优点还可通过提供一种胶粘剂膜来实现,该胶粘剂膜包含一种部分固化的混合物,该混合物包含聚酯类热塑性树脂,含至少一个羟基、羧基或环氧基的高弹体树脂,环氧树脂,酚固化剂,潜在催化固化剂或固化催化剂中的至少一种,硅烷偶联剂,以及填料。
本发明的至少一个上述特征以及其他特征和优点还可通过提供一种切割晶片粘结膜来实现,该切割晶片粘结膜包含切割膜、胶粘剂膜和压敏胶粘剂层。该压敏胶粘剂层可位于该胶粘剂膜与该切割膜之间。该胶粘剂膜可包含一种部分固化的混合物,该混合物包含聚酯类热塑性树脂,含至少一个羟基、羧基或环氧基的高弹体树脂,环氧树脂,酚固化剂,潜在催化固化剂或固化催化剂中的至少一种,硅烷偶联剂,以及填料。
本发明的至少一个上述特征以及其他特征和优点还可通过提供一种晶片封装件来实现,该晶片封装件包含晶片、胶粘剂膜和衬底,该胶粘剂膜位于该晶片和该衬底之间。该胶粘剂膜可包含一种固化的混合物,该混合物包含聚酯类热塑性树脂,含至少一个羟基、羧基或环氧基的高弹体树脂,环氧树脂,酚固化剂,潜在催化固化剂或固化催化剂中的至少一种,硅烷偶联剂,以及填料。
附图说明
通过对示例性实例进行详细描述并参考随附的附图,本发明的上述及其他特征和优点对于本领域的常规技术人员来说将变得更加明显,其中:
图1A和图1B描绘了本发明封装晶片的方法中的各步骤的截面图;
图2说明了在实施例1-1至1-4和对比例1中使用的组分表;
图3说明了在实施例2-1至2-4和对比例2中使用的组分表;
图4说明了实施例1-1至1-4和实施例2-1至2-4以及对比例1和对比例2的测试结果。
具体实施方式
于2006年12月13日向韩国知识产权局提交的名称为“半导体装配用胶粘剂膜组合物以及使用该组合物制备的胶粘剂膜”的第10-2006-0127293号韩国专利申请的全部内容以参考的方式并入于此。
以下将参考随附的附图对实施例进行更加详细的描述,但是它们仅仅以不同方式进行表征,不应被解释为仅限制为描述于此的实例。更确切地说,提供这些实例是为了使公开更加充分、完整,并且向本领域的技术人员充分展示本发明的范围。
在附图中,各层和各区域的尺寸出于清楚描述的目的而被放大了。还应理解,当提到某一层或某一元件在另一层或衬底“上”时,其可以直接在该另一层或衬底上,或者可以存在中间层。此外,应当理解,当提到某一层在另一层“下方”时,其可以直接在其下,也可以存在一个或多个中间层。另外,还应理解,当提到某一层在两层“之间”时,其可以为两层之间的唯一一层,或还可存在一个或多个中间层。相同的附图标记始终表示相同的元件。
在此使用的表述“至少一个/一种”、“一个/一种或多个/多种”以及“和/或”为开放式的表述,其在使用中同时是连接性和可选性(disjunctive)的。举例来说,表述“A、B和C中的至少一个”、“A、B或C中的至少一个”、“A、B和C中的一个或多个”、“A、B或C中的一个或多个”以及“A、B和/或C”中的每一种都包括如下含义:仅有A,仅有B,仅有C,A和B两者,A和C两者,B和C两者,以及A、B和C三者。此外,除结合使用术语“由……构成”以明确表示相反含义外,这些表述是开放式的。举例来说,表述“A、B和C中的至少一个”还可包括第n个成分,其中n大于3。相反,表述“从由A、B和C构成的组中选出的至少一个”则不是这样。
在此使用的表述“或”并不是“排他性的或”,除非其与术语“不是……就是……”结合使用。举例来说,表述“A、B或C”包括:仅有A,仅有B,仅有C,A和B两者,A和C两者,B和C两者,以及A、B和C三者。相反,表述“不是A、B就是C”则表示仅有A,仅有B,仅有C这三种情况中的一种,而不表示A和B两者,A和C两者,B和C两者,以及A、B和C三者这些情况中的任一种。
在此使用的措辞“一个”和“一种”是开放式的措辞,其可与单数物品或复数物品联用。举例来说,术语“一种固化剂”可表示单一的化合物,如四苯基硼酸四苯基磷盐,或表示多种化合物的组合,如与三苯膦-1,4-苯醌加合物混合在一起的四苯基硼酸四苯基磷盐。
除另有说明外,在此使用的高分子材料的分子量为重均分子量。
除另有说明外,在此使用的语句“基于胶粘剂膜组合物的总量的重量份”未将溶剂计算在内。即,在此使用的参考点“胶粘剂膜组合物的总量”并不包括溶剂。举例来说,当一种组合物由两组分A和B组成,且基于胶粘剂膜组合物的总量A为35重量份、B为65重量份时,在该组合物中添加10重量份溶剂会产生如下结果:基于该胶粘剂膜组合物的总量,该组合物仍然含有35重量份的A和65重量份的B。
图1A和图1B描绘了本发明封装晶片(例如,半导体器件)的方法例中的各步骤的截面图,其中使用切割晶片粘结膜将晶圆切割并将单独的晶片(即芯片)贴附到衬底上。在接下来的描述性实例中,将描述封装半导体晶片的方法。但是,其他类型的芯片或晶片,如光学或电光器件、MEMS器件等,也可类似地进行封装。
参考图1A和图1B,半导体晶圆100可具有在其上制造的多个器件,例如存储器器件、微处理器等。为封装这些器件,需要沿划片线将半导体晶圆100分割,以形成多个晶片100a。该切割工序可包括将完整的未切割的晶圆100与切割晶片粘结膜101(其包括切割膜125和中间胶粘剂层105)层压在一起。切割晶片粘结膜101的胶粘剂层105可使用本发明的胶粘剂膜组合物来形成,详情将描述于下。
切割膜125可包括PSA层115和基膜120。PSA层115例如可以是非固化膜或UV固化膜。基膜120例如可以是氯乙烯膜如PVC或聚烯烃。在一种实施方式中,切割膜125可以通过将PSA层115与基膜120层压在一起来制造。切割晶片粘结膜101可在胶粘剂膜105处贴附到半导体晶圆100上,而PSA层115面对胶粘剂层105并贴附到胶粘剂层105上。
如上所述,晶圆组件需要通过将未切割的晶圆100粘结到包括本发明的胶粘剂层105的切割晶片粘结膜101上形成。然后进行切割工序,以将晶圆100分割成多个晶片100a。该切割工序还将胶粘剂层105分割成了对应于单独晶片100a的部分105a,如切割后的切割晶片粘结膜101’的分离的胶粘剂层105a所示。同样,切割膜125会被部分地分割以形成切割膜125’,使得PSA层115被分割为部分115a,并使得基膜120被部分地分割为部分120a。在整个切割工序中,晶圆100/晶片100a始终保持贴附在切割晶片粘结膜101/101’上。
参考图1B,一个单独的晶片100a可从切割晶片粘结膜101’上被移除。该工序通过将组件曝露于紫外(UV)光下实现,该紫外光使PSA层115a固化,以产生降低了粘附力水平的固化的PSA层115a’。特别是,固化的PSA层115a’对经切割的胶粘剂层105a的粘附力非常低,从而在单独晶片100a的拾取中,经切割的胶粘剂层105a保持贴附在单独晶片100a上而从固化的PSA层115a’上脱离。因此,拾取工序会将单独晶片100a和与其结合的经切割的胶粘剂层105a移除,随后其被贴装在衬底130上,经切割的胶粘剂层105a面对衬底130并与衬底130接触,这样单独晶片100a就贴附到衬底130上。然后进行其后的工序,例如布线、包封等。胶粘剂层105可通过使用本发明的胶粘剂膜组合物来形成,现描述其详情。
本发明的一个实例涉及一种晶片装配用胶粘剂膜组合物,其包含聚酯类热塑性树脂。该胶粘剂膜组合物可包含聚酯类热塑性树脂,含例如羟基、羧基或环氧基中的一个或多个基团的高弹体树脂,环氧树脂,酚固化剂,潜在催化固化剂或固化催化剂中的一种或多种,硅烷偶联剂,以及填料。
胶粘剂膜在室温下可为固态,其可有利地降低胶粘剂膜相对于压敏胶粘剂(PSA)层的粘附力,可在拾取工序中促进拾取。此外,胶粘剂膜可在贴晶片工序的预定的粘结温度下显示出想要水平的流动性,可降低或消除在胶粘剂膜与例如印制电路板(PCB)、晶圆等之间界面上的空隙的生成,可为封装的器件提供高的可靠性。
聚酯类热塑性树脂可有助于形成胶粘剂膜并可增强界面粘附力。在一种实施方式中,聚酯类热塑性树脂的软化点可为约0℃~约200℃,优选30℃~约140℃,并且重均分子量可为约200~约1,000,000,帮助所得到的胶粘剂膜在室温下保持固体状态,可在晶片拾取工序中有助于降低与PSA层之间的粘附力,其可减少晶片拾取错误,并提高晶片的拾取率。另外,包含聚酯类热塑性树脂的胶粘剂膜可在贴晶片工序的预定预粘结温度下显示出想要水平的流动性,其可消除界面空隙,如胶粘剂膜与衬底之间的空隙的生成。
在一种实施方式中,聚酯类热塑性树脂可包括如下式1表示的化合物:
式1中,R1可包括与相邻羰基连接的具有至少一个碳的碳链。R1例如可为来自草酸的草酸基,来自琥珀酸的琥珀酰基,来自对苯二甲酸的对苯二甲酸基,来自间苯二甲酸的间苯二甲酸基,来自2,6-萘二甲酸、2,7-萘二甲酸、1,5-萘二甲酸等的萘基,来自二苯基二甲酸、二苯醚二甲酸、二苯乙烷二甲酸等的二苯基,来自二苯氧亚乙基-4,4-二甲酸的二苯氧亚乙基,来自二苯砜二甲酸的二苯砜基,来自己二酸(adipic acid)、癸二酸、己二酸(hexanedioicacid)、丁烯二酸、乙醇酸等的烷基,来自对氧苯甲酸、对氧乙氧基苯甲酸等的苯甲酰基,来自环己烷二甲酸的环烷基,或来自1,2,4-苯三酸、1,3,5-苯三酸、1,2,4,5-苯四酸等的苯基。这些基团可以是取代的或未取代的。另外,这些基团可单独使用或与一个或多个其他基团结合使用,即,聚酯类热塑性树脂可以是例如上述的R1基团的均聚物或共聚物。
式1中,R2可包括与相邻酯和羟基或羰基连接的具有至少一个碳的碳链。R2例如可为来自乙二醇、丙二醇、季戊四醇、异亚丁基二醇、丁二醇、新戊二醇等的烷基,来自2,6-二羟萘的萘基,来自环己二醇、十氢-4,7-亚甲基-1H-茚-二甲醇、萘二酚等的环烷基,来自氢醌的氢醌基,来自间苯二酚的苯基,来自二羟苯基、二羟苯酯、2,2-双(4-羟苯基)丙烷、二乙氧基双酚A等的苯基,或取代有烷氧基或取代有卤素的具有两个或更多羟基基团的化合物。这些基团可以是取代的或未取代的,并且它们中的每一个可单独使用或与一个或多个其他基团结合使用。式1中,n可为1~约300。
由式1表示的化合物可由第一化合物和第二化合物聚合得到,其中第一化合物在聚合前具有两个或更多羧基并可包含R1,第二化合物在聚合前具有二醇结构并可包含R2。第一化合物和第二化合物可通过如下表示的聚合路线聚合产生式1表示的化合物:
第一化合物和第二化合物中之一或两者可被取代,例如被苯基、硅氧烷基或烷基中的一种或多种取代。当发生这些取代时,取代不能大范围地进行以明显影响整体的聚合反应。第一化合物例如可为草酸、琥珀酸、对苯二甲酸、间苯二甲酸、2,6-萘二甲酸、2,7-萘二甲酸、1,5-萘二甲酸、二苯基二甲酸、二苯醚二甲酸、二苯乙烷二甲酸、二苯氧亚乙基-4,4-二甲酸、二苯砜二甲酸、己二酸、癸二酸、己二酸、丁烯二酸、乙醇酸、对氧苯甲酸、对氧乙氧基苯甲酸、环己烷二甲酸、1,2,4-苯三酸、1,3,5-苯三酸、1,2,4,5-苯四酸等。这些基团可以是取代的或未取代的,并且它们中的每一个可单独使用或与一个或多个其他基团结合使用。
第二化合物例如可为乙二醇、丙二醇、季戊四醇、异亚丁基二醇、丁二醇、新戊二醇、2,6-二羟萘、环己二醇、十氢-4,7-亚甲基-1H-茚-二甲醇、萘二酚、氢醌、间苯二酚、二羟苯基、二羟苯酯、2,2-双(4-羟苯基)丙烷、二乙氧基双酚A、取代有烷氧基或取代有卤素的具有两个或更多羟基基团的化合物等。这些基团可以是取代的或未取代的,并且它们中的每一个可单独使用或与一个或多个其他基团结合使用。
聚酯类热塑性树脂,如由式1表示的化合物,可赋予聚酯树脂在预定预粘结温度下的流动性和粘附力。在一种实施方式中,聚酯类热塑性树脂可具有预定的材料特性,从而其粘度根据温度明显变化,以下将会另加详述。
在一种实施方式中,基于胶粘剂膜组合物的总量,聚酯类热塑性树脂可以约1~约50重量份,优选约10~约30重量份的量来使用。约50重量份或更低的用量可避免膜的拉伸强度的不适当降低,并可简化膜的施用。
高弹体树脂可以是成膜的橡胶成分,例如含羟基、羧基或环氧基的橡胶。高弹体树脂的重均分子量可为约500~约5,000,000。高弹体树脂的例子包括丙烯腈类高弹体、丁二烯类高弹体、苯乙烯类高弹体、丙烯酰类高弹体、异戊二烯类高弹体、乙烯类高弹体、丙烯类高弹体、聚氨酯类高弹体和有机硅类高弹体。
基于胶粘剂膜组合物的总量,高弹体树脂可以约5~约75重量份的量来使用。约5重量份或更高的用量使膜的成形变得容易,约75重量份或更低的用量有助于避免粘附力的不适当降低,并因此提高可靠性。
环氧树脂可以是任何显示出固化和粘附功能的合适环氧树脂。处于固体状态或接近固体状态的环氧树脂对于使胶粘剂膜成形是理想的。具有一个或多个官能团的环氧树脂是特别有用的。
处于固体状态的环氧树脂的例子包括双酚类环氧树脂、苯酚酚醛清漆类环氧树脂、邻甲酚酚醛清漆类环氧树脂、多官能环氧树脂、胺类环氧树脂、含杂环的环氧树脂、具有取代基的环氧树脂、萘酚类环氧树脂以及它们的衍生物。
环氧树脂的具有上述成分的商业制造产品的例子包括如下的物质。双酚类环氧树脂的例子包括:YD-017H、YD-020、YD020-L、YD-014、YD-014ER、YD-013K、YD-019K、YD-019、YD-017R、YD-017、YD-012、YD-011H、YD-011S、YD-011、YDF-2004和YDF-2001,均由Kukdo Chemical Co.,Ltd.(韩国)制造。苯酚酚醛清漆类环氧树脂的例子包括:EPIKOTETM 152和EPIKOTETM 154,均由Hexion SpecialtyChemicals,Inc.(美国)(前身为Yuka-Shell Epoxy Co.,Ltd.和ResolutionPerformance Products,LLC)制造,EPPN-201,由Nippon Kayaku Co.,Ltd.(日本)制造,D.E.N.TM 438,由Dow Chemical Co.(美国)制造,以及YDPN-641、YDPN-638A80、YDPN-638、YDPN-637、YDPN-644和YDPN-631,均由Kukdo Chemical Co.,Ltd.(韩国)制造。邻甲酚酚醛清漆类环氧树脂的例子包括:YDCN-500-1P、YDCN-500-2P、YDCN-500-4P、YDCN-500-5P、YDCN-500-7P、YDCN-500-8P、YDCN-500-10P、YDCN-500-80P、YDCN-500-80PCA60、YDCN-500-80PBC60、YDCN-500-90P和YDCN-500-90PA75,均由KukdoChemical Co.,Ltd.(韩国)制造,EOCN-102S、EOCN-103S、EOCN-104S、EOCN-1012、EOCN-1025和EOCN-1027,均由Nippon Kayaku Co.,Ltd.(日本)制造,YDCN-701、YDCN-702、YDCN-703和YDCN-704,均由TohtoKasei Co.,Ltd.(日本)制造,以及EPICLONN-665-EXP,由Dainippon Ink& Chemicals,Inc.(DIC Corp.)(日本)制造。双酚类酚醛清漆环氧树脂的例子包括:KBPN-110、KBPN-120和KBPN-115,均由Kukdo Chemical Co.,Ltd.(韩国)制造。多官能环氧树脂的例子包括:EPONTM 1031S,由Hexion Specialty Chemicals,Inc.(美国)(前身为Yuka-Shell Epoxy Co.,Ltd.和Resolution Performance Products,LLC)制造,Araldite0163,由CibaSpecialty Chemicals(瑞士)制造,DENACOLEX-611、DENACOLEX-614、DENACOLEX-614B、DENACOLEX-622、DENACOLEX-512、DENACOLEX-521、DENACOLEX-421、DENACOLEX-411和DENACOLEX-321,均由Nagase ChemteX Corp.(前身为NagaseChemicals Ltd.)(日本)制造,以及EP-5200R、KD-1012、EP-5100R、KD-1011、KDT-4400A70、KDT-4400、YH-434L、YH-434和YH-300,均由Kukdo Chemical Co.,Ltd.(韩国)制造。胺类环氧树脂的例子包括:EPIKOTETM 604,由Hexion Specialty Chemicals,Inc.(美国)制造,YH-434,由Tohto Kasei Co.,Ltd.(日本)制造,TETRADX和TETRADC,均由Mitsubishi Gas Chemical Co.,Inc.(日本)制造,以及ELM-120,由SumitomoChemical Co.,Ltd.(日本)制造。含杂环的环氧树脂的一个例子为AralditePT-810。具有取代基的环氧树脂的例子包括:ERL-4234、ERL-4299、ERL-4221和ERL-4206,均由Union Carbide Corp制造。萘酚类环氧树脂的例子包括:EPICLONHP-4032、EPICLONHP-4032D、EPICLONHP-4700和EPICLON4701,均由Dainippon Ink & Chemicals,Inc.(DIC Corp.)(日本)制造。上述的环氧树脂的商业制造产品的例子可单独使用或以两种或更多种的混合物形式使用。
基于胶粘剂膜的总量,环氧树脂可以约3~约20重量份的量来使用。约3重量份或更高的用量可因充分固化的部分而提高可靠性,约20重量份或更低的用量可有助于避免膜的拉伸强度的不适当降低。
酚固化剂可以是任何合适的酚固化剂。特别有用的为在吸湿的情况下具有优异的耐电解腐蚀性的酚固化剂,例如双酚A类固化树脂、双酚F类固化树脂和双酚S类固化树脂,苯酚酚醛清漆树脂、双酚A类酚醛清漆树脂、甲酚酚醛清漆树脂、聚酚醚类酚树脂、联苯类酚树脂等。
酚固化剂的具有上述成分的商业制造产品的例子包括如下的物质。简单的酚固化剂的例子包括:H-1、H-4、HF-1M、HF-3M、HF-4M和HF-45,均由Meiwa Plastic Industries,Ltd.(日本)制造。对二甲苯类固化剂的例子包括:MEH-78004S、MEH-7800SS、MEH-7800S、MEH-7800M、MEH-7800H、MEH-7800HH和MEH-78003H,均由MeiwaPlastic Industries,Ltd.(日本)制造,以及KPH-F3065,由Kolon Chemical Co.,Ltd(韩国)制造。联苯类固化剂的例子包括:MEH-7851SS、MEH-7851S、MEH7851M、MEH-7851H、MEH-78513H和MEH-78514H,均由MeiwaPlastic Industries,Ltd.(日本)制造,以及KPH-F4500,由Kolon Chemical Co.,Ltd(韩国)制造。三苯基甲基类固化剂的例子包括:MEH-7500、MEH-75003S、MEH-7500SS、MEH-7500S和MEH-7500H,均由MeiwaPlastic Industries,Ltd.(日本)制造。上述的酚固化剂的商业制造产品的例子可单独使用或以两种或更多种的混合物形式使用。
基于胶粘剂膜组合物的总量,酚固化剂可以约3~约40重量份的量来使用。酚固化剂约3重量份或更高的用量可因充分固化的部分而提高可靠性,约40重量份或更低的用量可有助于避免膜的拉伸强度的不适当减少。
潜在催化固化剂可以是这样一种固化剂,其中固化催化剂以化学或物理的方式被引入到固化剂中,从而允许长时间保存并在热量的存在下促进固化反应。示例性的潜在催化固化剂包括在联苯类酚固化剂或聚酚醚类酚固化剂中引入了如下式2催化剂(四苯基硼酸四苯基磷盐)或式3催化剂(三苯膦-1,4-苯醌加合物)的那些物质:
潜在催化固化剂的典型例子包括聚酚醚类酚,如MEH-7800C,以及联苯类酚,如MEH-7851C,均由Meiwa Plastic Industries,Ltd.(日本)制造,其可单独使用或以两种或更多种的混合物形式使用。
基于胶粘剂膜组合物的总量,潜在催化固化剂可以约3~约20重量份的量来使用。约20重量份或更低的用量可避免不适当的高固化率,高固化率会降低粘附特性。
固化催化剂可用于缩短固化时间,其可在半导体装配工序中有助于使环氧树脂完全固化。固化催化剂可以是任何合适的催化剂,例如能与三聚氰胺类固化剂、咪唑类固化剂或苯酚类固化剂反应的催化剂。商业制造产品的例子包括咪唑类催化剂,例如AjicurePN-23和PN-40,均由Ajinomoto Co.,Inc.(日本)制造,以及2P4MZ、2MA-OK、2MAOK-PW和2P4MHZ,均由Shikoku Chemicals Corp.(日本)制造,其可单独使用或以两种或更多种的混合物形式使用。
基于胶粘剂膜组合物的总量,固化催化剂可以约0.01~约20重量份,优选约0.01~约5重量份的量来使用。固化催化剂约20重量份或更低的用量可避免保存稳定性的不适当降低。
硅烷偶联剂可以是能提高无机材料(如二氧化硅、晶片或晶圆)表面与胶粘剂膜的树脂之间的粘附力的增粘剂。偶联剂的例子包括含环氧基的2-(3,4-环氧环己基)-乙基三甲氧基硅烷、3-环氧丙氧基三甲氧基硅烷、3-环氧丙氧丙基三乙氧基硅烷、3-环氧丙氧丙基三乙氧基硅烷,含胺基的N-(2-氨乙基)-3-氨丙基甲基二甲氧基硅烷、N-(2-氨乙基)-3-氨丙基三甲氧基硅烷、N-(2-氨乙基)-3-氨丙基三乙氧基硅烷、3-氨丙基三甲氧基硅烷、3-氨丙基三乙氧基硅烷、3-三乙氧基甲硅烷基-N-(1,3-二甲基亚丁基)丙胺、N-苯基-3-氨丙基三甲氧基硅烷,含巯基的3-巯基丙基甲基二甲氧基硅烷、3-巯基丙基三乙氧基硅烷,以及含异氰酸酯基的3-异氰酸酯丙基三乙氧基硅烷,它们可单独使用或以两种或更多种的混合物形式使用。
基于胶粘剂膜组合物的总量,硅烷偶联剂可以约0.01~约10重量份的量来使用。硅烷偶联剂约10重量份或更低的用量可有助于避免膜的粘附力和拉伸强度的不适当降低。
根据特定的应用,填料可包括无机填料或有机填料。可使用任何合适的填料。无机填料可包括金属,如金粉、银粉、铜粉和/或镍,以及非金属,如氧化铝、氢氧化铝、氢氧化镁、碳酸钙、碳酸镁、硅酸钙、硅酸镁、氧化钙、氧化镁、氧化铝、氮化铝、二氧化硅、氮化硼、二氧化钛、玻璃、氧化铁和/或陶瓷。有机填料例如可以包括碳、橡胶填料和/或聚合物。
还可使用无机填料,如球形二氧化硅和无定形二氧化硅,其粒径为约5nm~约10μm。使用粒径为约10μm或更小的无机填料可有助于避免半导体器件中电路的损伤。
基于胶粘剂膜组合物的总量,填料可以约0.1~约60重量份的量来使用。当胶粘剂膜被用来粘结相似的芯片时,填料的量可为约0.1~约30重量份,而当胶粘剂膜被用来粘结不同的芯片时,填料的量可为约10~约60重量份。约60重量份或更低的用量可有助于避免膜成形时发生困难,并可避免膜的拉伸强度的不适当降低。
胶粘剂膜组合物中还可包含有机溶剂,其可降低胶粘剂膜组合物的粘度并有利于膜的制备。有机溶剂可以是合适的溶剂,例如甲苯、二甲苯、丙二醇单甲醚乙酸酯、苯、丙酮、甲乙酮、四氢呋喃、二甲基甲酰胺或环己酮。溶剂可以是单一溶剂,也可以是多种溶剂的混合物。
相对于上述胶粘剂膜组合物的成分,溶剂的用量优选为约5~约85重量份。有机溶剂的量可根据组合物的粘度而定。通常,有机溶剂的用量可为约20~约60重量份,这样可提供稳定的膜。
胶粘剂膜组合物还可包含离子俘获剂,用来消除离子性杂质,并提高由胶粘剂膜组合物提供的绝缘特性的可靠性。离子俘获剂可以是任何合适的试剂,例如三嗪硫醇化合物、锆类化合物、锑/铋类化合物或镁/铝类化合物。
基于胶粘剂膜组合物的总量,离子俘获剂可以约0.01~约5重量份的量来使用。大量离子俘获剂的使用是不希望的,因为这会导致离子俘获剂本身成为一种杂质。
本发明还涉及使用该胶粘剂膜组合物制备的胶粘剂膜。该胶粘剂膜可以是使用该胶粘剂膜组合物制备的部分固化的混合物。胶粘剂膜在室温下可显示出非常好的固态特性,有利于晶片在PSA层上的拾取。此外,在预定的粘结温度下,流动性会增加,从而在例如60℃~80℃的条件下贴装晶圆时,可提供相对于晶圆强的粘附力。另外,在贴晶片工序中,由于胶粘剂膜的流动性,胶粘剂膜可使对面的PCB或晶圆的粗糙表面变得均匀,有助于使空隙的生成减到最小,并可有效地封入线路。因此,可提供高度可靠的半导体装配用胶粘剂膜。
本发明还涉及用于半导体装配的切割晶片粘结膜,其包含上述的胶粘剂膜。切割晶片粘结膜可在将胶粘剂膜贴附到半导体晶圆的背面的过程中使空隙的生成减到最小。本发明还涉及使用上述胶粘剂膜制备的晶片封装件,其中胶粘剂膜被固化。因此,当切割晶片粘结膜在成膜过程中例如通过干燥而部分固化时,切割晶片粘结膜在晶片封装件中被固化了,即完全固化,例如,在环氧树脂模塑工序中被固化。
提供如下实施例和对比例以描述本发明一个或多个实例的特别详情。但是,应当认识到,这些实例并不局限于所描述的特别详情。
[实施例1-1至1-4,实施例2-1至2-4,以及对比例1和对比
例2]
将如下列出的组分(如图2和图3所示)添加到配备有高速搅拌棒的1升圆筒状烧瓶中,然后以4000rpm的速度快速分散20分钟,从而制备组合物,随后,使用50μm的滤囊(capsule filter)过滤。使用涂布器将每种经过滤的组合物涂布成60μm的厚度以制备胶粘剂膜,此后将胶粘剂膜在60℃下干燥20分钟,接着在90℃下干燥20分钟,然后于室温下放置一天。
[实施例1-1]
(a)4g聚酯热塑性树脂(Elitel UE3320,由Unitika,Ltd.(日本)制造),
(b)60g含羧基和羟基的高弹体树脂(KLS-1013,由Fujikura KaseiCo.,Ltd.(日本)制造),
(c)11g甲酚酚醛清漆类环氧树脂(YDCN-500-90P,由KukdoChemical Co.,Ltd.(韩国)制造)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020,由Nippon Kayaku Co.,Ltd.(日本)制造),
(d)17g联苯类酚固化剂(KPH-F4500,由Kolon Chemical Co.,Ltd(韩国)制造),
(e)0.2g咪唑类固化催化剂(2P4MZ,由Shikoku Chemicals Corp.(日本)制造),
(f)0.5g巯基硅烷偶联剂(KBM-803,由Shin-Etsu Chemical Co.,Ltd.(日本)制造)和0.5g环氧硅烷偶联剂(KBM-303,由Shin-Etsu ChemicalCo.,Ltd.(日本)制造),和
(g)14g无定形二氧化硅(AEROSILR-972,由Evonik DegussaGmbH,前身为Degussa GmbH(德国)制造)。
[实施例1-2]
(a)8g聚酯热塑性树脂(UE3320),
(b)56g含羧基和羟基的高弹体树脂(KLS-1013),
(c)11g甲酚酚醛清漆类环氧树脂(YDCN-500-90P)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(d)17g联苯类酚固化剂(KPH-F4500),
(e)0.2g咪唑类固化催化剂(2P4MZ),
(f)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(g)14g无定形二氧化硅(AEROSILR-972)。
[实施例1-3]
(a)15g聚酯热塑性树脂(UE3320),
(b)49g含羧基和羟基的高弹体树脂(KLS-1013),
(c)11g甲酚酚醛清漆类环氧树脂(YDCN-500-90P)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(d)17g联苯类酚固化剂(KPH-F4500),
(e)0.2g咪唑类固化催化剂(2P4MZ),
(f)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(g)14g无定形二氧化硅(AEROSILR-972)。
[实施例1-4]
(a)23g聚酯热塑性树脂(UE3320),
(b)41g含羧基和羟基的高弹体树脂(KLS-1013),
(c)11g甲酚酚醛清漆类环氧树脂(YDCN-500-90P)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(d)17g联苯类酚固化剂(KPH-F4500),
(e)0.2g咪唑类固化催化剂(2P4MZ),
(f)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(g)14g无定形二氧化硅(AEROSILR-972)。
[实施例2-1]
(a)4g聚酯热塑性树脂(Adhesion Resin 2440,由Evonik DegussaGmbH,前身为Degussa GmbH(德国)制造),
(b)34g含羧基和羟基的高弹体树脂(SG-708-6,由NagaseChemteX Corp.(日本)制造),
(c)11g甲酚酚醛清漆类环氧树脂(YDCN-500-5P,由KukdoChemical Co.,Ltd.(韩国)制造)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(d)15g联苯类酚固化剂(KPH-F4500,由Kolon Chemical Co.,Ltd.制造),
(e)5g聚酚醚类潜在固化催化剂(MEH-7800C,由Meiwa PlasticIndustries制造),
(f)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(g)34g球形二氧化硅填料(PLV-3,由Tatsumori Ltd.制造)。
[实施例2-2]
(a)8g聚酯热塑性树脂(Adhesion Resin 2440),
(b)30g含羧基和羟基的高弹体树脂(SG-708-6),
(c)11g甲酚酚醛清漆类环氧树脂(YDCN-500-5P)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(d)15g联苯类酚固化剂(KPH-F4500),
(e)5g聚酚醚类潜在固化催化剂(MEH-7800C),
(f)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(g)34g球形二氧化硅填料(PLV-3)。
[实施例2-3]
(a)15g聚酯热塑性树脂(Adhesion Resin 2440),
(b)23g含羧基和羟基的高弹体树脂(SG-708-6),
(c)11g甲酚酚醛清漆类环氧树脂(YDCN-500-5P)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(d)15g联苯类酚固化剂(KPH-F4500),
(e)5g聚酚醚类潜在固化催化剂(MEH-7800C),
(f)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(g)34g球形二氧化硅填料(PLV-3)。
[实施例2-4]
(a)23g聚酯热塑性树脂(Adhesion Resin 2440),
(b)15g含羧基和羟基的高弹体树脂(SG-708-6),
(c)11g甲酚酚醛清漆类环氧树脂(YDCN-500-5P)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(d)15g联苯类酚固化剂(KPH-F4500),
(e)5g聚酚醚类潜在固化催化剂(MEH-7800C),
(f)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(g)34g球形二氧化硅填料(PLV-3)。
[对比例1和对比例2]
除不使用聚酯类热塑性树脂外,分别使用实施例1-1和实施例2-1的组分来制备第一对比胶粘剂膜组合物和第二对比胶粘剂膜组合物。使用如此获得的每种组合物以制备胶粘剂膜。制备的详情描述如下。
[对比例1]
(a)64g含羧基和羟基的高弹体树脂(KLS-1013),
(b)11g甲酚酚醛清漆类环氧树脂(YDCN-500-90P)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(c)17g联苯类酚固化剂(KPH-F4500),
(d)0.2g咪唑类固化催化剂(2P4MZ),
(e)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(f)14g无定形二氧化硅(AEROSILR-972)。
[对比例2]
(a)38g含羧基和羟基的高弹体树脂(SG-708-6),
(b)11g甲酚酚醛清漆类环氧树脂(YDCN-500-5P)和10g甲酚酚醛清漆和联苯类环氧树脂(CER-1020),
(c)15g联苯类酚固化剂(KPH-F4500),
(d)5g聚酚醚类潜在固化催化剂(MEH-7800C),
(e)0.5g巯基硅烷偶联剂(KBM-803)和0.5g环氧硅烷偶联剂(KBM-303),和
(f)34g球形二氧化硅填料(PLV-3)。
[实施例和对比例的胶粘剂膜的特性评价]
按如下方式评价实施例1-1至1-4和实施例2-1至2-4以及对比例1和对比例2中每一种胶粘剂膜的特性。结果示于图4。为评价拾取的成功率,测定图4中UV辐射前后的胶粘剂层与PSA层之间的180°剥离强度。结果同样示于图4。
(1)180°剥离强度(胶粘剂层与PSA层之间)
为测定胶粘剂膜与PSA层之间的粘附力,在室温(25℃)下将胶粘剂膜与切割膜层压在一起,放置1小时,然后使用尺寸为15mm×70mm的矩形膜测量180°剥离强度。切割膜通过将10μm厚的一层UV可固化的PSA涂布在100μm厚的聚烯烃膜上来制备。在UV固化前,切割膜的粘性值为130gf,而在UV固化后为60gf。当施敷到由不锈钢(SUS 304)构成的样品上时,在UV固化前,切割膜的180°剥离值为300dyne/mm,而在UV固化后,切割膜的180°剥离值为900dyne/mm。
(2)180°剥离强度(胶粘剂层与晶圆之间)
为测定晶圆与胶粘剂膜之间的粘附力,每张膜在室温(25℃)下形成,放置1小时,在60℃下以0.2MPa的辊压和20m/s的速度与尺寸为25mm×70mm的晶圆(720μm厚)层压在一起,然后测量180°剥离强度。
(3)粘度
为测定胶粘剂膜的粘度,每张膜在60℃下被层压为四层,并切割成直径为8mm的圆形。胶粘剂膜的厚度为约200μm~约240μm。在30℃~100℃的范围内以5℃/分钟的加热速率测量粘度。图3中,60℃的粘度(η)值可用于评价在晶圆贴装工序中晶圆与胶粘剂膜之间的粘附力,而100℃的η值可用于评价贴晶片的温度下的流动性。100℃下的η值表明,在贴晶片工序中待装配的芯片上,膜的流动性将会增加,这将抑制空隙的生成,并有助于有效地用膜来封入线路。
(4)贴晶片之后的空隙
将晶圆(720μm厚并用二氧化物膜涂布)切割成5mm×5mm的大小,在60℃下与各自的胶粘剂膜层压在一起,并对粘贴的部分之外的部分进行切割。将另一块720μm厚、尺寸为10mm×10mm的晶圆放置在100℃的热板上。将与各自的胶粘剂膜层压在一起的晶圆片与该10mm×10mm的晶圆贴在一起。接下来,用1kg·f的力对这两块晶圆施压20秒,然后在125℃下1小时接着在175℃下3小时使其完全固化。接下来,使用超声波断层扫描摄影装置(SAT)来观察晶圆之间胶粘剂膜的空隙状态。
如图4所述,与不具有聚酯类热塑性树脂的对比例1和对比例2的胶粘剂膜相比,具有聚酯类热塑性树脂的实施例1-1至1-4和实施例2-1至2-4的胶粘剂膜显示出在UV固化前后均降低了的胶粘剂层与PSA层之间的180°剥离强度。当聚酯类热塑性树脂的量增加时,180°剥离强度进一步降低。据信这是由于含有聚酯类热塑性树脂的膜在室温下显示出固态特性的缘故,这意味着在热塑性树脂的量更高时,膜的外表面的硬度会增加。因此,在半导体拾取时,与PSA层的粘附程度降低,导致增加的拾取成功率。
为获得高的拾取成功率,胶粘剂层与晶圆之间的粘附力必须高于胶粘剂层与PSA层之间的粘附力。此外,由于UV辐射前后的180°剥离强度的差值增大,拾取成功率也会得到改善。如图4所示,与对比例1和对比例2中不具有聚酯类热塑性树脂的胶粘剂膜相比,实施例1-1至1-4和实施例2-1至2-4中具有聚酯类热塑性树脂的胶粘剂膜的胶粘剂层与晶圆之间的180°剥离强度增加了。当聚酯类热塑性树脂的量增加时,180°剥离强度进一步增加。据信这是由于与图4中用于晶圆贴装的60℃下粘度相应的η值因胶粘剂膜中的聚酯类热塑性树脂而明显增加了,从而增加了晶圆的可润湿性,并增加了与晶圆之间的粘附力,因此确实地影响了拾取成功率。
如图4明显所示,与对比例1和对比例2中不具有聚酯类热塑性树脂的胶粘剂膜相比,实施例1-1至1-4和实施例2-1至2-4中具有聚酯类热塑性树脂的胶粘剂膜不论在代表贴晶片的100℃下粘度的η值方面还是形成空隙的可能性方面都得到了降低。不具有聚酯类热塑性树脂的树脂的60℃以上的粘度变化非常低,显示出低的流动性,并产生空隙。相反,实施例1-1至1-4和实施例2-1至2-4中具有聚酯类热塑性树脂的树脂的粘度下降程度更大,并且很少产生空隙。
如在此所描述的,本发明的实施例提供了胶粘剂膜组合物和使用该组合物制备的胶粘剂膜。该胶粘剂膜组合物包含聚酯类热塑性树脂,因此胶粘剂膜在室温下显示出优异的固态特性,即变得更硬,并降低了与PSA层的粘附力。由于膜的流动性在预定的粘结温度(如,约50℃~约80℃)下非常好,膜的粘度在晶圆贴装时会显著降低,从而增大了与晶圆的粘附力。此外,在半导体装配工序中,被胶粘剂层与PSA层之间的粘附水平左右的拾取成功率因膜表面的硬度而会降低。此外,膜在高温下会显示出高的流动性,因此相对于衬底的粗糙表面提供了优异的结果,膜在贴晶片时变得更加均匀,并使高温下贴晶片时的空隙的产生降至最低。此外,例如PCB或布线器件的粗糙表面会被有效地封入,以提供显示出高可靠性和可加工性的半导体装配用胶粘剂膜。
本发明的实施例在此已公开,尽管使用了特殊的术语,它们应仅在一般的描述性意义上使用并解释而不用于限制。因此,本领域的技术人员可以理解,在不背离随附的权利要求书中描述的本发明的精神和范围的情况下,可以进行形式和细节上的各种改变。
Claims (21)
1.一种胶粘剂膜组合物,包含:
聚酯类热塑性树脂;
含至少一个羟基、羧基或环氧基的高弹体树脂;
环氧树脂;
酚固化剂;
潜在催化固化剂或固化催化剂中的至少一种;
硅烷偶联剂;以及
填料。
2.权利要求1所述的组合物,其中所述聚酯类热塑性树脂是由下式1表示的均聚物或共聚物:
其中:
R1和R2各自独立地包括具有至少一个碳的碳链,
R1和R2各自独立地被取代或未被取代,并且
n在1至约300的范围内。
3.权利要求2所述的组合物,其中:
R1是草酸基、琥珀酰基、对苯二甲酸基、间苯二甲酸基、萘基、二苯基、二苯氧亚乙基、二苯砜基、烷基、苯甲酰基、环烷基或苯基,
R2是烷基、萘基、氢醌基、苯基或苯基,并且
R1和R2各自独立地被取代或未被取代。
4.权利要求2所述的组合物,其中所述聚酯类热塑性树脂的软化点为约0℃~约200℃,重均分子量为约200~约1,000,000。
5.权利要求4所述的组合物,其中所述聚酯类热塑性树脂的软化点为约30℃~约140℃。
6.权利要求1所述的组合物,其中所述高弹体树脂的重均分子量为约500~约5,000,000。
7.权利要求1所述的组合物,其中所述环氧树脂包括双酚类环氧树脂、苯酚酚醛清漆类环氧树脂、邻甲酚酚醛清漆类环氧树脂、多官能环氧树脂、胺类环氧树脂、含杂环的环氧树脂、具有取代基的环氧树脂、萘酚类环氧树脂或它们的衍生物中的一种或多种。
8.权利要求7所述的组合物,其中所述酚固化剂包括苯酚酚醛类清漆树脂、聚酚醚类树脂、双酚A类酚醛清漆树脂或甲酚类酚醛清漆树脂中的一种或多种。
10.权利要求8所述的组合物,其中:
该组合物包含固化催化剂,并且
该固化催化剂包括三聚氰胺类固化催化剂、咪唑类固化催化剂或酚类固化催化剂中的一种或多种。
11.权利要求1所述的组合物,其中所述硅烷偶联剂包括含环氧基硅烷或含巯基硅烷中的一种或多种。
12.权利要求11所述的组合物,其中所述填料的粒径为约5nm~约10μm。
13.权利要求1所述的组合物,其中,基于不计任何溶剂的所述胶粘剂膜组合物的总量:
所述聚酯类热塑性树脂的含有量为约1~约50重量份,
所述高弹体树脂的含有量为约5~约75重量份,
所述环氧树脂的含有量为约3~约20重量份,
所述酚固化剂的含有量为约3~约40重量份,
所述潜在催化固化剂的含有量为约3~约20重量份,
所述硅烷偶联剂的含有量为约0.01~约10重量份,并且
所述填料的含有量为约0.1~约60重量份。
14.权利要求13所述的组合物,该组合物还包含约5~约85重量份的有机溶剂。
15.权利要求13所述的组合物,该组合物还包含约0.01~约5重量份的离子俘获剂,其中该离子俘获剂包括三嗪硫醇化合物、锆类化合物、锑铋类化合物或镁铝类化合物中的一种或多种。
16.权利要求1所述的组合物,其中,基于不计任何溶剂的所述胶粘剂膜组合物的总量:
所述聚酯类热塑性树脂的含有量为约1~约50重量份,
所述高弹体树脂的含有量为约5~约75重量份,
所述环氧树脂的含有量为约3~约20重量份,
所述酚固化剂的含有量为约3~约40重量份,
所述固化催化剂的含有量为约0.01~约5重量份,
所述硅烷偶联剂的含有量为约0.01~约10重量份,并且
所述填料的含有量为约0.1~约60重量份。
17.权利要求16所述的组合物,该组合物还包含约5~约85重量份的有机溶剂。
18.权利要求16所述的组合物,该组合物还包含约0.01~约5重量份的离子俘获剂,其中该离子俘获剂包括三嗪硫醇化合物、锆类化合物、锑铋类化合物或镁铝类化合物中的一种或多种。
19.一种胶粘剂膜,包含一种部分固化的混合物,该混合物包含:
聚酯类热塑性树脂;
含至少一个羟基、羧基或环氧基的高弹体树脂;
环氧树脂;
酚固化剂;
潜在催化固化剂或固化催化剂中的至少一种;
硅烷偶联剂;以及
填料。
20.一种切割晶片粘结膜,包含:
切割膜;
胶粘剂膜;和
压敏胶粘剂层,其中:
该压敏胶粘剂层位于该胶粘剂膜与该切割膜之间,并且
该胶粘剂膜包含一种部分固化的混合物,该混合物包含:
聚酯类热塑性树脂;
含至少一个羟基、羧基或环氧基的高弹体树脂;
环氧树脂;
酚固化剂;
潜在催化固化剂或固化催化剂中的至少一种;
硅烷偶联剂;以及
填料。
21.一种晶片封装件,包含:
晶片;
胶粘剂膜;和
衬底,该胶粘剂膜位于该晶片和该衬底之间,其中该胶粘剂膜包含一种固化的混合物,该混合物包含:
聚酯类热塑性树脂;
含至少一个羟基、羧基或环氧基的高弹体树脂;
环氧树脂;
酚固化剂;
潜在催化固化剂或固化催化剂中的至少一种;
硅烷偶联剂;以及
填料。
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KR1020060127293A KR100800214B1 (ko) | 2006-12-13 | 2006-12-13 | 반도체 조립용 접착 필름 조성물 및 접착 필름 |
KR1020060127293 | 2006-12-13 |
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Country Status (5)
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US (1) | US7863758B2 (zh) |
JP (1) | JP4885834B2 (zh) |
KR (1) | KR100800214B1 (zh) |
CN (1) | CN101205444B (zh) |
TW (1) | TWI400314B (zh) |
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- 2007-12-10 TW TW96146957A patent/TWI400314B/zh not_active IP Right Cessation
- 2007-12-11 JP JP2007319478A patent/JP4885834B2/ja not_active Expired - Fee Related
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Also Published As
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TWI400314B (zh) | 2013-07-01 |
CN101205444B (zh) | 2012-06-13 |
JP4885834B2 (ja) | 2012-02-29 |
US7863758B2 (en) | 2011-01-04 |
KR100800214B1 (ko) | 2008-02-01 |
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US20080145668A1 (en) | 2008-06-19 |
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