CN101201549A - A device and method for focusing and leveling based on a microlens array - Google Patents
A device and method for focusing and leveling based on a microlens array Download PDFInfo
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- CN101201549A CN101201549A CNA200710178468XA CN200710178468A CN101201549A CN 101201549 A CN101201549 A CN 101201549A CN A200710178468X A CNA200710178468X A CN A200710178468XA CN 200710178468 A CN200710178468 A CN 200710178468A CN 101201549 A CN101201549 A CN 101201549A
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 210000001747 pupil Anatomy 0.000 claims abstract description 22
- 238000001514 detection method Methods 0.000 claims abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 43
- 229910052710 silicon Inorganic materials 0.000 claims description 43
- 239000010703 silicon Substances 0.000 claims description 43
- 238000005457 optimization Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- 238000000691 measurement method Methods 0.000 claims 1
- 238000012876 topography Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 12
- 238000003384 imaging method Methods 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 8
- 238000012634 optical imaging Methods 0.000 description 7
- 239000004606 Fillers/Extenders Substances 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- 238000007493 shaping process Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 241001248531 Euchloe <genus> Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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Abstract
本发明公开了一种基于微透镜阵列调焦调平的方法与装置，属于光电检测技术领域。本发明包括发射部分和接收部分。其中发射部分包括光源、聚焦透镜、针孔滤波器、扩束透镜、优化入瞳器件、微透镜阵列，转向反射镜；接收部分包括转向反射镜、微透镜阵列、聚焦透镜、微光机电系统(OMEMS)扫描反射镜、针孔滤波器和探测器。本发明采用优化入瞳器件控制通光量来改善测量光斑，或者通过开关状态控制成像点的数量来适应不同曝光视场；采用微透镜阵列替代狭缝阵列；采用微光机电系统(OMEMS)扫描反射镜替代单镜扫描；采用差分接收方法，降低对光源稳定性的要求，获得更高的测量精度。
The invention discloses a focusing and leveling method and device based on a microlens array, belonging to the technical field of photoelectric detection. The invention includes a transmitting part and a receiving part. The transmitting part includes light source, focusing lens, pinhole filter, beam expander lens, optimized pupil device, microlens array, and steering mirror; the receiving part includes steering mirror, microlens array, focusing lens, micro-opto-electromechanical system ( OMEMS) scanning mirrors, pinhole filters and detectors. The present invention adopts the optimal pupil device to control the amount of light to improve the measurement spot, or controls the number of imaging points through the switch state to adapt to different exposure fields of view; uses a microlens array instead of a slit array; uses a micro-opto-electromechanical system (OMEMS) to scan reflection The single-mirror scanning is replaced by a single mirror; the differential receiving method is adopted to reduce the requirement for the stability of the light source and obtain higher measurement accuracy.
Description
Technical field
The present invention relates to a kind of focusing and leveling detection method and device that is applied in the projection lithography system, its major function is that high Precision Detection is carried out with respect to the distance and the silicon chip two-dimensional tilting angle of projection objective in the surface of exposure silicon chip, particularly a kind of have a simultaneously-measured focusing and leveling sensor of multiple spot, belongs to the optical measurement field.
Background technology
In projection lithography system, the silicon chip focusing, leveling measuring system is used for measuring height and corner (Z, the θ of silicon chip surface with respect to projection objective in litho machine
XAnd θ
Y), constitute feedback system with vertical 3 actuators of work stage, control the vertical position of silicon chip in real time, guarantee that silicon chip is in the focal depth range of projection objective in exposure process all the time when the front court.In the step and repeat projection litho machine in the early stage, the leveling of silicon chip only needs whole focusing and leveling, promptly in chip transmission the whole silicon wafer surface is positioned in the focal depth range.Raising along with step and repeat projection litho machine resolution and throughput rate, need to adopt to increase the surface form deviation that causes by a focusing and leveling with the quick shortening that adapts to effective depth of focus and die size and become big, the area of silicon wafer in the exposure visual field is positioned in effective focal depth range.Begin to be applied to now to have become a gordian technique of advanced scanning projecting photoetching machine in the step and repeat projection litho machine of sub-half-micron resolution by a focusing and leveling.Rapid increase along with the integrated level of integrated circuit, the lines that expose are also more and more carefully more and more closeer, the resolution of projection objective improves constantly, depth of focus is also constantly reducing, want to make the corresponding surface of the silicon chip that will expose to remain in the depth of focus, the measuring accuracy of focusing and leveling sensor-based system and stability have also been proposed more and more higher requirement.Optical non-contact multimetering focusing and leveling method at present commonly used mainly contains three major types: 1) based on the multimetering method of the slit array [method that Japanese Nikon company adopts, SusumuMori.Higher NA ArF Scanning Exposure Tool on New Platform for further 100nmTechnology Node, 2001, SPIE, 4346,651]; 2) based on the multiple spot imaging method of pinhole array [method that Japanese Canon company adopts, U.S. Patent number: 6081614]; 3) based on the Moire fringe technique of many gratings [method that Dutch ASML company adopts, U.S. Patent number: 5191200].The focusing and leveling system that this three big litho machine manufacturer adopts all is based on the photoelectric measurement sensor-based system.These systems adopt identical, equally distributed measurement hot spot, and its measuring characteristic is respectively arranged.Wherein first method is that slit array is imaged on the measured object surface by same optical imaging system, again by the imaging of another one optical imaging system, seeing through a reception slit array incides on the detector, by out of focus hot spot is influenced, survey the light intensity that every bit receives.Specifically see also Fig. 1, incident light 1 sees through slit array 2, through optical imaging system 3, catoptron 4, optical imaging system 5 and catoptron 6, slit array is imaged on measured silicon chip surface 7, picture seven row seven row of slit cover whole exposure visual field 20, as shown in Figure 2 on silicon chip.Slit image on the silicon chip once more by catoptron 8, optical imaging system 9, optical imaging system 10, through scanning reflection mirror 11 reflections, is seen through parallel-plate 12 and slit array 13 and incides on the detector 14 again.By scanning reflection mirror 11 scanning modulation, on detector 14, obtain each picture and see through the variation of slit array 12 energy, thereby obtain the information of silicon chip surface.There is the deficiency of the following aspects in this technology: at first, many slit array are imaged onto on same by same imaging system, need consider big view field imaging problem during optical design, have increased the optical design difficulty; Secondly, single scanning reflection mirror sees through the reception slit array to all luminous points and unifies scanning, is difficult to improve the spot measurement precision, thereby has reduced The measuring precision; The 3rd, adopt scanning to receive each point light intensity method, to the stability requirement of light source own also than higher.
Summary of the invention
The present invention has proposed a kind ofly based on the microlens array imaging system on the basis of prior art [1], reduces the difficulty of system optics design.And utilize single scanning catoptron mode in Micro-Opto-Electro-Mechanical Systems (OMEMS) the scanning reflection mirror substitute technology [1], improve the spot measurement precision; Utilize the differential received method to substitute single reception, reduced requirement, and improved Measurement Resolution light source stability.The use of these new technologies, the measuring accuracy and the entire system adaptability of raising total system.
Technical scheme of the present invention is as follows:
The present invention is used for projection mask aligner's focusing and leveling measuring system, comprises the two large divisions: radiating portion, receiving unit.Radiating portion, receiving unit wherein radiating portion comprise that light source, condenser lens, pinhole filter, extender lens, optimization goes into pupil device, microlens array, steering reflection mirror; Receiving unit comprises steering reflection mirror, microlens array, condenser lens, Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror, pinhole filter and detector; Annexation between each parts is seen Fig. 3, and light source focuses on pinhole filter through condenser lens; Light sees through pinhole filter, by extender lens, becomes directional light, sees through to optimize pupil device; Go into the pupil device back in optimization and place microlens array, each lenticule is aimed at respectively from optimizing gone into the light that pupil device sees through; The light that sees through microlens array reflexes to silicon chip surface through steering reflection mirror; Through silicon chip and steering reflection mirror reflection, see through the another one microlens array, focus on and the mirror reflection of Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection through condenser lens again, see through pinhole filter, incide on the detector.Adopt to optimize go into the logical light quantity of pupil device control and improve the measurement hot spot, perhaps the quantity that is controlled to picture point by on off state adapts to different exposures visual fields; Adopt microlens array to substitute slit array; Adopt Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror to substitute single mirror scanning; Adopt the differential received method, reduce requirement, obtain higher measuring accuracy light source stability.
Can substitute with liquid crystal light valve and optimize pupil device.
Microlens array is the microlens array that is in the microlens array of the different focal in the same plane or is in identical focusing in the Different Plane.
Light source is the hybrid light source of little white light source or infrared wideband laser light source or different wavelength of laser device array.
Steering reflection mirror is plane mirror or reflecting prism.
Detector is the silicon photodetector array of single CCD or multiwindow ccd array or multiwindow.
Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror is one-dimensional scanning or two-dimensional scan.
A kind of focusing leveling measuring method of the present invention based on the microlens array focusing and leveling, step is:
(1) light source passes through shaping, is focused into by condenser lens and is mapped to pinhole filter, expands bundle through extender lens again;
(2) directional light that expands after restrainting is gone into the logical light quantity of pupil device control by optimizing;
(3) utilize microlens array to aim at corresponding parallel beam in the back, light sees through microlens array;
(4) focus on the tested silicon chip surface through plane mirror again;
(5) silicon chip surface reflects light, passes through plane mirror again, sees through the another one microlens array;
(6) through the light of microlens array,, see through pinhole filter, on the incident detector again through a condenser lens and plane mirror reflects;
(7) signal of photodetector output, through promptly obtaining the position pattern information of tested silicon chip surface after the signal Processing, drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
The receiving unit detection principle can be the difference detecting principle.
The light that sends from light source expands bundle through beam shaping, spatial filtering, goes into pupil device through optimization again and controls each lenticular logical light quantity, sees through microlens array, is imaged on the tested silicon chip face through steering reflection mirror again., incide on the detector through another one steering reflection mirror, reception microlens array, condenser lens, Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror, pinhole filter from tested silicon chip surface light reflected.The signal of photodetector output, through promptly obtaining the position pattern information of tested silicon chip surface after the signal Processing, drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
Pupil device is gone in described optimization can optimize each lenticular logical light quantity, optimizes optical quality on silicon chip, can also utilize it single-point is closed or opened to change launching spot quantity, thereby can adapt to different exposure visual fields.
The present invention compares the characteristics that had with background technology:
One, the present invention adopt and optimize the logical light quantity of pupil device control and improve the measurement hot spot, improve measuring accuracy; Perhaps the quantity that is controlled to picture point by on off state adapts to different exposures visual fields, has improved the dirigibility of chip design and production.
Two, the present invention adopts microlens array to substitute slit array in the first technology [1], can optimize the image quality of each measurement point, reduces the optical design difficulty.
Three, the present invention adopts Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror to substitute single mirror scanning in the first technology [1], can optimize the measuring accuracy of each measurement point.
Four, the present invention adopts the method in the alternative first technology [1] of difference method, has reduced the requirement to light source stability, thereby can obtain higher measuring accuracy.
Description of drawings
Fig. 1 is the focusing and leveling system schematic of prior art [1], and wherein: 1-is an incident light, and 2-is a slit array, 3,5,9,10-is optical imaging system, 4,6, the 8-plane mirror, 11-is a scanning reflection mirror, 12-is a parallel plate, and 13-receives slit array, 14-detector;
Fig. 2 is the slit array of prior art [1] imaging on silicon chip, wherein: the 20-visual field of exposing, 21-slit picture point;
Fig. 3 is the specific embodiment of the invention, wherein: 300-is a light source, and 301-is a condenser lens, 302,312-is pinhole filter, 303-is an extender lens, 304-is for optimizing pupil device, and 305,309-is microlens array, 306,308-is plane mirror, 307-is tested silicon chip, 310-is a condenser lens, and 311-is the OMEMS scanning reflection mirror, and 313-is a detector;
Fig. 4 is the microlens array structural representation of different focal among the present invention, and wherein: 40-is the different focal microlens array, and 41-is single lenticule;
Fig. 5 is a receiving unit scanning reflection structure, and wherein: 50-is a condenser lens, and 51-is the OMEMS scanning reflection mirror, and 52-is a pinhole filter, and 53-is a detector;
Fig. 6 is Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror structural representation, and wherein: 60-is the OMEMS scanning reflection mirror, and 61-is single micro-reflector;
Fig. 7 is the differential scanning principle schematic, and wherein: 70-is an optical splitter; 71,76-is a condenser lens, 72,77-is the OMEMS scanning reflection mirror, 73,79-is the focal plane, 74,78-is pinhole filter, 75, the 80-detector;
Fig. 8-be the same focal length microlens array mounting structure side schematic view, wherein: 81-is the same focal length microlens array, 82-is a lenticule.
Embodiment
Further specify the present invention below in conjunction with accompanying drawing.
As shown in Figure 3, be the structural representation of photo-etching machine focusing leveling system of the present invention.The optical system of focusing leveling device of the present invention comprises two big module, i.e. transmitter module and receiver modules.
Next coming in order in conjunction with the accompanying drawings 3 optical system of the present invention is described one by one each form module.
The receiver module of system as shown in Figure 5, light is by condenser lens 50 and 51 reflections of OMEMS scanning reflection mirror, wherein OMEMS scanning reflection mirror 51 concrete structures are made up of small level crossing 61 arrays as shown in Figure 6, and every small plane mirror can separate two-dimensional scanning.51 couples of every Shu Guang of OMEMS scanning reflection mirror scan separately, make it see through pinhole filter 52, incide on the detector 53, obtain the out of focus information of silicon chip 307 and the two-dimentional inclination information of silicon chip 307.For of the requirement of reduction system to light source stability, can adopt the receive mode of difference, its concrete synoptic diagram is as shown in Figure 7.With 71 light separated into two parts of optical splitter, i.e. reflected light and transmitted light through microlens array 309.Wherein transmitted light incides on the detector 75 by condenser lens 71, OMEMS scanning reflection mirror 72, pin hole 74.Wherein pinhole filter 74 is placed on the back of condenser lens 71 focal planes 73, makes it be in out-of-focus appearance.In like manner, the reflected light of optical splitter 71 also sees through condenser lens 76, OMEMS scanning reflection mirror 77 and a pinhole filter 78, incides on the detector 80.Wherein pinhole filter 78 is positioned at the front of the focal plane 79 of condenser lens 76, makes it be in out-of-focus appearance.The transmitted light of optical splitter 71 and reflected light, respectively by identical optical system, different is that pinhole filter 78 and 74 is in symmetry out of focus position, focal plane respectively.The information of utilizing detector 75 and detector 80 to obtain, corresponding point are subtracted each other, and are promptly poor, obtain the out of focus information of silicon chip 307 and the two-dimentional inclination information of silicon chip 307.The differential received of system can also adopt similar as shown in Figure 7 differential configuration, promptly adds a condenser lens before optical splitter 71, cancels condenser lens 72 and 76 simultaneously.
Microlens array 305 in the measuring system and 309 can also adopt the same focal length lens arra, but the lenticule of seven row the same focal length, mounting structure will be as shown in Figure 9, becomes steppedly, and the focusing of seven row microlens arrays is just dropped on the tested silicon chip surface 307.
Claims (9)
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