CN101201549A - Device and method for focusing and leveling based on microlens array - Google Patents
Device and method for focusing and leveling based on microlens array Download PDFInfo
- Publication number
- CN101201549A CN101201549A CNA200710178468XA CN200710178468A CN101201549A CN 101201549 A CN101201549 A CN 101201549A CN A200710178468X A CNA200710178468X A CN A200710178468XA CN 200710178468 A CN200710178468 A CN 200710178468A CN 101201549 A CN101201549 A CN 101201549A
- Authority
- CN
- China
- Prior art keywords
- microlens array
- focusing
- light
- reflection mirror
- leveling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Automatic Focus Adjustment (AREA)
- Focusing (AREA)
Abstract
The invention discloses a method and a device based on focusing and leveling of a lenticule array and belongs to the technical field of opto-electrical detection. The invention comprises an emitting part and a receiving part, wherein, the emitting part comprises a light source, a focusing lens, a pinhole filter, a beam expanding lens, an optimal entrance pupil device, a lenticule array and a steering mirror; the receiving part comprises a steering mirror, a lenticule array, a focusing lens, a scan mirror of a micro-opto-electro-mechanical-system (OMEMS), a pinhole filter and a detector. The invention adopts the optimal entrance pupil device to control light entrance quantity and then improve measuring light spot, or the quantity of the imaging point can be controlled by the state of a switch to adapt to different exposure viewing field; the invention adopts the lenticule array to replace a slit array; the scan mirror of the micro-opto-electro-mechanical-system (OMEMS) is adopted to replace the single lens scan; the difference receiving method is adopted and then the requirement for stability of the light source is decreased and higher measuring accuracy can be acquired.
Description
Technical field
The present invention relates to a kind of focusing and leveling detection method and device that is applied in the projection lithography system, its major function is that high Precision Detection is carried out with respect to the distance and the silicon chip two-dimensional tilting angle of projection objective in the surface of exposure silicon chip, particularly a kind of have a simultaneously-measured focusing and leveling sensor of multiple spot, belongs to the optical measurement field.
Background technology
In projection lithography system, the silicon chip focusing, leveling measuring system is used for measuring height and corner (Z, the θ of silicon chip surface with respect to projection objective in litho machine
XAnd θ
Y), constitute feedback system with vertical 3 actuators of work stage, control the vertical position of silicon chip in real time, guarantee that silicon chip is in the focal depth range of projection objective in exposure process all the time when the front court.In the step and repeat projection litho machine in the early stage, the leveling of silicon chip only needs whole focusing and leveling, promptly in chip transmission the whole silicon wafer surface is positioned in the focal depth range.Raising along with step and repeat projection litho machine resolution and throughput rate, need to adopt to increase the surface form deviation that causes by a focusing and leveling with the quick shortening that adapts to effective depth of focus and die size and become big, the area of silicon wafer in the exposure visual field is positioned in effective focal depth range.Begin to be applied to now to have become a gordian technique of advanced scanning projecting photoetching machine in the step and repeat projection litho machine of sub-half-micron resolution by a focusing and leveling.Rapid increase along with the integrated level of integrated circuit, the lines that expose are also more and more carefully more and more closeer, the resolution of projection objective improves constantly, depth of focus is also constantly reducing, want to make the corresponding surface of the silicon chip that will expose to remain in the depth of focus, the measuring accuracy of focusing and leveling sensor-based system and stability have also been proposed more and more higher requirement.Optical non-contact multimetering focusing and leveling method at present commonly used mainly contains three major types: 1) based on the multimetering method of the slit array [method that Japanese Nikon company adopts, SusumuMori.Higher NA ArF Scanning Exposure Tool on New Platform for further 100nmTechnology Node, 2001, SPIE, 4346,651]; 2) based on the multiple spot imaging method of pinhole array [method that Japanese Canon company adopts, U.S. Patent number: 6081614]; 3) based on the Moire fringe technique of many gratings [method that Dutch ASML company adopts, U.S. Patent number: 5191200].The focusing and leveling system that this three big litho machine manufacturer adopts all is based on the photoelectric measurement sensor-based system.These systems adopt identical, equally distributed measurement hot spot, and its measuring characteristic is respectively arranged.Wherein first method is that slit array is imaged on the measured object surface by same optical imaging system, again by the imaging of another one optical imaging system, seeing through a reception slit array incides on the detector, by out of focus hot spot is influenced, survey the light intensity that every bit receives.Specifically see also Fig. 1, incident light 1 sees through slit array 2, through optical imaging system 3, catoptron 4, optical imaging system 5 and catoptron 6, slit array is imaged on measured silicon chip surface 7, picture seven row seven row of slit cover whole exposure visual field 20, as shown in Figure 2 on silicon chip.Slit image on the silicon chip once more by catoptron 8, optical imaging system 9, optical imaging system 10, through scanning reflection mirror 11 reflections, is seen through parallel-plate 12 and slit array 13 and incides on the detector 14 again.By scanning reflection mirror 11 scanning modulation, on detector 14, obtain each picture and see through the variation of slit array 12 energy, thereby obtain the information of silicon chip surface.There is the deficiency of the following aspects in this technology: at first, many slit array are imaged onto on same by same imaging system, need consider big view field imaging problem during optical design, have increased the optical design difficulty; Secondly, single scanning reflection mirror sees through the reception slit array to all luminous points and unifies scanning, is difficult to improve the spot measurement precision, thereby has reduced The measuring precision; The 3rd, adopt scanning to receive each point light intensity method, to the stability requirement of light source own also than higher.
Summary of the invention
The present invention has proposed a kind ofly based on the microlens array imaging system on the basis of prior art [1], reduces the difficulty of system optics design.And utilize single scanning catoptron mode in Micro-Opto-Electro-Mechanical Systems (OMEMS) the scanning reflection mirror substitute technology [1], improve the spot measurement precision; Utilize the differential received method to substitute single reception, reduced requirement, and improved Measurement Resolution light source stability.The use of these new technologies, the measuring accuracy and the entire system adaptability of raising total system.
Technical scheme of the present invention is as follows:
The present invention is used for projection mask aligner's focusing and leveling measuring system, comprises the two large divisions: radiating portion, receiving unit.Radiating portion, receiving unit wherein radiating portion comprise that light source, condenser lens, pinhole filter, extender lens, optimization goes into pupil device, microlens array, steering reflection mirror; Receiving unit comprises steering reflection mirror, microlens array, condenser lens, Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror, pinhole filter and detector; Annexation between each parts is seen Fig. 3, and light source focuses on pinhole filter through condenser lens; Light sees through pinhole filter, by extender lens, becomes directional light, sees through to optimize pupil device; Go into the pupil device back in optimization and place microlens array, each lenticule is aimed at respectively from optimizing gone into the light that pupil device sees through; The light that sees through microlens array reflexes to silicon chip surface through steering reflection mirror; Through silicon chip and steering reflection mirror reflection, see through the another one microlens array, focus on and the mirror reflection of Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection through condenser lens again, see through pinhole filter, incide on the detector.Adopt to optimize go into the logical light quantity of pupil device control and improve the measurement hot spot, perhaps the quantity that is controlled to picture point by on off state adapts to different exposures visual fields; Adopt microlens array to substitute slit array; Adopt Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror to substitute single mirror scanning; Adopt the differential received method, reduce requirement, obtain higher measuring accuracy light source stability.
Can substitute with liquid crystal light valve and optimize pupil device.
Microlens array is the microlens array that is in the microlens array of the different focal in the same plane or is in identical focusing in the Different Plane.
Light source is the hybrid light source of little white light source or infrared wideband laser light source or different wavelength of laser device array.
Steering reflection mirror is plane mirror or reflecting prism.
Detector is the silicon photodetector array of single CCD or multiwindow ccd array or multiwindow.
Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror is one-dimensional scanning or two-dimensional scan.
A kind of focusing leveling measuring method of the present invention based on the microlens array focusing and leveling, step is:
(1) light source passes through shaping, is focused into by condenser lens and is mapped to pinhole filter, expands bundle through extender lens again;
(2) directional light that expands after restrainting is gone into the logical light quantity of pupil device control by optimizing;
(3) utilize microlens array to aim at corresponding parallel beam in the back, light sees through microlens array;
(4) focus on the tested silicon chip surface through plane mirror again;
(5) silicon chip surface reflects light, passes through plane mirror again, sees through the another one microlens array;
(6) through the light of microlens array,, see through pinhole filter, on the incident detector again through a condenser lens and plane mirror reflects;
(7) signal of photodetector output, through promptly obtaining the position pattern information of tested silicon chip surface after the signal Processing, drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
The receiving unit detection principle can be the difference detecting principle.
The light that sends from light source expands bundle through beam shaping, spatial filtering, goes into pupil device through optimization again and controls each lenticular logical light quantity, sees through microlens array, is imaged on the tested silicon chip face through steering reflection mirror again., incide on the detector through another one steering reflection mirror, reception microlens array, condenser lens, Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror, pinhole filter from tested silicon chip surface light reflected.The signal of photodetector output, through promptly obtaining the position pattern information of tested silicon chip surface after the signal Processing, drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
Pupil device is gone in described optimization can optimize each lenticular logical light quantity, optimizes optical quality on silicon chip, can also utilize it single-point is closed or opened to change launching spot quantity, thereby can adapt to different exposure visual fields.
The present invention compares the characteristics that had with background technology:
One, the present invention adopt and optimize the logical light quantity of pupil device control and improve the measurement hot spot, improve measuring accuracy; Perhaps the quantity that is controlled to picture point by on off state adapts to different exposures visual fields, has improved the dirigibility of chip design and production.
Two, the present invention adopts microlens array to substitute slit array in the first technology [1], can optimize the image quality of each measurement point, reduces the optical design difficulty.
Three, the present invention adopts Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror to substitute single mirror scanning in the first technology [1], can optimize the measuring accuracy of each measurement point.
Four, the present invention adopts the method in the alternative first technology [1] of difference method, has reduced the requirement to light source stability, thereby can obtain higher measuring accuracy.
Description of drawings
Fig. 1 is the focusing and leveling system schematic of prior art [1], and wherein: 1-is an incident light, and 2-is a slit array, 3,5,9,10-is optical imaging system, 4,6, the 8-plane mirror, 11-is a scanning reflection mirror, 12-is a parallel plate, and 13-receives slit array, 14-detector;
Fig. 2 is the slit array of prior art [1] imaging on silicon chip, wherein: the 20-visual field of exposing, 21-slit picture point;
Fig. 3 is the specific embodiment of the invention, wherein: 300-is a light source, and 301-is a condenser lens, 302,312-is pinhole filter, 303-is an extender lens, 304-is for optimizing pupil device, and 305,309-is microlens array, 306,308-is plane mirror, 307-is tested silicon chip, 310-is a condenser lens, and 311-is the OMEMS scanning reflection mirror, and 313-is a detector;
Fig. 4 is the microlens array structural representation of different focal among the present invention, and wherein: 40-is the different focal microlens array, and 41-is single lenticule;
Fig. 5 is a receiving unit scanning reflection structure, and wherein: 50-is a condenser lens, and 51-is the OMEMS scanning reflection mirror, and 52-is a pinhole filter, and 53-is a detector;
Fig. 6 is Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror structural representation, and wherein: 60-is the OMEMS scanning reflection mirror, and 61-is single micro-reflector;
Fig. 7 is the differential scanning principle schematic, and wherein: 70-is an optical splitter; 71,76-is a condenser lens, 72,77-is the OMEMS scanning reflection mirror, 73,79-is the focal plane, 74,78-is pinhole filter, 75, the 80-detector;
Fig. 8-be the same focal length microlens array mounting structure side schematic view, wherein: 81-is the same focal length microlens array, 82-is a lenticule.
Embodiment
Further specify the present invention below in conjunction with accompanying drawing.
As shown in Figure 3, be the structural representation of photo-etching machine focusing leveling system of the present invention.The optical system of focusing leveling device of the present invention comprises two big module, i.e. transmitter module and receiver modules.
Next coming in order in conjunction with the accompanying drawings 3 optical system of the present invention is described one by one each form module.
The receiver module of system as shown in Figure 5, light is by condenser lens 50 and 51 reflections of OMEMS scanning reflection mirror, wherein OMEMS scanning reflection mirror 51 concrete structures are made up of small level crossing 61 arrays as shown in Figure 6, and every small plane mirror can separate two-dimensional scanning.51 couples of every Shu Guang of OMEMS scanning reflection mirror scan separately, make it see through pinhole filter 52, incide on the detector 53, obtain the out of focus information of silicon chip 307 and the two-dimentional inclination information of silicon chip 307.For of the requirement of reduction system to light source stability, can adopt the receive mode of difference, its concrete synoptic diagram is as shown in Figure 7.With 71 light separated into two parts of optical splitter, i.e. reflected light and transmitted light through microlens array 309.Wherein transmitted light incides on the detector 75 by condenser lens 71, OMEMS scanning reflection mirror 72, pin hole 74.Wherein pinhole filter 74 is placed on the back of condenser lens 71 focal planes 73, makes it be in out-of-focus appearance.In like manner, the reflected light of optical splitter 71 also sees through condenser lens 76, OMEMS scanning reflection mirror 77 and a pinhole filter 78, incides on the detector 80.Wherein pinhole filter 78 is positioned at the front of the focal plane 79 of condenser lens 76, makes it be in out-of-focus appearance.The transmitted light of optical splitter 71 and reflected light, respectively by identical optical system, different is that pinhole filter 78 and 74 is in symmetry out of focus position, focal plane respectively.The information of utilizing detector 75 and detector 80 to obtain, corresponding point are subtracted each other, and are promptly poor, obtain the out of focus information of silicon chip 307 and the two-dimentional inclination information of silicon chip 307.The differential received of system can also adopt similar as shown in Figure 7 differential configuration, promptly adds a condenser lens before optical splitter 71, cancels condenser lens 72 and 76 simultaneously.
Microlens array 305 in the measuring system and 309 can also adopt the same focal length lens arra, but the lenticule of seven row the same focal length, mounting structure will be as shown in Figure 9, becomes steppedly, and the focusing of seven row microlens arrays is just dropped on the tested silicon chip surface 307.
Claims (9)
1. device based on the microlens array focusing and leveling, this device comprises the two large divisions: radiating portion, receiving unit wherein radiating portion comprise light source (300), condenser lens (301), pinhole filter (302), extender lens (303), optimize and go into pupil device (304), microlens array (305), steering reflection mirror (306); Receiving unit comprises steering reflection mirror (308), microlens array (309), condenser lens (310), Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror (311), pinhole filter (312) and detector (313); It is characterized in that: the annexation between each parts is for seeing Fig. 3, light source (300) focuses on pinhole filter (302) through condenser lens (301), light sees through pinhole filter (302), becomes directional light by extender lens (303), sees through to optimize pupil device (304); Go into pupil device (304) back in optimization and place microlens array (305), each lenticule is aimed at respectively from optimizing gone into the light that pupil device (304) sees through; The light that sees through microlens array reflexes to silicon chip (307) surface through steering reflection mirror (306); Through silicon chip (307) and steering reflection mirror (308) reflection, see through another one microlens array (309), pass through condenser lens (310) focusing and Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror (311) reflection again, see through pinhole filter (312), incide on the detector (313).
2. a kind of device based on the microlens array focusing and leveling according to claim 1 is characterized in that: can substitute with liquid crystal light valve and optimize pupil device (304).
3. a kind of device based on the microlens array focusing and leveling according to claim 1 is characterized in that: microlens array (305,309) is the microlens array that is in the microlens array of the different focal in the same plane or is in identical focusing in the Different Plane.
4. a kind of device based on the microlens array focusing and leveling according to claim 1 is characterized in that: light source (300) is little white light source or infrared wideband laser light source.
5. a kind of device based on the microlens array focusing and leveling according to claim 1 is characterized in that: steering reflection mirror (306,308) is plane mirror or reflecting prism.
6. a kind of device based on the microlens array focusing and leveling according to claim 1 is characterized in that: detector (313) is the silicon photodetector array of single CCD or multiwindow ccd array or multiwindow.
7. a kind of device based on the microlens array focusing and leveling according to claim 1 is characterized in that: Micro-Opto-Electro-Mechanical Systems (OMEMS) scanning reflection mirror (311) is one-dimensional scanning or two-dimensional scan.
8. a kind of device based on the microlens array focusing and leveling according to claim 1 is characterized in that: the receiving unit detection principle can be the difference detecting principle.
9. focusing leveling measuring method based on the microlens array focusing and leveling is characterized in that this method step is:
(1) light source (300) passes through shaping, is focused into by condenser lens (301) and is mapped to pinhole filter (302), passes through extender lens (303) again and expands bundle;
(2) directional light that expands after restrainting is gone into the logical light quantity of pupil device (304) control by optimizing;
(3) utilize microlens array (305) to aim at corresponding parallel beam in (304) back, light sees through microlens array (305);
(4) passing through plane mirror (306) again focuses on the tested silicon chip surface (307);
(5) silicon chip surface (307) passes through plane mirror (308) again with the light reflection, sees through another one microlens array (309);
(6) through the light of microlens array (309), through a condenser lens (310) and plane mirror (311) reflection, see through pinhole filter (312), on the incident detector (313) again;
(7) signal of photodetector (313) output, through promptly obtaining the position pattern information of tested silicon chip surface after the signal Processing, drive three by motion control board and drive height and the inclination of regulating substrate surface, make and measure the available focal depth range that substrate surface is positioned at projection objective.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710178468A CN100592214C (en) | 2007-11-30 | 2007-11-30 | Device and method for focusing and leveling based on microlens array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710178468A CN100592214C (en) | 2007-11-30 | 2007-11-30 | Device and method for focusing and leveling based on microlens array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101201549A true CN101201549A (en) | 2008-06-18 |
| CN100592214C CN100592214C (en) | 2010-02-24 |
Family
ID=39516777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710178468A Expired - Fee Related CN100592214C (en) | 2007-11-30 | 2007-11-30 | Device and method for focusing and leveling based on microlens array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100592214C (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102282440A (en) * | 2009-03-03 | 2011-12-14 | 韦崔斯股份有限公司 | Method and device for optically measuring the surface of a product |
| CN103091992A (en) * | 2011-11-02 | 2013-05-08 | 上海微电子装备有限公司 | Workpiece position correction device and correction method |
| CN103090787A (en) * | 2013-01-29 | 2013-05-08 | 哈尔滨工业大学 | Confocal microscopy measuring device based on measured surface fluorescence excitation |
| CN103105142A (en) * | 2013-01-29 | 2013-05-15 | 哈尔滨工业大学 | Long-working-distance skeleton measuring device based on fluorescence excitation of surface to be detected |
| CN103115582A (en) * | 2013-01-29 | 2013-05-22 | 哈尔滨工业大学 | Stimulated radiation based Michelson fluorescence interference microscopic measurement device |
| CN103115583A (en) * | 2013-01-29 | 2013-05-22 | 哈尔滨工业大学 | Stimulated radiation based Mirau fluorescence interference microscopic measurement device |
| CN103838088A (en) * | 2012-11-23 | 2014-06-04 | 上海微电子装备有限公司 | Focusing and levelling device and method |
| CN103969961A (en) * | 2013-02-04 | 2014-08-06 | 上海微电子装备有限公司 | Focusing and leveling system |
| CN104076581A (en) * | 2013-03-28 | 2014-10-01 | Lg电子株式会社 | Laser projector |
| CN104268621A (en) * | 2014-09-22 | 2015-01-07 | 无锡名谷科技有限公司 | Silicon wafer counting device and method |
| WO2015101196A1 (en) * | 2013-12-31 | 2015-07-09 | 上海微电子装备有限公司 | Focusing leveling device |
| CN105700296A (en) * | 2014-11-26 | 2016-06-22 | 上海微电子装备有限公司 | Silicon chip surface height and gradient detection apparatus and method thereof |
| WO2017206755A1 (en) * | 2016-05-31 | 2017-12-07 | 上海微电子装备（集团）股份有限公司 | Focusing and leveling measurement device and method |
| CN107907965A (en) * | 2017-11-27 | 2018-04-13 | 成都信息工程大学 | A kind of method and device for adjusting focal length of micro-lens array |
| CN108398449A (en) * | 2018-04-23 | 2018-08-14 | 浙江工业大学 | X-ray dioptric apparatus for X-ray array combination refractor integrated package to be miniaturized |
| CN110441754A (en) * | 2019-07-22 | 2019-11-12 | 中国科学院上海光学精密机械研究所 | Segment the controllable optical receiver assembly of visual field optical efficiency |
| CN112304904A (en) * | 2019-07-15 | 2021-02-02 | 松山湖材料实验室 | Silicon wafer reflectivity detection method based on filter array |
| CN113030912A (en) * | 2019-12-09 | 2021-06-25 | 觉芯电子(无锡)有限公司 | Laser radar system based on scanning galvanometer |
| CN113059807A (en) * | 2021-03-18 | 2021-07-02 | 之江实验室 | High axial resolution three-dimensional printing method and device based on uniform active light sheet |
| CN113625533A (en) * | 2021-07-27 | 2021-11-09 | 电子科技大学 | Photoetching machine workpiece table leveling and focusing method considering system coupling characteristics |
-
2007
- 2007-11-30 CN CN200710178468A patent/CN100592214C/en not_active Expired - Fee Related
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102282440B (en) * | 2009-03-03 | 2014-08-20 | 韦崔斯股份有限公司 | Method and device for optically measuring the surface of a product |
| CN102282440A (en) * | 2009-03-03 | 2011-12-14 | 韦崔斯股份有限公司 | Method and device for optically measuring the surface of a product |
| CN103091992A (en) * | 2011-11-02 | 2013-05-08 | 上海微电子装备有限公司 | Workpiece position correction device and correction method |
| CN103838088B (en) * | 2012-11-23 | 2016-12-07 | 上海微电子装备有限公司 | A kind of focusing leveling device and focusing and leveling method |
| CN103838088A (en) * | 2012-11-23 | 2014-06-04 | 上海微电子装备有限公司 | Focusing and levelling device and method |
| CN103115582A (en) * | 2013-01-29 | 2013-05-22 | 哈尔滨工业大学 | Stimulated radiation based Michelson fluorescence interference microscopic measurement device |
| CN103115583A (en) * | 2013-01-29 | 2013-05-22 | 哈尔滨工业大学 | Stimulated radiation based Mirau fluorescence interference microscopic measurement device |
| CN103105142A (en) * | 2013-01-29 | 2013-05-15 | 哈尔滨工业大学 | Long-working-distance skeleton measuring device based on fluorescence excitation of surface to be detected |
| CN103090787B (en) * | 2013-01-29 | 2016-01-20 | 哈尔滨工业大学 | Based on the confocal micro-measurement device of measured surface fluorescence excitation |
| CN103090787A (en) * | 2013-01-29 | 2013-05-08 | 哈尔滨工业大学 | Confocal microscopy measuring device based on measured surface fluorescence excitation |
| CN103115582B (en) * | 2013-01-29 | 2015-07-29 | 哈尔滨工业大学 | Based on the Michelson fluorescence interference micro-measurement apparatus of stimulated radiation |
| CN103115583B (en) * | 2013-01-29 | 2015-07-29 | 哈尔滨工业大学 | Based on the Mirau fluorescence interference micro-measurement apparatus of stimulated radiation |
| CN103105142B (en) * | 2013-01-29 | 2015-09-02 | 哈尔滨工业大学 | Based on the long working distance contour outline measuring set of measured surface fluorescence excitation |
| CN103969961A (en) * | 2013-02-04 | 2014-08-06 | 上海微电子装备有限公司 | Focusing and leveling system |
| CN103969961B (en) * | 2013-02-04 | 2016-04-20 | 上海微电子装备有限公司 | A kind of focusing and leveling system |
| US9454067B2 (en) | 2013-03-28 | 2016-09-27 | Lg Electronics Inc. | Laser projector |
| CN104076581A (en) * | 2013-03-28 | 2014-10-01 | Lg电子株式会社 | Laser projector |
| CN104076581B (en) * | 2013-03-28 | 2017-01-18 | Lg电子株式会社 | Laser projector |
| US9857702B2 (en) | 2013-12-31 | 2018-01-02 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Focusing leveling device |
| WO2015101196A1 (en) * | 2013-12-31 | 2015-07-09 | 上海微电子装备有限公司 | Focusing leveling device |
| CN104268621A (en) * | 2014-09-22 | 2015-01-07 | 无锡名谷科技有限公司 | Silicon wafer counting device and method |
| CN104268621B (en) * | 2014-09-22 | 2017-10-03 | 无锡名谷科技有限公司 | A kind of silicon chip piece counting apparatus and several pieces methods |
| CN105700296B (en) * | 2014-11-26 | 2019-04-30 | 上海微电子装备（集团）股份有限公司 | Silicon chip surface height and gradient detection device and method |
| CN105700296A (en) * | 2014-11-26 | 2016-06-22 | 上海微电子装备有限公司 | Silicon chip surface height and gradient detection apparatus and method thereof |
| US10656507B2 (en) | 2016-05-31 | 2020-05-19 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Focusing and leveling measurement device and method |
| WO2017206755A1 (en) * | 2016-05-31 | 2017-12-07 | 上海微电子装备（集团）股份有限公司 | Focusing and leveling measurement device and method |
| CN107907965A (en) * | 2017-11-27 | 2018-04-13 | 成都信息工程大学 | A kind of method and device for adjusting focal length of micro-lens array |
| CN108398449A (en) * | 2018-04-23 | 2018-08-14 | 浙江工业大学 | X-ray dioptric apparatus for X-ray array combination refractor integrated package to be miniaturized |
| CN112304904A (en) * | 2019-07-15 | 2021-02-02 | 松山湖材料实验室 | Silicon wafer reflectivity detection method based on filter array |
| CN112304904B (en) * | 2019-07-15 | 2023-11-03 | 松山湖材料实验室 | Silicon wafer reflectivity detection method based on filter array |
| CN110441754A (en) * | 2019-07-22 | 2019-11-12 | 中国科学院上海光学精密机械研究所 | Segment the controllable optical receiver assembly of visual field optical efficiency |
| CN110441754B (en) * | 2019-07-22 | 2022-08-30 | 中国科学院上海光学精密机械研究所 | Optical receiving device with controllable optical efficiency of subdivided field of view |
| CN113030912A (en) * | 2019-12-09 | 2021-06-25 | 觉芯电子(无锡)有限公司 | Laser radar system based on scanning galvanometer |
| CN113030912B (en) * | 2019-12-09 | 2024-05-28 | 觉芯电子(无锡)有限公司 | Laser radar system based on scanning galvanometer |
| CN113059807A (en) * | 2021-03-18 | 2021-07-02 | 之江实验室 | High axial resolution three-dimensional printing method and device based on uniform active light sheet |
| CN113059807B (en) * | 2021-03-18 | 2022-05-06 | 之江实验室 | High axial resolution three-dimensional printing method and device based on uniform active light sheet |
| CN113625533A (en) * | 2021-07-27 | 2021-11-09 | 电子科技大学 | Photoetching machine workpiece table leveling and focusing method considering system coupling characteristics |
| CN113625533B (en) * | 2021-07-27 | 2022-04-19 | 电子科技大学 | Photoetching machine workpiece table leveling and focusing method considering system coupling characteristics |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100592214C (en) | 2010-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100592214C (en) | Device and method for focusing and leveling based on microlens array | |
| KR100471524B1 (en) | Exposure method | |
| US9606071B2 (en) | Defect inspection method and device using same | |
| KR101275076B1 (en) | Image detection system and method for producing at least one image detection system | |
| CN102540778B (en) | Measuring system and photoetching device using same | |
| US6049373A (en) | Position detection technique applied to proximity exposure | |
| CN100409102C (en) | In-situ detection method for stray light in step scan projection mask aligner | |
| JP2004528605A (en) | Autofocus device for optical equipment | |
| CN100559278C (en) | A kind of optical system of focusing and leveling sensor | |
| CN1707363A (en) | Radiation system, lithographic apparatus, device manufacturing method and device manufactured thereby | |
| US20080142681A1 (en) | Focus control method | |
| US11592653B2 (en) | Automated focusing system for tracking specimen surface with a configurable focus offset | |
| CN102043352B (en) | Focusing and leveling detection device | |
| CN101855568A (en) | Device for optical distance measurement | |
| TWI833392B (en) | Apparatus for measuring overlay | |
| CN104375383B (en) | Focusing-levelling detection device and method for lithographic equipment | |
| KR0132269B1 (en) | Alignment apparatus of stepper and control method therefor | |
| JP4884615B2 (en) | Parallel processing optical distance meter | |
| CN102207694A (en) | Imaging adjustment unit and focusing and leveling control system using the unit | |
| CN114509923B (en) | Focusing and leveling device in deep ultraviolet objective lens design and application thereof | |
| CN100474124C (en) | Multi-platform photolithographic machine silicon chip horizontal control and automatic focusing system and implement method thereof | |
| US6539326B1 (en) | Position detecting system for projection exposure apparatus | |
| CN106814547B (en) | A kind of detecting and correcting device and survey calibration method | |
| KR102022799B1 (en) | Line width measuring system and line width measuring device | |
| CN102890433A (en) | Alignment device and alignment method for lithography equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100224 Termination date: 20141130 |
|
| EXPY | Termination of patent right or utility model |